CN212812470U - Vehicle-mounted device - Google Patents

Vehicle-mounted device Download PDF

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Publication number
CN212812470U
CN212812470U CN202021750861.9U CN202021750861U CN212812470U CN 212812470 U CN212812470 U CN 212812470U CN 202021750861 U CN202021750861 U CN 202021750861U CN 212812470 U CN212812470 U CN 212812470U
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air
electronic component
air outlet
heat
vehicle
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CN202021750861.9U
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尹鹏
朱群
向世灿
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Huizhou Boshijie Technology Co ltd
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Huizhou Boshijie Technology Co ltd
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Abstract

The utility model relates to a vehicle-mounted device, which comprises a device shell and electronic components, wherein the electronic components are arranged in a holding cavity arranged inside the device shell; the equipment shell is also provided with a main air inlet and a main air outlet, the main air inlet and the main air outlet are respectively communicated with the accommodating cavity, and the electronic component is arranged at the main air inlet; the vehicle-mounted equipment further comprises a heat absorption fan and an air guide cover, the heat absorption fan and the air guide cover are arranged in the accommodating cavity, the air storage cavity is formed in the heat absorption fan, the heat absorption fan is further provided with an air suction opening and an air outlet, the air suction opening, the air storage cavity and the air outlet are sequentially communicated, the air suction opening faces to the electronic component, and the air guide cover is connected between the air outlet and the main air outlet. Above-mentioned mobile unit, the radiating efficiency is higher, can not make the high temperature of equipment casing moreover, and this kind of radiating mode again requires not high to ambient temperature, also can carry out effectual heat dissipation in high temperature environment, in addition, owing to set up the heat absorption fan, can also take away the dust in the holding chamber when with the hot-air suction.

