CN212786393U

CN212786393U - Cooling box for electroplating of electronic parts

Info

Publication number: CN212786393U
Application number: CN202021700865.6U
Authority: CN
Inventors: 陈�峰
Original assignee: Wuxi Xinyakang Environmental Protection Technology Co ltd
Current assignee: Wuxi Xinyakang Environmental Protection Technology Co ltd
Priority date: 2020-08-15
Filing date: 2020-08-15
Publication date: 2021-03-23
Anticipated expiration: 2030-08-15

Abstract

The utility model discloses an electronic component electroplates and uses cooling box, comprising a base plate, the top of bottom plate is provided with the box case, be provided with the fixed orifices on the bottom plate, box case fixed mounting be in on the bottom plate, run through on one side inner wall of box case and seted up through-hole and fixed mounting have the screw thread inlet tube, the inside of box case is provided with first cooling device, and first cooling device has a plurality of, first cooling device fixed mounting be in on the bottom plate, the box case is the plastics material and adopts one shot forming process, the cooling bath has been seted up to the bottom of bottom plate, the cooling trough plate is being installed to the cooling bath. This electronic component electroplates with cooling box passes through the screw thread mounting means of screw thread inlet tube, makes things convenient for this cooling box direct quick access coolant liquid to go out the liquid end, through predetermineeing the internal thread on the fixed orifices on the bottom plate, makes things convenient for this cooling box to install the location through the fixed orifices fast to install fast through the threaded connection mode.

Description

Cooling box for electroplating of electronic parts

Technical Field

The utility model relates to an electroplating device field specifically is an electronic component electroplates and uses cooling box.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate) and improve the appearance. The outer layer of many coins is also plated.

The small electronic product part after electroplating need cool off in the cooling box, and current electronic part is electroplated with the cooling box and is not good to the electronic product cooling effect after electroplating, and the unable abundant and electroplating product of coolant liquid fully contacts and in time discharges heat energy in time, and the installation location of cooling box is inconvenient, and the access process that the cooling box inserted external coolant liquid is more loaded down with trivial details.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic component electroplates and uses cooling box to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides an electronic component electroplates and uses cooling box, includes the bottom plate, the top of bottom plate is provided with the box case, be provided with the fixed orifices on the bottom plate, box case fixed mounting be in on the bottom plate, run through on one side inner wall of box case and seted up through-hole and fixed mounting have the screw thread inlet tube, the inside of box case is provided with first cooling device, and first cooling device has a plurality of, first cooling device fixed mounting be in on the bottom plate, the box case is the plastics material and adopts one shot forming technology, the cooling bath has been seted up to the bottom of bottom plate, installing the cooling trough plate in the cooling bath, the cooling trough plate has a plurality of and evenly distributed in the cooling bath.

Preferably, the fixed orifices are provided in a plurality, and the fixed orifices are positioned on the outer side of the box and are symmetrically arranged.

Preferably, first cooling device comprises baffle, two hexagon nuts of mutual symmetry, wherein the baffle is located the box incasement, and baffle along the perpendicular bottom plate of fore-and-aft direction and fixed mounting on the bottom plate, the baffle is less than to the distance that is provided with the box incasement wall of screw thread inlet tube the baffle arrives the distance of another inner wall of box, run through on the bottom plate and seted up the cooling hole, hexagon nut sets up in the cooling hole, hexagon nut is located the box incasement, hexagon nut is located the baffle and keeps away from one side of screw thread inlet tube, hexagon nut still runs through and has seted up first through-hole.

Preferably, a second cooling device can be further arranged in the box, the second cooling device is symmetrically arranged, the second cooling device is composed of a cooling seat and cast iron blocks, the cooling seat is fixedly installed on the bottom plate, an inner cavity is formed in the cooling seat, the cast iron blocks are arranged in the inner cavity, a second through hole is formed in the cooling seat in a penetrating mode, the second through hole is communicated with the inner cavity of the cooling seat, the cast iron blocks are fixedly installed in the inner cavity of the cooling seat, a third through hole is formed in the cast iron blocks in a penetrating mode, the third through hole is connected with the second through hole in a same connecting mode, the diameter of the third through hole is smaller than that of the second through hole, and the cooling seat is a silver seat.

