CN212850219U

CN212850219U - Frequency converter power assembly

Info

Publication number: CN212850219U
Application number: CN202020462983.1U
Authority: CN
Inventors: 席文杰; 徐佳巍
Original assignee: Atlas Copco Wuxi Compressor Co Ltd
Current assignee: Atlas Copco Wuxi Compressor Co Ltd
Priority date: 2020-04-01
Filing date: 2020-04-01
Publication date: 2021-03-30
Anticipated expiration: 2030-04-01

Abstract

The utility model discloses a converter power component. This converter power pack includes: a mounting frame; a power module mounted on the mounting bracket; a capacitor electrically connected with the power module. According to the utility model discloses a converter power pack, through installing power module on the mounting bracket, be connected electric capacity and power module electricity again, can make whole converter power pack simple structure, compact, arrange rationally.

Description

Frequency converter power assembly

Technical Field

The utility model relates to a converter technical field particularly, relates to a converter power component.

Background

The frequency converter power assembly comprises a power module and a capacitor, the capacitor is electrically connected with the power module, however, in the existing frequency converter power assembly, the arrangement mode of the power module and the capacitor is often unreasonable, so that the capacitor cannot adopt a large specification, and when the capacitor is electrically connected with the power module, more connecting parts are arranged, so that the whole frequency converter power assembly is complex in structure and large in size. Furthermore, the cooling structure of the power module is usually mounted on a mounting frame together with the power module, which also results in a bulky power assembly of the frequency converter.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the above-mentioned technical problem among the prior art to a certain extent at least. Therefore, the utility model provides a converter power component, its simple structure, compactness.

According to the utility model discloses converter power pack includes: a mounting frame; a power module mounted on the mounting bracket; a capacitor electrically connected with the power module.

According to the utility model discloses converter power module through installing power module on the mounting bracket, is connected electric capacity and power module electricity again, can make whole converter power module simple structure, compactness, arrange rationally.

According to some embodiments of the invention, the mounting bracket comprises: the power module comprises a mounting bottom frame and at least one mounting support arm, wherein the mounting support arm is arranged on the mounting bottom frame and extends out of the mounting bottom frame, and the power module is mounted on the mounting support arm.

Furthermore, cooling cavities which are communicated with each other are arranged in the mounting support arm and the mounting underframe.

Specifically, the cooling chamber includes: the cooling device comprises a bottom frame cooling cavity positioned in the installation bottom frame and a support arm cooling cavity positioned in the installation support arm, wherein the support arm cooling cavity is communicated with the bottom frame cooling cavity.

Furthermore, a partition plate is arranged in the cavity of the support arm cooling cavity, the partition plate divides the support arm cooling cavity into a support arm inlet cavity and a support arm outlet cavity, and the partition plate is separated from the inner top wall of the support arm cooling cavity, so that the support arm inlet cavity is communicated with the support arm outlet cavity at the top of the support arm cooling cavity.

Specifically, a first medium port and a second medium port which are communicated with the chassis cooling cavity are arranged on the mounting chassis, one of the first medium port and the second medium port is a medium inlet, and the other is a medium outlet.

Optionally, a series medium passage is formed among the first medium port, the chassis cooling cavity, the arm inlet cavity, the arm outlet cavity and the second medium port.

Specifically, the mounting arms are multiple, and the arm outlet cavity of the mounting arm located on the upstream side of the medium passage is communicated with the arm inlet cavity of the mounting arm adjacent to the downstream side of the medium passage through the underframe cooling cavity.

According to some embodiments of the present invention, the mounting bracket further comprises: and one end of the capacitor supporting element is fixed on the mounting support arm, and the other end of the capacitor supporting element is suitable for supporting the capacitor.

According to some embodiments of the present invention, the mounting bracket further comprises: the installation top frame is arranged at the top of the installation support arm and is suitable for supporting the capacitor, and the power module is located between the installation top frame and the installation bottom frame.

Furthermore, cooling cavities which are communicated with each other are arranged in the mounting top frame, the mounting support arm and the mounting bottom frame.

Specifically, the cooling chamber includes: the installation support arm comprises an installation bottom frame, a bottom frame cooling cavity, a top frame cooling cavity and a support arm cooling cavity, wherein the bottom frame cooling cavity is positioned in the installation bottom frame, the top frame cooling cavity is positioned in the installation top frame, the support arm cooling cavity is positioned in the installation support arm, and the support arm cooling cavity is communicated with the top frame cooling cavity and the bottom frame cooling cavity.

According to some embodiments of the invention, the support arm cooling chamber is a single-channel cavity structure.

According to the utility model discloses a some embodiments, be provided with the division board in the cavity in support arm cooling chamber, the division board will a plurality of support arm minute chambers are separated into in support arm cooling chamber, every the support arm divide the chamber all with roof-rack cooling chamber chassis cooling chamber is linked together.

According to some embodiments of the utility model, be provided with on the installation chassis with the first medium mouth of chassis cooling chamber intercommunication, be provided with on the installation roof-rack with the second medium mouth of roof-rack cooling chamber intercommunication, first medium mouth with one of the two of second medium mouth is the medium import, and another is the medium export.

Optionally, a series medium passage is formed among the second medium port, the top frame cooling cavity, the arm cooling cavity, the bottom frame cooling cavity and the first medium port.

Furthermore, the installation support arm is a plurality of, with the second medium mouth is linked together the support arm cooling chamber bottom of installation support arm is adjacent the support arm cooling chamber bottom of installation support arm passes through chassis cooling chamber is linked together, with first medium mouth is linked together the support arm cooling chamber top of installation support arm is adjacent the support arm cooling chamber top of installation support arm passes through roof-rack cooling chamber is linked together, other adjacent two pass through between the support arm cooling chamber of installation support arm the roof-rack cooling chamber or pass through chassis cooling chamber series connection intercommunication.

Optionally, the mounting top frame is parallel to the mounting bottom frame.

Optionally, the mounting arms are perpendicular to the mounting chassis.

According to the utility model discloses a some embodiments, be provided with a plurality of fins in the cavity in support arm cooling chamber, it is a plurality of the one end of fin with the division board is connected, the other end with the chamber wall in support arm cooling chamber is connected, adjacent two form the fin between the fin and divide the chamber.

Optionally, a plurality of said fins are parallel to each other.

According to some embodiments of the invention, the mounting chassis comprises: the mounting support arm is arranged on the first underframe and the second underframe.

Furthermore, cooling cavities which are communicated with each other are arranged in the mounting support arm, the first underframe and the second underframe.

Specifically, the cooling chamber includes: the cooling device comprises a first cooling cavity, a second cooling cavity and a support arm cooling cavity, wherein the first cooling cavity is positioned in the first chassis, the second cooling cavity is positioned in the second chassis, the support arm cooling cavity is positioned in the mounting support arm, and the first cooling cavity, the support arm cooling cavity and the second cooling cavity are communicated.

According to some embodiments of the present invention, the first chassis is provided with a first medium port communicated with the first cooling chamber, the second chassis is provided with a second medium port communicated with the second cooling chamber, one of the first medium port and the second medium port is a medium inlet, and the other is a medium outlet.

Optionally, the number of the mounting support arms is multiple, and multiple support arm cooling cavities are arranged between the first cooling cavity and the second cooling cavity in parallel.

According to some embodiments of the utility model, be provided with on the first chassis with the first chassis interface of first cooling chamber intercommunication, be provided with on the second chassis with the second chassis interface of second cooling chamber intercommunication, be provided with on the installation support arm with the first interface of support arm and the support arm second interface of support arm cooling chamber intercommunication, the first interface of support arm with first chassis interface is linked together, the support arm second interface with second chassis interface is linked together.

According to some embodiments of the invention, each of the two oppositely disposed sides of the mounting arm is provided with the power module on at least one side.

According to some embodiments of the present invention, the mounting arm and one of the two of the power modules is provided with a positioning protrusion, and the other is provided with a positioning groove adapted to be positioned and matched with the positioning protrusion.

According to some embodiments of the invention, the capacitor is located at the top of the mounting frame.

Further, the frequency converter power assembly further comprises: the capacitor comprises a first polar plate and a second polar plate, wherein the first polar plate and the second polar plate are arranged at the end part of the power module, and the power module and the capacitor are electrically connected with the first polar plate and the second polar plate.

Further, the capacitor has a first terminal adapted to be electrically connected to the first plate and a second terminal adapted to be electrically connected to the second plate.

Further, a first capacitor connecting part is arranged on the first polar plate, and the first terminal is electrically connected with the first capacitor connecting part; and a second capacitor connecting part is arranged on the second polar plate, and the second terminal is electrically connected with the second capacitor connecting part.

In particular, the first and second capacitor connection portions are configured as plate-like structures located between the capacitor and the mounting bracket.

According to some embodiments of the utility model, power module has first female arranging and the female row of second, first female arranging with first polar plate electricity is connected, the female row of second with second polar plate electricity is connected.

Further, a first pole piece is arranged on the first pole plate, extends out towards the power module and is suitable for being electrically connected with the first busbar; and a second pole piece is arranged on the second pole plate, extends towards the power module and is suitable for being electrically connected with the second busbar.

Further, the first busbar is provided with a first busbar switching end plate, and the first pole piece is fixedly connected with the first busbar switching end plate through a first bolt; the second busbar is provided with a second busbar switching end plate, and the second pole piece is fixedly connected with the second busbar switching end plate through a second bolt.

According to some embodiments of the invention, the mounting frame is constructed as a flat mounting frame, and at least one of two oppositely disposed sides of the mounting frame is provided with the power module.

Specifically, the two oppositely arranged side faces are the side faces with the largest area of the mounting rack.

Optionally, one of the at least one side surface and the power module is provided with a positioning protrusion, and the other side surface is provided with a positioning groove adapted to be in positioning fit with the positioning protrusion.

According to some embodiments of the invention, the mounting frame has a cooling chamber therein.

Further, be provided with the division board in the cavity in cooling chamber, the division board will the cooling chamber is separated into first cooling minute chamber and second cooling minute chamber, the division board with another inside wall in cooling chamber is separated, so that first cooling minute chamber with second cooling minute chamber is in the lateral part in cooling chamber is linked together.

Further, a first medium port communicated with the first cooling sub-cavity and a second medium port communicated with the second cooling sub-cavity are arranged on the mounting frame, one of the first medium port and the second medium port is a medium inlet, and the other is a medium outlet.

Optionally, a series medium passage is formed among the first medium port, the first cooling subchamber, the second cooling subchamber and the second medium port.

According to the utility model discloses a some embodiments, be provided with a plurality of fins in the cavity in cooling chamber, it is a plurality of the one end of fin with the division board is connected, the other end with the chamber wall in cooling chamber is connected, adjacent two it divides the chamber to form the fin between the fin.

According to some embodiments of the invention, the capacitor is located at the top or bottom of the mounting frame.

According to some embodiments of the present invention, the frequency converter power assembly further comprises: the capacitor comprises a first polar plate and a second polar plate, wherein the first polar plate and the second polar plate are arranged at the end part of the power module, and the power module and the capacitor are electrically connected with the first polar plate and the second polar plate.

Furthermore, the power module is provided with a first busbar and a second busbar, the first busbar is electrically connected with the first polar plate, and the second busbar is electrically connected with the second polar plate.

According to some embodiments of the invention, a first pole piece is arranged on the first pole plate, the first pole piece extending towards the power module and adapted to be electrically connected to the first busbar; and a second pole piece is arranged on the second pole plate, extends towards the power module and is suitable for being electrically connected with the second busbar.

According to some embodiments of the present invention, the frequency converter power assembly further comprises: a first terminal plate and a second terminal plate, the capacitor having a first terminal adapted to be electrically connected with the first terminal plate and a second terminal adapted to be electrically connected with the second terminal plate.

Further, the first pole plate is adapted to be electrically connected to the first terminal board, and the second pole plate is adapted to be electrically connected to the second terminal board.

Furthermore, the first terminal board is electrically connected with the first pole plate through the first pole piece, and the second terminal board is electrically connected with the second pole plate through the second pole piece.

