CN212749694U

CN212749694U - Transmission integrated module of Internet of things

Info

Publication number: CN212749694U
Application number: CN202021328824.9U
Authority: CN
Inventors: 韩洪武
Original assignee: Ouleok Tangshan Technology Co ltd
Current assignee: Ouleok Tangshan Technology Co ltd
Priority date: 2020-07-08
Filing date: 2020-07-08
Publication date: 2021-03-19
Anticipated expiration: 2030-07-08

Abstract

The utility model relates to the technical field of the internet of things, and discloses an internet of things transmission integrated module, which comprises a circuit board body and an encapsulation body, wherein the front side of the circuit board body is hinged with a protective cover, the inner part of the protective cover is provided with an inner cover, the upper side and the lower side of the back part of the inner cover are respectively bolted with a fixed block, the rear side of the inner cavity of the protective cover is bolted with a support, the upper side and the lower side of the front side of the support are respectively provided with a first fixed groove and a second fixed groove, and the left side; the utility model discloses a setting of protection casing, inner cover, draw-in groove, card post and sealing washer for this collection moulding piece can protect the chip and the packaging material that self surface set up, reduces the impaired probability of chip, has solved when clearing up and maintaining collection moulding piece's circuit board, and the packaging material that easily touches leads to the chip not hard up damage even, influences the problem that collection moulding piece used, has improved the protectiveness of this collection moulding piece self.

Description

Transmission integrated module of Internet of things

Technical Field

The utility model relates to a thing networking technology field specifically is thing networking transmission collection moulding piece.

Background

The internet of things is characterized in that any object is connected with a network through information sensing equipment according to an agreed protocol, the object performs information exchange and communication through an information transmission medium so as to realize functions of intelligent identification, positioning, tracking, supervision and the like, and an internet of things transmission integrated module is an important unit in information transmission of the internet of things and can also be an integrated circuit capable of realizing remote data acquisition, processing, storage, encryption and transmission.

The integrated circuit board of the transmission integrated module is provided with various chips, and the surfaces of the chips are provided with packaging materials, but when the surfaces of the circuit board are cleaned and maintained, the packaging materials on the surfaces of the chips are easily touched, so that the chips are loosened and even damaged, and therefore the integrated module which can protect the chip packaging materials and reduce the damage probability of the chips is provided for solving the problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a thing networking transmission collection moulding piece possesses and can protect chip packaging material, reduces the advantage of the impaired probability of chip, has solved when clearing up and maintaining collection moulding piece's circuit board, easily touches packaging material and leads to the not hard up problem of damaging even of chip.

In order to achieve the above object, the utility model provides a following technical scheme: thing networking transmission collection moulding piece, including circuit board body and packaging body, the front of circuit board body articulates there is the protection casing, the inside of protection casing is provided with the inner cover, the upper and lower both sides at inner cover back all bolted connection have the fixed block, the rear bolted connection of protection casing inner chamber has the support, first fixed slot and second fixed slot have been seted up respectively to the positive upper and lower both sides of support, the draw-in groove has been seted up in the positive left side of protection casing, the front of circuit board body is provided with the card post that uses with the draw-in groove cooperation, the packaging body be provided with the sealing washer all around, and the back and the circuit board body bonding of.

Preferably, an inner groove is formed in the support and above the first fixing groove, and a sliding groove is formed in the top of the inner cavity of the first fixing groove.

Preferably, the left side and the right side of the top of the support are both provided with a connecting rod in a penetrating mode, the bottom end of the connecting rod penetrates through the first fixing groove and is bolted with the push plate, and the top end of the connecting rod penetrates through the outer portion of the protective cover and is bolted with the transverse plate.

Preferably, the inner wall of the inner groove is slidably connected with a limiting plate, a plurality of springs are mounted on the front side and the rear side of the top of the limiting plate through fixing buckles, and the top ends of the springs are fixedly mounted on the inner wall of the inner groove through fixing buckles.

Preferably, a pull ring is installed at the center of the top of the transverse plate, and a shifting piece is bolted to the left side of the protective cover.

Preferably, the inner wall of the inner cover is bonded with a protective pad, and the protective pad is made of rubber.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses a setting of protection casing, inner cover, draw-in groove, card post and sealing washer for this collection moulding piece can protect the chip and the packaging material that self surface set up, reduces the impaired probability of chip, has solved when clearing up and maintaining collection moulding piece's circuit board, and the packaging material that easily touches leads to the chip not hard up damage even, influences the problem that collection moulding piece used, has improved the protectiveness of this collection moulding piece self.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

fig. 2 is a structural front view of the protective cover of the present invention;

FIG. 3 is a left sectional view of the present invention;

fig. 4 is a sectional view of the support according to the present invention.

In the figure: 1. a circuit board body; 2. a package body; 3. a protective cover; 4. an inner cover; 5. a fixed block; 6. a support; 7. a first fixing groove; 8. a second fixing groove; 9. a card slot; 10. clamping the column; 11. a seal ring; 12. an inner tank; 13. a chute; 14. pushing the plate; 15. a connecting rod; 16. a transverse plate; 17. a limiting plate; 18. a spring; 19. a pull ring; 20. a shifting sheet.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, an internet of things transmission integrated module includes a circuit board body 1 and a package body 2, a protective cover 3 is hinged to the front of the circuit board body 1, an inner cover 4 is disposed inside the protective cover 3, fixing blocks 5 are bolted to the upper and lower sides of the back of the inner cover 4, a support 6 is bolted to the rear of the inner cavity of the protective cover 3, a first fixing groove 7 and a second fixing groove 8 are respectively disposed on the upper and lower sides of the front of the support 6, a clamping groove 9 is disposed on the left side of the front of the protective cover 3, a clamping post 10 matched with the clamping groove 9 is disposed on the front of the circuit board body 1, a sealing ring 11 is disposed around the package body 2, and the back of the sealing ring 11 is bonded to the circuit board body 1, the integrated module can protect a chip and a package material thereof disposed on the surface thereof, reduce the probability of damage of the, the problem that the use of the integrated module is affected due to the fact that the chip is loosened and even damaged due to the fact that the packaging material is easily touched is solved, and the protection performance of the integrated module is improved.

