CN212764133U

CN212764133U - Semiconductor processing die device

Info

Publication number: CN212764133U
Application number: CN202020495052.1U
Authority: CN
Inventors: 张超; 刘星; 万冠军; 赵建国
Original assignee: Shandong Tianyue Advanced Technology Co Ltd
Current assignee: Shandong Tianyue Advanced Technology Co Ltd
Priority date: 2020-04-07
Filing date: 2020-04-07
Publication date: 2021-03-23
Anticipated expiration: 2030-04-07

Abstract

The utility model provides a semiconductor processing die device, which comprises a base and a die body, wherein a pressing sheet is arranged in the die body; the movable plate is arranged above the die body and is connected with the pressing sheet through a first supporting column; the fixed plate is arranged above the movable plate, connected with the movable plate through an elastic element and connected with the die body through a second supporting column; the lever, the one end of lever is connected with the top surface of fixed plate, be connected with the third support column on the lever, the one end of third support column is fixed on the lever, the other end and base fixed connection. The utility model discloses an increase fly leaf and fixed plate in mould main part top, and adopt the lever convenience to exert strength to the mould body, through being connected of fly leaf and this internal pressing plate of mould, when outwards getting the material, press down the fly leaf, the pressing plate promotes the material and takes out convenient and fast downwards.

Description

Semiconductor processing die device

Technical Field

The utility model relates to a semiconductor processing mold device belongs to the technical field of production mould.

Background

The mould is a tool which is used for making blanks into finished pieces with specific shapes and sizes by various moulds and tools which are used for obtaining required products by injection molding, blow molding, extrusion, die casting or forging forming, smelting, stamping and the like in industrial production under the action of external force. The mould has a specific contour or an inner cavity shape, the material can be separated according to the contour shape by applying the contour shape with the cutting edge, and the material can obtain a corresponding three-dimensional shape by applying the inner cavity shape.

Silicon carbide, as a third-generation semiconductor material, has excellent properties such as large forbidden band width, high saturated electron mobility, strong breakdown field, high thermal conductivity and the like, and is widely applied to the fields of power electronics, photoelectronic devices and the like. Silicon carbide products can be classified into a wide variety of types, and into different types according to different use environments. Generally, a relatively large number of machines are used. Such as those used in mechanical seals, which may be referred to as silicon carbide plates, silicon carbide rings, and the like.

According to the existing silicon carbide material processing mold, when materials are processed, two hands are used for pressing the mold, the mold does not have any auxiliary force and protective measures, and the body of a user feels tired when a plurality of materials are continuously processed. And when the processed materials are taken out of the die, the materials are not easy to take out, and the materials are required to be pushed out one by one on the die when taken, so that the materials are easy to damage, the cost is increased, and the work is inconvenient.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a semiconductor processing die device after improvement, this die device is through increasing fly leaf and fixed plate in mould main part top, and utilizes the lever can conveniently process and take out the material.

The utility model adopts the technical scheme as follows:

the utility model provides a semiconductor processing die device, a serial communication port, die device includes:

a base;

the die comprises a die body, a base and a pressing sheet, wherein the die body is placed on the base, and the pressing sheet is arranged in the die body;

the movable plate is arranged above the die body and is connected with the pressing sheet through a first supporting column;

the fixed plate is arranged above the movable plate, connected with the movable plate through an elastic element and connected with the die body through a second supporting column;

the lever, the one end of lever is connected with the top surface of fixed plate, be connected with the third support column on the lever, the one end of third support column is fixed on the lever, the other end and base fixed connection.

Preferably, the number of the first support columns is at least three, and the at least three first support columns are connected with the pressing piece in a symmetrical manner.

Preferably, the number of the second support columns is at least three, and the at least three second support columns are connected with the die body in a symmetrical manner.

Preferably, the die body is provided with a cutting edge.

Preferably, the semiconductor material is placed below the die body, and the length of the cutting edge is 3-6 times of the thickness of the semiconductor material.

Preferably, the mold body includes an annular groove and a hollow body, and an outer circumferential surface of the hollow body is provided with the annular groove.

Preferably, the outer bottom wall of the annular groove is a first cutting edge, and the inner bottom wall of the annular groove is a second cutting edge.

Preferably, the first cutting edge and the second cutting edge are both planar structures.

Preferably, the pressing piece is a circular ring piece.

Preferably, one end of the third supporting column is fixed on the lever at a position close to the connecting end of the lever and the fixing plate.

The utility model has the advantages that:

(1) the utility model discloses an increase fly leaf and fixed plate in mould main part top, and adopt the lever convenience to exert strength to the mould body, through being connected of fly leaf and this internal pressing plate of mould, when outwards getting the material, press down the fly leaf, the pressing plate promotes the material and takes out convenient and fast downwards.

(2) The utility model discloses an at least three first support column that will connect fly leaf and pressing sheet is the symmetry setting for the stress point of pressing sheet is even, when the pressing sheet promoted the material, because the stress is even, the material is not fragile, has increased the qualification rate.

