CN212808343U

CN212808343U - Positioning and splitting device for TEM plane sample

Info

Publication number: CN212808343U
Application number: CN202021817681.8U
Authority: CN
Inventors: 严祥平
Original assignee: Shanghai Xinyuan Integrated Circuit Technology Co ltd
Current assignee: Shanghai Xinyuan Integrated Circuit Technology Co ltd
Priority date: 2020-08-27
Filing date: 2020-08-27
Publication date: 2021-03-26
Anticipated expiration: 2030-08-27

Abstract

The utility model relates to a lobe of a leaf technical field of photoelectric material just discloses a location lobe of a leaf device of TEM plane sample, including location lobe of a leaf device body, location lobe of a leaf device body includes workstation and operating equipment, the workstation includes fixed block, Z axostylus axostyle, atress strip and base, operating equipment includes sliding block, Y axostylus axostyle, lobe of a leaf sword and adjusts blade equipment, lobe of a leaf device body top is equipped with remains the lobe of a leaf material, treat the lobe of a leaf material including treating lobe of a leaf position and mark, the workstation is located lobe of a leaf device body bottom. This location lobe of a leaf device of TEM plane sample installs the workstation through lobe of a leaf device body top, utilizes the top leveling effect of atress strip, can be so that treat the lobe of a leaf material and reach the beneficial effect of quick location, assembles the lobe of a leaf device body through workstation and operating means, has reached the simple structure beneficial effect that non-professional also can use.

Description

Positioning and splitting device for TEM plane sample

Technical Field

The utility model relates to a lobe of a leaf technical field of photoelectric material specifically is a location lobe of a leaf device of TEM plane sample.

Background

If the photoelectric material is detected to have leakage abnormality through failure analysis, the leakage abnormality is probably caused by the structural defect in the photoelectric material, and for the condition, the structural defect part of the photoelectric material needs to be further observed and analyzed. The defect sites are usually smaller in size, and the resolution of SEM (scanning electron microscope) is lower, so the defect sites are usually further observed and analyzed by TEM (transmission electron microscope) with higher resolution, and TEM plane samples are prepared by DB-FIB (dual focused ion beam) for analysis. In the TEM plane sample manufacturing process, the photoelectric material wafer is large and cannot be placed on a DB-FIB machine, and the photoelectric material needs to be split.

The traditional splitting mode for the photoelectric material is as follows: 1. and adopting a splitting knife mode, firstly, scribing a cutting line according to the position to be split, and then, adopting the splitting knife to split along the cutting line. The method cannot well control the operation track of the splitting knife, the deviation of the actual cutting direction and the actual cutting line is easily caused, and the structural defect part with small size cannot be observed by naked eyes, so that the accurate positioning cannot be realized during splitting, and the splitting efficiency is low; 2. the method can accurately position, but the crack formed by laser irradiation breakdown is rough and not smooth enough, so that the quality of a sample is influenced.

Disclosure of Invention

Technical problem to be solved

Not enough to prior art, the utility model provides a location lobe of a leaf device of TEM plane sample possesses quick location, and above-mentioned technical problem has been solved to advantages such as simple structure.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the positioning splitting device for the TEM plane sample comprises a positioning splitting device body, wherein the positioning splitting device body comprises a workbench and operating equipment, the workbench comprises a fixed block, a Z shaft rod, a stress strip and a base, the operating equipment comprises a sliding block, a Y shaft rod, a splitting knife and adjusting blade equipment, a material to be split is arranged at the top of the splitting device body, and the material to be split comprises a position to be split and a mark.

Preferably, the workbench is located at the bottom of the splitting device body, and the operating equipment is installed at the bottom of the splitting device body and connected to the top ends of the Z-shaped shaft levers at the left end and the right end of the workbench.

Through above-mentioned technical scheme, through installing the workstation in lobe of a leaf device body bottom, utilize the workstation can carry out the lobe of a leaf with treating the lobe of a leaf material, can fix a position fast, and stable the installation at lobe of a leaf device body top, install operating means through lobe of a leaf device body top and can carry out quick lobe of a leaf.

Preferably, the fixed blocks are installed at four corners of the top of the workbench, the Z-shaped shaft rods are installed between the fixed blocks, the stress strip is installed at the center of the top of the base, and the base is located at the bottom of the workbench.

