CN212783113U - Suck-back device for capacitor glue filling - Google Patents
Suck-back device for capacitor glue filling Download PDFInfo
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- CN212783113U CN212783113U CN202021863100.4U CN202021863100U CN212783113U CN 212783113 U CN212783113 U CN 212783113U CN 202021863100 U CN202021863100 U CN 202021863100U CN 212783113 U CN212783113 U CN 212783113U
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Abstract
The embodiment of the utility model provides a resorption device for capacitor glue filling, which comprises a material beating cylinder and a material locking cylinder, wherein a material beating cylinder rod is telescopically arranged at the side edge of the material beating cylinder, and a material locking cylinder rod is telescopically arranged at the bottom of the material locking cylinder; still including first notes material space and second notes material space, be equipped with between first notes material space and the second notes material space and cross the gluey through-hole, lock material cylinder pole is used for the shutoff to cross gluey through-hole to cut off first notes material space and second and annotate the material space. This back suction device for condenser encapsulating is after the encapsulating technology of completion condenser, and remaining epoxy obtains retrieving under the suck-back effect (atmospheric pressure negative pressure principle) of knockout cylinder pole in first notes material space and the second notes material space, prevents that epoxy's leakage from leading to appearing epoxy and flowing to the product surface to the condition that causes the pollution to machinery and equipment appears.
Description
Technical Field
The utility model relates to a condenser fills technical field, concretely relates to back suction device for condenser encapsulating.
Background
The epoxy resin is a general name of a polymer containing more than two epoxy groups in a molecule, namely a thermosetting resin, has excellent chemical stability and corrosion resistance, good bonding property, high mechanical strength and strong electrical insulation property, is widely applied in industry, and is particularly widely applied to the casting and packaging of electronic devices such as capacitors and the like. In the prior art, the filling material used for capacitors in the fields of household appliances and various electronic products is basically epoxy resin.
The epoxy resin on the capacitor has excellent insulating property and high temperature resistance, and has no great negative effect on the breakage of the shell even if the shell is collided in transportation or actual use. In order to ensure the continuity and operability of the potting operation of the potted capacitor, the requirement on the potting process of the epoxy resin potting adhesive is strict, namely, the epoxy material cannot be adhered to the surface of the shell of the product after the potting operation is finished. However, epoxy materials configured in the glue filling device in the prior art have low viscosity, and can continue to flow under the action of gravity in combination with the characteristics of the fluid. However, in the process of the epoxy material flowing, the lower product leaves the original position due to mechanical action, epoxy material flows to the outer surface of the product, so that the pollution to machinery and equipment is caused, the machine is stopped to clean the lower product, and otherwise, the lower product cannot be cleaned continuously after the epoxy material is solidified.
SUMMERY OF THE UTILITY MODEL
For solving the condenser encapsulating device among the prior art epoxy material stream to product surface appears easily to cause the problem of pollution to machinery and equipment, the utility model provides a resorption device for condenser encapsulating.
The utility model provides a capacitor is resorption device for encapsulating which characterized in that includes:
the device comprises a material beating cylinder and a material locking cylinder, wherein a material beating cylinder rod is telescopically arranged on the side edge of the material beating cylinder, and a material locking cylinder rod is telescopically arranged at the bottom of the material locking cylinder;
the end part of the material beating cylinder rod can be arranged in the first material injection space in a sliding mode along the horizontal direction, and the end part of the material locking cylinder rod can be arranged in the second material injection space in a sliding mode along the vertical direction;
and the material locking air cylinder rod is used for plugging the material passing through hole so as to partition the first material injection space and the second material injection space.
The material beating device further comprises a bottom supporting plate, the material beating cylinder is fixedly arranged on the bottom supporting plate, and the material beating cylinder rod is arranged on the bottom supporting plate in a sliding mode along the horizontal direction.
Further, the device also comprises a charging assembly, wherein the charging assembly is arranged on the top of the bottom support plate, and the first injection space extending along the horizontal direction is formed between the charging assembly and the bottom support plate.