(3) The utility model discloses an at least three second support column that will connect fixed plate and mould main part is the symmetry setting for at least three stress point is even on the mould body, and when utilizing mould main part processing material, the material is not fragile.

(4) The utility model discloses a set up the length of cutting edge for 3 ~ 6 times of semiconductor material thickness, with the length increase of cutting edge, can many materials of simultaneous processing, process after stacking the material board, can realize the quantization processing material.

Drawings

The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it.

In the drawings:

fig. 1 is a schematic structural view of the semiconductor processing mold apparatus of the present invention in a state;

fig. 2 is a schematic structural view of the semiconductor processing mold device of the present invention in another state;

fig. 3 is a schematic structural view of the mold body of the present invention;

wherein, 1, a mould body; 2. a movable plate; 3. a fixing plate; 4. a lever; 5. pressing the sheet; 6. a first support column; 7. a second support column; 8. an elastic element; 9. a third support column; 10. a hollow body; 11. an annular groove; 12. a first cutting edge; 13. a second cutting edge.

Detailed Description

The present invention will be described in detail with reference to the following examples, but the present invention is not limited to these examples.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

In addition, in the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; the connection can be mechanical connection, connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Referring to fig. 1 and 2, an embodiment of the present invention discloses a semiconductor processing mold device, which includes a base, a mold body 1, a movable plate 2, a fixed plate 3 and a lever 4; the die body 1 is placed on a base, and a pressing sheet 5 is arranged in the die body 1; the movable plate 2 is disposed above the mold body 1, and the movable plate 2 is connected to the pressing sheet 5 through a first support column 6. For the sake of clear illustration of the pressing piece, the pressing piece 5 is pushed out downward without being in the die body 1 as shown in fig. 2. The fixed plate 3 is arranged above the movable plate 2, the fixed plate 3 is connected with the movable plate 2 through an elastic element 8, and the fixed plate 3 is connected with the die body 1 through a second support column 7; one end of the lever 4 is connected with the top surface of the fixing plate 3, the lever 4 is connected with a third supporting column 9, one end of the third supporting column 9 is fixed on the lever 4, and the other end of the third supporting column is fixedly connected with the base.

The utility model discloses a set up fly leaf 2 and fixed plate 3 above mould body 1, and utilize lever 4, when upwards lifting 4 one ends of lever, the other end downward application of force that lever 4 and fixed plate 3 are connected because fixed plate 3 is connected with mould body 1, conveniently exerts strength to mould body 1. Through being connected of fly leaf 2 and interior pressing piece 5 of mould body 1, when outwards getting the material, press down lever 4 and make mould body 1 lift, press fly leaf 2 down, pressing piece 5 promotes the material and takes out convenient and fast downwards.

In one embodiment of the present application, the lower end of the first support column 6 is welded to the pressing sheet 5 in the mold body 1, and the upper end of the first support column 6 is bolted to the movable plate 2, so as to facilitate disassembly; the top wall of the die main body 1 is provided with a through hole through which the first support column 6 passes, and the diameter of the through hole is approximately equal to that of the first support column 6. When no external force is applied, the first support column 6 has friction with the through hole, and the first support column 6 cannot move. Under the action of external force, the first support column 6 can move up and down. The connection manner of the first support column 6 with the pressing sheet 5 and the movable plate 2 may also be other manners conventionally used in the art.

In a specific embodiment of the application, the lower end of the second supporting column 7 is welded with the top end of the die main body 1, and the upper end of the second supporting column 7 is connected with the fixing plate 3 through a bolt, so that the disassembly is convenient; a through hole through which the second supporting column 7 passes is formed in the movable plate 2, and the diameter of the through hole is approximately equal to that of the second supporting column 7. The second supporting columns 7 are connected to the mold body 1 and the fixing plate 3 in other ways that are conventionally used in the art.

In one embodiment of the present application, the number of the first support columns 6 is at least three, and the at least three first support columns 6 are connected to the pressing piece in a symmetrical manner. Preferably, the number of the first support columns 6 is four. One end of each of the four first support columns 6 is connected with the bottom end of the movable plate 2 in a symmetrical manner, the four first support columns 6 respectively penetrate through holes formed in the die body 1, and the other end of each of the four first support columns 6 is connected with the pressing piece 5 in a symmetrical manner. Through with 6 symmetry settings of at least three second support column for it is even to apply to the stress point of pressing the piece 5, when pressing the piece 5 and promoting the material, because the atress is even, the material is not fragile, has increased the qualification rate.

In a specific embodiment of the present application, the number of the second supporting columns 7 is at least three, and the at least three second supporting columns 7 are connected with the mold body 1 in a symmetrical manner. Preferably, the number of the second supporting columns 7 is four, one ends of the four second supporting columns 7 are connected with the bottom end of the fixed plate 3 in a symmetrical manner, the four second supporting columns 7 respectively penetrate through holes formed in the movable plate 2, and the other ends of the second supporting columns 7 are connected with the mold body 1 in a symmetrical manner. Through with 7 symmetry settings of at least three second support column for when exerting oneself downwards to mould body 1, make a plurality of stress points even, mould body 1 atress is even, and during the processing material, the material is not fragile.