Through above-mentioned technical scheme, install the fixed block through workstation top for can cross fixing the Z axostylus axostyle, utilize the Z axostylus axostyle can carry out Z axle sliding operation with operating device, install the atress strip through the base top, utilize the atress strip will treat that the lobe of a leaf material is pressed and is carried out the lobe of a leaf.

Preferably, the sliding block is connected to the top of the Z shaft rod and located at the top of the operating device, the Y shaft rod is installed between the sliding blocks, the adjusting blade device is installed between the Y shaft rods, and the splitting blade is installed at the bottom of the adjusting blade device.

Through above-mentioned technical scheme, connect in the sliding block through Z axostylus axostyle top, the sliding block slides on the Z axostylus axostyle, controls the lobe of a leaf sword and treats the lobe of a leaf material and carry out effectual lobe of a leaf, utilizes to install the Y axostylus axostyle between the sliding block, can make operating equipment carry out Y axle slip and do, carries out the lobe of a leaf, installs the lobe of a leaf sword in adjusting blade equipment bottom, utilizes the lobe of a leaf to treat lobe of a leaf material top, treats the lobe of a leaf position and carries out effectual.

Preferably, the material to be cracked is placed at the top of the cracking device body, and the bottom of the material to be cracked is connected with the top surface of the stress strip.

Through the technical scheme, the material to be cracked is placed at the top of the cracking device body, the cracking device body can be used for treating the material to be cracked, cracking can be rapidly carried out, the cracking is a line, elements beside the cracking device cannot be touched, and effective protection of the material to be cracked is kept.

Preferably, the position to be cracked is positioned at the left end of the material to be cracked, and the mark and the position to be cracked are positioned on a straight line.

Through the technical scheme, the position to be cracked is arranged at the left end of the material to be cracked, the mark and the position to be cracked are positioned on the same line, and the material to be cracked can be cracked by using the cracking knife.

Compared with the prior art, the utility model provides a location lobe of a leaf device of TEM plane sample possesses following beneficial effect:

1. according to the positioning splitting device for the TEM plane sample, the workbench is installed at the top of the splitting device body, and the beneficial effect of quick positioning of the material to be split can be achieved by utilizing the leveling effect of the top of the stress strip.

2. The positioning lobe of a leaf device of TEM plane sample assembles into lobe of a leaf device body through workstation and operating means, has reached simple structure non professional also usable's beneficial effect.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a schematic side view of the structure of the present invention;

FIG. 3 is a schematic diagram of the material of the structure to be cracked of the present invention;

fig. 4 is a schematic view of the structure of the breaking blade of the present invention.

Wherein: 1. a splinter device body; 2. a work table; 3. operating the equipment; 201. a fixed block; 202. a Z shaft lever; 203. a stress strip; 204. a base; 301. a slider; 302. a Y-axis rod; 303. a splitting knife; 304. adjusting the blade apparatus; 4. the material to be cracked; 401. the position of the splinter to be splinted; 402. and (4) marking.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a positioning splitting device for a TEM plane sample includes a positioning splitting device body 1, the positioning splitting device body 1 includes a workbench 2 and an operating device 3, the workbench 2 includes a fixing block 201, a Z shaft 202, a stress bar 203 and a base 204, the operating device 3 includes a sliding block 301, a Y shaft 302, a splitting knife 303 and an adjusting blade device 304, a material to be split 4 is arranged on the top of the splitting device body 1, and the material to be split 4 includes a position to be split 401 and a mark 402.

Specifically, the workbench 2 is located at the bottom of the splitting device body 1, and the operating device 3 is installed at the bottom of the splitting device body 1 and connected to the top ends of the Z-axis rods 202 at the left end and the right end of the workbench 2.

The advantage is through installing workstation 2 in lobe of a leaf device body 1 bottom, utilizes workstation 2 can carry out the lobe of a leaf with treating lobe of a leaf material 4, can fix a position fast, and stable the installation at lobe of a leaf device body 1 top, installs operating means 3 through lobe of a leaf device body 1 top and can carry out quick lobe of a leaf.

Specifically, the fixed blocks 201 are installed at four corners of the top of the workbench 2, the Z-axis 202 is installed between the fixed blocks 201, the stress bar 203 is installed at the center of the top of the base 204, and the base 204 is located at the bottom of the workbench 2.