Further, the charging assembly comprises a plurality of charging holes which are opened upwards and communicated with the first injection space, and the charging holes are used for injection operation.
Further, a first rubber sealing ring is arranged in the charging hole, and the first rubber sealing ring is in clearance fit with the inner wall of the charging hole.
Further, the material locking device further comprises a top support frame, the material locking cylinder is fixedly arranged at the top of the top support frame, and the material locking cylinder rod can slide in the vertical direction relative to the top support frame.
Further, the top support frame and the charging assembly, the bottom support plate form the second injection space therebetween, the second injection space extending in a vertical direction.
Furthermore, the second material injection space is provided with a second rubber sealing ring, and the second rubber sealing ring is in clearance fit with the inner wall of the second material injection space.
The utility model provides a capacitor is resorption device for encapsulating is including beating material cylinder and lock material cylinder, beats the side of material cylinder and is equipped with and beats the material cylinder pole telescopically, and the bottom of lock material cylinder is equipped with lock material cylinder pole telescopically, beats the material cylinder pole and is used for beating of epoxy glue to expect and push away the material operation, and lock material cylinder pole is used for blocking of epoxy glue to expect the operation. The first material space of annotating is used for placing the epoxy glue of treating the pouring, and the second is annotated material space and device outside intercommunication, and the epoxy glue of treating the pouring flows out in order to accomplish the operation of pouring of condenser from the bottom in second notes material space. The first material injection space and the second material injection space are provided with glue passing through holes, when the material locking air cylinder rod is in an initial state, the glue passing through holes are blocked, and epoxy glue in the first material injection space cannot flow to the second material injection space through the glue passing through holes; when the material locking cylinder drives the material locking cylinder rod to move upwards to the position where the glue passing through hole is not blocked any more, the first material injecting space is communicated with the second material injecting space, and epoxy glue in the first material injecting space can flow to the second material injecting space through the glue passing through hole.
Therefore, this capacitor is resorption device for encapsulating's specific working process does: install the epoxy glue of treating the pouring in first notes material space, the tip of beating the material cylinder drive and beating the material cylinder pole slides forward at first notes material space level, the tip of locking the material cylinder synchronous drive lock material cylinder pole at this moment upwards slides the pine lock, make the lock material cylinder pole no longer block the gluing through-hole, first notes material space and second are annotated the material space and are linked together, the epoxy glue flows to second and annotates material space department at the effort of beating the material cylinder pole, the bottom in material space is annotated to final follow the second flows, accomplish the encapsulating operation of condenser. When the material beating cylinder rod finishes beating the epoxy glue with the preset amount, the material beating cylinder drives the material beating cylinder rod to retract, the epoxy glue in the first material injecting space and the second material injecting space is sucked back by utilizing the piston principle, the material locking cylinder rod starts to lock the material when the material beating cylinder rod retracts to a half stroke, namely, the material locking cylinder rod is driven by the material locking cylinder rod to move downwards to the initial position of the glue passing through hole in a sealing mode, and finally the glue pouring operation of the primary capacitor is finished. This back suction device for condenser encapsulating is after the encapsulating technology of completion condenser, and remaining epoxy obtains retrieving under the suck-back effect (atmospheric pressure negative pressure principle) of knockout cylinder pole in first notes material space and the second notes material space, prevents that epoxy's leakage from leading to appearing epoxy and flowing to the product surface to the condition that causes the pollution appears machinery and equipment, avoids repeated shut down in the operation process to handle.
