CN212781962U - Low-cost high reliability OGS touch-sensitive screen and electronic equipment - Google Patents

Low-cost high reliability OGS touch-sensitive screen and electronic equipment Download PDF

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Publication number
CN212781962U
CN212781962U CN202021032495.3U CN202021032495U CN212781962U CN 212781962 U CN212781962 U CN 212781962U CN 202021032495 U CN202021032495 U CN 202021032495U CN 212781962 U CN212781962 U CN 212781962U
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layer
conductive pattern
ogs touch
silicon nitride
touch screen
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CN202021032495.3U
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陈健立
林汉良
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Truly Opto Electronics Ltd
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Truly Opto Electronics Ltd
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Abstract

The utility model discloses a low-cost high reliability OGS touch-sensitive screen and electronic equipment, OGS touch-sensitive screen includes: a substrate; the conductive pattern layer is arranged on the substrate; the metal routing is arranged on the substrate, positioned at the periphery of the conductive pattern layer and electrically connected with the conductive pattern layer; and the silicon dioxide layer or the silicon nitride layer covers the metal routing wire and the conductive pattern layer. Through the scheme of the utility model, the back of the metal wiring is plated with silicon dioxide or silicon nitride with higher compactness and hardness to resist severe environment, so that the metal wiring can be protected from being corroded in projects with higher reliability requirements, and the requirement of high reliability resistance is met; the OC glue is replaced by the silicon dioxide or the silicon nitride, and compared with the situation that a silicon dioxide layer or a silicon nitride layer is directly arranged on the back surface of the OC glue, the cost of the OGS touch screen can be effectively reduced.