The advantage is installed fixed block 201 through workstation top 2 top for can fix Z axostylus axostyle 202, utilize Z axostylus axostyle 202 to carry out Z axle sliding operation with operating means 3, install atress strip 203 through base 204 top, utilize atress strip 203 to press the material 4 of waiting to lobe of a leaf to carry out the lobe of a leaf.

Specifically, the sliding block 301 is connected to the top of the Z-axis 202 and located on the top of the operating device 3, the Y-axis 302 is installed between the sliding blocks 301, the adjusting blade device 304 is installed between the Y-axis 302, and the splitting blade 303 is installed on the bottom of the adjusting blade device 304.

The advantage is connected in sliding block 301 through Z axostylus axostyle 202 top, and sliding block 301 slides on Z axostylus axostyle 202, controls splitting sword 303 and carries out effectual splitting to treating splitting material 4, utilizes to install Y axostylus axostyle 302 between sliding block 301, can make operating device 3 carry out Y axle slip, carries out the splitting, installs splitting sword 303 in adjusting blade equipment 304 bottom, utilizes the splitting to come to treat splitting material 4 top, treats that splitting position 401 carries out effectual quick splitting.

Specifically, the material 4 to be splinted is placed on the top of the splinter device body 1, and the bottom of the material is connected with the top surface of the stress strip 203.

The splitting device has the advantages that the material 4 to be split is placed on the top of the splitting device body 1, the material 4 to be split can be rapidly split by utilizing the splitting device body 1, and the split is a line and cannot touch a nearby element, so that the effective protection of the material 4 to be split is kept.

Specifically, the position 401 to be cracked is located at the left end of the material 4 to be cracked, and the mark 402 and the position 401 to be cracked are located on a straight line.

The splitting tool has the advantages that the position 401 to be split is arranged at the left end of the material 4 to be split, the mark 402 and the position 401 to be split are positioned on the same line, and the material 4 to be split can be split by the splitting tool 303.

When the splitting device is used, the splitting device body 1 is placed in a required working area, a to-be-split position 401 and a mark are marked on a to-be-split material 4, then the to-be-split material 4 is placed on the top surface of a bottom workbench 2 of the splitting device body 1, the operating equipment 3 is adjusted to the rear end of the splitting device body 1 through the Z shaft rod 202, then the splitting knife 303 is placed at the top mark 402 of the to-be-split material 4, the to-be-split material 4 is split, the to-be-split material 4 is pressed through the stress strip 203, and splitting is completed.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a location lobe of a leaf device of TEM plane sample, includes location lobe of a leaf device body (1), its characterized in that: the positioning splitting device body (1) comprises a workbench (2) and an operating device (3), the workbench (2) comprises a fixed block (201), a Z shaft rod (202), a stress strip (203) and a base (204), the operating device (3) comprises a sliding block (301), a Y shaft rod (302), a splitting blade (303) and an adjusting blade device (304), the top of the splitting device body (1) is provided with a material (4) to be split, and the material (4) to be split comprises a position (401) to be split and a mark (402).

2. A localized splinting device for a TEM plane sample according to claim 1, wherein: the working table (2) is located at the bottom of the splitting device body (1), and the operating equipment (3) is installed at the bottom of the splitting device body (1) and connected with the top ends of Z shaft levers (202) at the left end and the right end of the working table (2).

3. A localized splinting device for a TEM plane sample according to claim 1, wherein: the fixed blocks (201) are installed at four corners of the top of the workbench (2), the Z shaft rods (202) are installed between the fixed blocks (201), the stress strips (203) are installed at the center of the top of the base (204), and the base (204) is located at the bottom of the workbench (2).

4. A localized splinting device for a TEM plane sample according to claim 1, wherein: the sliding blocks (301) are connected to the tops of the Z shaft rods (202) and located on the tops of the operating devices (3), the Y shaft rods (302) are installed between the sliding blocks (301), the adjusting blade devices (304) are installed between the Y shaft rods (302), and the splitting blades (303) are installed on the bottoms of the adjusting blade devices (304).

5. A localized splinting device for a TEM plane sample according to claim 1, wherein: the material (4) to be cracked is placed at the top of the cracking device body (1), and the bottom of the material is connected with the top surface of the stress strip (203).

6. A localized splinting device for a TEM plane sample according to claim 1, wherein: the position (401) to be cracked is positioned at the left end of the material (4) to be cracked, and the mark (402) and the position (401) to be cracked are positioned on a straight line.