CN212822579U - Mould is used in hardware processing - Google Patents

Mould is used in hardware processing Download PDF

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Publication number
CN212822579U
CN212822579U CN202020861755.1U CN202020861755U CN212822579U CN 212822579 U CN212822579 U CN 212822579U CN 202020861755 U CN202020861755 U CN 202020861755U CN 212822579 U CN212822579 U CN 212822579U
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CN
China
Prior art keywords
fixedly connected
mould
upper portion
die
spring
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202020861755.1U
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Chinese (zh)
Inventor
侯凯强
李永月
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Anhui Shuanghu Intelligent Equipment Co Ltd
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Anhui Shuanghu Intelligent Equipment Co Ltd
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Priority to CN202020861755.1U priority Critical patent/CN212822579U/en
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Publication of CN212822579U publication Critical patent/CN212822579U/en
Expired - Fee Related legal-status Critical Current
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Abstract

The utility model relates to the technical field of mold, and a mould is used in hardware processing is disclosed, the power distribution box comprises a device box body, the upper portion fixedly connected with lower part mould of device box lower part, the downside fixedly connected with telescopic link at device box upper portion middle part, the lower part fixedly connected with upper portion mould of telescopic link, one side fixedly connected with gag lever post on upper portion mould upper portion, the inside fixedly connected with cooling tube way of upper portion mould, one side fixedly connected with lower part loop of upper portion mould lower part. Mould is used in hardware processing through the inside fixedly connected with cooling tube with lower part mould and upper portion mould to pour into the comdenstion water into the inside of cooling tube, make in the use, can directly cool down the processing to the mould is inside, make in the use, can play the speed of cooling faster, simultaneously in the use, stability and practicality when multiplicable device uses.