According to some embodiments of the invention, the mounting bracket has a mounting bracket first side facing the capacitor, the power module being disposed on the mounting bracket first side; the first terminal plate is provided with a first terminal piece, the first pole piece extending towards the first side surface of the mounting frame and the first busbar adapter end plate on the first side surface of the mounting frame are fixedly connected through the first bolt; the second terminal plate is provided with a second terminal piece, the second terminal piece and the second busbar adapter end plate are fixedly connected through a second bolt, wherein the second terminal piece extends out of the first side face of the mounting frame, and the second busbar adapter end plate is arranged on the first side face of the mounting frame.

Further, the mounting bracket has a mounting bracket second side facing away from the capacitor, and the power module is arranged on the mounting bracket second side; the first pole piece extending out of the second side face of the mounting frame and the first busbar adapter end plate on the second side face of the mounting frame are fixedly connected through the first bolt; the second pole piece extending towards the second side face of the mounting frame and the second busbar switching end plate on the second side face of the mounting frame are fixedly connected through the second bolt.

According to the utility model discloses a some embodiments, the mounting bracket has a plurality of installing districts that are located the coplanar, and is a plurality of power module tiling is installed and is corresponding installing district department, electric capacity sets up a plurality of power module's the dorsad one side of mounting bracket.

According to some embodiments of the invention, the power module comprises: a base plate, the first side of the base plate having a first side, the base plate being mounted on the mount, or the base plate being part of the mount; a tab structure located on the first side of the substrate; a plurality of bus bars arranged in a stacked manner; the power structure is pressed against the first side face by the pressing sheet structure and is provided with a plurality of pins, and the pins are connected with the corresponding busbar and are electrically insulated from other busbars.

Further, a retaining structure is included and is configured to retain the sheeting structure on the first side of the base.

According to some embodiments of the invention, the power structure comprises: a first power structure and a second power structure, the first and second power structures spaced apart; the tablet structure includes: preforming body and preforming arm, the preforming arm connect in the preforming body just is used for the pressure to support the power structure, the preforming arm includes: the first pressing plate arm is used for pressing the first power structure, the second pressing plate arm is used for pressing the second power structure, and the pressing plate body is located between the first power structure and the second power structure.

Specifically, the first power structure has a first connection foot, the second power structure has a second connection foot, the first connection foot and the second connection foot are respectively located on opposite outer sides of the first power structure and the second power structure, and the wafer body is located between opposite inner sides of the first power structure and the second power structure.

Optionally, the tablet body is formed into a recessed groove structure recessed toward the first side surface, the opening of the tablet body faces away from the first side surface, the first and second tablet arms are respectively connected to two ends of the opening of the tablet body, and the first and second tablet arms extend in directions away from each other.

According to some embodiments of the present invention, the busbar comprises: first female arranging, the female row of second and the female row of third, the one end of first female arranging is provided with the female switching end plate that arranges of first, the female one end of arranging of second is provided with the female switching end plate that arranges of second, first female arranging the switching end plate with the female switching end plate that arranges of second is located same end and sets up side by side, the female other end that arranges with the female switching end plate of first is provided with the female switching end plate that arranges of third.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a perspective assembly view of a power unit;

FIG. 2 is an assembled side view of the power unit;

FIG. 3 is a perspective exploded schematic view of the power unit;

FIG. 4 is an exploded side view of the power unit;

FIG. 5 is a perspective view of a wafer configuration;

FIG. 6 is an exploded isometric view of the power cell assembly;

FIG. 7 is a perspective assembled schematic view of the power cell assembly;

FIG. 8 is an assembled side view of the power cell assembly;

FIG. 9 is a schematic diagram of the connection of the power structure and the three-layer bus bar;

fig. 10 is a schematic perspective exploded view of the power unit, the second busbar and the third busbar;

fig. 11 is a schematic perspective view illustrating the assembly of the power unit with the second bus bar and the third bus bar;

fig. 12 is a schematic perspective exploded view of the power unit and the third busbar;

fig. 13 is a schematic perspective assembly view of the power unit and the third busbar;

fig. 14 is an exploded perspective view of the power unit assembly and the driving circuit board;

FIG. 15 is a perspective view of the power cell assembly and the driver circuit board;

FIG. 16 is an assembled side view of the power cell assembly and the drive circuit board;

FIG. 17 is an assembled schematic view of the frequency converter power module of the first embodiment;

18-19 are exploded schematic views of the frequency converter power assembly of the first embodiment;

FIG. 20 is a schematic diagram of the connection of capacitors to a power module;

FIG. 21 is a perspective view of the mounting bracket of the first embodiment;

FIG. 22 is a right side view of the mounting bracket of the first embodiment;

FIGS. 23-24 are cross-sectional views A '-A', B '-B' of FIG. 22, respectively;

FIG. 25 is a front view of the mount of the first embodiment;

FIGS. 26-28 are cross-sectional views of C '-C', D '-D', E '-E' of FIG. 25, respectively;

FIG. 29 is an assembled schematic view of a frequency converter power module of the second embodiment;

FIG. 30 is an exploded schematic view of a frequency converter power assembly of the second embodiment;

FIG. 31 is a perspective view of the mounting bracket of the second embodiment;

FIG. 32 is a right side view of the mounting bracket of the second embodiment;

FIGS. 33-34 are cross-sectional views A-A, B-B, respectively, of FIG. 32;

FIG. 35 is a front view of the mounting bracket of the second embodiment;

FIGS. 36-39 are cross-sectional views C-C, D-D, E-E, F-F, respectively, of FIG. 35;

40-41 are assembly schematic diagrams of a third embodiment of a frequency converter power assembly;

42-43 are exploded schematic views of a frequency converter power assembly of a third embodiment;

FIG. 44 is a perspective view of the mounting bracket of the third embodiment;

FIG. 45 is an S-directional view of the mount of the third embodiment;

FIG. 46 is a sectional view A "-A", respectively, of FIG. 45;

FIG. 47 is a T-view of the mount of the third embodiment;

FIG. 48 is a cross-sectional view B "-B" of FIG. 47;

FIG. 49 is an R-view of the mount of the third embodiment;

FIGS. 50-51 are assembly schematic diagrams of a frequency converter power assembly of a fourth embodiment;

fig. 52-53 are exploded schematic views of a frequency converter power assembly of a fourth embodiment.

Reference numerals:

power module 10000, power unit assembly 1000, power unit 100, substrate 10, tablet structure 20, tablet body 21, tablet body positioning hole 211, tablet arm 22, first tablet arm 221, second tablet arm 222, tablet connecting portion 23, bending section 24, power structure 30, first power structure 31, first connecting foot 311, second power structure 32, second connecting foot 321, first pin 331, second pin 332, third pin 333, holding structure 45, first holding structure 40, second holding structure 50, positioning sheet 60, positioning port 61, annular positioning rib 62, positioning sheet through hole 63, heat insulation structure 60', first busbar 201, first busbar connecting portion 2011, first busbar adapter end plate 2012, first busbar body 2013, first busbar connecting portion through hole 2014, second busbar 202, second busbar connecting portion 2021, second busbar adapter end plate 2022, second busbar body 2023, and first busbar body 2023, A second busbar connection through hole 2024, a third busbar 203, a first busbar connection 2031, a third busbar adapter end plate 2032, a third busbar body 2033, a third busbar connection through hole 2034, and a driving circuit board 2000;

frequency converter power assembly 20000, mounting bracket 3000, capacitor 3003, first terminal 30031, second terminal 30032, first pole plate 3006, first pole piece 30061, first bolt 30062, first capacitor connection portion 30063, second pole plate 3007, second pole piece 30071, second bolt 30072, second capacitor connection portion 30073, positioning boss 3008, first terminal plate 3017, first terminal piece 30171, second terminal plate 3018, second terminal piece 30181, mounting chassis 4001, first chassis 40011, first chassis interface 400111, second chassis 40012, second chassis interface 400121, mounting arm 4002, divider 40021, 400fin 22, arm first interface 40023, arm second interface 40024, mounting top frame 4003, capacitor support element 4004, cooling cavity 4005, chassis cooling cavity 40051, cooling cavity 40052, arm inlet cavity 400521, arm outlet cavity 400522, arm sub-cavity 400523, top frame cooling cavity 40053, first cooling cavity 40054, second cooling cavity 40055, cooling cavity 40055, A first medium port 4006, a second medium port 4007, and a seal ring 4008.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The power module 10000 according to an embodiment of the present invention is described in detail below with reference to fig. 1 to 16.

Referring to fig. 1 to 4 and fig. 6 to 16, a power module 10000 according to an embodiment of the present invention may include: power cell assembly 1000 and driver circuit board 2000, optionally, driver circuit board 2000 is located above power cell assembly 1000.

Wherein, the power unit assembly 1000 may include: power unit 100, a plurality of female arranging that set up in layers, power unit 100 can include: a substrate 10, a wafer structure 20, and a power structure 30, wherein a first side (i.e. the upper side in fig. 2) of the substrate 10 has a first side surface, the wafer structure 20 is located on the first side of the substrate 10, and the power structure 30 is pressed against the first side surface of the substrate 10 by the wafer structure 20.

By pressing the power structure 30 against the first side of the substrate 10 by the pressing structure 20, the power structure 30 can be firmly and reliably mounted on the substrate 10.

The power structure 30 has a plurality of pins, and the pins are connected to the corresponding bus bars and electrically insulated from the other bus bars, so that the pins and the other bus bars can be ensured to have good insulation performance. The pins and the corresponding busbars can be connected through punching or can be directly connected.

According to the utility model discloses power module 10000, power structure 30 is pressed by sheeting structure 20 and supports on base plate 10, and power structure 30's pin is connected with female the arranging of correspondence and arranges electrical insulation with other, whole power module 10000 compact structure, integrated level height.

Referring to fig. 1-5, the power unit 100 further includes: a retaining structure 45, the retaining structure 45 being arranged to retain the wafer structure 20 on the first side of the substrate 10.

Referring to fig. 1-5, the retaining structure 45 includes: the first holding structure 40, the first holding structure 40 extends from the substrate 10 to a direction away from the first side surface, and the first holding structure 40 penetrates through the wafer structure 20, the wafer structure 20 is held on the first side of the substrate 10 by the first holding structure 40, and the power structure 30 is held on the first side of the substrate 10 by the wafer structure 20 pressing against the power structure 30. In other words, referring to fig. 2, the first holding structure 40 penetrates the wafer structure 20 from bottom to top, the wafer structure 20 is held on the first side of the substrate 10 by the first holding structure 40, that is, when the first holding structure 40 penetrates the wafer structure 20, the relative position between the wafer structure 20 and the substrate 10 is determined, and the first holding structure 40 can play a role in positioning the wafer structure 20.

In some embodiments, not shown, the wafer structure 20 may also be directly attached, e.g., soldered, to the substrate 10, while the retaining structure 45 is eliminated, thereby advantageously reducing the number of connecting components and thus the weight of the power unit 100.

Further, referring to fig. 1-4, the retaining structure 45 further comprises: a second retaining structure 50, the second retaining structure 50 being adapted to engage the first retaining structure 40 to retain the wafer structure 20 on the first side of the substrate 10. The second retaining structure 50 is connected to the first retaining structure 40 on the side of the wafer structure 20 facing away from the substrate 10. As shown in fig. 2, the second holding structure 50 is connected to the first holding structure 40 at the upper side of the tablet structure 20, and the upper side of the tablet structure 20 is open to leave an operation space for mounting and dismounting the second holding structure 50. The wafer structure 20 is clamped between the second holding structure 50 and the substrate 10, while the power structure 30 is clamped between the wafer structure 20 and the substrate 10.

In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Further, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the embodiment shown in fig. 1-4, the first retaining structure 40 is configured as a cylindrical structure, the second retaining structure 50 is configured as a ring structure that is sleeved on the cylindrical structure, and the wafer structure 20 is clamped between the second retaining structure 50 and the substrate 10 to prevent the wafer structure 20 from being separated from the substrate 10.

Specifically, the first retaining structure 40 is perpendicular to the first side of the substrate 10, and the first retaining structure 40 has a free end away from the substrate 10, and the second retaining structure 50 is rotatably sleeved on the first retaining structure 40 from the side of the tabletting structure 20 away from the substrate 10, thereby facilitating quick connection or disconnection between the second retaining structure 50 and the first retaining structure 40.

