CN212749054U

CN212749054U - Near-field probe

Info

Publication number: CN212749054U
Application number: CN202020731186.9U
Authority: CN
Inventors: 史煜仲; 陈文宽; 薛俊
Original assignee: TP Link Technologies Co Ltd
Current assignee: TP Link Technologies Co Ltd
Priority date: 2020-05-06
Filing date: 2020-05-06
Publication date: 2021-03-19
Anticipated expiration: 2030-05-06

Abstract

The application relates to the technical field of near field detection, and provides a near field probe, which comprises a probe body and a sticking material, wherein the probe body is of a plate-shaped structure; the sticking material is made of insulating material and is in a membrane structure, the sticking material and the probe body are arranged in a laminated mode, one side membrane surface of the sticking material is stuck and connected to one side plate surface of the probe body, and the other side membrane surface is used for being stuck to the periphery side of the point to be detected. The near-field probe is characterized in that the probe body is arranged in a plate shape, and the plate surface on one side of the probe body is laminated with the adhesive material, so that the probe body is accurately fixed near a point to be detected through the adhesive material, the fixing and the dismounting are convenient, the probe body is favorable for accurately and continuously detecting the radiation quantity generated by the same interference source, and the longitudinal comparison of the effects of the probe body before and after the rectification of the interference source is favorably realized; the miniaturized design of the probe body is facilitated, so that the near-field probe can be used in a complicated or narrow test environment.

Description

Near-field probe

Technical Field

The application belongs to the technical field of near field detection, and particularly relates to a near field probe.

Background

The near-field probe can be used for realizing near-field detection so as to locate a radiation interference source and correct the radiation interference problem. When the near field probe is used, the near field probe is held by a user in related industries to scan a sample machine to be tested, however, the consistency of multiple detection positions is difficult to ensure, so that longitudinal comparison of effects before and after rectification of the sample machine to be tested cannot be carried out, and the size of the near field probe is relatively large for convenience of holding by the hand, so that the near field probe is difficult to use in a complex or narrow test environment; or the near-field probe is connected with the mechanical arm to scan the sample machine to be tested, which is beneficial to longitudinally comparing the effects before and after the sample machine to be tested is rectified, however, the degree of freedom of the mechanical arm is relatively poor, so that the near-field probe is still difficult to use in a complex or narrow testing environment.

SUMMERY OF THE UTILITY MODEL

An object of the embodiments of the present application is to provide a near field probe, so as to solve the technical problem that the existing near field probe is difficult to use in a complex or narrow test environment.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: a near field probe, comprising:

the probe body is of a plate-shaped structure;

the sticking material is made of an insulating material and has a membrane structure, the sticking material and the probe body are stacked, one membrane surface of the sticking material is stuck and connected with one membrane surface of the probe body, and the other membrane surface is used for being stuck to the periphery of the point to be detected.

In one embodiment, the adhesive material is glue, double-sided tape, foam or hot melt adhesive.

In one embodiment, the near-field probe further comprises a protective film adhered to the side of the pasting material, which faces away from the probe body.

In one embodiment, the probe body at least comprises a first shielding structure, a near-field detection structure and a second shielding structure which are sequentially stacked, wherein the near-field detection structure comprises a signal strip line and a detection strip line, the signal strip line is arranged in a straight routing manner, and the detection strip line is arranged in an open ring manner;

the first shielding structure comprises a first shielding body and a first shielding ring for shielding the detection strip line, and the second shielding structure comprises a second shielding body and a second shielding ring for shielding the detection strip line;

the probe body is provided with at least one first through hole which is arranged in a penetrating way at the free end, and the free end is connected with the first shielding ring and the second shielding ring through the first through holes.

In an embodiment, the near-field detection structure further includes a ground plate connected to a side of the signal stripline away from the detection stripline, a microstrip line disposed opposite to the ground plate is disposed on the first shielding body, the ground plate and the microstrip line are used together to implement electromagnetic energy transfer, a second through hole penetrating the probe body is disposed at an end of the signal stripline facing the ground plate, and the signal stripline is connected to the microstrip line through the second through hole.

In one embodiment, the first shielding body is further provided with a signal pad connected with the microstrip line, and the signal pad is connected with external test equipment through a coaxial line.

In one embodiment, an angle between the coaxial line and the microstrip line is 0 to 90 °.