Description

Mould is used in hardware processing
Technical Field
The utility model relates to the technical field of molds, specifically a mold for hardware processing.
Background
The injection mold is a tool for producing plastic products and also a tool for endowing the plastic products with complete structures and accurate sizes, and the injection molding is a processing method used in batch production of parts with complex shapes.
In the mould for the processing of current hardware, when the material is usually annotated, the material is the high temperature and glues thick material for the temperature is higher, need stew and cool down it, often need consume longer time at the cooling in-process, and need tear the mould open the processing to the device, and is common because inside air content is less, makes model and device lower part mould and upper portion mould in close contact with, makes at the tear the mould in-process, causes certain loaded down with trivial details phenomenon.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a mould is used in hardware processing, possess the advantage of accelerating the cooling rate and conveniently taking out the model after the preparation, when having solved common notes material, the material is the high temperature viscous material, make the temperature higher, need stew and cool down to it, it is common to need consume longer time at the in-process of cooling down, and need tear open the mould to the device and handle, it is common because inside air content is less, make model and device lower part mould and upper portion mould in close contact with, make at the tear open mould in-process, cause the problem of certain loaded down with trivial details phenomenon.
The utility model provides a following technical scheme: the utility model provides a mould for hardware processing, includes the device box, the upper portion fixedly connected with lower part mould of device box lower part, the downside fixedly connected with telescopic link at device box upper portion middle part, the lower part fixedly connected with upper portion mould of telescopic link, one side fixedly connected with gag lever post on upper portion mould upper portion, the inside fixedly connected with cooling duct of upper portion mould, one side fixedly connected with lower part loop of upper portion mould lower part, the inside fixedly connected with middle part bracing piece of lower part mould upper portion one side, the outside of middle part bracing piece lower part is fixed and is cup jointed the spring, one side fixedly connected with sealing washer in upper portion mould lower part middle part, the gasket has been placed to the lower part of sealing washer, the lower part fixedly connected with spring two of gasket, the fixed cover of lower part mould lower, the utility model discloses a support column structure, including support column connecting plate, the support column connecting plate of giving vent to anger, the outside fixedly connected with spring three of support column connecting plate gives vent to anger, the middle part fixedly connected with bracing piece on support column connecting plate upper portion gives vent to anger, the upper portion fixedly connected with upper portion gas leakage baffle of bracing piece, the external fixation of bracing piece has cup jointed spring four, the middle part fixedly connected with pull ring of support column connecting plate lower part gives vent.
Preferably, the telescopic link is a pneumatic telescopic device, can drive the upper mold to ascend and descend, and one side of the upper portion of the upper mold is fixedly connected with a limiting rod which penetrates through the upper portion of the device box body and can move inside the device box body.
Preferably, the cooling pipeline is fixedly connected to the inner parts of the lower mold and the upper mold, the cooling pipeline is fixed to the inner parts of the lower mold and the upper mold, and both ends of the cooling pipeline are connected with the condensed water and the water outlet pipeline, so that the condensed water can be injected into the lower mold and the upper mold in the using process.
Preferably, the lower loop is connected with the middle support rod in a matched manner, the middle support rod is movably sleeved outside the middle support rod, and the middle support rod is movably sleeved with a spring, wherein the spring can elastically support the lower loop.
Preferably, the sealing washer is fixed in the outside at upper portion mould lower part middle part, and the winding has a week, and simultaneously in the use, the gasket has been placed to the lower part, and the gasket joint is in the inside of lower part mould, and lower part fixedly connected with spring two simultaneously, wherein spring two can promote the gasket upwards to contact with the sealing washer.
Preferably, the nut passes the support column connecting plate of giving vent to anger and fixed connection is on the mould of lower part, and fixedly connected with spring three between the lower part of nut and the support column connecting plate of giving vent to anger, and the nut has certain elastic support ability, is giving vent to anger the upper portion fixedly connected with bracing piece of support column connecting plate simultaneously, wherein the upper portion fixedly connected with upper portion gas leakage baffle of bracing piece, and upper portion gas leakage baffle can block up the inside through-hole of lower part mould, and carries out elastic support through spring four between and fixes.
Compared with the prior art, the utility model discloses possess following beneficial effect:
1. this mould is used in hardware processing through the inside fixedly connected with cooling tube with lower part mould and upper portion mould to pour into the comdenstion water into the inside of cooling tube, make in the use, can directly cool down the processing to the mould is inside, make in the use, can play the speed of cooling faster, simultaneously in the use, stability and practicality when multiplicable device uses.
2. This mould is used in hardware processing, through the inside fixedly connected with support column connecting plate of giving vent to anger in lower part mould lower part, and the upper portion fixedly connected with bracing piece and the upper portion gas leakage baffle of the support column connecting plate of giving vent to anger, wherein the device passes through under spring four and the three elastic effects of spring, promote upper portion gas leakage baffle and seal the inside of lower part mould, in the use, the pulling pull ring, make to drive the support column connecting plate downstream that gives vent to anger, it stops contact with the inside upper portion of lower part mould to drive upper portion gas leakage baffle simultaneously, make in the use, make inside and air contact, therefore in the use, play and prevent that inside air is less, make the phenomenon of producing the appeal, therefore in the use, can conveniently demolish the effect to the device.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