In some alternative embodiments, the first retaining structure 40 is configured as a threaded rod having external threads, and the second retaining structure 50 is configured as a nut having internal threads, the nut being threadably engaged with the threaded rod to facilitate installation and removal of the wafer structure 20.

Referring to fig. 1-4, the second holding structure 50 is pressed against the side of the tablet structure 20 away from the substrate 10, and the second holding structure 50 can apply a pressing force to the tablet structure 20 toward the substrate 10, so as to prevent the tablet structure 20 from shaking, and thus, the connection between the tablet structure 20 and the substrate 10 is more reliable.

Referring to fig. 1 to 5, the tablet structure 20 includes: preforming body 21, preforming body 21 form towards the sunken groove body structure of first side, and the opening of preforming body 21 deviates from first side. Referring to fig. 2 and 4, the tablet body 21 is formed into a recessed groove structure recessed downward, and the opening of the tablet body 21 faces upward.

Further, at least a part of the second holding structure 50 is located in the recessed groove of the tablet body 21, and an end surface of the first holding structure 40 away from the free end of the substrate 10 (i.e., an upper end surface of the first holding structure 40) is also located in the recessed groove, so that a distance between the end surface of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, and a distance between the second holding structure 50 and the substrate 10 can be shortened, so that the holding structures 45 are located in the recessed groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, which is convenient for reserving an installation space for other components, and preventing mutual interference during installation.

In the embodiment shown in fig. 2, the second holding structure 50 is entirely located in the concave groove, and the upper end surface of the first holding structure 40 is also located in the concave groove, whereby the size of the power unit 100 in the height direction can be further reduced.

Referring to fig. 2, the overlapping dimension of the second holding structure 50 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the second holding structure 50, thereby ensuring that the second holding structure 50 is located in the recessed groove of the tablet body 21 as much as possible, and further reducing the distance between the second holding structure 50 and the substrate 10.

Referring to fig. 1-3 and 5, the second holding structure 50 is pressed against the bottom wall of the tablet body 21, the first holding structure 40 penetrates through the bottom wall of the tablet body, and a tablet body positioning hole 211 adapted to the first holding structure 40 is formed in the bottom wall of the tablet body, after the first holding structure 40 penetrates through the tablet body positioning hole 211 in the bottom wall of the tablet body, the tablet structure 20 can be initially positioned, so that the second holding structure 50 can be used to fix the tablet structure 20 subsequently.

Referring to fig. 5, the tablet structure 20 includes: a blade body 21 and a blade arm 22, the blade arm 22 being connected to the blade body 21, and as shown in fig. 1-2, the blade arm 22 being configured to press against the power structure 30, the power structure 30 being clamped between the blade structure 20 and the substrate 10.

Referring to fig. 1-4, the power structure 30 may include: a first power structure 31 and a second power structure 32, the first power structure 31 and the second power structure 32 being spaced apart. The presser arm 22 includes: a first pressing arm 221 and a second pressing arm 222, wherein the first pressing arm 221 is used for pressing against the first power structure 31, the second pressing arm 222 is used for pressing against the second power structure 32, the pressing body 21 is located between the first power structure 31 and the second power structure 32, and the retaining structure 45 is also located between the first power structure 31 and the second power structure 32.

Further, the first power structure 31 has a first connection leg 311, the second power structure 32 has a second connection leg 321, the first connection leg 311 and the second connection leg 321 are respectively located at opposite outer sides of the first power structure 31 and the second power structure 32, and the tablet body 21 is located between opposite inner sides of the first power structure 31 and the second power structure 32.

Alternatively, the angle between the extending direction of the first connecting leg portion 311 from the first power structure 31 and the extending direction of the second connecting leg portion 321 from the second power structure 32 is 180 degrees. That is to say, the pins of the first connecting leg portion 311 and the second connecting leg portion 321 are disposed outward, so as to leave a middle space between the first power structure 31 and the second power structure 32, and facilitate the holding structure 45 to fix the wafer structure 20 on the substrate 10 from the middle space.

The pins of the first and second

connection leg portions

311 and 321 each include: the first pin 331, the second pin 332, and the third pin 333, each of which is adapted to be electrically connected to the driving circuit board 2000 or a corresponding bus bar.

Referring to fig. 2 and 4, the extending direction of the first connecting leg 311 from the first power structure 31 is leftward, the extending direction of the second connecting leg 321 from the second power structure 32 is rightward, and an included angle therebetween is 180 degrees, so that it is avoided that the first connecting leg 311 and the second connecting leg 321 are closer to each other when the first connecting leg 311 and the second connecting leg 321 face each other, and the first power structure 31 and the second power structure 32 are interfered with each other. Meanwhile, when the first power structure 31 and the second power structure 32 are connected to the corresponding bus bar or the driving circuit board 2000, the first connecting leg 311 and the second connecting leg 321 both face outward, so that the space is sufficient, and the corresponding operation is convenient.

Referring to fig. 1 and 3, the first power structures 31 and the second power structures 32 are spaced apart, for example, arranged oppositely, in a first direction of the substrate 10, the first power structures 31 are plural, the plurality of first power structures 31 are arranged on the substrate 10 in a second direction of the substrate 10, the plurality of second power structures 32 are plural, the plurality of second power structures 32 are arranged on the substrate 10 in the second direction, the plurality of wafer structures 20 are plural, and the plurality of wafer structures 20 are arranged in the second direction, wherein the first direction and the second direction are perpendicular to each other. The retaining structure 45 is configured to retain a plurality of sheeting structures 20 on a first side of the base sheet 10. When the substrate 10 is rectangular, the first direction may be a width direction of the substrate 10, and the second direction may be a length direction of the substrate 10.

Further, the plurality of first power structures 31, the plurality of pad structures 20, and the plurality of second power structures 32 correspond one-to-one in the first direction. A pair of first power structures 31 and second power structures 32, which are oppositely disposed, can be pressed against the substrate 10 by the same wafer structure 20.

In some embodiments, not shown, the plurality of sheeting structures 20 may be separate entities.

In the embodiment shown in fig. 1, 3 and 5, the plurality of wafer structures 20 are connected into a whole through the wafer connecting portion 23, so that the assembling process of the plurality of wafer structures 20 is saved, and the assembling efficiency of the power unit 100 is improved. Meanwhile, the tabletting structures 20 connected into a whole can simultaneously press a plurality of power structures 30, and the pressing efficiency is high. The integrated wafer structure 20 is pressed against the base plate 10 by two or more retaining structures 45.

Further, the tablet connecting portion 23 is connected between the tablet bodies 21 of two adjacent tablet structures 20, and the width of the tablet connecting portion 23 may be equal to the width of the tablet body 21.

In the embodiment shown in fig. 1, 3, 5, the wafer structure 20 comprises: the first holding structure 40 penetrates through the pressing body 21, the pressing arm 22 is connected with the pressing body 21 in parallel in the first direction of the substrate 10, and the pressing arm 22 is used for pressing against the power structure 30; the tablet structures 20 are plural, and the plurality of tablet structures 20 are connected to each other in a second direction of the substrate 10, the first direction and the second direction being perpendicular to each other.

Further, the arm 22 may include: the first pressing arm 221 and the second pressing arm 222 are symmetrically connected to two sides of the pressing body 21; the tablet bodies 21 of two adjacent tablet structures 20 are connected to each other by a tablet connecting portion 23.

Referring to fig. 2, 4 and 5, the tablet body 21 is formed in a concave groove structure that is concave toward the first side surface, the opening of the tablet body 21 faces away from the first side surface, the first and

second tablet arms

221 and 222 are respectively connected to both ends of the opening of the tablet body 21, and the first and

second tablet arms

221 and 222 extend in directions away from each other. Referring to fig. 2 and 4, the tablet body 21 is formed into a recessed groove structure recessed downward, the opening of the tablet body 21 faces upward, the first tablet arm 221 extends leftward, and the second tablet arm 222 extends rightward.

In some optional embodiments, the power unit 100 of the power module 10000 may further include: the positioning part is used for positioning the power structure 30 on the substrate 10, thereby ensuring the accurate position of the power structure 30 on the substrate 10 and preventing the power structure 30 from shaking arbitrarily on the substrate 10.

In the embodiment shown in fig. 1-4, the positioning portion includes a positioning plate 60, and a through positioning hole 61 is formed on the positioning plate 60, and the positioning hole 61 is matched with the power structure 30. For example, the outer peripheral surface of the power structure 30 and the positioning opening 61 are rectangular, the power structure 30 is positioned in the positioning opening 61, the bottom of the power structure 30 is directly attached to the substrate 10, the substrate 10 may be a metal substrate 10, the heat of the power structure 30 may be transferred to the substrate 10, and a cooling device or a heating device may be disposed below the substrate 10 to cool or heat the power structure 30.

Optionally, as shown in fig. 3-4, the positioning plate 60 is further provided with an annular positioning rib 62 surrounding the positioning hole 61, and the annular positioning rib 62 is matched with the outer peripheral surface of the power structure 30. The annular positioning rib 62 protrudes out of the surface of the positioning plate 60, so that the positioning firmness of the power structure 30 can be increased, and the positioning effect is good.

In the embodiment shown in fig. 1-4, the positioning sheet 60 is an insulating positioning sheet, and the positioning sheet 60 is adhesively fixed to the first side of the substrate 10.

Referring to fig. 1 and 3, the splines 60 are provided with splines through holes 63 for mating with the first retaining structures 40 and allowing the first retaining structures 40 to pass through to form a locating fit, and after the first retaining structures 40 pass through the splines through holes 63, the splines 60 may be initially located. The first holding structure 40 is connected to the second holding structure 50 after passing through the positioning piece through hole 63 of the positioning piece 60 and the pressing piece positioning hole 211 of the pressing piece body 21, thereby fixing the positioning piece 60 and the pressing piece structure 20 between the second holding structure 50 and the substrate 10.

In some optional embodiments, the power unit 100 may further include: the heat insulation structure 60' is disposed on the first side of the substrate 10 in a manner of surrounding the power structure 30. The heat insulation structure 60 'is located between the power structure 30 and the substrate 10, and the heat insulation structure 60' can separate the power structure 30 from the substrate 10, so as to prevent the heat of the power structure 30 from affecting the components below the substrate 10, and at the same time, prevent the heat below the substrate 10 from being upwardly transferred to the power structure 30.

In some alternative embodiments, the first side of the substrate 10 is the side facing the busbar.

Referring to fig. 2, 4 and 5, the wafer structure 20 is configured as a gull wing type, and the wafer structure 20 may include a wafer body 21, a first wafer arm 221 and a second wafer arm 222, the first wafer arm 221 and the second wafer arm 222 are symmetrically connected to both sides of the wafer body 21, and free ends of the first wafer arm 221 and the second wafer arm 222 are provided with a bent section 24 bent toward the substrate 10. The bending section 24 is adapted to press against the power structure 30, so that the power structure 30 is pressed against the substrate 10.

A larger planar space is formed above the wafer structure 20, so as to leave an installation space for other components (for example, the busbar), and the dimensions of the power unit 100 and the busbar assembly in the height direction can be significantly reduced.

The pressing arm 22 and the substrate 10 form a power structure installation space therebetween, and the power structure 30 is adapted to be installed in the power structure installation space.

Referring to fig. 6 to 16, the power structure 30 has a plurality of pins, such as a first pin 331, a second pin 332, and a third pin 333 of the first connection pin 311 and the second connection pin 321, at least one pin is connected to the bus bar passing through only one layer of bus bar, and the at least one pin is staggered from and electrically insulated from other bus bars. That is to say, the at least one pin does not need to pass through other busbars, and only needs to punch on the perforated busbar to enable the at least one pin to penetrate through the hole, so that the number of punched holes on other busbars is reduced, and the production process of the power unit assembly 1000 is simplified. Meanwhile, the at least one pin is staggered with other busbars, so that the good insulation performance between the at least one pin and the other busbars can be ensured.

The pin is connected with the busbar which is penetrated through in a manner of penetrating only one layer of busbar, and the pin is staggered with other busbars, so that the punching quantity of other busbars can be reduced, the production and manufacturing processes of the busbars are simplified, and the pin and other busbars are favorably ensured to have better electrical insulation performance.