Description

Low-cost high reliability OGS touch-sensitive screen and electronic equipment
Technical Field
The utility model relates to a touch-control technical field especially relates to a high reliability OGS touch-sensitive screen and electronic equipment.
Background
An OGS (One Glass Solution, single Glass touch technology) touch screen is an electronic product protection screen in which an ITO (Indium Tin oxide) conductive film and a sensor are directly formed on a protective Glass, and mainly One piece of Glass simultaneously plays dual roles of protecting the Glass and touching the sensor. Compared with a G-G touch screen, the OGS touch screen has the advantages of lower price, simpler process flow and better control over timely delivery of products, so that the OGS touch screen gradually replaces the G-G touch screen and is widely applied to electronic products such as vehicle-mounted TP (touch Panel) and the like.
However, the conventional OGS touch screen has insufficient requirements for high reliability, and metal traces of the OGS touch screen are easily corroded when the OGS touch screen is continuously placed for more than one thousand hours in an environment with a temperature of 60 ℃ and a humidity of 90%.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a low-cost high reliability OGS touch-sensitive screen and electronic equipment for among the solution prior art, the metal of OGS touch-sensitive screen is walked the problem that the line was corroded easily.
In order to solve the above problem, the utility model adopts the following technical scheme:
the OGS touch screen with low cost and high reliability is provided, and comprises:
a substrate;
the conductive pattern layer is arranged on the substrate;
the metal wire is arranged on the substrate, positioned at the periphery of the conductive pattern layer and electrically connected with the conductive pattern layer;
a silicon dioxide layer or a silicon nitride layer covering the metal trace and the conductive pattern layer.
Optionally, the gap between the metal traces is exposed.
Optionally, the thickness of the silicon dioxide layer or the silicon nitride layer on the conductive pattern layer is the same as the thickness of the metal trace.
Optionally, the thickness of the silicon dioxide layer or the silicon nitride layer is greater than or equal to 20 μm.
Optionally, the silicon dioxide layer or the silicon nitride layer is recessed in the portion of the conductive pattern layer to the portion of the metal trace.
Optionally, the conductive pattern layer includes a first ITO conductive layer, an insulating layer, and a second ITO conductive layer stacked in sequence, the first ITO conductive layer is disposed on the substrate, and the silicon dioxide layer or the silicon nitride layer covers the second ITO conductive layer.
Optionally, ink is coated between the metal trace and the substrate.
Optionally, the conductive pattern layer includes an ITO conductive layer disposed on the substrate and an MAM bridge bridging the ITO conductive layer.
An electronic device is further provided, and the OGS touch screen comprises the OGS touch screen with low cost and high reliability.
The utility model discloses a technical scheme can reach following beneficial effect:
the back of the metal wire is plated with silicon dioxide or silicon nitride with higher compactness and hardness to resist severe environment, so that the metal wire can be protected from being corroded in the project with higher reliability requirement, and the requirement of high reliability resistance is met; the OC glue is replaced by silicon dioxide or silicon nitride, and compared with the situation that a silicon dioxide layer or a silicon nitride layer is directly arranged on the back surface (the surface opposite to the substrate) of the OC glue, the cost of the OGS touch screen can be effectively reduced.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof of the present invention explain the present invention and do not form an improper limitation to the present invention. In the drawings:
FIG. 1 is a schematic structural diagram of an OGS touch screen disclosed in the prior art;
fig. 2 is a schematic diagram of a stacking structure of an OGS touch screen disclosed in an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an OGS touch screen disclosed in an embodiment of the present invention.
Wherein the following reference numerals are specifically included in figures 1-3:
a substrate-1; a conductive pattern layer-2; metal traces-3, 3'; a silicon dioxide layer-4; OC glue-4'; ink-5; a first ITO conductive layer-21; an insulating layer-22; second ITO conductive layer-23.
Detailed Description
To make the purpose, technical solution and advantages of the present invention clearer, the following will combine the embodiments of the present invention and the corresponding drawings to clearly and completely describe the technical solution of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model discloses a low-cost high reliability OGS touch-sensitive screen can be applied to electronic products such as on-vehicle TP. As shown in fig. 2 and 3, the OGS touch screen with low cost and high reliability comprises a substrate 1, a conductive pattern layer 2, a metal trace 3 and a silicon dioxide layer 4 (or a silicon nitride layer). The substrate 1 may be a glass substrate 1 provided with a window area and a non-window area located at the periphery of the window area. The conductive pattern layer 2 may be provided in a window region of the substrate 1. The metal wire 3 is disposed in the non-window area of the substrate 1 and located at the periphery of the conductive pattern layer 2 to electrically connect the conductive pattern layer 2 with an electronic device, such as an FPC, and the metal wire 3 may be made of MoAlMo (molybdenum aluminum molybdenum, MAM for short). The silicon dioxide layer 4 (or silicon nitride layer) covers the conductive pattern layer 2 and the metal trace 3.
In the existing OGS touch screen, as shown in fig. 1, a metal trace 3 is covered by OC glue 4 ', but hardness and compactness of the OC glue 4 ' are not very high, and in a project with a high reliability requirement, the metal trace 3 ' is corroded, so that the reliability is not satisfied. Compared with the existing OGS touch screen, the OGS touch screen of the utility model plates silicon dioxide (or silicon nitride) with higher compactness and hardness on the back of the metal wiring 3 to resist severe environment, can protect the metal wiring 3 from being corroded in the project with higher reliability requirement, and meets the requirement of high reliability resistance; the OC glue 4 'is replaced by the silicon dioxide layer 4 (or the silicon nitride layer), and compared with the method of directly sputtering the silicon dioxide layer 4 (or the silicon nitride layer) on the back surface (the surface facing away from the substrate 1) of the OC glue 4', the cost of the OGS touch screen can be effectively reduced.
The gaps between the metal traces 3 are exposed without silicon dioxide (or silicon nitride), i.e. after the silicon dioxide layer 4 (or silicon nitride layer) is plated in a sputtering way, the silicon dioxide (or silicon nitride) between the metal traces 3 is etched to ensure good conductivity of the metal traces 3. The thickness of the silicon dioxide layer 4 (or the silicon nitride layer) on the conductive pattern layer 2 is the same as that of the metal trace 3, i.e. the sputtering time of the silicon dioxide layer 4 (or the silicon nitride layer) on the conductive pattern layer 2 is the same as that of the metal trace 3. The silicon dioxide layer 4 (or silicon nitride layer) portion of the conductive pattern layer 2 is recessed relative to the silicon dioxide layer 4 (or silicon nitride layer) portion of the metal trace 3. And the thickness of the silicon dioxide layer 4 (or the silicon nitride layer) at each portion is 20 μm or more. So set up, the process is simple, reliable, under the prerequisite of guaranteeing high reliability requirement, effective reduce cost.
The conductive pattern layer 2 may be provided in various ways regardless of the arrangement of the silicon oxide layer 4 (or the silicon nitride layer). In the first example, the conductive pattern layer 2 includes a first ITO conductive layer 21 disposed on the substrate 1 by sputtering, an insulating layer 22 disposed on the first ITO conductive layer 21, and a second ITO conductive layer 23 disposed on the insulating layer 22, where the first ITO conductive layer 21 and the second ITO conductive layer 23 are cross-striped hollow patterns, and a plurality of touch sensing points are formed by the first ITO conductive layer 21 and the second ITO conductive layer 23.
At this time, ink 5 (BM) is applied on the back surface of the substrate 1 in the non-window area (i.e. between the metal trace 3 and the substrate 1). The metal traces 3 are shielded by the ink 5 to prevent the metal traces 3 from being seen from the front of the touch screen.
In a second example, the conductive pattern layer includes an ITO conductive layer provided on the substrate and MAM (MoAlMo, molybdenum aluminum molybdenum) bridges bridging the ITO conductive layer. The pattern shape of the ITO conductive layer can be a triangular structure, a flexible structure or a rectangular structure. The conductive pattern layer is stable in structure and convenient for batch production.
The electronic equipment comprises the high-reliability OGS touch screen. In the electronic equipment, the back surface of the metal wire 3 is plated with silicon dioxide (or silicon nitride) with higher compactness and hardness to resist severe environment, and in the project with higher reliability requirement, the metal wire 3 can be protected from being corroded to meet the requirement of high reliability resistance; the OC glue 4 'is replaced by the silicon dioxide layer 4 (or the silicon nitride layer), so that the cost of the electronic device can be effectively reduced compared with the case that the silicon dioxide layer 4 (or the silicon nitride layer) is directly sputtered on the back surface (the surface opposite to the substrate 1) of the OC glue 4'.
The embodiments of the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments, which are only illustrative and not restrictive, and those skilled in the art can make many forms without departing from the spirit and scope of the present invention.