Drawings
FIG. 1 is a cross-sectional view of the suck-back device for filling glue into a capacitor of the present invention;
FIG. 2 is an enlarged partial schematic view of the circled portion of FIG. 1;
FIG. 3 is a schematic structural view of the suck-back device for potting a capacitor of the present invention;
description of reference numerals: 1. a knockout cylinder; 101. a knockout cylinder rod; 2. a material locking cylinder; 201. a material locking cylinder rod; 3. a charging assembly; 301. a charging hole; 302. a first rubber seal ring; 4. a bottom support plate; 5. a top support frame; 6. a first injection space; 7. a second injection space; 8. gluing through holes; 9. and a second rubber sealing ring.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, according to the utility model discloses an embodiment, the capacitor encapsulating is with resorption device is including beating material cylinder 1 and lock material cylinder 2, beats the side of material cylinder 1 and is equipped with to beat material cylinder pole 101 telescopically, and the bottom of lock material cylinder 2 is equipped with to lock material cylinder pole 201 telescopically. The material beating cylinder rod 101 completes beating and pushing operations of epoxy glue through reciprocating motion in the horizontal direction, and the material locking cylinder rod 201 completes blocking and locking and releasing operations of the epoxy glue through reciprocating motion in the vertical direction.
The suck-back device for capacitor glue filling further comprises a first material injection space 6 and a second material injection space 7, wherein the end part of the material injection cylinder rod 101 can be arranged in the first material injection space 6 in a sliding mode along the horizontal direction, and the end part of the material locking cylinder rod 201 can be arranged in the second material injection space 7 in a sliding mode along the vertical direction. Wherein, first notes material space 6 is used for placing the epoxy that treats the perfusion and glues, and second notes material space 7 and condenser are the resorption device external environment for the encapsulating and are linked together, treat that the epoxy that pours flows out to the condenser on in order to accomplish the encapsulating operation of condenser from the bottom in second notes material space 7.
Referring to fig. 2, according to the utility model discloses an embodiment, the capacitor back suction device for encapsulating still includes crosses gluey through-hole 8, crosses gluey through-hole 8's one end and first notes material space 6 and is linked together, and the other end and second are annotated and are expected space 7 and be linked together, and lock material cylinder pole 201 is used for the shutoff to cross gluey through-hole 8 to cut off first notes material space 6 and second and annotate material space 7. Specifically, when the material locking cylinder rod 201 is in the initial state, the glue through hole 8 is blocked, and the epoxy glue in the first material injection space 6 cannot flow to the second material injection space 7 through the glue through hole 8; when the material locking cylinder 2 drives the material locking cylinder rod 201 to move upwards to the position where the glue through hole 8 is not blocked, the first material injecting space 6 is communicated with the second material injecting space 7, and epoxy glue in the first material injecting space 6 can flow to the second material injecting space 7 through the glue through hole 8.
To sum up, the concrete working process of the suck-back device for the glue filling of the capacitor is as follows: install the epoxy glue of treating the pouring in first notes material space 6, the tip of beating material cylinder pole 101 of the drive of beating material cylinder 1 slides forward at first notes material space 6 level, lock the material cylinder 2 and drive the tip of locking material cylinder pole 201 in step and upwards slide the pine lock this moment, make locking material cylinder pole 201 no longer block and cross gluey through-hole 8, first notes material space 6 and second notes material space 7 and be linked together, epoxy glue is flowed to second notes material space 7 department at the effort of beating material cylinder pole 101, finally flow out from the bottom in second notes material space 7, accomplish the encapsulating operation of condenser. When the material beating cylinder rod 101 finishes beating the epoxy glue of the preset amount, the material beating cylinder 1 drives the material beating cylinder rod 101 to retract, the epoxy glue in the first material injecting space 6 and the second material injecting space 7 is sucked back by using the piston principle, the material locking cylinder rod 201 starts to lock the material when the material beating cylinder rod 101 retracts to a half stroke, namely, the material locking cylinder 2 drives the material locking cylinder rod 201 to move downwards to the initial position of the glue blocking through hole 8, and finally, the glue pouring operation of the capacitor is finished. After the capacitor glue filling process is completed, residual epoxy resin in the first material injection space 6 and the second material injection space 7 is recovered under the back suction effect (the atmospheric pressure negative pressure principle) of the material pumping cylinder rod, and epoxy resin leakage is prevented from causing epoxy material to flow to the outer surface of a product, so that the pollution to machinery and equipment is avoided.
