CN212750826U - Semiconductor processing device with excellent hydrophobic property - Google Patents

Abstract

The utility model discloses a semiconductor processingequipment that hydrophobic performance is excellent, comprising a base plate, bottom plate upper end rigid coupling has the apron, begins to have the screw hole in the upper end of apron, the apron sets up for the slope, and has the angle of inclination between apron and the bottom plate, is provided with hydrophobic coating in the upper end of apron. The utility model discloses in the implementation, reduced the emergence of defective rate, the effect is splendid, and this technical scheme can use repeatedly.

Description

Semiconductor processing device with excellent hydrophobic property

Technical Field

The utility model belongs to the technical field of the chip manufacturing processing, specifically be a semiconductor processingequipment that hydrophobic property is excellent.

Background

In the field of current semiconductor chip processing, liquid needs to be sprayed and poured on the surface of an object in the process, the liquid components are complex, the liquid is easy to remain in other areas which do not need to be sprayed under the condition of long-time use, and finally, the liquid is deposited (like scale), the deposited load can be continuously accumulated to be enlarged into blocks and even fall off, and the fallen load can scratch and pollute the product, so that the product is scrapped and defective products are produced.

Under the existing conditions, redundant loads on the surface cannot be thoroughly cleaned, the solution is to stop the machine for brushing, so that the whole machine needs to be washed and cleaned after each processing or in the process of long-time processing, the working hours and materials are wasted, equipment is consumed, the process time and the processing cost of chip processing are increased, and the working efficiency is reduced.

Disclosure of Invention

To the above situation, for overcoming prior art's defect, the utility model provides a semiconductor processing device that hydrophobic property is excellent, the effectual inconvenient problem of clearing up among the prior art of having solved, product fish tail, pollution, cleaning cycle length.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor processing device that hydrophobic property is excellent, includes the bottom plate, bottom plate upper end rigid coupling has the apron, begins to have the screw hole in the upper end of apron, the apron sets up for the slope, and has the angle of inclination between apron and the bottom plate, is provided with hydrophobic coating in the upper end of apron.

Preferably, the angle of inclination is in the range of up to 10 degrees 45.

Preferably, the material of the hydrophobic coating is one of PTFE, PFA or ETFE.

Preferably, the number of the screw holes is several.

Compared with the prior art, the beneficial effects of the utility model are that:

the cover plate is provided with a slope surface with a certain hydrophobic angle, and the surface of the cover plate is coated with a hydrophobic material. The cover plate can be used for designing and replacing parts needing hydrophobic protection. The cover plate slope angle is 10-45 degrees which is a hydrophobic angle adjusted according to different liquid surface adsorption forces, so that liquid can not stay and accumulate, the surface of the cover plate is coated with a special hydrophobic material, and the coating has no adsorption effect on the liquid, so that an excellent hydrophobic effect is achieved.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic cross-sectional view of a-a in fig. 1 according to the present invention.

In the figure: 1. a cover plate; 2. a screw hole; 3. a base plate; 4. an inclination angle; 5. a hydrophobic coating.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Given by fig. 1-2, the utility model discloses a semiconductor processing device that hydrophobic performance is excellent, including bottom plate 3, the rigid coupling of bottom plate 3 upper end has apron 1, has screw hole 2 in the upper end of apron 1 beginning, and apron 1 sets up for the slope, and has angle of inclination 4 between apron 1 and the bottom plate 3, is provided with hydrophobic coating 5 in the upper end of apron 1.

The angle of inclination 4 ranges between 10 and 45 degrees.

The hydrophobic coating 5 is made of one of PTFE, PFA or ETFE.

The number of the screw holes 2 is several.

The cover plate 1 has a slope surface with a certain hydrophobic angle and the surface is coated with hydrophobic material. The cover plate 1 can be designed and replaced for parts needing hydrophobic protection. The cover plate 1 is characterized in that the slope angle of the cover plate 1 is 10-45 degrees, the slope angle is a hydrophobic angle adjusted according to adsorption force of different liquid surfaces, so that liquid can not stay and accumulate, the surface of the cover plate is coated with a special hydrophobic material, and the coating has no adsorption effect on the liquid, so that an excellent hydrophobic effect is achieved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. A semiconductor processing apparatus excellent in hydrophobic property, comprising a base plate (3), characterized in that: bottom plate (3) upper end rigid coupling has apron (1), begins to have screw hole (2) in the upper end of apron (1), apron (1) sets up for the slope, and has angle of inclination (4) between apron (1) and bottom plate (3), is provided with hydrophobic coating (5) in the upper end of apron (1).

2. The semiconductor processing apparatus according to claim 1, wherein: the inclination angle (4) ranges between 10 and 45 degrees.

3. The semiconductor processing apparatus according to claim 1, wherein: the material of the hydrophobic coating (5) is one of PTFE, PFA or ETFE.

4. The semiconductor processing apparatus according to claim 1, wherein: the number of the screw holes (2) is a plurality.

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