In some optional embodiments, the busbar has a busbar connection portion, at least one pin of the power unit 100 is connected to the busbar in a manner of penetrating only one layer of the busbar connection portion, and the busbar connection portion is configured in a sheet shape. That is to say, for the busbar, the busbar connecting part is only arranged at the position required to be connected with the pin, and the solid structure is not arranged at the position staggered with the pin, so that the material of the busbar is saved, and the cost is saved.

Optionally, the busbar and the corresponding busbar connecting part are on the same plane, so that the busbar structure is simplified, the processing and manufacturing of the busbar are facilitated, and the stray inductance is reduced.

Optionally, the busbar and the corresponding busbar connecting part are formed through a blanking process, the blanking process is simple, the efficiency is high, and the processing time of the busbar is favorably shortened.

In some optional embodiments, the busbar connection portion protrudes out of at least one side edge of the corresponding busbar, and the busbar connection portion is directly connected with the corresponding busbar, in other words, the busbar connection portion is connected with the corresponding busbar without other connecting pieces, so that the simple structure of the busbar can be ensured, the simplification of the processing procedure of the busbar is facilitated, and the reduction of stray inductance is facilitated.

In some optional embodiments, the busbar connecting portion is provided with a busbar connecting portion through hole for allowing the pin to pass through. The pins of the power structure 30 extend into the through holes of the corresponding busbar connecting portions and are electrically connected with the busbar in which the busbar connecting portions are located.

In some optional embodiments, in two busbar connecting portions corresponding to two adjacent pins, the busbar connecting portion through hole on one busbar connecting portion is located outside the outline of the other busbar connecting portion, so that each pin is only connected with the busbar connecting portion through hole on the corresponding busbar connecting portion, and is not connected with the busbar connecting portion through holes on the other busbar connecting portions. It should be noted that "two adjacent pins" referred to herein may be two adjacent pins of the same power structure 30, or two adjacent pins of different power structures 30.

In some alternative embodiments, referring to fig. 6 to 13, two pins in the same power structure 30 are respectively connected to the busbar connection portions of two corresponding busbars, and each pin is connected to only the corresponding busbar connection portion in a penetrating manner. Referring to fig. 14-16, the remaining one pin in the same power structure 30 is adapted to be connected to a driver circuit board 2000.

Referring to fig. 6 to 9, the bus bar includes: the bus bar comprises a first bus bar 201, a second bus bar 202 and a third bus bar 203, wherein the first bus bar 201 comprises a first bus bar body 2013, the second bus bar 202 comprises a second bus bar body 2023, and the third bus bar 203 comprises a third bus bar body 2033; female connecting portion that arranges includes: the bus bar comprises a first bus bar connecting part 2011, a second bus bar connecting part 2021 and a third bus bar connecting part 2031, wherein the first bus bar connecting part 2011 is connected with a first bus bar body 2013 of the first bus bar 201, the second bus bar connecting part 2021 is connected with a second bus bar body 2023 of the second bus bar 202, and the third bus bar connecting part 2031 is connected with a third bus bar body 2033 of the third bus bar 203.

The first busbar connection portion 2011 is located on one side of the first busbar 201, the second busbar connection portion 2021 is located on the other side of the second busbar 202 opposite to the first busbar connection portion 2011, and the third busbar connection portions 2031 are located on two sides of the third busbar 203 respectively.

In some alternative embodiments, as shown with reference to fig. 6, the power structure 30 includes: the pin of the first power structure 31 and the pin of the second power structure 32 are located on opposite outer sides of the first power structure 31 and the second power structure 32, respectively, the pin of the first power structure 31 is a first connection pin 311, the pin of the second power structure 32 is a second connection pin 321, and the first connection pin 311 and the second connection pin 321 both include a first pin 331, a second pin 332, and a third pin 333.

The pins 311 of the first power structure 31 are located on the first side (for example, the left side in fig. 6) together with the first busbar connection 2011 and the third busbar connection 2031 on the first side of the busbar on the third busbar 203, and the pins 321 of the second power structure 32 are located on the second side (for example, the right side in fig. 6) together with the second busbar connection 2021 and the third busbar connection 2031 on the second side of the busbar on the third busbar 203.

The first busbar connecting portion 2011 is provided with a first busbar connecting portion through hole 2014, the second busbar connecting portion 2021 is provided with a second busbar connecting portion through hole 2024, and the third busbar connecting portion 2031 is provided with a third busbar connecting portion through hole 2034.

Specifically, referring to fig. 6 to 9 and 13 to 16, the first pin 331 of the first connecting leg portion 311 is adapted to penetrate through the third busbar connecting through hole 2034 on the third busbar connecting portion 2031 to achieve connection with the third busbar 203; the second pin 332 of the first connection leg 311 is adapted to penetrate through the driving circuit board 2000 to realize connection with the driving circuit board 2000; the third pin 333 of the first connecting leg 311 is adapted to penetrate through the first busbar connecting portion through hole 2014 of the first busbar connecting portion 2011, so as to connect with the first busbar 201.

Similarly, referring to fig. 10 to 16, the first pin 331 of the second connecting leg portion 321 is adapted to penetrate through the second busbar connecting through hole 2024 of the second busbar connecting portion 2021 to connect with the second busbar 202; the second pin 332 of the second connection leg 321 is adapted to penetrate through the driving circuit board 2000 to realize connection with the driving circuit board 2000; the third pin 333 of the second connecting leg 321 is adapted to penetrate through the third busbar connecting through hole 2034 on the third busbar connecting portion 2031, so as to connect with the third busbar 203. The third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 on the first side of the busbar on the third busbar 203 is staggered from the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 on the second side of the busbar on the third busbar 203. Referring to fig. 10, a line of the third busbar connecting portion through holes 2034 on two sides of the third busbar 203 is not parallel to a short side of the third busbar 203.

The stacking positions of the first busbar 201, the second busbar 202 and the third busbar 203 can be changed according to actual requirements. For example, the third busbar 203 may be located above the first busbar 201 and the second busbar 202, or located between the first busbar 201 and the second busbar 202.

Further, any one of the two pins in the same power structure 30 is connected to the corresponding busbar connection portion and is adjacent to or spaced apart from the other busbar connection portion side by side.

As shown in fig. 6 to 7, the first pin 331 of the first connection leg 311 is connected to the third busbar connection portion 2031 and spaced apart from the first busbar connection portion 2011, and the third pin 333 of the first connection leg 311 is connected to the first busbar connection portion 2011 and spaced apart from the third busbar connection portion 2031; the first pin 331 of the second connecting leg portion 321 is connected to the second busbar connecting portion 2021 and spaced apart from the third busbar connecting portion 2031, and the third pin 333 of the second connecting leg portion 321 is connected to the third busbar connecting portion 2031 and spaced apart from the second busbar connecting portion 2021.

In some optional embodiments, any one of the two pins in the same power structure 30 is connected to a corresponding busbar connection portion, and the busbar connection through hole on one busbar connection portion is located outside the outline of the other busbar connection portion. As shown in fig. 6-7, the first pin 331 of the first connecting leg 311 is connected to the third busbar connecting portion 2031, and the third busbar connecting portion via 2034 on the third busbar connecting portion 2031 is located outside the outline of the first busbar connecting portion 2011; the third pin 333 of the first connecting leg 311 is connected to the first busbar connection 2011, and the first busbar connection through-hole 2014 of the first busbar connection 2011 is located outside the contour of the third busbar connection 2031; the first pin 331 of the second connecting leg portion 321 is connected to the second busbar connecting portion 2021, and the second busbar connecting portion through hole 2024 on the second busbar connecting portion 2021 is located outside the contour of the third busbar connecting portion 2031; the third pin 333 of the second connecting leg 321 is connected to the third busbar connecting portion 2031, and the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 is located outside the outline of the second busbar connecting portion 2021.

Referring to fig. 14 to 16, the remaining pin of the same power structure 30 is adapted to be connected to the driving circuit board 2000, and the remaining pin is directly connected to the driving circuit board 2000 without being blocked by a bus bar connecting portion. For example, the second pin 332 of the first power structure 31 is connected to the driving circuit board 2000, and there is no busbar connection portion between the second pin 332 of the first power structure 31 and the driving circuit board 2000; the second pin 332 of the second power structure 32 is connected to the driving circuit board 2000, and there is no shielding of the bus bar connecting portion between the second pin 332 of the second power structure 32 and the driving circuit board 2000.

In some alternative embodiments, referring to fig. 1, 3, 6-7, 9-11, and 15, the same power structure 30 has a first pin 331, a second pin 332, and a third pin 333, where the third pin 333 is located between the first pin 331 and the second pin 332, and referring to fig. 2, 4, 8, and 16, the third pin 333 is located outside the first pin 331 and the second pin 332 with respect to the power structure 30, and the pins are arranged in a staggered manner, which is beneficial to properly arranging the connection points of the power structure 30 to the corresponding bus bars. A gap between the first pin 331 and the second pin 332 allows a bus bar connecting part to be inserted, and the bus bar connecting part is penetratingly connected with the third pin 333.

For example, a gap between the first pin 331 and the second pin 332 of the first power structure 31 allows the first bus bar connection 2011 to be inserted, and the first bus bar connection 2011 is penetratingly connected with the third pin 333 of the first power structure 31. A gap between the first pin 331 and the second pin 332 of the second power structure 32 allows the third busbar connection portion 2031 to be inserted, and the third busbar connection portion 2031 is penetratingly connected with the third pin 333 of the second power structure 32.

Further, the busbar connection portions penetrating the first pins 331 and the busbar connection portions penetrating the third pins 333 are partially stacked or staggered in the stacking direction of the plurality of busbars, for example, as shown in fig. 6 to 7, the third busbar connection portion 2031 penetrating the first pins 331 of the first power structure 31 and the first busbar connection portion 2011 penetrating the third pins 333 are partially stacked or staggered in the stacking direction of the plurality of busbars; the second bus bar connection portion 2021 penetrating the first pin 331 of the second power structure 32 and the third bus bar connection portion 2031 penetrating the third pin 333 are partially stacked or staggered in the stacking direction of the plurality of bus bars. Due to the design, welding points of the power structure and the metal busbar are located at the position where the edge of the busbar protrudes, welding heat can be well kept at the welding points when a traditional welding process is used, and the threshold of the production process is lower, so that the power structure and the metal busbar can be produced in a large scale by using the traditional process.

Referring to fig. 14-16, the second pin 332 of the first power structure 31 and the second pin 332 of the second power structure 32 are both adapted to be directly connected to the driving circuit board 2000.

Specifically, one of the first busbar 201 and the second busbar 202 is a positive busbar and the other is a negative busbar. The third busbar 203 is a phase row. For example, the first busbar 201 is a positive busbar and the second busbar 202 is a negative busbar, or the first busbar 201 is a negative busbar and the second busbar 202 is a positive busbar.

Further, the power unit assembly 1000 may further include: a bus bar clamp (not shown) for clamping the first bus bar 201 and the second bus bar 202 is favorable for the first bus bar 201 and the second bus bar 202 to be attached, and the distance between the first bus bar 201 and the second bus bar 202 can be shortened, so that the height dimension of the power unit assembly 1000 is further shortened.

In the embodiment shown in fig. 6-16, each of the first busbar 201, the second busbar 202 and the third busbar 203 is rectangular, and the first busbar 201, the second busbar 202 and the third busbar 203 are stacked in the thickness direction of the busbars, and busbar connection portions are formed on the longitudinal long sides of the corresponding busbars. Specifically, the first busbar connection portion 2011 is formed on the first side longitudinal long edge of the first busbar 201, the second busbar connection portion 2021 is formed on the second side longitudinal long edge of the second busbar 202, and the third busbar connection portion 2031 is formed on the both side longitudinal long edges of the third busbar 203.

Referring to fig. 6-7 and 9-13, a first busbar adapter end plate 2012 is disposed at one end of the first busbar 201, a second busbar adapter end plate 2022 is disposed at one end of the second busbar 202, the first busbar adapter end plate 2012 and the second busbar adapter end plate 2022 are disposed at the same end and are arranged side by side, and a third busbar adapter end plate 2032 is disposed at the other end of the third busbar 203 opposite to the first busbar adapter end plate 2012, thereby facilitating the rational arrangement of the adapter end plates of the busbars.

