CN212764902U - Mould pressing device is used in production of glass sealed diode - Google Patents
Mould pressing device is used in production of glass sealed diode Download PDFInfo
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- CN212764902U CN212764902U CN202020851927.7U CN202020851927U CN212764902U CN 212764902 U CN212764902 U CN 212764902U CN 202020851927 U CN202020851927 U CN 202020851927U CN 212764902 U CN212764902 U CN 212764902U
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Abstract
The utility model belongs to diode production and processing field, especially, glass seals mould pressing device for diode production is not convenient for clear up the die-pressing groove after the die-pressing is accomplished to the die-pressing groove on the current mould pressing device to be not convenient for take out the problem of die-pressing back product, the following scheme is put forward now, and it includes the die holder, the L template has all been welded to the both sides of die holder, and the top welding of two L templates has same roof, the bottom fixedly connected with hydraulic pump of roof, and fixedly connected with movable die holder on the hydraulic stem of hydraulic pump, the bottom fixedly connected with pressure type piece of movable die holder, has all seted up the rotary groove on the both sides inner wall of die holder, and same pivot is installed to two rotary groove internal rotations, and the outside fixedly connected with metal sheet of pivot, the die-pressing groove has been seted. The utility model discloses the practicality is good, and the last pressure type groove of molding press is convenient for clear up pressure type groove after the die pressing is accomplished to be convenient for take out product behind the die pressing.
Description
Technical Field
The utility model relates to a diode production and processing technology field especially relates to a glass seals mould pressing device for diode production.
Background
A diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.). It has one-way conducting performance, that is, when positive voltage is applied to the anode and cathode of the diode, the diode is conducted. When a reverse voltage is applied to the anode and the cathode, the diode is turned off.
The pressure type groove on present molding device is not convenient for clear up the pressure type groove after the die mould is accomplished to the product after the die mould is not convenient for take out.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the pressing groove on the mould pressing device is not convenient for clear up the pressing groove after the pressing is completed in the prior art, and the shortcoming of the product after the pressing is not convenient for take out, and the mould pressing device is used in the production of a glass sealed diode that provides.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a mould pressing device for producing glass-sealed diodes comprises a fixed mould base, L-shaped plates are welded on two sides of the fixed mould base, a same top plate is welded on the tops of the two L-shaped plates, a hydraulic pump is fixedly connected with the bottom of the top plate, a movable mould base is fixedly connected with a hydraulic rod of the hydraulic pump, a pressing block is fixedly connected with the bottom of the movable mould base, rotary grooves are formed in the inner walls of two sides of the fixed mould base, a same rotary shaft is rotatably mounted in the two rotary grooves, a metal plate is fixedly connected to the outer side of the rotary shaft, a pressing groove is formed in the top of the metal plate, pin grooves are formed in the inner walls of two sides of the pressing groove, a push plate groove is formed in the inner wall of the bottom of the pressing groove, a bottom groove is formed in the inner wall of the bottom of the push plate groove, a first push rod motor is fixedly connected to the inner wall of the bottom of the, the welding has the square plate on the output shaft of second push rod motor, the fixed cover in the outside of pivot is equipped with the gear, the front side fixedly connected with rack of square plate, the gear meshes with the rack mutually, fixedly connected with bottom plate on the bottom inner wall of cover half seat, the rectangular channel has been seted up at the top of bottom plate, the bottom of square plate extends to the rectangular channel in, equal fixedly connected with conducting strip on the bottom of square plate and the bottom inner wall of rectangular channel, the bottom fixedly connected with air pump of cover half seat, the fixedly connected with trachea of gas outlet department of air pump.
Preferably, the air pump and the two conducting strips are sequentially connected in series to form a loop.
Preferably, the two sides of the bottom of the fixed die seat are welded with supporting plates to support the fixed die seat.
Preferably, the top of the movable die holder is provided with a square hole, and the bottom of the square plate penetrates through the square hole.
Preferably, the sliding plates are fixedly connected to two sides of the bottom of the movable die holder, the sliding grooves are formed in two sides of the top of the fixed die holder, and the sliding plates are slidably mounted in the sliding grooves, so that the stability of the movable die holder during moving is improved.
Preferably, the bottom of the fixed die holder is provided with a mounting hole, and the air pipe is fixedly mounted in the mounting hole.