Referring to fig. 3, according to the embodiment of the present invention, the suck-back device for the glue filling of the capacitor further includes a bottom support plate 4, the material-hitting cylinder 1 is fixedly disposed on the bottom support plate 4, and the material-hitting cylinder rod 101 can be slidably disposed on the bottom support plate 4 along the horizontal direction. Particularly, the bottom support plate 4 is arranged at the bottom of the knockout cylinder 1, and is used as a substrate structure of the suck-back device for the glue pouring of the capacitor, so that the knockout cylinder 1 is fixed to play a supporting role. At the same time, the bottom support plate 4 also provides an upward supporting force for the sliding of the knockout cylinder rod 101 in the horizontal direction.
Preferably, the suck-back device for capacitor potting further comprises a charging assembly 3, the charging assembly 3 is arranged on the top of the bottom support plate 4, and a first injection space 6 extending along the horizontal direction is formed between the charging assembly 3 and the bottom support plate 4. Specifically, the charging assembly 3 communicates with a first injecting space 6, the bottom of which extends in the horizontal direction, for use as an epoxy injecting operation of the suck-back device for capacitor potting. The epoxy glue charged from the charging assembly 3 flows downwards under the action of gravity and is horizontally distributed in the first injection space 6, and then flows into the second injection space 7 under the action of the horizontal thrust of the knockout cylinder rod 101, so that the epoxy glue injection operation is completed.
Further, the charging assembly 3 comprises a plurality of charging holes 301, the charging holes 301 being open upwards and communicating with the first injection space 6, the charging holes 301 being used for injection operation. Specifically, the charging hole 301 is opened upwards and extends in the vertical direction, and the epoxy glue injected from the charging hole 301 flows downwards into the first injection space 6 under the action of gravity and then flows into the second injection space 7 under the action of the horizontal thrust of the knockout cylinder rod 101, so that the epoxy glue injection operation is completed.
Optionally, a first rubber sealing ring 302 is arranged in the charging hole 301, and the first rubber sealing ring 302 is in clearance fit with the inner wall of the charging hole 301. Specifically, the first rubber sealing rings 302 which are in clearance fit connection with the inner walls of the plurality of charging holes 301 are arranged in the plurality of charging holes 301, the first rubber sealing rings 302 are used for sealing the first charging space 6, and the situation that epoxy glue flows backwards under the thrust action of the material beating cylinder rod 101 or under the situation that the epoxy glue injected from the opening of the charging hole 301 is too much can be prevented, so that the situation that pollution is caused to machinery and equipment is avoided.
Referring to fig. 3, according to the embodiment of the present invention, the suck-back device for the glue filling of the capacitor further includes a top support frame 5, the material locking cylinder 2 is fixed at the top of the top support frame 5, and the material locking cylinder rod 201 can slide in the vertical direction relative to the top support frame 5. Particularly, top support frame 5 sets up in the bottom of locking material cylinder 2, as the foundation structure of this capacitor resorption device for encapsulating, plays the supporting role for this fixed of locking material cylinder 2. Meanwhile, the top support frame 5 also provides a supporting force in the vertical direction for the sliding of the locking cylinder rod 201 in the vertical direction.
Preferably, a second injection space 7 is formed between the top support 5 and the loading assembly 3 and the bottom support plate 4, the second injection space 7 extending in a vertical direction. Specifically, when the locking cylinder 2 drives the locking cylinder rod 201 to move upwards and is in a loose locking state, the second material injection space 7 is communicated with the first material injection space 6, epoxy glue flowing from the first material injection space 6 to the second material injection space 7 flows out from the bottom of the second material injection space 7 under the action of thrust and gravity of the material beating cylinder rod 101 and is poured on the capacitor, and therefore the glue pouring operation of the capacitor is completed.
Optionally, the second material injection space 7 is provided with a second rubber sealing ring 9, and the second rubber sealing ring 9 is in clearance fit with the inner wall of the second material injection space 7. Specifically, a second rubber sealing ring 9 is arranged in the second injection space 7 in a clearance fit connection with the inner wall thereof, and the second rubber sealing ring 9 serves as a sealing function of the second injection space 7. In the retraction stroke of the material beating cylinder rod 101 driven by the material beating cylinder 1, the epoxy glue at the second material injecting space 7 can be prevented from returning to the first material injecting space 6 again under the action of the suck-back force of the material beating cylinder rod 101, so that the pollution to machinery and equipment is avoided.