In some optional embodiments, the first busbar 201, the second busbar 202, and the third busbar 203 are all flat busbars, thereby facilitating further reduction of the size of the power unit assembly 1000 in the height direction.

In some embodiments, which may not be shown, a through slot allowing the pin to pass through is formed in the busbar connection portion, and the through slot extends in a direction away from the busbar and penetrates through an outer edge of the busbar connection portion away from the busbar. For example, the through slot may be a "U" shaped slot with an outward opening, thereby facilitating the insertion and removal of the pins through and out of the through slot.

In some optional embodiments, the surface of the busbar is entirely covered with an insulating film.

In other optional embodiments, the busbar comprises: the female body of arranging and female connecting portion of arranging, female connecting portion protrusion of arranging corresponds female at least one side edge of arranging and female connecting portion of arranging with correspond female the arranging and directly link to each other, the surface cladding of arranging connecting portion has the insulating film, two adjacent female row's female body separate each other. That is to say, can only be in female the surface cladding of arranging connecting portion have the insulating film, and the surface of arranging the body can not wrap the insulating film, only need guarantee two adjacent female arranging the body separate each other can, be favorable to saving the material of insulating film from this.

In further alternative embodiments, the busbar comprises: the female body of arranging, the whole cladding of surface of female body of arranging has the insulating film, like this, when a plurality of female row range upon range of when arranging, insulating properties is good between two adjacent female arranging.

Further, the busbar also includes: the female connecting portion that arranges, female connecting portion protrusion correspond female at least one side edge of arranging the body and female connecting portion and correspond female the body and directly link to each other of arranging, and the whole cladding of the surface of female arranging the body and female connecting portion has the insulating film, and insulating film can prevent that female arranging from producing the electricity with other pins of power structure 30 and being connected to two adjacent female row between insulating properties better.

Referring to fig. 6 to 16, busbar bodies of two adjacent busbars are at least partially stacked, thereby facilitating reduction in size of the power module 10000.

The following describes the frequency converter power assembly 20000 according to an embodiment of the present invention in detail with reference to fig. 17-53.

Referring to fig. 17-19, fig. 29-30, fig. 40-43, and fig. 50-53, a frequency converter power assembly 20000 according to an embodiment of the present invention may include: mounting bracket 3000, power module 10000 and electric capacity 3003, power module 10000 installs on mounting bracket 3000 for power module 10000 arranges the compactness, and then makes whole converter power component 20000 compact structure, and electric capacity 3003 is connected with power module 10000 electricity.

According to the utility model discloses converter power component 20000, through installing power module 10000 on mounting bracket 3000, be connected electric capacity 3003 and power module 10000 electricity again, can make whole converter power component 20000 simple structure, compactness, arrange rationally.

In the embodiment shown in fig. 17-39, 50-53, the mounting bracket 3000 may include: mounting chassis 4001 and at least one mounting arm 4002, mounting arm 4002 sets up on mounting chassis 4001, and power module 10000 is installed on mounting arm 4002.

In the embodiment shown in fig. 17-39, mounting arm 4002 extends from mounting chassis 4001. In some embodiments, the bottom of the mounting arm 4002 may be secured to the mounting chassis 4001 using a bolt fastener or may be integrally formed with the mounting chassis 4001.

Further, as shown in fig. 21-28, cooling cavities 4005 are disposed in the mounting arm 4002 and the mounting base frame 4001 and are in communication with each other, and a cooling medium is adapted to flow through the cooling cavities 4005 to remove heat generated by the power module 10000 during operation, so as to prevent the power module 10000 from being damaged due to overheating. The cooling cavity 4005 is disposed in the mounting bracket 3000, and cooling parts may not be additionally disposed, so that the structure of the frequency converter power assembly 20000 is more compact.

Alternatively, the cooling medium may be a cooling liquid or a cooling gas. Under some cold operating modes, the cooling cavity 4005 can be filled with a medium with a higher temperature, so that the power module 10000 can be heated, the power module 10000 is in a suitable temperature environment, and the service life of the power module 10000 is prolonged. For convenience of description, the cooling cavity 4005 is filled with a low-temperature cooling medium.

Specifically, the cooling cavity 4005 includes: a chassis cooling cavity 40051 located in the mounting chassis 4001 and an arm cooling cavity 40052 located in the mounting arm 4002, the arm cooling cavity 40052 being in communication with the chassis cooling cavity 40051, a cooling medium being adapted to circulate in the arm cooling cavity 40052 and the chassis cooling cavity 40051 to carry away heat of the power module 10000.

As shown in fig. 18-19, the connection of the mounting arm 4002 to the mounting chassis 4001 may be provided with a seal 4008 to prevent leakage of a cooling medium from the connection.

Further, as shown in fig. 22 to 23, a partition plate 40021 is provided in the cavity of the arm cooling cavity 40052, the partition plate 40021 divides the arm cooling cavity 40052 into an arm inlet cavity 400521 and an arm outlet cavity 400522, and the partition plate 40021 is separated from the inner ceiling wall of the arm cooling cavity 40052 so that the arm inlet cavity 400521 and the arm outlet cavity 400522 communicate with each other at the top of the arm cooling cavity 40052. The cooling medium within chassis cooling cavity 40051 of mounting chassis 4001 flows into mounting arm 4002 via arm inlet cavity 400521 and from mounting arm 4002 via arm outlet cavity 400522 into chassis cooling cavity 40051.

Specifically, a first medium port 4006 and a second medium port 4007 which communicate with the chassis cooling cavity 40051 are provided in the mounting chassis 4001, and one of the first medium port 4006 and the second medium port 4007 is a medium inlet and the other is a medium outlet. The cooling medium flows into the chassis cooling cavity 40051 through the medium inlet, and the cooling medium in the chassis cooling cavity 40051 flows out of the mounting chassis 4001 through the medium outlet.

Optionally, a series media path is formed between first media port 4006, chassis cooling cavity 40051, arm inlet cavity 400521, arm outlet cavity 400522, and second media port 4007. A cooling medium circulates in the medium passage to take away heat of the power module 10000.

Specifically, a plurality of mounting arms 4002 are provided, and the arm outlet chamber 400522 of the mounting arm 4002 located on the upstream side of the medium passage communicates with the arm inlet chamber 400521 of the mounting arm 4002 adjacent on the downstream side via the chassis cooling chamber 40051. As shown in fig. 23, there are three mounting arms 4002, first medium port 4006 is a medium inlet, and second medium port 4007 is a medium outlet. Series-connected medium passages are formed among the first medium, the chassis cooling chamber 40051, the arm inlet chamber 400521 and the arm outlet chamber 400522 of the first mounting arm 4002, the chassis cooling chamber 40051, the arm inlet chamber 400521 and the arm outlet chamber 400522 of the second mounting arm 4002, the chassis cooling chamber 40051, the arm inlet chamber 400521 and the arm outlet chamber 400522 of the third mounting arm 4002, the chassis cooling chamber 40051 and the second medium port 4007. Specifically, the cooling medium flowing in from first medium port 4006 reaches chassis cooling chamber 40051, and then enters arm inlet chamber 400521 of first mounting arm 4002, and then flows into chassis cooling chamber 40051 through arm outlet chamber 400522, the cooling medium in chassis cooling chamber 40051 enters arm inlet chamber 400521 of second mounting arm 4002, and then flows into chassis cooling chamber 40051 through arm outlet chamber 400522, the cooling medium in chassis cooling chamber 40051 enters arm inlet chamber 400521 of third mounting arm 4002, and then flows into chassis cooling chamber 40051 through arm outlet chamber 400522, and the cooling medium in chassis cooling chamber 40051 finally flows out through second medium port 4007.

In some embodiments, not shown, parallel media paths may also be formed between first media port 4006, chassis cooling cavity 40051, arm inlet cavity 400521, arm outlet cavity 400522, and second media port 4007. Specifically, the cooling medium flowing in from first medium port 4006 reaches chassis cooling chamber 40051, and then enters arm inlet chamber 400521 of first mounting arm 4002, arm inlet chamber 400521 of second mounting arm 4002, and arm inlet chamber 400521 of third mounting arm 4002, and further flows into chassis cooling chamber 40051 through arm outlet chamber 400522 of first mounting arm 4002, arm outlet chamber 400522 of second mounting arm 4002, and arm outlet chamber 400522 of third mounting arm 4002, and finally flows out through second medium port 4007 in chassis cooling chamber 40051.

Referring to fig. 18-19, the mounting bracket 3000 further includes: and a capacitor support member 4004, one end of the capacitor support member 4004 being fixed to the mounting arm 4002 and the other end being adapted to support the capacitor 3003. The capacitance support element 4004 includes: cylindrical electric capacity supporting part and the support arm connecting portion of "U" shape, electric capacity supporting part are located the top of support arm connecting portion, and support arm connecting portion stride and establish on installation support arm 4002, and electric capacity supporting part is used for supporting electric capacity 3003.

In the embodiment shown in fig. 29-39, the mounting bracket 3000 may further comprise: a mounting top frame 4003, the mounting top frame 4003 being arranged on top of the mounting arm 4002, and the mounting top frame 4003 being adapted to support a capacitor 3003, a power module 10000 being located between the mounting top frame 4003 and the mounting base frame 4001, in other words, the power module 10000 being mounted on the mounting arm 4002 between the mounting top frame 4003 and the mounting base frame 4001. In some embodiments, the top of the mounting arm 4002 may be secured to the mounting top frame 4003 using a bolt fastener, or may be integrally formed with the mounting top frame 4003.

Further, as shown in fig. 30 and 33, cooling cavities 4005 are provided in the mounting top frame 4003, the mounting arm 4002 and the mounting base frame 4001, and are communicated with each other, and a cooling medium is adapted to flow through the cooling cavities 4005 to remove heat generated by the power module 10000 during operation, so as to prevent the power module 10000 from being damaged due to overheating.

Specifically, the cooling cavity 4005 includes: a chassis cooling cavity 40051 located in the mounting chassis 4001, a top frame cooling cavity 40053 located in the mounting top frame 4003, and an arm cooling cavity 40052 located in the mounting arm 4002, the arm cooling cavity 40052 being in communication with the top frame cooling cavity 40053 and the chassis cooling cavity 40051, a cooling medium being adapted to circulate in the top frame cooling cavity 40053, the arm cooling cavity 40052, and the chassis cooling cavity 40051 to carry away heat of the power module 10000.

Referring to fig. 30, the joints of the mounting arms 4002 with the mounting base frame 4001 and the mounting top frame 4003 may be provided with a packing 4008 to prevent a cooling medium from leaking from the joints.

In some embodiments, not shown, the arm cooling cavity 40052 is a single channel cavity structure.

In the embodiment shown in fig. 33, a partition plate 40021 is disposed in the cavity of the arm cooling cavity 40052, the partition plate 40021 divides the arm cooling cavity 40052 into a plurality of arm subchambers 400523, and each arm subchamber 400523 is in communication with the top frame cooling cavity 40053 and the bottom frame cooling cavity 40051. For example, the partition plate 40021 may divide the arm cooling cavity 40052 into two arm branch cavities 400523, and when the power modules 10000 are installed on two opposite sides of the left and right sides of the installation arm 4002, each power module 10000 may be attached to the arm branch cavity 400523, so that the arm branch cavity 400523 takes away heat corresponding to the power module 10000. Meanwhile, the support arm cooling cavity 40052 is divided into a plurality of support arm sub-cavities 400523, which is beneficial to increasing the flow rate of the cooling medium, so that the heat of the power module 10000 can be taken away more quickly.

The mounting base frame 4001 is provided with a first medium port 4006 communicating with the base frame cooling cavity 40051, the mounting top frame 4003 is provided with a second medium port 4007 communicating with the top frame cooling cavity 40053, one of the first medium port 4006 and the second medium port 4007 is a medium inlet, and the other is a medium outlet. The cooling medium flows into the cooling cavity 4005 through the medium inlet, and the cooling medium in the cooling cavity 4005 flows out of the mounting bracket 3000 through the medium outlet.