fig. 2 is an enlarged schematic view of the structure a of the present invention.
In the figure: 1. a device case; 2. a lower mold; 3. a telescopic rod; 4. an upper mold; 5. a limiting rod; 6. a cooling duct; 7. a lower loop; 8. a middle support bar; 9. a spring; 10. a seal ring; 11. a gasket; 12. a second spring; 13. an air outlet support column connecting plate; 14. a nut; 15. a third spring; 16. a support bar; 17. an upper air leakage baffle; 18. a fourth spring; 19. and (4) a pull ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a mold for hardware processing comprises a device box 1, a lower mold 2 is fixedly connected to the upper part of the lower part of the device box 1, a telescopic rod 3 is fixedly connected to the lower side of the middle part of the upper part of the device box 1, an upper mold 4 is fixedly connected to the lower part of the telescopic rod 3, a limit rod 5 is fixedly connected to one side of the upper part of the upper mold 4, a cooling pipeline 6 is fixedly connected to the inside of the upper mold 4, a lower loop 7 is fixedly connected to one side of the lower part of the upper mold 4, a middle support rod 8 is fixedly connected to the inside of one side of the upper part of the lower mold 2, a spring 9 is fixedly sleeved on the outside of the lower part of the middle support rod 8, a seal ring 10 is fixedly connected to one side of the middle part of the upper mold 4, a gasket, one side fixedly connected with nut 14 of the support column connecting plate of giving vent to anger 13, the three 15 of outside fixedly connected with spring of nut 14, the middle part fixedly connected with bracing piece 16 on the support column connecting plate of giving vent to anger 13 upper portion, the upper portion fixedly connected with upper portion gas leakage baffle 17 of bracing piece 16, the external fixation of bracing piece 16 has cup jointed spring four 18, the middle part fixedly connected with pull ring 19 of the support column connecting plate of giving vent to anger 13 lower part.
Wherein, the telescopic link 3 is the pneumatic telescoping device, can drive upper portion mould 4 and rise and descend, and one side fixedly connected with gag lever post 5 on upper portion 4 of upper portion mould, and gag lever post 5 passes the upper portion of device box 1, and can be at its inside activity, in the use, through telescopic link 3, for telescopic rod structure, make in the use, can drive upper portion mould 4 and stretch out and draw back, make in the use, can coincide and close the device, make in the use, conveniently open the device, make in the use, conveniently take out the inside model of device, one side fixedly connected with gag lever post 5 on 4 upper portions of device upper portion mould simultaneously, make in the use, can fix a position the device, make in the use, can guarantee the stability of device.
Wherein, the inner parts of the lower die 2 and the upper die 4 are fixedly connected with a cooling pipeline 6, the cooling pipeline 6 is fixed in the inner parts of the lower die 2 and the upper die 4, both ends are connected with condensed water and a water outlet pipeline, during the use process, condensed water can be injected into the interior of the material, during the use process, the material is a high-temperature viscous material when the material is injected, so that the temperature is high, the temperature needs to be cooled by standing still, and the long time is consumed in the cooling process, by fixedly connecting the inside of the lower mold 2 and the upper mold 4 with the cooling duct 6, and injecting the inside of the cooling duct 6 with the condensed water, during use, can directly cool down the processing to the mould inside for in the use, the speed that can play the cooling is faster, simultaneously in the use, stability and practicality when multiplicable device uses.
Wherein, the lower part loop 7 is connected with the middle part support bar 8 in a matching way, the middle part support bar 8 is movably sleeved outside the middle part support bar 8, meanwhile, the spring 9 is movably sleeved outside the middle part support bar 8, wherein the spring 9 can perform the function of elastic support to the lower part loop 7, in the using process, the lower part loop 7 and the middle part support bar 8 are connected in a matching way, the middle part support bar 8 is sleeved inside the middle part support bar 8, so that in the using process, the lower part loop can be fixed, the lower part mold 2 and the upper part mold 4 can be perfectly superposed when the device is closed, in the using process, the spring 9 is fixedly connected with the outer part of the middle part support bar 8, so that under the elastic function of the spring 9, the device can be driven to perform upward supporting force, therefore, in the using process, the function of facilitating the device to be disassembled can be performed, therefore, the safety and the practicability of the device in use can be improved in the use process.
Wherein, the sealing ring 10 is fixed outside the middle part of the lower part of the upper die 4, and is wound by a circle, and meanwhile, during the use, the gasket 11 is placed on the lower part, and the gasket 11 is clamped inside the lower die 2, and meanwhile, the lower part is fixedly connected with a spring II 12, wherein the spring II 12 can push the gasket 11 to contact with the sealing ring 10 upwards, during the use, the sealing ring 10 is fixedly connected to the outside of the middle part of the lower part of the upper die 4, and the sealing ring 10 surrounds the middle part of the lower part of the upper die 4, so that during the use, the sealing ring 10 can be used for carrying out superposition sealing between the lower die 2 and the upper die 4, the phenomenon that colloid is exposed during the use of the device is reduced, and meanwhile, during the use, the gasket 11 is fixedly connected with the lower part of the sealing ring 10, and the gasket 11 can be pushed to contact with the lower part of the, so that the sealing of the lower part is ensured during use, and therefore, the sealing performance and the practicability of the device during use can be improved.