Preferably, the fixing hole is a threaded hole.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) when the cooling box for electroplating the electronic parts is used, the cooling box can be conveniently and directly and quickly connected to a liquid outlet end of cooling liquid through the threaded water inlet pipe preset on the box and the threaded mounting mode of the threaded water inlet pipe, the cooling box can be conveniently and quickly mounted and positioned through the fixed hole through the internal thread preset on the fixed hole on the bottom plate and can be quickly mounted through the threaded connection mode, so that the cooling box for electroplating the electronic parts is conveniently and quickly and accurately assembled and connected to the cooling liquid end when in use,

(2) this electronic component electroplates and uses cooling box when using, through set up first cooling device or second cooling device in the box, the coolant liquid that conveniently gets into the box fully contacts with electroplating product and carries out abundant cooling to electroplating product, cast iron block and cooling seat heat-conduction are fast, thereby can let the coolant liquid after the cooling becomes hot can in time discharge the heat, the baffle can let the coolant liquid continuously gush out through the baffle and fully flow the contact with electroplating product in the cooling box, in time the heat on will electroplating the product is walked and in time flows through the first through-hole on the hexagon nut, thereby guarantee that this cooling box to the product cooling effect after having electroplated better.

Drawings

FIG. 1 is a schematic view showing a structure of a cooling box for electronic part plating.

Fig. 2 is a bottom view of the cooling box for electronic component plating.

Fig. 3 is a sectional view of the cooling box for electronic part plating.

FIG. 4 is a schematic structural view of another embodiment of a cooling box for electroplating electronic parts.

Fig. 5 is a bottom view of another embodiment of a cooling box for electronic part plating.

FIG. 6 is a sectional view of another embodiment of a cooling box for plating electronic parts

In the figure: 1. a base plate; 2. a box; 3. a baffle plate; 4. a threaded water inlet pipe; 5. a fixing hole; 6. a hexagonal nut; 7. cooling the trough plate; 8. a cooling seat; 9. a second through hole; 10. a cast iron block; 11. a first cooling device; 12. a second cooling device.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 6, in a novel embodiment of the present invention, the present invention provides a cooling box for electroplating an electronic component: including bottom plate 1, the top of bottom plate 1 is provided with box case 2, be provided with fixed orifices 5 on the

bottom plate

1, 2 fixed mounting of box case are in on the bottom plate 1, run through on one side inner wall of box case 2 and seted up through-hole and fixed mounting have screw thread inlet tube 4, the inside of box case 2 is provided with first cooling device 11, and first cooling device 11 has a plurality of, 11 fixed mounting of first cooling device are in on the bottom plate 1, box case 2 is the plastics material and adopts one shot forming technology, the cooling bath has been seted up to the bottom of bottom plate 1, cooling frid 7 is being installed in the cooling bath, and cooling frid 7 has a plurality of and evenly distributed in the cooling bath.

Preferably, there are several fixing holes 5, and the fixing holes 5 are located on the outer side of the box 2 and symmetrically arranged.

Preferably, first cooling device 11 comprises baffle 3, two hexagon nuts 6 of mutual symmetry, wherein baffle 3 is located box 2, and baffle 3 is along the perpendicular bottom plate 1 of fore-and-aft direction and fixed mounting on bottom plate 1, 3 distances of baffle 3 to the box 2 inner walls that are provided with screw inlet tube 4 are less than baffle 3 arrives the distance of another inner wall of box 2, run through on bottom plate 1 and seted up the cooling hole, hexagon nut 6 sets up in the cooling hole, hexagon nut 6 is located box 2, hexagon nut 6 is located baffle 3 and keeps away from one side of screw inlet tube 4, hexagon nut 6 has still run through and has seted up first through-hole.

According to fig. 4 to 6, for the utility model discloses a another embodiment, a cooling box for electronic component electroplating, including bottom plate 1, the top of bottom plate 1 is provided with box case 2, run through on the bottom plate 1 and seted up fixed orifices 5, fixed orifices 5 have two and the symmetry to set up in the outside of box case 2, box case 2 fixed mounting be in on the bottom plate 1, run through on one side inner wall of box case 2 and seted up the through-hole and fixed mounting has screw inlet tube 4 in the through-hole, be provided with second cooling device 12 in the inner chamber of box case 2, second cooling device 12 fixed mounting be in on the bottom plate 1, box case 2 is the plastics material and adopts one shot forming's technology.

Preferably, two second cooling devices 12 are symmetrically arranged, each second cooling device 12 is composed of a cooling seat 8 and a cast iron block 10, wherein the cooling seat 8 is fixedly installed on the bottom plate 1, the cooling seat 8 is provided with an inner cavity, the cast iron block 10 is arranged in the inner cavity, a second through hole 9 is formed in the cooling seat 8 in a penetrating manner, the second through hole 9 is communicated with the inner cavity of the cooling seat 8, the cast iron block 10 is fixedly installed in the inner cavity of the cooling seat 8, a third through hole is formed in the cast iron block 10 in a penetrating manner, the third through hole is connected with the second through hole 9 in a same manner, the diameter of the third through hole is smaller than that of the second through hole 9, and the cooling seat 8 is a silver seat.