In one embodiment of the present application, the die body 1 is provided with a cutting edge. The cutting edge of the cutting edge can be used for separating materials according to the contour line of the cutting edge.

In a specific embodiment of this application, place the semiconductor material below the mould body 1, the length of cutting edge is 3 ~ 6 times of semiconductor material thickness. In the conventional material processing mold, only one material can be processed at one time when the material is processed. The utility model discloses a with the length increase of cutting edge, can many materials of simultaneous processing, process after stacking the material board, can realize the quantization material processing.

In one embodiment of the present application, the mold body 1 includes an annular groove 11 and a hollow body 10, and the outer circumferential surface of the hollow body 10 is provided with the annular groove 11. When the material feeding device is used, the opening end of the annular groove 11 faces downwards, and materials are placed below the opening end of the annular groove 11.

In one embodiment of the present application, the pressing piece 5 is a circular ring piece. The pressing sheet 5 is placed in the annular groove of the die body 1, and the processed material is a circular ring sheet, so that the pressing sheet 5 is arranged into the circular ring sheet and basically matched with the shape of the material, and when the pressing sheet 5 is used for pushing out the material, the material can be protected to a certain extent.

In a preferred embodiment of the present application, the elastic member 8 is a spring, and an elastic member conventionally used in the art may be used. The spring has simple and convenient structure. And the spring is arranged at the position between the movable plate 2 and the fixed plate 3, so that the uniformity of stress points on the movable plate 2 is not influenced when the movable plate 2 moves downwards.

In one embodiment of the present application, one end of the third supporting column 9 is fixed to the lever 4 near its end connected to the fixing plate 3. One end of the third supporting column 9 is fixed at a position close to the connecting end of the lever 4 and the fixed plate 3, and when one end of the lever 4 is pressed downwards, the mold body 1 and the movable plate 2 and the fixed plate 3 connected with the mold body can be lifted up by using a small force.

Referring to fig. 3, in a preferred embodiment of the present application, the outer bottom wall of the annular groove 11 is a first cutting edge 12, and the inner bottom wall of the annular groove is a second cutting edge 13. The first cutting edge 12 is used for cutting a circumference of an outer circle of a ring, and the second cutting edge 13 is used for cutting a circumference of an inner circle of a ring.

In a preferred embodiment of the present application, the first cutting edge 12 and the second cutting edge 13 are both planar structures. When the first cutting edge 12 and the second cutting edge 13 are used for processing materials, the first cutting edge 12 and the second cutting edge 13 simultaneously act on the materials, and the materials can be processed into a circular ring component.

When the device of the utility model is used, when the free end of the lever 4 is pressed down the lever 4 with force downwards, the die body 1 and the movable plate 2 and the fixed plate 3 connected with the die body are lifted, and then the material to be processed is placed on the base at the position of the die body before the stress, so that the material to be processed is positioned below the die body 1 during processing; then, exerting force upwards on the free end of the lever 4, lifting the free end of the lever 4, and enabling the die body 1 to contact with the material and cut through the material through the cutting edge; and finally, when the lever 4 is pressed downwards and forcefully at the free end of the lever 4, the die body 1 and the movable plate 2 and the fixed plate 3 connected with the die body are lifted, the movable plate 2 is pressed down, the material is pushed downwards by the pressing sheet 5 connected with the movable plate 2, and the whole processing process is finished.

The above description is only an example of the present invention, and the protection scope of the present invention is not limited by these specific examples, but is defined by the claims of the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the technical idea and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor processing die apparatus, comprising:

a base seat is arranged on the base seat,

2. The semiconductor processing die apparatus according to claim 1, wherein the number of the first support columns is at least three, and the at least three first support columns are connected to the pressing piece in a symmetrical manner.

3. The semiconductor processing die apparatus of claim 1, wherein the number of the second support columns is at least three, and the at least three second support columns are connected with the die body in a symmetrical manner.

4. The semiconductor processing die apparatus according to claim 1, wherein a cutting edge is provided on the die body.

5. The semiconductor processing die device according to claim 4, wherein the semiconductor material is placed under the die body, and the length of the cutting edge is 3 to 6 times the thickness of the semiconductor material.

6. The semiconductor processing die apparatus according to claim 1, wherein the die body comprises an annular groove and a hollow body, an outer peripheral surface of the hollow body being provided with the annular groove.

7. The semiconductor processing die apparatus of claim 6, wherein the outer bottom wall of the annular groove is a first cutting edge and the inner bottom wall of the annular groove is a second cutting edge.

8. The semiconductor processing die apparatus of claim 7, wherein the first cutting edge and the second cutting edge are each planar in configuration.

9. The semiconductor processing die apparatus according to claim 1, wherein the pressing piece is a circular ring piece.

10. The semiconductor processing die apparatus of claim 1, wherein one end of the third supporting column is fixed to the lever at a position near a connecting end of the lever with the fixing plate.