In the utility model, in the mould pressing device for producing the glass-sealed diode, a diode component and a stamping filler are placed in a pressing groove, then a hydraulic pump is started, a movable mould seat drives the pressing block to move, so that the pressing block is inserted into the pressing groove for pressing, a hydraulic rod on the hydraulic pump returns to the original position after the pressing is finished, then a first push rod motor is started, a product after the pressing is finished is ejected out by a push plate, the formed product is conveniently taken out, then a second push rod motor is started, a square plate drives a rack to move, a gear drives a rotating shaft to rotate, the rotating shaft drives a metal plate to rotate, the metal plate drives the pressing groove to rotate, the square plate drives a conducting strip above the pressing groove to move, when the pressing groove rotates 180 degrees, the two conducting strips just contact at the moment, when the two conducting strips contact, an air pump is started, the air pump blows the pressing groove through an, the pressure-type groove is convenient to clean.
The utility model discloses the practicality is good, and the last pressure type groove of molding press is convenient for clear up pressure type groove after the die pressing is accomplished to be convenient for take out product behind the die pressing.
Drawings
Fig. 1 is a schematic structural view of a mold pressing device for producing a glass-sealed diode according to the present invention;
fig. 2 is a schematic structural diagram of a portion a of a mold pressing device for producing a glass-sealed diode according to the present invention;
fig. 3 is a schematic structural diagram of a part B of the molding device for producing a glass-sealed diode according to the present invention.
In the figure: 1. fixing a die holder; 2. an L-shaped plate; 3. a top plate; 4. a hydraulic pump; 5. a movable die holder; 6. a slide plate; 7. a molding block; 8. a rotating shaft; 9. a metal plate; 10. pressing a groove; 11. a first push rod motor; 12. a push plate; 13. a second push rod motor; 14. a square plate; 15. a gear; 16. a rack; 17. a base plate; 18. a conductive sheet; 19. an air pump.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, a mold pressing device for producing glass-sealed diodes comprises a fixed mold base 1, L-shaped plates 2 are welded on both sides of the fixed mold base 1, the tops of the two L-shaped plates 2 are welded with a same top plate 3, a hydraulic pump 4 is fixedly connected with the bottom of the top plate 3, a movable mold base 5 is fixedly connected with a hydraulic rod of the hydraulic pump 4, a pressing block 7 is fixedly connected with the bottom of the movable mold base 5, rotary grooves are respectively formed on the inner walls of both sides of the fixed mold base 1, a same rotary shaft 8 is rotatably mounted in the two rotary grooves, a metal plate 9 is fixedly connected with the outer side of the rotary shaft 8, a press groove 10 is formed in the top of the metal plate 9, pin grooves are respectively formed in the inner walls of both sides of the press groove 10, a push plate groove is formed in the inner wall of the bottom of the push plate groove, a first push rod motor 11 is fixedly connected to the inner wall of the bottom groove, a, bottom fixedly connected with second push rod motor 13 of roof 3, the welding has square plate 14 on the output shaft of second push rod motor 13, the fixed cover in outside of pivot 8 is equipped with gear 15, square plate 14's front side fixedly connected with rack 16, gear 15 meshes with rack 16 mutually, fixedly connected with bottom plate 17 on the bottom inner wall of stationary die base 1, the rectangular channel has been seted up at the top of bottom plate 17, square plate 14's bottom extends to the rectangular channel in, equal fixedly connected with conducting strip 18 on square plate 14's the bottom and the bottom inner wall of rectangular channel, stationary die base 1's bottom fixedly connected with air pump 19, the fixedly connected with trachea of air outlet department of air pump 19.
In this embodiment, the air pump 19 is connected in series with the two conductive sheets 18 to form a loop.
In this embodiment, the bottom both sides of cover half seat 1 all weld the backup pad, support cover half seat 1.
In this embodiment, a square hole is formed at the top of the movable mold base 5, and the bottom of the square plate 14 penetrates through the square hole.
In this embodiment, the sliding plates 6 are fixedly connected to two sides of the bottom of the movable die holder 5, the sliding grooves are formed in two sides of the top of the fixed die holder 1, and the sliding plates 6 are slidably mounted in the sliding grooves, so that the stability of the movable die holder 5 during movement is improved.
In this embodiment, the bottom of the fixed mold base 1 is provided with a mounting hole, and the air pipe is fixedly mounted in the mounting hole.