Optionally, a series-connected media passage is formed between second media port 4007, top frame cooling cavity 40053, arm cooling cavity 40052, chassis cooling cavity 40051, and first media port 4006. A cooling medium circulates in the medium passage to take away heat of the power module 10000.

Further, there are a plurality of mounting arms 4002, the bottom ends of arm cooling cavities 40052 of mounting arms 4002 communicating with second medium port 4007 communicate with the bottom ends of arm cooling cavities 40052 of adjacent mounting arms 4002 through chassis cooling cavities 40051, the top ends of arm cooling cavities 40052 of mounting arms 4002 communicating with first medium port 4006 communicate with the top ends of arm cooling cavities 40052 of adjacent mounting arms 4002 through top frame cooling cavities 40053, and the arm cooling cavities 40052 of two other adjacent mounting arms 4002 communicate in series through top frame cooling cavities 40053 at the top ends or through chassis cooling cavities 40051 at the bottom ends.

It should be noted that, here, two adjacent mounting arms 4002 are directed to the flow direction of the same serial media path, and one of the two adjacent mounting arms 4002 is located on the upstream side of the media path, and the other is located on the downstream side of the media path.

Optionally, the first medium port 4006 is a medium inlet, the second medium port 4007 is a medium outlet, and the cooling medium flows from bottom to top, so that the whole cooling cavity 4005 is filled with the cooling medium. In the embodiment shown in fig. 33, there are three mounting arms 4002, second medium port 4007 communicates with the top end of arm cooling chamber 40052 of first mounting arm 4002 via top frame cooling chamber 40053, the bottom end of arm cooling chamber 40052 of first mounting arm 4002 communicates with the bottom end of arm cooling chamber 40052 of second mounting arm 4002 via bottom frame cooling chamber 40051, the top end of arm cooling chamber 40052 of second mounting arm 4002 communicates with the top end of arm cooling chamber 40052 of third mounting arm 4002 via top frame cooling chamber 40053, and the bottom end of arm cooling chamber 40052 of third mounting arm 4002 communicates with first medium port 4006 via bottom frame cooling chamber 40051.

The cooling medium flowing in from the first medium port 4006 reaches the base frame cooling cavity 40051, flows in through the bottom end of the arm cooling cavity 40052 of the third mounting arm 4002, further flows in through the top end of the arm cooling cavity 40052 of the third mounting arm 4002 and further flows in the top frame cooling cavity 40053, the cooling medium in the top frame cooling cavity 40053 flows in through the top end of the arm cooling cavity 40052 of the second mounting arm 4002, further flows in the base frame cooling cavity 40051 through the bottom end of the arm cooling cavity 40052 of the second mounting arm 4002, the cooling medium in the base frame cooling cavity 40051 flows in through the bottom end of the arm cooling cavity 40052 of the first mounting arm 4002, further flows in the top frame cooling cavity 40053 through the top end of the arm cooling cavity 40052 of the first mounting arm 4002, and finally flows out through the second medium port 4007 in the top frame cooling cavity 40053.

In some embodiments, not shown, parallel media passages may be formed between second media port 4007, top frame cooling cavity 40053, arm cooling cavity 40052, chassis cooling cavity 40051, and first media port 4006. Specifically, the cooling medium flowing in from the first medium port 4006 reaches the underframe cooling chamber 40051, then enters the arm part chamber 400523 of the first mounting arm 4002, the arm part chamber 400523 of the second mounting arm 4002, and the arm part chamber 400523 of the third mounting arm 4002, and further flows into the top frame cooling chamber 40053, and the cooling medium in the top frame cooling chamber 40053 finally flows out through the second medium port 4007.

Of course, in some alternative embodiments, the first medium port 4006 may be a medium outlet, and the second medium port 4007 may be a medium inlet, where the flow path of the cooling medium is opposite to the above path, and will not be described herein again.

Optionally, the mounting top frame 4003 is parallel to the mounting bottom frame 4001, as shown in fig. 31-33, which is beneficial to ensure consistent distance between the mounting top frame 4003 and the mounting bottom frame 4001, and facilitates the installation of the power module 10000 without distinction.

Optionally, the mounting arm 4002 is perpendicular to the mounting base frame 4001, as shown in fig. 21-23 and 31-33, which is beneficial to ensure consistent space on both sides of the mounting arm 4002 and facilitate the installation of the power module 10000 without distinction.

Referring to fig. 24-28 and 34-39, a plurality of fins 40022 are arranged in the cavity of the arm cooling cavity 40052, one end of each of the plurality of fins 40022 is connected to the partition plate 40021, the other end of each of the plurality of fins 40022 is connected to the cavity wall of the arm cooling cavity 40052, and two adjacent fins 40022 surround the cavity walls of the partition plate 40021 and the arm cooling cavity 40052 to form a fin sub-cavity. The cooling medium circulates in the fin subchamber to take away heat of the power module 10000. The sectional area of each fin cavity is small, so that the speed of cooling media is increased.

Optionally, the plurality of fins 40022 are parallel to each other. Preferably, the distance between two adjacent fins 40022 is consistent, so that the cross-sectional area of each fin sub-cavity is consistent, and the flow rate of the cooling medium is consistent.

In the embodiment shown in fig. 50-53, the mounting chassis 4001 comprises: a first base frame 40011 and a second base frame 40012, and a mounting arm 4002 is arranged on the first base frame 40011 and the second base frame 40012 in a bridging manner.

Further, cooling cavities that communicate with each other are provided in the mounting arm 4002, the first chassis 40011, and the second chassis 40012.

Specifically, the cooling chamber includes: a first cooling cavity in the first base frame 40011, a second cooling cavity in the second base frame 40012, and an arm cooling cavity in the mounting arm 4002, the first cooling cavity and the arm cooling cavity being in communication with the second cooling cavity.

Referring to fig. 50, a first medium port 4006 communicating with the first cooling chamber is provided in the first chassis 40011, a second medium port 4007 communicating with the second cooling chamber is provided in the second chassis 40012, and one of the first medium port 4006 and the second medium port 4007 is a medium inlet and the other is a medium outlet.

Optionally, the mounting arm 4002 is multiple, and multiple arm cooling cavities are arranged in parallel between the first cooling cavity and the second cooling cavity.

Referring to fig. 52, a first chassis interface 400111 communicating with the first cooling chamber is provided on the first chassis 40011, a second chassis interface 400121 communicating with the second cooling chamber is provided on the second chassis 40012, a first arm interface 40023 and a second arm interface 40024 communicating with the arm cooling chamber are provided on the mounting arm 4002, the first arm interface 40023 communicates with the first chassis interface 400111, and the second arm interface 40024 communicates with the second chassis interface 400121.

Taking first medium port 4006 as a medium inlet and second medium port 4007 as a medium outlet as an example, the cooling medium flows into the first cooling cavity in first chassis 40011 through first medium port 4006, then flows into each arm cooling cavity through each first chassis interface 400111 and corresponding arm first interface 40023, then flows into the second cooling cavity in second chassis 40012 through corresponding arm second interface 40024 and second chassis interface 400121, and finally flows out through second medium port 4007.

A seal 4008 may be provided between the arm first interface 40023 and the first chassis interface 400111 to prevent leakage of a cooling medium from a joint between the mounting arm 4002 and the first chassis 40011, and a seal 4008 may be provided between the arm second interface 40024 and the second chassis interface 400121 to prevent leakage of a cooling medium from a joint between the mounting arm 4002 and the second chassis 40012.

As shown in fig. 17 to 19, 29 to 30, and 50 to 53, at least one of two oppositely disposed sides of each mounting arm 4002 is mounted with a power module 10000. For example, the power modules 10000 may be mounted on only one side of the mounting arm 4002, or the power modules 10000 may be mounted on both sides of the mounting arm 4002 facing away from each other, which is beneficial to increase the number of the power modules 10000.

One of the mounting arm 4002 and the power module 10000 is provided with a positioning protrusion 3008, and the other is provided with a positioning groove adapted to be in positioning fit with the positioning protrusion 3008, as shown in fig. 21 and 31, the positioning protrusion 3008 is provided on the mounting arm 4002, thereby positioning and mounting the power module 10000 on the mounting arm 4002.

Referring to fig. 17-19, 29-30, and 50-53, the capacitor 3003 is located on top of the mounting bracket 3000.

Further, the frequency converter power component 20000 may further include: the first plate 3006 and the second plate 3007, the first plate 3006 and the second plate 3007 are disposed at an end of the power module 10000, and both the power module 10000 and the capacitor 3003 are electrically connected to the first plate 3006 and the second plate 3007. In other words, the first plate 3006 and the second plate 3007 are components for electrically connecting the power module 10000 and the capacitor 3003, and the first plate 3006 and the second plate 3007 are provided to indirectly electrically connect the power module 10000 and the capacitor 3003. The first plate 3006 may be disposed on a side of the second plate 3007 facing away from the mounting bracket 3000.

Further, the capacitance 3003 may be one or more. The capacitor 3003 has a first terminal adapted to be electrically connected to the first plate 3006 and a second terminal adapted to be electrically connected to the second plate 3007. The first terminal and the second terminal of the capacitor 3003 are conductive portions, and other portions of the capacitor 3003 have insulating surfaces to improve the safety of the capacitor 3003 in use.

Further, the first plate 3006 is provided with a first capacitor connecting portion 30063, and the first terminal is electrically connected to the first capacitor connecting portion 30063; the second plate 3007 is provided with a second capacitor connecting portion 30073, and a second terminal is electrically connected to the second capacitor connecting portion 30073. When the terminal is electrically connected with the corresponding capacitor connecting part, in some optional embodiments, the end part of the terminal can be directly attached to the conductive part on the surface of the capacitor connecting part, so that the terminal is electrically connected with the corresponding capacitor connecting part; in other alternative embodiments, the capacitor connecting portion may be provided with a terminal hole, and the terminal may penetrate through the terminal hole and be electrically connected to a hole wall of the terminal hole, so as to electrically connect the terminal to the capacitor connecting portion. Of course, the terminals and the corresponding capacitor connecting portions may be connected by wires.

Specifically, as shown in fig. 18 to 19, 30, and 50 to 53, the first and second

capacitor connecting parts

30063 and 30073 are configured as a plate-shaped structure between the capacitor 3003 and the mounting bracket 3000. The first capacitor connection part 30063 may be perpendicular to the first plate 3006, and the second capacitor connection part 30073 may be perpendicular to the second plate 3007. And the first capacitor connecting part 30063 and the first plate 3006 may be formed by bending one plate, and the second capacitor connecting part 30073 and the second plate 3007 may be formed by bending one plate.

Referring to fig. 6, 17 to 19, 29 to 30, and 50 to 53, the power module 10000 includes a first busbar 201 and a second busbar 202, the first busbar 201 is electrically connected to the first plate 3006, and the second busbar 202 is electrically connected to the second plate 3007.

Further, a first pole piece 30061 is arranged on the first pole plate 3006, the first pole piece 30061 extends out towards the power module 10000, and the first pole piece 30061 is suitable for being electrically connected with the first busbar 201; the second plate 3007 is provided with a second tab 30071, the second tab 30071 extends toward the power module 10000, and the second tab 30071 is adapted to be electrically connected to the second busbar 202.

The first capacitor connecting portion 30063 and the first pole piece 30061 of the first pole plate 3006, and the second capacitor connecting portion 30073 and the second pole piece 30071 of the second pole plate 3007 are conductive portions, and other portions may have insulating surfaces to improve the safety of the first pole plate 3006 and the second pole plate 3007.

Further, the first busbar 201 is provided with a first busbar adapter end plate 2012, and the first pole piece 30061 is fixedly connected with the first busbar adapter end plate 2012 through a first bolt 30062, so as to electrically connect the first pole piece 30061 with the first busbar adapter end plate 2012. The second busbar 202 has a second busbar adapter end plate 2022, and the second pole piece 30071 is fixedly connected to the second busbar adapter end plate 2022 by a second bolt 30072, so as to electrically connect the second pole piece 30071 to the second busbar adapter end plate 2022.

The number of the power modules 10000 is the same as that of the first pole piece 30061 and that of the second pole piece 30071.