Description

Vehicle-mounted device
Technical Field
The utility model relates to a radiating technical field of mobile unit especially relates to a mobile unit.
Background
The internal space of the vehicle-mounted equipment is small, but the required functions are multiple, the power of the used internal electronic components is high, the heating sources are multiple, and the internal heat of the equipment is large. The working environment of the equipment is on the center console in the vehicle or embedded into the center console, and the integral temperature of the equipment can be rapidly increased when the equipment is subjected to direct solar radiation. If the electronic components operate at a high temperature for a long time, performance is degraded, thereby accelerating aging of the equipment.
In order to solve the problem of heat dissipation of equipment, the heat dissipation mode of the traditional vehicle-mounted equipment is heat dissipation through heat conduction, and structurally, the heat dissipation mode is characterized in that heat-conducting silica gel is attached to a heating component and is transferred to a shell through the heat-conducting silica gel, the shell becomes a radiator, and heat exchange is carried out between the shell and the atmosphere; this kind of radiating mode, the radiating efficiency is low, because shell heat conduction can make product surface temperature too high, under the outside high temperature environment of direct solar radiation moreover, can make the shell from outside to inside heat conduction, influence the heat dissipation of equipment, ambient temperature must be less than the inside temperature of equipment and can realize effectively dispelling the heat.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide an on-board device for solving the problems that the conventional on-board device has low heat dissipation efficiency and the heat conduction of the housing causes the surface temperature of the product to be too high and is not favorable for heat dissipation in a high-temperature environment.
A vehicle-mounted device comprises a device shell and an electronic component, wherein the electronic component is arranged in an accommodating cavity formed in the device shell,
the equipment shell is also provided with a main air inlet and a main air outlet, the main air inlet and the main air outlet are respectively communicated with the accommodating cavity, and the electronic component is arranged at the main air inlet;
the vehicle-mounted equipment further comprises a heat absorption fan and an air guide cover, the heat absorption fan and the air guide cover are arranged in the accommodating cavity, the air storage cavity is formed in the heat absorption fan, the heat absorption fan is further provided with an air suction opening and an air outlet, the air suction opening, the air storage cavity and the air outlet are sequentially communicated, the air suction opening faces the electronic component, and the air guide cover is connected between the air outlet and the main air outlet.
In one embodiment, the equipment housing has a bottom side wall and a rear side wall, the main air inlet opening is formed in the bottom side wall, and the main air outlet opening is formed in the rear side wall.
In one embodiment, the electronic component and the bottom side wall form a space, and the electronic component and the bottom side wall form a space communicated with the accommodating cavity.
In one embodiment, the electronic component includes a device body and a fixing column, one end of the fixing column is connected with the device body, and the other end of the fixing column is connected with the bottom side wall.
In one embodiment, the air guiding cover is provided with an air guiding channel, and the edge of an opening at one end of the air guiding channel, which is far away from the heat absorbing fan, is abutted against the edge of the main air outlet.
In one embodiment, the vehicle-mounted device further comprises a radiator arranged in the accommodating cavity, the radiator is connected with the electronic component, and the air suction opening faces to one surface of the radiator, which deviates from the electronic component.
In one embodiment, the heat radiator is of a heat radiating fin structure, and the heat radiator is attached and connected with the electronic component.
In one embodiment, a heat conducting member is disposed between the heat sink and the electronic component.
In one embodiment, the heat absorption fan is further provided with an air suction hole communicated with the air storage cavity, and the air suction hole is communicated with the accommodating cavity.
In one embodiment, the equipment shell is further provided with an auxiliary air inlet and an auxiliary air outlet, and the auxiliary air inlet and the auxiliary air outlet are respectively communicated with the accommodating cavity; the main air inlet, the main air outlet, the auxiliary air inlet and the auxiliary air outlet are respectively arranged on different side walls of the equipment shell.
Above-mentioned mobile unit, the equipment casing has seted up the holding chamber and has respectively with main air intake and the main air outlet of holding chamber intercommunication, and main air outlet is arranged in hot-air outgoing equipment casing in the holding chamber, and main air intake is arranged in supplying the air in the holding chamber in the cold air entering holding chamber of external world, has formed the effect of convection heat dissipation. Furthermore, the air suction opening of the heat absorption fan faces the electronic component, so that heat emitted by the electronic component can be absorbed into the air storage cavity and then exhausted out of the equipment shell through the air exhaust opening and the main air outlet, thereby effectively preventing hot air formed by the heat emitted by the electronic component from being accumulated in the accommodating cavity, enhancing the effect of convection heat dissipation, and effectively preventing the heat from being accumulated in the accommodating cavity for too long time to influence the heat dissipation of each element in the equipment shell; in addition, the heat absorption fan is arranged, so that the air flowing speed is increased, the convection heat transfer can be accelerated, and the heat dissipation effect is further improved. Compared with the common heat conduction heat dissipation, the heat dissipation mode has higher heat dissipation efficiency, the temperature of the equipment shell cannot be overhigh, the requirement on the environment temperature is not high, and effective heat dissipation can be carried out in a high-temperature environment; in addition, due to the arrangement of the heat absorption fan, dust in the accommodating cavity can be taken away while hot air is sucked out, hot air exhausted from the air outlet of the heat absorption fan can be concentrated by arranging the air guide cover and is conveyed towards the main air outlet, and therefore hot air in the air storage cavity of the heat absorption fan can be effectively exhausted from the main air outlet, and the convection effect is enhanced.