Referring to fig. 3 and 4, an inner groove 12 is formed in the support 6 and above the first fixing groove 7, a sliding groove 13 is formed in the top of the inner cavity of the first fixing groove 7, and the inner groove 12 and the sliding groove 13 are arranged to facilitate the connecting rod 15 and the push plate 14 to slide up and down in the support 6, so as to achieve the effect of adjusting the push plate 14 up and down.

Referring to fig. 3 and 4, the left side and the right side of the top of the support 6 are both provided with a connecting rod 15 in a penetrating manner, the bottom end of the connecting rod 15 penetrates through the first fixing groove 7 and is bolted with a push plate 14, the top end of the connecting rod 15 penetrates through the outside of the protective cover 3 and is bolted with a transverse plate 16, and the fixing block 5 is limited by the arrangement of the connecting rod 15 and the push plate 14.

Referring to fig. 3 and 4, the inner wall of the inner groove 12 is slidably connected with a limiting plate 17, a plurality of springs 18 are mounted on the front and rear sides of the top of the limiting plate 17 through fixing buckles, the top ends of the springs 18 are fixedly mounted on the inner wall of the inner groove 12 through fixing buckles, and the pushing plate 14 and the connecting rod 15 can be reset after being pulled up through the limiting plate 17 and the springs 18.

Referring to fig. 1 and 2, a pull ring 19 is installed at the center of the top of the transverse plate 16, a shifting piece 20 is bolted to the left side of the shield 3, and the push plate 14 and the connecting rod 15 are conveniently pulled up by a user through the arrangement of the pull ring 19 and the shifting piece 20, so that the limit of the fixed block 5 is released.

Referring to fig. 1 and 2, a protection pad is bonded to an inner wall of the inner cover 4, and the protection pad is made of rubber, so that the protection performance and the insulation performance of the inner cover 4 are improved by the protection pad.

The working principle is as follows: when the chip on the circuit board needs to be protected, firstly, the inner cover 4 is held, the fixing block 5 on the back of the inner cover is respectively aligned with the first fixing groove 7 and the second fixing groove 8, the fixing block 5 is respectively dropped into the two grooves downwards, meanwhile, the pull ring 19 is hooked to enable the fixing block to move upwards, the connecting rod 15, the push plate 14 and the limiting plate 17 are driven by the transverse plate 16 to move upwards together, the spring 18 is compressed at the moment, then the pull ring 19 is loosened, the limiting plate 17 and the push plate 14 move downwards under the reaction force of the spring 18 until the push plate 14 is contacted with the fixing block 5, at the moment, the inner cover 4 is fixed in front of the support 6, then the poking piece 20 is pinched to rotate the protective cover 3 by 180 degrees until the opening of the protective cover 3 is tightly attached to the sealing ring 11, meanwhile, the clamping column 10 is tightly attached to the inner wall of the clamping groove 9, so that the protective cover 3 is tightly attached, the chip on the inner side of the chip is protected.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Thing networking transmission collection moulding piece, including circuit board body (1) and packaging body (2), its characterized in that: the front of circuit board body (1) articulates there is protection casing (3), the inside of protection casing (3) is provided with inner cover (4), the equal bolt in upper and lower both sides at inner cover (4) back has fixed block (5), the rear bolt in protection casing (3) inner chamber has support (6), first fixed slot (7) and second fixed slot (8) have been seted up respectively to the positive upper and lower both sides of support (6), draw-in groove (9) have been seted up in the positive left side of protection casing (3), the front of circuit board body (1) is provided with card post (10) of using with draw-in groove (9) cooperation, be provided with sealing washer (11) around encapsulation body (2), and the back of sealing washer (11) bonds with circuit board body (1).

2. The internet of things transmission integration module of claim 1, wherein: an inner groove (12) is formed in the support (6) and above the first fixing groove (7), and a sliding groove (13) is formed in the top of the inner cavity of the first fixing groove (7).

3. The internet of things transmission integration module of claim 1, wherein: the left side and the right side of support (6) top all run through and are provided with connecting rod (15), the bottom of connecting rod (15) runs through to first fixed slot (7) and bolted connection has push pedal (14), the top of connecting rod (15) runs through to the outside of protection casing (3) and bolted connection has diaphragm (16).

4. The internet of things transmission integration module of claim 2, wherein: the inner wall sliding connection of inside groove (12) has limiting plate (17), a plurality of spring (18) are all installed through the fixed knot to both sides around limiting plate (17) top, and the top of spring (18) is through the fixed knot with the inner wall fixed mounting of inside groove (12).

5. The internet of things transmission integration module of claim 3, wherein: the center of the top of the transverse plate (16) is provided with a pull ring (19), and the left side of the protective cover (3) is bolted with a shifting piece (20).

6. The internet of things transmission integration module of claim 1, wherein: the inner wall of the inner cover (4) is bonded with a protective pad, and the protective pad is made of rubber.