Wherein, the nut 14 passes through the air outlet support column connecting plate 13 and is fixedly connected on the lower die 2, a spring III 15 is fixedly connected between the lower part of the nut 14 and the air outlet support column connecting plate 13, the nut 14 has a certain elastic supporting capacity, meanwhile, the upper part of the air outlet support column connecting plate 13 is fixedly connected with a support rod 16, the upper part of the support rod 16 is fixedly connected with an upper air leakage baffle 17, the upper air leakage baffle 17 can block a through hole in the lower die 2 and is elastically supported by a spring IV 18 for fixing, after the use is finished, the device needs to be demoulded, usually, because the content of internal air is less, the die is in close contact with the lower die 2 and the upper die 4 of the device, certain fussy phenomenon is caused in the demould process, therefore, in the use process, the air outlet support column connecting plate 13 is fixedly connected in the lower part of the lower die 2, and the upper portion fixedly connected with bracing piece 16 and upper portion gas leakage baffle 17 of support column connecting plate 13 gives vent to anger, wherein the device passes through under the elastic effect of spring four 18 and spring three 15, promote upper portion gas leakage baffle 17 and seal the inside of lower part mould 2, in the use, pulling pull ring 19, make and drive support column connecting plate 13 that gives vent to anger and move downwards, drive upper portion gas leakage baffle 17 and the inside upper portion of lower part mould 2 simultaneously and stop contacting, make in the use, make inside and air contact, therefore in the use, play and prevent that inside air is less, make the phenomenon that produces the appeal, in the use for this reason, can conveniently demolish the effect to the device.
The working principle is as follows: during the use, will start telescopic link 3, make and drive upper portion mould 4 downstream, lower part loop 7 is fixed cup joints outside middle part bracing piece 8 simultaneously, make and fix a position its position, simultaneously in the use, carry out the injecting glue to the mould inside between lower part mould 2 and the upper portion mould 4, simultaneously add the cooling water in cooling tube 6's inside, make and cool down inside, in the use for this reason, conveniently stereotype the inside mould in space between lower part mould 2 and the upper portion mould 4, after the use simultaneously, the pulling support column connecting plate 13 of giving vent to anger, make and drive upper portion gas leakage baffle 17 downstream, make and let inside model and air contact, start telescopic link 3 simultaneously, can drive upper portion mould 4 rebound, can take out the inside model for this reason.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a mould is used in hardware processing, includes device box (1), its characterized in that: the device is characterized in that a lower part die (2) is fixedly connected to the upper part of the lower part of the device box body (1), a telescopic rod (3) is fixedly connected to the lower side of the middle part of the upper part of the device box body (1), an upper part die (4) is fixedly connected to the lower part of the telescopic rod (3), a limiting rod (5) is fixedly connected to one side of the upper part die (4), a cooling pipeline (6) is fixedly connected to the inside of the upper part die (4), a lower part loop (7) is fixedly connected to one side of the lower part of the upper part die (4), a middle supporting rod (8) is fixedly connected to the inside of one side of the upper part of the lower part die (2), a spring (9) is fixedly sleeved on the outside of the lower part of the middle supporting rod (8), the lower part fixedly connected with spring two (12) of gasket (11), the fixed cover of lower part mould (2) lower part one side has connect support column connecting plate (13) of giving vent to anger, one side fixedly connected with nut (14) of support column connecting plate (13) of giving vent to anger, the three (15) of outside fixedly connected with spring of nut (14), middle part fixedly connected with bracing piece (16) on support column connecting plate (13) upper portion of giving vent to anger, the upper portion fixedly connected with upper portion gas leakage baffle (17) of bracing piece (16), the external fixation of bracing piece (16) has cup jointed spring four (18), the middle part fixedly connected with pull ring (19) of support column connecting plate (13) lower part.
2. The die for hardware processing according to claim 1, characterized in that: the telescopic rod (3) is a pneumatic telescopic device and can drive the upper die (4) to ascend and descend, a limiting rod (5) is fixedly connected to one side of the upper portion of the upper die (4), and the limiting rod (5) penetrates through the upper portion of the device box body (1) and can move inside the device box body.
3. The die for hardware processing according to claim 1, characterized in that: the inside fixedly connected with cooling tube (6) of lower part mould (2) and upper portion mould (4), and cooling tube (6) are fixed in the inside of lower part mould (2) and upper portion mould (4), and both ends are connected with condensate water and outlet conduit, do in the use, can pour into the condensate water into to its inside.
4. The die for hardware processing according to claim 1, characterized in that: the lower part loop (7) is connected with the middle supporting rod (8) in a matched mode, the middle supporting rod (8) is movably sleeved outside the middle supporting rod (8), meanwhile, the spring (9) is movably sleeved outside the middle supporting rod (8), and the spring (9) can elastically support the lower part loop (7).
5. The die for hardware processing according to claim 1, characterized in that: sealing washer (10) are fixed in the outside at upper portion mould (4) lower part middle part, and the winding has a week, and simultaneously in the use, gasket (11) have been placed to the lower part, and gasket (11) joint is in the inside of lower part mould (2), and lower part fixedly connected with spring two (12) simultaneously, and wherein spring two (12) can promote gasket (11) and upwards contact with sealing washer (10).
6. The die for hardware processing according to claim 1, characterized in that: nut (14) pass support column connecting plate (13) and fixed connection of giving vent to anger on lower part mould (2), and fixedly connected with spring three (15) between the lower part of nut (14) and support column connecting plate (13) of giving vent to anger, and nut (14) have certain elastic support ability, simultaneously at upper portion fixedly connected with bracing piece (16) of support column connecting plate (13) of giving vent to anger, wherein upper portion fixedly connected with upper portion gas leakage baffle (17) of bracing piece (16), and upper portion gas leakage baffle (17) can block up the inside through-hole of lower part mould (2), and carry out elastic support through spring four (18) between and fix.
CN202020861755.1U 2020-05-21 2020-05-21 Mould is used in hardware processing Expired - Fee Related CN212822579U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020861755.1U CN212822579U (en) 2020-05-21 2020-05-21 Mould is used in hardware processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020861755.1U CN212822579U (en) 2020-05-21 2020-05-21 Mould is used in hardware processing

Publications (1)

Publication Number Publication Date
CN212822579U true CN212822579U (en) 2021-03-30

Family

ID=75167457

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020861755.1U Expired - Fee Related CN212822579U (en) 2020-05-21 2020-05-21 Mould is used in hardware processing

Country Status (1)

Country Link
CN (1) CN212822579U (en)

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Granted publication date: 20210330