In the utility model, when in use, the diode component and the punching filler are put into the pressing groove 10, then the hydraulic pump 4 is started, the hydraulic pump 4 drives the movable die holder 5 to move through the hydraulic rod, the movable die holder 5 drives the pressing block 7 to move, so that the pressing block 7 is inserted into the pressing groove 10 for pressing, the hydraulic rod on the hydraulic pump 4 returns to the original position after the pressing is completed, then the first push rod motor 11 is started, the output shaft of the first push rod motor 11 drives the pushing plate 12 to move, the pushing plate 12 pushes out the product after the pressing is completed, the formed product is convenient to take out, then the second push rod motor 13 is started, the output shaft of the second push rod motor 13 drives the square plate 14 to move, the square plate 14 drives the rack 16 to move, the rack 16 drives the gear 15 to rotate, the gear 15 drives the rotating shaft 8 to rotate, the rotating shaft 8 drives the metal plate 9 to rotate, the metal plate 9 drives the pressure type groove 10 to rotate, the square plate 14 drives the conducting strips 18 above the square plate to move, after the pressure type groove 10 rotates 180 degrees, the two conducting strips 18 just contact at the moment, when the two conducting strips 18 contact, the air pump 19 is started, the air pump 19 blows the pressure type groove 10 through an air pipe, and the pressure type groove 10 is conveniently cleaned.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A mould pressing device for producing glass-sealed diodes comprises a fixed mould base (1) and is characterized in that L-shaped plates (2) are welded on two sides of the fixed mould base (1), a same top plate (3) is welded on the tops of the two L-shaped plates (2), a hydraulic pump (4) is fixedly connected with the bottom of the top plate (3), a movable mould base (5) is fixedly connected onto a hydraulic rod of the hydraulic pump (4), a pressing block (7) is fixedly connected onto the bottom of the movable mould base (5), rotary grooves are formed in the inner walls of two sides of the fixed mould base (1), a same rotary shaft (8) is rotatably installed in the two rotary grooves, a metal plate (9) is fixedly connected onto the outer side of the rotary shaft (8), a pressing groove (10) is formed in the top of the metal plate (9), pin grooves are formed in the inner walls of two sides of the pressing groove (10), a push plate groove is, a bottom groove is formed in the inner wall of the bottom of the push plate groove, a first push rod motor (11) is fixedly connected to the inner wall of the bottom groove, a push plate (12) matched with the push plate groove is welded to the output shaft of the first push rod motor (11), a second push rod motor (13) is fixedly connected to the bottom of the top plate (3), a square plate (14) is welded to the output shaft of the second push rod motor (13), a gear (15) is fixedly sleeved on the outer side of the rotating shaft (8), a rack (16) is fixedly connected to the front side of the square plate (14), the gear (15) is meshed with the rack (16), a bottom plate (17) is fixedly connected to the inner wall of the bottom of the fixed die holder (1), a rectangular groove is formed in the top of the bottom plate (17), the bottom of the square plate (14) extends into the rectangular groove, conductive sheets (18) are fixedly connected to the bottom of the square plate (14) and the inner wall of the bottom, an air pipe is fixedly connected at the air outlet of the air pump (19).
2. The glass-sealed diode production embossing device as claimed in claim 1, wherein the air pump (19) and the two conducting strips (18) are connected in series in sequence to form a loop.
3. The glass-sealed diode production molding device according to claim 1, wherein the fixed mold base (1) is welded with support plates on both sides of the bottom.
4. The die pressing device for producing the glass-sealed diode according to claim 1, wherein a square hole is formed in the top of the movable die holder (5), and the bottom of the square plate (14) penetrates through the square hole.
5. The glass-sealed diode production die pressing device according to claim 1, wherein sliding plates (6) are fixedly connected to two sides of the bottom of the movable die holder (5), sliding grooves are formed in two sides of the top of the fixed die holder (1), and the sliding plates (6) are slidably mounted in the sliding grooves.
6. The glass-sealed diode production die pressing device as claimed in claim 1, wherein the bottom of the fixed die holder (1) is provided with a mounting hole, and the air pipe is fixedly mounted in the mounting hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020851927.7U CN212764902U (en) | 2020-05-20 | 2020-05-20 | Mould pressing device is used in production of glass sealed diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020851927.7U CN212764902U (en) | 2020-05-20 | 2020-05-20 | Mould pressing device is used in production of glass sealed diode |
Publications (1)
Publication Number | Publication Date |
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CN212764902U true CN212764902U (en) | 2021-03-23 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202020851927.7U Expired - Fee Related CN212764902U (en) | 2020-05-20 | 2020-05-20 | Mould pressing device is used in production of glass sealed diode |
Country Status (1)
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CN (1) | CN212764902U (en) |
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2020
- 2020-05-20 CN CN202020851927.7U patent/CN212764902U/en not_active Expired - Fee Related
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210323 |
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CF01 | Termination of patent right due to non-payment of annual fee |