Claims (9)

1. A low-cost high-reliability OGS touch screen is characterized by comprising:
a substrate;
the conductive pattern layer is arranged on the substrate;
the metal wire is arranged on the substrate, positioned at the periphery of the conductive pattern layer and electrically connected with the conductive pattern layer;
a silicon dioxide layer or a silicon nitride layer covering the metal trace and the conductive pattern layer.
2. The low-cost high-reliability OGS touch screen according to claim 1, wherein the gaps between the metal traces are exposed.
3. The low-cost high-reliability OGS touch screen according to claim 1, wherein the thickness of the silicon dioxide layer or the silicon nitride layer on the conductive pattern layer is the same as that of the metal trace.
4. A low-cost high-reliability OGS touch screen according to claim 3, characterized in that the thickness of the silicon dioxide layer or the silicon nitride layer is greater than or equal to 20 μm.
5. The low-cost high-reliability OGS touch screen according to claim 3, wherein the silicon dioxide layer or the silicon nitride layer is recessed within the portion of the conductive pattern layer to the portion of the metal trace.
6. A low-cost high-reliability OGS touch screen according to any one of claims 1 to 5, characterized in that the conductive pattern layer comprises a first ITO conductive layer, an insulating layer and a second ITO conductive layer which are sequentially stacked, the first ITO conductive layer is arranged on the substrate, and the silicon dioxide layer or the silicon nitride layer covers the second ITO conductive layer.
7. The low-cost high-reliability OGS touch screen according to claim 6, wherein the metal traces and the substrate are coated with ink.
8. A low-cost high-reliability OGS touch screen according to any one of claims 1 to 5, characterized in that the conductive pattern layer comprises an ITO conductive layer provided on the substrate and MAM bridges bridging the ITO conductive layer.
9. An electronic device, comprising the low-cost high-reliability OGS touch screen of any one of claims 1-8.
CN202021032495.3U 2020-06-08 2020-06-08 Low-cost high reliability OGS touch-sensitive screen and electronic equipment Active CN212781962U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021032495.3U CN212781962U (en) 2020-06-08 2020-06-08 Low-cost high reliability OGS touch-sensitive screen and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021032495.3U CN212781962U (en) 2020-06-08 2020-06-08 Low-cost high reliability OGS touch-sensitive screen and electronic equipment

Publications (1)

Publication Number Publication Date
CN212781962U true CN212781962U (en) 2021-03-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021032495.3U Active CN212781962U (en) 2020-06-08 2020-06-08 Low-cost high reliability OGS touch-sensitive screen and electronic equipment

Country Status (1)

Country Link
CN (1) CN212781962U (en)

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