Drawings
FIG. 1 is a schematic structural diagram of an in-vehicle device according to an embodiment;
FIG. 2 is a partially enlarged schematic view of the in-vehicle apparatus shown in FIG. 1 at A;
FIG. 3 is another schematic structural diagram of an in-vehicle device according to an embodiment;
FIG. 4 is a partial schematic structural diagram of an in-vehicle apparatus according to an embodiment;
FIG. 5 is a schematic view of another angle of the in-vehicle apparatus shown in FIG. 4;
FIG. 6 is another partial schematic view of an in-vehicle apparatus according to an embodiment;
fig. 7 is a partially enlarged schematic view of the vehicle-mounted device shown in fig. 6 at B.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
In one embodiment, the vehicle-mounted equipment comprises an equipment shell and an electronic component, wherein the electronic component is arranged in an accommodating cavity formed in the equipment shell; the equipment shell is also provided with a main air inlet and a main air outlet, the main air inlet and the main air outlet are respectively communicated with the accommodating cavity, and the electronic component is arranged at the main air inlet; the vehicle-mounted equipment further comprises a heat absorption fan and an air guide cover which are arranged in the accommodating cavity, an air storage cavity is formed in the heat absorption fan, the heat absorption fan is further provided with an air suction port and an air outlet, the air suction port, the air storage cavity and the air outlet are sequentially communicated, the air suction port faces the electronic component, and the air guide cover is connected between the air outlet and the main air outlet; the equipment shell is provided with a bottom side wall, the electronic component is located on the inner side of the bottom side wall, and the main air inlet is formed in the bottom side wall.
As shown in fig. 1 and fig. 2, an in-vehicle device 10 according to an embodiment includes a device housing 100 and an electronic component 200, where the electronic component 200 is disposed in an accommodating cavity 110 formed in the device housing 100. As shown in fig. 2 and fig. 3, the device housing 100 is further provided with a main air inlet 101 and a main air outlet 120, the main air inlet 101 and the main air outlet 120 are respectively communicated with the accommodating cavity 110, and the electronic component 200 is disposed at the main air inlet 101. Referring to fig. 3 and 4, the vehicle-mounted device 10 further includes a heat absorbing fan 300 and an air guiding cover 400 disposed in the accommodating cavity 110, the heat absorbing fan 300 is provided with an air storage cavity 310 therein, the heat absorbing fan 300 is further provided with an air suction port 320 and an air exhaust port 330, the air suction port 320, the air storage cavity 310 and the air exhaust port 330 are sequentially communicated, the air suction port 320 faces the electronic component 200, and the air guiding cover is connected between the air exhaust port 330 and the main air outlet 120, that is, one end of the air guiding channel 410 is communicated with the air exhaust port 330, and the other end is communicated with the main air outlet 120. In one embodiment, the equipment housing 100 includes a base 130 and a cover 140, and the base 130 defines the accommodating cavity 110 and the main air inlet 101.
In the vehicle-mounted device 10, the device housing 100 is provided with the accommodating cavity 110, and the main air inlet 101 and the main air outlet 120 which are respectively communicated with the accommodating cavity 110, the main air outlet 120 is used for discharging hot air in the accommodating cavity 110 out of the device housing 100, and the main air inlet 101 is used for supplying cold air from the outside into the accommodating cavity 110 to supplement air in the accommodating cavity 110, so that a convection heat dissipation effect is formed.
Further, the air suction opening 320 of the heat absorbing fan 300 faces the electronic component 200, so that heat emitted by the electronic component 200 can be sucked into the air storage cavity 310 and then exhausted out of the equipment housing 100 through the air exhaust opening 330 and the main air outlet 120, thereby effectively preventing hot air generated by the heat emitted by the electronic component 200 from being accumulated in the accommodating cavity 110, enhancing the effect of convection heat dissipation, and effectively preventing the heat from being accumulated in the accommodating cavity 110 for a long time to affect the heat dissipation of each element in the equipment housing 100; in addition, the heat absorption fan 300 is arranged, so that the air flowing speed is increased, the convection heat transfer can be accelerated, and the heat dissipation effect is further improved.
Compared with the common heat conduction heat dissipation, the heat dissipation mode has higher heat dissipation efficiency, the temperature of the equipment shell 100 cannot be overhigh, the requirement on the environment temperature is not high, and effective heat dissipation can also be carried out in a high-temperature environment, because the electronic component 200 is arranged at the main air inlet 101, after cold air of the main air inlet 101 enters the accommodating cavity 110, the cold air firstly blows the electronic component 200, not only can the electronic component 200 be blown for heat dissipation, but also can enhance the heat dissipation of the electronic component 200, and the heat dissipation of the electronic component 200 is promoted; in addition, because the heat absorption fan 300 is arranged, the dust in the accommodating cavity 110 can be taken away while hot air is sucked out, and the hot air exhausted from the air outlet 330 of the heat absorption fan 300 can be collected and completely conveyed to the main air outlet 120 by arranging the air guiding cover 400, the hot air in the air storage cavity 310 of the heat absorption fan 300 can be effectively exhausted from the main air outlet 120, and the convection heat dissipation effect is enhanced.