Preferably, the fixing hole 5 is a threaded hole.

The utility model discloses a theory of operation and use flow: when the cooling box for the electronic part electroplating is used, the cooling box can be conveniently and directly and quickly connected to a liquid outlet end of cooling liquid through the threaded water inlet pipe 4 preset on the box 2 and the threaded mounting mode of the threaded water inlet pipe 4, the cooling box can be conveniently and quickly mounted and positioned through the fixed hole 5 through the internal threads preset on the fixed hole 5 on the bottom plate 1 and can be quickly mounted through the threaded connection mode, so that the cooling box for the electronic part electroplating is conveniently and quickly and accurately assembled and connected to a cooling liquid end when in use, the cooling liquid conveniently entering the box 2 can be in full contact with a metal plated part to fully cool the metal plated part through the arrangement of the first cooling device 11 or the second cooling device 12 in the box 2, the cast iron block 10 and the cooling seat 8 are fast in heat conduction, the cooling liquid after being cooled and heated can timely discharge heat, the baffle 3 can enable the cooling liquid to continuously flow out to be in full flow contact with an electroplated product in the cooling box through the baffle 3, the heat on the electroplated product is timely transmitted away and timely flows out through the first through hole in the hexagonal nut 6, so that the cooling effect of the cooling box on the electroplated product is better.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an electronic component electroplates and uses cooling box, includes bottom plate (1), its characterized in that: the top of bottom plate (1) is provided with box (2), be provided with fixed orifices (5) on bottom plate (1), box (2) fixed mounting be in on bottom plate (1), run through on one side inner wall of box (2) and seted up through-hole and fixed mounting have screw thread inlet tube (4), the inside of box (2) is provided with first cooling device (11), and first cooling device (11) have a plurality of, first cooling device (11) fixed mounting be in on bottom plate (1).

2. The cooling box for electronic part plating according to claim 1, characterized in that: the bottom of the bottom plate (1) is provided with a cooling groove, a cooling groove plate (7) is arranged in the cooling groove, and the cooling groove plate (7) is provided with a plurality of cooling grooves which are uniformly distributed in the cooling groove.

3. The cooling box for electronic part plating according to claim 1, characterized in that: the box (2) is made of plastic and adopts a one-step forming process.

4. The cooling box for electronic part plating according to claim 1, characterized in that: the fixed holes (5) are provided with a plurality of fixed holes, and the fixed holes (5) are positioned on the outer side of the box (2) and are symmetrically arranged.

5. The cooling box for electronic part plating according to claim 1, characterized in that: the fixing hole (5) is a threaded hole.

6. The cooling box for electronic part plating according to claim 1, characterized in that: first cooling device (11) comprise baffle (3), two hexagon nuts (6) of mutual symmetry, wherein baffle (3) are located box (2), and baffle (3) are along the perpendicular bottom plate of fore-and-aft direction (1) and fixed mounting on bottom plate (1), baffle (3) are less than to the distance of box (2) inner wall that is provided with screw inlet tube (4) baffle (3) arrive the distance of another inner wall of box (2), run through on bottom plate (1) and seted up the cooling hole, hexagon nut (6) set up in the cooling hole, hexagon nut (6) are located box (2), hexagon nut (6) are located one side that screw inlet tube (4) were kept away from in baffle (3), first through-hole has still been seted up in hexagon nut (6).

7. The cooling box for electronic part plating according to claim 1, characterized in that: the box (2) can be further internally provided with two second cooling devices (12), the two second cooling devices (12) are symmetrically arranged, each second cooling device (12) consists of a cooling seat (8) and a cast iron block (10), the cooling seat (8) is fixedly arranged on the bottom plate (1), the cooling seat (8) is provided with an inner cavity, the cast iron blocks (10) are arranged in the inner cavity, a second through hole (9) penetrates through the cooling seat (8), the second through hole (9) is communicated with the inner cavity of the cooling seat (8), the cast iron blocks (10) are fixedly arranged in the inner cavity of the cooling seat (8), a third through hole penetrates through the cast iron blocks (10), the third through hole is connected with the second through hole (9) in the same manner, and the diameter of the third through hole is smaller than that of the second through hole (9).

8. The cooling box for electronic part plating according to claim 7, characterized in that: the cooling seat (8) is a silver seat.