In some embodiments, not shown, the mounting rack 3000 has a plurality of mounting areas located in the same plane, a plurality of power modules 10000 are tiled at the corresponding mounting areas, and the capacitor 3003 is disposed on a side of the plurality of power modules 10000 facing away from the mounting rack 3000.

In the embodiment shown in fig. 40-49, the mounting bracket 3000 is configured as a flat mounting bracket, and at least one of the two oppositely disposed sides of the mounting bracket 3000 is mounted with a power module 10000. For example, the power modules 10000 may be mounted on only one side of the mounting rack 3000, or as shown in fig. 40 to 43, the power modules 10000 are mounted on two sides of the mounting rack 3000, which are disposed away from each other, which is beneficial to increase the number of the power modules 10000.

Specifically, two sides that set up dorsad are the biggest side of the area of the mounting bracket 3000 shown, can provide great space for installing power module 10000 from this, like this, can realize the installation of a plurality of power module 10000 on same mounting bracket 3000 to promote the capacity of converter power component 20000.

Optionally, one of the at least one side surface and the power module 10000 is provided with a positioning protrusion 3008, and the other side surface is provided with a positioning groove adapted to be in positioning fit with the positioning protrusion 3008. Referring to fig. 44-45 and 49, two oppositely disposed side surfaces of the mounting rack 3000 are respectively provided with a positioning protrusion 3008, so as to position the power module 10000, and realize the positioning and mounting of the power module 10000 on the mounting rack 3000.

Referring to fig. 44-49, the mounting bracket 3000 has a cooling cavity 4005 therein, and a cooling medium is adapted to flow through the cooling cavity 4005 to remove heat generated by the power module 10000 during operation, so as to prevent the power module 10000 from being damaged due to overheating. The cooling cavity 4005 is disposed in the mounting bracket 3000, and cooling parts may not be additionally disposed, so that the structure of the frequency converter power assembly 20000 is more compact.

Further, as shown in fig. 44-45 and fig. 48-49, a partition plate 40021 is provided in the cavity of the cooling cavity 4005, the partition plate 40021 partitions the cooling cavity 4005 into a first cooling subchamber 40054 and a second cooling subchamber 40055, and the partition plate 40021 is separated from the other inner side wall (e.g., the left side wall in fig. 49) of the cooling cavity 4005 so that the first cooling subchamber 40054 and the second cooling subchamber 40055 communicate with each other at the side of the cooling cavity 4005.

Further, as shown in fig. 44 to 49, the mounting bracket 3000 is provided with a first medium port 4006 communicating with the first cooling subchamber 40054 and a second medium port 4007 communicating with the second cooling subchamber 40055, wherein one of the first medium port 4006 and the second medium port 4007 is a medium inlet, and the other is a medium outlet. For example, when first medium port 4006 is a medium inlet and second medium port 4007 is a medium outlet, the cooling medium flows into first cooling subchamber 40054 through first medium port 4006, flows into second medium port 4007 through second cooling subchamber 40055, and finally flows out from second medium port 4007.

Optionally, a series of media passages are formed between first media port 4006, first cooling subchamber 40054, second cooling subchamber 40055 and second media port 4007. A cooling medium circulates in the medium passage to take away heat of the power module 10000.

In the embodiment shown in fig. 49, the first cooling subchamber 40054 is located above the second cooling subchamber 40055, and in some embodiments not shown, the first cooling subchamber 40054 and the second cooling subchamber 40055 can also be arranged in the same plane.

Referring to fig. 44 to 48, a plurality of fins 40022 are disposed in a cavity of the cooling cavity 4005, one end of each of the plurality of fins 40022 is connected to the partition plate 40021, the other end of each of the plurality of fins 40022 is connected to a cavity wall of the cooling cavity 4005, and a fin sub-cavity is formed between two adjacent fins 40022. The cooling medium circulates in the fin subchamber to take away heat of the power module 10000. The sectional area of each fin cavity is small, so that the speed of cooling media is increased.

Optionally, the capacitor 3003 is located at the top or bottom of the mounting bracket 3000. In the embodiment shown in fig. 40-43, the capacitor 3003 is located on top of the mounting bracket 3000.

Referring to fig. 40-43, the frequency converter power assembly 20000 may further include: the first plate 3006 and the second plate 3007, the first plate 3006 and the second plate 3007 are disposed at an end of the power module 10000, and both the power module 10000 and the capacitor 3003 are electrically connected to the first plate 3006 and the second plate 3007. In other words, the first plate 3006 and the second plate 3007 are components for electrically connecting the power module 10000 and the capacitor 3003, and the first plate 3006 and the second plate 3007 are provided to indirectly electrically connect the power module 10000 and the capacitor 3003. The first plate 3006 may be disposed on a side of the second plate 3007 facing away from the mounting bracket 3000.

Further, as shown in fig. 6, the power module 10000 has a first busbar 201 and a second busbar 202, the first busbar 201 is electrically connected to the first plate 3006, and the second busbar 202 is electrically connected to the second plate 3007.

The first pole plate 3006 is provided with a first pole piece 30061, the first pole piece 30061 extends out towards the power module 10000, and the first pole piece 30061 is suitable for being electrically connected with the first busbar 201; the second plate 3007 is provided with a second tab 30071, the second tab 30071 extends toward the power module 10000, and the second tab 30071 is adapted to be electrically connected to the second busbar 202.

Further, the first busbar 201 is provided with a first busbar adapter end plate 2012, and the first pole piece 30061 is fixedly connected with the first busbar adapter end plate 2012 through a first bolt 30062; the second busbar 202 has a second busbar adapter end plate 2022, and the second pole piece 30071 is fixedly connected to the second busbar adapter end plate 2022 by a second bolt 30072.

The frequency converter power assembly 20000 may further include: a first terminal plate 3017 and a second terminal plate 3018, a capacitor 3003 having a first terminal 30031 and a second terminal 30032, the first terminal 30031 being adapted to be electrically connected to the first terminal plate 3017 and the second terminal 30032 being adapted to be electrically connected to the second terminal plate 3018. The first terminal 30031 and the second terminal 30032 of the capacitor 3003 are conductive portions, and other portions of the capacitor 3003 have insulating surfaces to improve the safety of the capacitor 3003 in use. When the terminal is electrically connected with the corresponding terminal board, in some alternative embodiments, the end of the terminal can be directly attached to the conductive part on the surface of the terminal board, so as to realize the electrical connection between the terminal and the corresponding terminal board; in other alternative embodiments, the terminal board may be provided with a terminal hole, and the terminal may pass through the terminal hole and be electrically connected with a hole wall of the terminal hole, so as to realize the electrical connection between the terminal and the terminal board. Of course, the terminals and the corresponding terminal plates may be connected by wires.

Further, the first plate 3006 is adapted to be electrically connected to the first terminal board 3017, and the second plate 3007 is adapted to be electrically connected to the second terminal board 3018.

Further, the first terminal plate 3017 is electrically connected to the first pole plate 3006 through the first pole piece 30061, and the second terminal plate 3018 is electrically connected to the second pole plate 3007 through the second pole piece 30071.

Referring to fig. 40-43, mount 3000 has a mount first side facing capacitor 3003, on which power module 10000 is disposed; the first terminal plate 3017 is provided with a first terminal sheet 30171, the first terminal sheet 30171, a first pole piece 30061 extending towards the first side surface of the mounting rack, and a first busbar adapter end plate 2012 on the first side surface of the mounting rack are fixedly connected through a first bolt 30062; the second terminal plate 3018 has a second terminal piece 30181, the second terminal piece 30181, a second pole piece 30071 extending toward the first side surface of the mounting block, and a second bus bar adapter end plate 2022 on the first side surface of the mounting block are fixedly connected by a second bolt 30072.

Further, the mount 3000 has a mount second side facing away from the capacitor 3003, on which the power module 10000 is disposed; the first pole piece 30061 extending towards the second side surface of the mounting bracket and the first busbar adapter end plate 2012 on the second side surface of the mounting bracket are fixedly connected through a first bolt 30062, and the second pole piece 30071 extending towards the second side surface of the mounting bracket and the second busbar adapter end plate 2022 on the second side surface of the mounting bracket are fixedly connected through a second bolt 30072.

In some embodiments, not shown, the power module 10000 may be disposed only on the second side of the mounting rack, and the power module 10000 is not disposed on the first side of the mounting rack, in which case, the first terminal sheet 30171 and the first pole sheet 30061 extending towards the first side of the mounting rack are fixedly connected by the first bolt 30062; the second terminal plate 3018 has a second terminal piece 30181, the second pole piece 30071 that stretches out towards the first side of the mounting bracket are fixedly connected through the second bolt 30072; the first pole piece 30061 extending towards the second side surface of the mounting bracket and the first busbar adapter end plate 2012 on the second side surface of the mounting bracket are fixedly connected through a first bolt 30062, and the second pole piece 30071 extending towards the second side surface of the mounting bracket and the second busbar adapter end plate 2022 on the second side surface of the mounting bracket are fixedly connected through a second bolt 30072.

The base plate 10 of the power module 10000 may be mounted on the mounting bracket 3000, or the base plate 10 may be a part of the mounting bracket 3000.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims

1. A frequency converter power assembly, comprising:

a mounting block having a cooling cavity therein;

a power module mounted on the mounting bracket;

a capacitor electrically connected with the power module.

2. The frequency converter power assembly of claim 1, wherein the mounting bracket comprises: the power module comprises a mounting bottom frame and at least one mounting support arm, wherein the mounting support arm is arranged on the mounting bottom frame, and the power module is mounted on the mounting support arm.

3. The frequency converter power assembly of claim 2, wherein said mounting chassis is a one-piece chassis, said mounting arms extending from said mounting chassis.

4. The frequency converter power assembly of claim 3, wherein said cooling cavities are disposed in said mounting arms and said mounting chassis in communication with one another.

5. The frequency converter power assembly of claim 4, wherein the cooling cavity comprises: the cooling device comprises a bottom frame cooling cavity positioned in the installation bottom frame and a support arm cooling cavity positioned in the installation support arm, wherein the support arm cooling cavity is communicated with the bottom frame cooling cavity.

6. The frequency converter power assembly according to claim 5, wherein a divider plate is disposed within the cavity of the arm cooling cavity, the divider plate dividing the arm cooling cavity into an arm inlet cavity and an arm outlet cavity, the divider plate being separate from an inner top wall of the arm cooling cavity such that the arm inlet cavity and the arm outlet cavity are in communication at a top of the arm cooling cavity.

7. The frequency converter power assembly of claim 6, wherein said mounting chassis is provided with a first media port and a second media port in communication with said chassis cooling cavity, one of said first media port and said second media port being a media inlet and the other being a media outlet.

8. The frequency converter power assembly of claim 7, wherein said first media port, said chassis cooling cavity, said boom inlet cavity, said boom outlet cavity, and said second media port form a serial media path therebetween.

9. The frequency converter power assembly of claim 8, wherein said mounting arms are plural, and said arm exit cavity of said mounting arm on an upstream side of said media path communicates with said arm entrance cavity of said mounting arm adjacent to a downstream side of said media path via said chassis cooling cavity.

10. The frequency converter power assembly of claim 2, wherein the mounting bracket further comprises: and one end of the capacitor supporting element is fixed on the mounting support arm, and the other end of the capacitor supporting element is suitable for supporting the capacitor.

11. The frequency converter power assembly of claim 2, wherein the mounting bracket further comprises: the installation top frame is arranged at the top of the installation support arm and is suitable for supporting the capacitor, and the power module is located between the installation top frame and the installation bottom frame.

12. The frequency converter power assembly of claim 11, wherein said cooling cavities are disposed in said mounting top frame, said mounting arms, and said mounting bottom frame in communication with one another.

13. The frequency converter power assembly of claim 12, wherein said cooling cavity comprises: the installation support arm comprises an installation bottom frame, a bottom frame cooling cavity, a top frame cooling cavity and a support arm cooling cavity, wherein the bottom frame cooling cavity is positioned in the installation bottom frame, the top frame cooling cavity is positioned in the installation top frame, the support arm cooling cavity is positioned in the installation support arm, and the support arm cooling cavity is communicated with the top frame cooling cavity and the bottom frame cooling cavity.

14. The frequency converter power assembly of claim 13, wherein said boom cooling cavity is a single pass cavity configuration.