In one embodiment, the equipment enclosure 100 has a bottom side wall 150 and a rear side wall 160, the primary air inlet 101 opens into the bottom side wall 150, and the primary air outlet 120 opens into the rear side wall 160. Therefore, cold air enters the accommodating cavity 110 from the main air inlet 101 at the bottom and can directly blow to the electronic component 200, so that heat dissipation is facilitated, and the main air inlet 101 and the main air outlet 120 are located on different side walls of the equipment shell 100 and have intervals and small mutual interference.
In one embodiment, as shown in fig. 6 and 7, the electronic component 200 is spaced from the bottom sidewall 150, and the electronic component 200 and the bottom sidewall 150 form a spacing space 111 communicating with the accommodating cavity 110. The electronic component 200 is spaced from the bottom side wall 150, so that the heat dissipation area of the electronic component 200 is increased, the ventilation and heat dissipation effects are enhanced, and the cold air is convenient to circulate.
In one embodiment, as shown in fig. 6 and 7, the electronic component 200 includes a device body 210 and a fixing post 220, one end of the fixing post 220 is connected to the device body 210, and the other end is connected to the bottom sidewall 150, so that the fixing post 220 can separate the device body 210 from the bottom sidewall 150 to form the separation space 111, and since the fixing post 220 is provided, the diameter of the fixing post 220 can be made smaller, thereby ensuring that the device body 210 supporting the electronic component 200 can be supported without blocking the air circulation. In one embodiment, the fixing posts 220 abut against the bottom sidewall 150, which facilitates the placement of electrical components.
In order to strengthen the heat dissipation of electronic components 200, in one of them embodiment, main air intake 101 orientation electronic components 200, just main air intake 101 with inlet scoop 320 intercommunication, the cold wind of main air intake 101 enters into the holding chamber 110 back from the bottom lateral wall like this, directly can blow to electronic components 200, not only can blow the heat dissipation to electronic components 200, can strengthen the heat dissipation of electronic components 200 moreover, can blow away the heat of electronic components 200 towards the inlet scoop 320 of heat absorption fan 300, promoted the heat dissipation to electronic components 200.
In order to better discharge the hot air out of the equipment housing 100, in one embodiment, the air outlet 330 is disposed adjacent to the main air outlet 120, and the air outlet 330 is disposed adjacent to the main air outlet 120, so that the heat emitted from the electronic component 200 can flow out of the main air outlet 120 more after being discharged through the air outlet 330, thereby enhancing the efficiency of discharging the hot air.
In order to enhance the communication effect between the air guiding channel 410 and the main air outlet 120, in one embodiment, the air guiding cover 400 has the air guiding channel 410, and an opening edge of one end of the air guiding channel 410, which is far away from the heat absorbing fan 300, abuts against an edge of the main air outlet 120, so that one end of the air guiding channel 410, which is far away from the heat absorbing fan 300, is almost hermetically communicated with the main air outlet 120, and the communication effect between the air guiding channel 410 and the main air outlet 120 is enhanced, so that the hot air exhausted to the air guiding channel 410 through the air outlet 330 can be almost completely exhausted from the main air outlet 120, and the convection heat dissipation effect is further enhanced. In one embodiment, as shown in fig. 1, the base 130 of the device housing 100 has a rear sidewall 160 in addition to the bottom sidewall 150, the rear sidewall 160 is opened with the main air outlet 120, and an opening edge of one end of the air guiding channel 410 away from the heat absorbing fan 300 abuts against the rear sidewall 160.
In order to further enhance the heat dissipation of the electronic component 200, in one embodiment, as shown in fig. 3 and fig. 4, the vehicle-mounted device 10 further includes a heat sink 500 disposed in the accommodating cavity 110, the heat sink 500 is connected to the electronic component 200, the air suction opening 320 faces a surface of the heat sink 500 away from the electronic component 200, the heat sink 500 is disposed to better dissipate part of heat of the electronic component 200, and the air suction opening 320 of the heat absorbing fan 300 is easily sucked into the air storage cavity 310, so that the electronic component 200 can be better cooled.
In order to facilitate the heat sink 500 to absorb and dissipate heat from the electronic component 200, in one embodiment, the heat sink 500 is a heat dissipation plate structure, the heat sink 500 is attached to and connected with the electronic component 200, and the heat sink 500 of the heat dissipation plate structure is attached to and connected with the electronic component 200, so that the heat conduction area can be increased, the heat conduction amount of the electronic component 200 in unit time is increased, and the heat dissipation effect of the heat sink 500 of the heat dissipation plate structure is better. In one embodiment, the heat sink 500 is a thermally conductive silicone sheet structure.
In order to increase the speed of the heat dissipation of the electronic component 200, in one embodiment, a heat conducting member is disposed between the heat sink 500 and the electronic component 200, and the heat conducting member can effectively absorb the heat of the electronic component 200 and then conduct the heat to the heat sink 500, which is faster and more efficient than the speed of directly conducting the heat of the electronic component 200 to the heat sink 500. In one embodiment, the heat conducting member is a heat conducting silicone or other heat conducting structure.