Therefore, the utility model provides a resorption device for condenser encapsulating is after the encapsulating technology of completion condenser, and first notes are expected to remain residual epoxy in space 6 and the second in the space 7 and are being got back under the resorption effect (the negative pressure principle of atmospheric pressure) of beating material cylinder pole 101 to be retrieved, prevent that epoxy's leakage from leading to appearing the epoxy and flow to the product surface to machinery and equipment cause the condition of pollution, avoid repeated shut down in the operation process to handle.
Of course, the above is a preferred embodiment of the present invention. It should be noted that, for a person skilled in the art, several modifications and decorations can be made without departing from the basic principle of the present invention, and these modifications and decorations are also considered to be within the scope of the present invention.
Claims (8)
1. The utility model provides a capacitor is resorption device for encapsulating which characterized in that includes:
the device comprises a material beating cylinder and a material locking cylinder, wherein a material beating cylinder rod is telescopically arranged on the side edge of the material beating cylinder, and a material locking cylinder rod is telescopically arranged at the bottom of the material locking cylinder;
the end part of the material beating cylinder rod can be arranged in the first material injection space in a sliding mode along the horizontal direction, and the end part of the material locking cylinder rod can be arranged in the second material injection space in a sliding mode along the vertical direction;
and the material locking air cylinder rod is used for plugging the material passing through hole so as to partition the first material injection space and the second material injection space.
2. The suck-back device for capacitor potting adhesive of claim 1, further comprising a bottom support plate, wherein the knockout cylinder is fixedly arranged on the bottom support plate, and the knockout cylinder rod is slidably arranged on the bottom support plate along a horizontal direction.
3. The suck-back device for capacitor potting compound of claim 2, further comprising a charging assembly disposed on top of the bottom support plate, the charging assembly and the bottom support plate forming the first potting space therebetween extending in a horizontal direction.
4. The suck-back device for capacitor potting compound of claim 3 wherein said charging assembly includes a plurality of charging holes opening upwardly and communicating with said first fill volume, said charging holes being adapted for a fill operation.
5. The suck-back device for capacitor glue filling according to claim 4, wherein a first rubber sealing ring is arranged in the charging hole, and the first rubber sealing ring is in clearance fit with the inner wall of the charging hole.
6. The suck-back device for capacitor glue filling according to claim 3, further comprising a top support frame, wherein the material locking cylinder is fixedly arranged at the top of the top support frame, and the material locking cylinder rod can slide in a vertical direction relative to the top support frame.
7. The suck-back device for capacitor potting adhesive of claim 6, wherein said top support frame and said charging assembly and said bottom support plate define therebetween said second injection space, said second injection space extending in a vertical direction.
8. The suck-back device for capacitor glue filling according to claim 7, wherein the second material injection space is provided with a second rubber sealing ring, and the second rubber sealing ring is in clearance fit with the inner wall of the second material injection space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021863100.4U CN212783113U (en) | 2020-08-31 | 2020-08-31 | Suck-back device for capacitor glue filling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021863100.4U CN212783113U (en) | 2020-08-31 | 2020-08-31 | Suck-back device for capacitor glue filling |
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| Publication Number | Publication Date |
|---|---|
| CN212783113U true CN212783113U (en) | 2021-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021863100.4U Active CN212783113U (en) | 2020-08-31 | 2020-08-31 | Suck-back device for capacitor glue filling |
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| CN (1) | CN212783113U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420473A (en) * | 2022-01-29 | 2022-04-29 | 常熟市国瑞科技股份有限公司 | Packaging device for shell-less capacitor |
-
2020
- 2020-08-31 CN CN202021863100.4U patent/CN212783113U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420473A (en) * | 2022-01-29 | 2022-04-29 | 常熟市国瑞科技股份有限公司 | Packaging device for shell-less capacitor |
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