15. The frequency converter power assembly according to claim 13, wherein a divider plate is disposed in the cavity of the support arm cooling cavity, the divider plate dividing the support arm cooling cavity into a plurality of support arm subchambers, each of the support arm subchambers communicating with the top frame cooling cavity and the bottom frame cooling cavity.

16. The frequency converter power assembly of claim 13, wherein the mounting chassis is provided with a first media port in communication with the chassis cooling cavity, the mounting top frame is provided with a second media port in communication with the top frame cooling cavity, and one of the first media port and the second media port is a media inlet and the other is a media outlet.

17. The frequency converter power assembly of claim 16, wherein said second media port, said top frame cooling cavity, said arm cooling cavity, said base frame cooling cavity, and said first media port form a serial media path therebetween.

18. The frequency converter power assembly according to claim 17, wherein the number of the mounting arms is plural, the bottom end of the cooling cavity of the mounting arm in communication with the second medium port is in communication with the bottom end of the cooling cavity of the mounting arm adjacent to the mounting arm through the bottom frame cooling cavity, the top end of the cooling cavity of the mounting arm in communication with the first medium port is in communication with the top end of the cooling cavity of the mounting arm adjacent to the mounting arm through the top frame cooling cavity, and the cooling cavities of the other two mounting arms adjacent to each other are in series communication through the top frame cooling cavity or through the bottom frame cooling cavity.

19. The frequency converter power assembly of claim 11, wherein the mounting top frame is parallel to the mounting bottom frame.

20. The frequency converter power assembly according to claim 3 or 11, wherein the mounting arms are perpendicular to the mounting chassis.

21. The frequency converter power assembly according to claim 6 or 15, wherein a plurality of fins are arranged in the cavity of the support arm cooling cavity, one end of each fin is connected with the partition plate, the other end of each fin is connected with the cavity wall of the support arm cooling cavity, and a fin sub-cavity is formed between every two adjacent fins.

22. The frequency converter power assembly according to claim 21, wherein a plurality of said fins are parallel to each other.

23. The frequency converter power assembly of claim 2, wherein the mounting chassis comprises: the mounting support arm is arranged on the first underframe and the second underframe.

24. The frequency converter power assembly of claim 23, wherein said mounting arm, said first chassis, and said second chassis have said cooling cavities disposed therein in communication with one another.

25. The frequency converter power assembly of claim 24, wherein said cooling cavity comprises: the cooling device comprises a first cooling cavity, a second cooling cavity and a support arm cooling cavity, wherein the first cooling cavity is positioned in the first chassis, the second cooling cavity is positioned in the second chassis, the support arm cooling cavity is positioned in the mounting support arm, and the first cooling cavity, the support arm cooling cavity and the second cooling cavity are communicated.

26. The frequency converter power assembly of claim 25, wherein said first chassis is provided with a first media port in communication with said first cooling cavity, said second chassis is provided with a second media port in communication with said second cooling cavity, one of said first and second media ports being a media inlet and the other being a media outlet.

27. The frequency converter power assembly according to claim 25, wherein said mounting arm is in plurality, and a plurality of said arm cooling cavities are disposed in parallel between said first cooling cavity and said second cooling cavity.

28. The frequency converter power assembly according to claim 25, wherein the first chassis has a first chassis interface in communication with the first cooling chamber, the second chassis has a second chassis interface in communication with the second cooling chamber, the mounting arm has a first arm interface and a second arm interface in communication with the arm cooling chamber, the first arm interface is in communication with the first chassis interface, and the second arm interface is in communication with the second chassis interface.

29. The frequency converter power assembly according to any one of claims 2-19 or 23-28, wherein at least one of the two oppositely disposed sides of each mounting arm mounts the power module.

30. The frequency converter power assembly according to any one of claims 2-19 or 23-28, wherein one of the mounting arm and the power module is provided with a positioning protrusion and the other is provided with a positioning groove adapted to be in positioning engagement with the positioning protrusion.

31. A frequency converter power assembly according to any one of claims 1 to 19 or 23 to 28, wherein the capacitor is located on top of the mounting bracket.

32. The frequency converter power assembly of claim 31, further comprising: the capacitor comprises a first polar plate and a second polar plate, wherein the first polar plate and the second polar plate are arranged at the end part of the power module, and the power module and the capacitor are electrically connected with the first polar plate and the second polar plate.

33. The converter power assembly of claim 32, wherein said capacitor has a first terminal and a second terminal, said first terminal adapted to be electrically connected to said first plate, said second terminal adapted to be electrically connected to said second plate.

34. The frequency converter power assembly of claim 33, wherein said first plate has a first capacitive connection disposed thereon, said first terminal being electrically connected to said first capacitive connection; and a second capacitor connecting part is arranged on the second polar plate, and the second terminal is electrically connected with the second capacitor connecting part.

35. The frequency converter power assembly of claim 34, wherein the first and second capacitive connection portions are configured as a plate-like structure located between the capacitor and the mounting bracket.

36. The frequency converter power assembly of claim 32, wherein the power module has a first bus bar electrically connected to the first pole plate and a second bus bar electrically connected to the second pole plate.

37. The frequency converter power assembly according to claim 36, wherein a first pole piece is disposed on the first pole plate, the first pole piece protruding toward the power module and adapted to be electrically connected to the first bus bar; and a second pole piece is arranged on the second pole plate, extends towards the power module and is suitable for being electrically connected with the second busbar.

38. The frequency converter power assembly of claim 37, wherein the first busbar has a first busbar adapter end plate, and the first pole piece is fixedly connected to the first busbar adapter end plate by a first bolt; the second busbar is provided with a second busbar switching end plate, and the second pole piece is fixedly connected with the second busbar switching end plate through a second bolt.

39. The frequency converter power assembly according to claim 1, wherein the mount is configured as a flat mount and at least one of two oppositely disposed sides of the mount mounts the power module.

40. The frequency converter power assembly according to claim 39, wherein the two oppositely disposed sides are the sides of the mounting bracket having the largest area.

41. The frequency converter power assembly according to claim 39, wherein one of the at least one side surface and the power module is provided with a positioning protrusion, and the other is provided with a positioning groove adapted to be in positioning engagement with the positioning protrusion.

42. The frequency converter power assembly according to claim 39, wherein a partition plate is disposed in the cavity of the cooling cavity, the partition plate dividing the cooling cavity into a first cooling subchamber and a second cooling subchamber, the partition plate being separated from another inner side wall of the cooling cavity so that the first cooling subchamber and the second cooling subchamber are communicated at a side portion of the cooling cavity.

43. The frequency converter power assembly according to claim 42, wherein the mounting bracket is provided with a first medium port communicating with the first cooling subchamber and a second medium port communicating with the second cooling subchamber, one of the first medium port and the second medium port is a medium inlet, and the other is a medium outlet.

44. The frequency converter power assembly of claim 43, wherein said first media port, said first cooling subchamber, said second cooling subchamber and said second media port form a series media path therebetween.

45. The frequency converter power assembly according to claim 42, wherein a plurality of fins are disposed in the cavity of the cooling cavity, one end of each of the plurality of fins is connected to the partition plate, the other end of each of the plurality of fins is connected to the cavity wall of the cooling cavity, and a fin sub-cavity is formed between two adjacent fins.

46. The frequency converter power assembly according to any one of claims 39-45, wherein the capacitor is located at the top or bottom of the mounting bracket.

47. The frequency converter power assembly according to any one of claims 39-45, further comprising: the capacitor comprises a first polar plate and a second polar plate, wherein the first polar plate and the second polar plate are arranged at the end part of the power module, and the power module and the capacitor are electrically connected with the first polar plate and the second polar plate.

48. The frequency converter power assembly of claim 47, wherein the power module has a first bus bar electrically connected to the first pole plate and a second bus bar electrically connected to the second pole plate.

49. The frequency converter power assembly according to claim 48, wherein a first pole piece is disposed on the first pole plate, the first pole piece protruding toward the power module and adapted to be electrically connected to the first bus bar; and a second pole piece is arranged on the second pole plate, extends towards the power module and is suitable for being electrically connected with the second busbar.

50. The frequency converter power assembly of claim 49, wherein the first busbar has a first busbar adapter end plate, and the first pole piece is fixedly connected to the first busbar adapter end plate by a first bolt; the second busbar is provided with a second busbar switching end plate, and the second pole piece is fixedly connected with the second busbar switching end plate through a second bolt.

51. The frequency converter power assembly of claim 50, further comprising: a first terminal plate and a second terminal plate, the capacitor having a first terminal adapted to be electrically connected with the first terminal plate and a second terminal adapted to be electrically connected with the second terminal plate.

52. The frequency converter power assembly of claim 51, wherein said first plate is adapted to be electrically connected to said first terminal board and said second plate is adapted to be electrically connected to said second terminal board.

53. The frequency converter power assembly of claim 52, wherein said first terminal board is electrically connected to said first pole plate through said first pole piece, and said second terminal board is electrically connected to said second pole plate through said second pole piece.

54. The frequency converter power assembly according to claim 53, wherein the mount has a mount first side facing the capacitor, the power module being disposed on the mount first side;

the first terminal plate is provided with a first terminal piece, the first pole piece extending towards the first side surface of the mounting frame and the first busbar adapter end plate on the first side surface of the mounting frame are fixedly connected through the first bolt; the second terminal plate is provided with a second terminal piece, the second terminal piece and the second busbar adapter end plate are fixedly connected through a second bolt, wherein the second terminal piece extends out of the first side face of the mounting frame, and the second busbar adapter end plate is arranged on the first side face of the mounting frame.

55. The frequency converter power assembly according to claim 54, wherein the mount has a mount second side facing away from the capacitor, the mount second side having the power module disposed thereon;

the first pole piece extending out of the second side face of the mounting frame and the first busbar adapter end plate on the second side face of the mounting frame are fixedly connected through the first bolt; the second pole piece extending towards the second side face of the mounting frame and the second busbar switching end plate on the second side face of the mounting frame are fixedly connected through the second bolt.

56. The frequency converter power assembly according to claim 1, wherein the mounting frame has a plurality of mounting areas located in the same plane, a plurality of the power modules are tiled and mounted at the corresponding mounting areas, and the capacitors are disposed at a side of the plurality of the power modules facing away from the mounting frame.

57. The frequency converter power assembly of claim 1, wherein the power module comprises:

a base plate, the first side of the base plate having a first side, the base plate being mounted on the mount, or the base plate being part of the mount;

a tab structure located on the first side of the substrate;

a plurality of bus bars arranged in a stacked manner;

the power structure is pressed against the first side face by the pressing sheet structure and is provided with a plurality of pins, and the pins are connected with the corresponding busbar and are electrically insulated from other busbars.

58. The frequency converter power assembly according to claim 57, further comprising a retaining structure configured to retain said blade structure on said first side of said base.

59. The frequency converter power assembly of claim 57,

the power structure includes: a first power structure and a second power structure, the first and second power structures spaced apart;

the tablet structure includes: preforming body and preforming arm, the preforming arm connect in the preforming body just is used for the pressure to support the power structure, the preforming arm includes: the first pressing plate arm is used for pressing the first power structure, the second pressing plate arm is used for pressing the second power structure, and the pressing plate body is located between the first power structure and the second power structure.

60. The frequency converter power assembly according to claim 59, wherein the first power structure has a first connection leg and the second power structure has a second connection leg, the first and second connection legs being located on opposite outer sides of the first and second power structures, respectively, and the wafer body being located between opposite inner sides of the first and second power structures.

61. The frequency converter power assembly according to claim 59, wherein the wafer body is formed as a recessed slot structure recessed toward the first side, the opening of the wafer body faces away from the first side, the first and second wafer arms are respectively connected at both ends of the opening of the wafer body, and the first and second wafer arms extend in directions away from each other.

62. The frequency converter power assembly according to claim 57, wherein the busbar comprises: first female arranging, the female row of second and the female row of third, the one end of first female arranging is provided with the female switching end plate that arranges of first, the female one end of arranging of second is provided with the female switching end plate that arranges of second, first female arranging the switching end plate with the female switching end plate that arranges of second is located same end and sets up side by side, the female other end that arranges with the female switching end plate of first is provided with the female switching end plate that arranges of third.