In order to more effectively discharge the hot air in the accommodating cavity 110 out of the accommodating cavity 110, in one embodiment, as shown in fig. 2 and 3, the heat absorbing fan 300 further has an air suction hole 340 communicated with the air storage cavity 310, the air suction hole 340 is communicated with the accommodating cavity 110, and after the air suction hole 340 is provided, the heat dispersed elsewhere in the accommodating cavity 110 is sucked by the air suction hole 340 and enters the air storage cavity 310, and then is discharged through the air outlet 330 and the main air outlet 120, so that the convection heat dissipation effect is further enhanced. In one embodiment, the air suction hole 340 and the air suction opening 320 are respectively disposed on different sidewalls of the heat absorbing fan 300, so that the air suction opening 320 is mainly used for sucking heat from the electronic component 200 and the vicinity of the electronic component 200, and the air suction hole 340 can suck heat from other positions in the accommodating cavity 110 into the air storage cavity 310, thereby further enhancing the effect of exhausting hot air. In one embodiment, the plurality of air suction holes 340 are distributed at each position of the heat absorbing fan 300, so that heat at each position in the accommodating cavity 110 can be more fully absorbed.
In order to enhance the air intake and exhaust, in one embodiment, as shown in fig. 3, the device housing 100 further has an auxiliary air inlet 102 and an auxiliary air outlet 103, and the auxiliary air inlet 102 and the auxiliary air outlet 103 are respectively communicated with the accommodating cavity 110; the main air inlet 101, the main air outlet 120, the auxiliary air inlet 102 and the auxiliary air outlet 103 are respectively arranged on different side walls of the equipment shell 100, and the main air inlet 101, the auxiliary air inlet 102, the main air outlet 120 and the auxiliary air outlet 103 are arranged, so that the entering of cold air and the discharging of hot air are enhanced, and the efficiency of convection heat dissipation is improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A vehicle-mounted device comprises a device shell and an electronic component, wherein the electronic component is arranged in an accommodating cavity arranged in the device shell,
the equipment shell is also provided with a main air inlet and a main air outlet, the main air inlet and the main air outlet are respectively communicated with the accommodating cavity, and the electronic component is arranged at the main air inlet;
the vehicle-mounted equipment further comprises a heat absorption fan and an air guide cover, the heat absorption fan and the air guide cover are arranged in the accommodating cavity, the air storage cavity is formed in the heat absorption fan, the heat absorption fan is further provided with an air suction opening and an air outlet, the air suction opening, the air storage cavity and the air outlet are sequentially communicated, the air suction opening faces the electronic component, and the air guide cover is connected between the air outlet and the main air outlet.
2. The in-vehicle device according to claim 1, wherein the device housing has a bottom side wall and a rear end side wall, the main air inlet opening is provided in the bottom side wall, and the main air outlet opening is provided in the rear end side wall.
3. The in-vehicle apparatus according to claim 2, wherein the electronic component is spaced from the bottom side wall, and the electronic component and the bottom side wall form a space communicating with the accommodation chamber.
4. The vehicle-mounted device according to claim 3, wherein the electronic component includes a device body and a fixing post, one end of the fixing post is connected to the device body, and the other end of the fixing post is connected to the bottom side wall.
5. The in-vehicle apparatus according to claim 1, wherein the air guide cover has an air guide passage, and an opening edge of an end of the air guide passage remote from the heat absorbing fan abuts against an edge of the main outlet.
6. The vehicle-mounted device according to claim 1 or 5, further comprising a heat sink disposed in the accommodating cavity, wherein the heat sink is connected with the electronic component, and the air suction opening faces a surface of the heat sink, which faces away from the electronic component.
7. The vehicle-mounted device according to claim 6, wherein the heat sink is of a heat sink structure, and the heat sink is attached to the electronic component.
8. The in-vehicle apparatus according to claim 6, wherein a heat conductive member is provided between the heat sink and the electronic component.
9. The vehicle-mounted device of claim 1, wherein the heat absorption fan further defines an air suction hole communicating with the air storage cavity, and the air suction hole communicates with the accommodating cavity.
10. The vehicle-mounted device of claim 1, wherein the device housing further defines an auxiliary air inlet and an auxiliary air outlet, and the auxiliary air inlet and the auxiliary air outlet are respectively communicated with the accommodating cavity; the main air inlet, the main air outlet, the auxiliary air inlet and the auxiliary air outlet are respectively arranged on different side walls of the equipment shell.
CN202021750861.9U 2020-08-20 2020-08-20 Vehicle-mounted device Active CN212812470U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021750861.9U CN212812470U (en) 2020-08-20 2020-08-20 Vehicle-mounted device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021750861.9U CN212812470U (en) 2020-08-20 2020-08-20 Vehicle-mounted device

Publications (1)

Publication Number Publication Date
CN212812470U true CN212812470U (en) 2021-03-26

Family

ID=75084512

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021750861.9U Active CN212812470U (en) 2020-08-20 2020-08-20 Vehicle-mounted device

Country Status (1)

Country Link
CN (1) CN212812470U (en)

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