In one embodiment, the first shielding structure has an open window region, a first gap region located on a side of the first shielding ring away from the first shielding body, and a first copper-clad region located outside the open window region and the first gap region, the microstrip line and the signal pad are both located in the open window region, and the first gap region is used for cutting off a current path of the first shielding ring to improve the capability of the probe body to suppress interference signals;

the second shielding structure is provided with a forbidden spreading area corresponding to the second communication hole, a second gap area located on one side, away from the second shielding body, of the second shielding ring, and a second copper-clad area located outside the forbidden spreading area and the second gap area, and the second gap area is used for cutting off a current path of the second shielding ring.

In one embodiment, the microstrip line is connected with external test equipment through an SMA radio frequency connector.

In one embodiment, the diameter of the second communicating hole is 0.2-0.4 mm.

In one embodiment, the length of the signal strip line is 5-10 mm, and the diameter of the open ring formed by the detection strip line is 5-7 mm.

In one embodiment, the probe body further comprises a first dielectric layer stacked and arranged between the first shielding structure and the near-field detection structure, and a second dielectric layer stacked and arranged between the near-field detection structure and the second shielding structure.

The application provides beneficial effect lies in:

according to the near-field probe provided by the embodiment of the application, the probe body is arranged in a plate shape, the pasting material is arranged on the plate surface on one side of the probe body in a laminating mode, so that the probe body is accurately fixed near a point to be detected like a label through the pasting material, on the basis, on one hand, the near-field probe is beneficial to the probe body to accurately and continuously detect the radiation quantity generated by the same interference source, and therefore the probe body is beneficial to longitudinally comparing the effects of the probe body before and after the interference source is rectified; on the other hand, paste the material and can make the probe body fixed, dismantle all comparatively convenient, and can not lead to the fact great restraint to the size of probe body, therefore, it still does benefit to and carries out miniaturized design to the probe body, has reduced near field probe's whole volume to make near field probe can use in complicated or constrictive test environment.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a top view of a near field probe according to an embodiment of the present disclosure;

FIG. 2 is an exploded view of the near field probe provided in FIG. 1;

FIG. 3 is a schematic perspective view of the near field detection structure provided in FIG. 2;

fig. 4 is a top view of a near field probe according to a second embodiment of the present application.

Wherein, in the figures, the respective reference numerals:

100-probe body, 110-first shielding structure, 111-first shielding body, 112-first shielding ring, 113-microstrip line, 114-signal pad, 115-coaxial line, 116-windowing region, 117-first gap region, 118-first copper-clad region, 119-SMA radio frequency connector, 120-near field detection structure, 121-signal stripline, 122-detection stripline, 1221-connecting end, 1222-free end, 123-ground plate, 130-second shielding structure, 131-second shielding body, 132-second shielding ring, 133-forbidden paving region, 134-second gap region, 135-second copper-clad region, 101-first connecting hole, 102-second connecting hole, 140-first dielectric layer, 150-second dielectric layer, 200-sticking material.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Specific implementations of the present application are described in more detail below with reference to specific embodiments:

example one

Referring to fig. 1 to 3, an embodiment of the present application provides a near field probe suitable for continuous detection of the same interference source, where the near field probe includes a probe body 100 and a bonding material 200. Wherein, the probe body 100 is a plate-shaped structure; the adhesive material 200 is made of an insulating material and has a film structure, the adhesive material 200 is stacked with the probe body 100, one film surface of the adhesive material 200 is adhered and connected to one plate surface of the probe body 100, and the other film surface is used for adhering to the periphery of the point to be detected.

Here, the probe body 100 is provided in a plate shape. Optionally, the probe body 100 is manufactured by a circuit board manufacturing process, and under the condition without other requirements, the probe body 100 can be favorably miniaturized and miniaturized, so that on one hand, the probe body 100 can be favorably used in a complicated and narrow test space, and on the other hand, the disturbance of the probe body 100 to an electromagnetic field can be reduced, and the detection precision of the probe body 100 can be improved.

It should be noted that the adhesive material 200 is made of an insulating material and is laminated on one plate surface of the probe body 100, and the adhesive material 200 and the probe body 100 are only in a mechanical connection relationship but not in an electrical connection relationship, so as to reduce the influence of the adhesive material 200 on the detection accuracy of the probe body 100. The probe body 100 can be accurately fixed near a point to be detected (an interference source) of a sample machine to be detected as a label through the adhesive material 200, so that the probe body 100 can be used for accurately detecting the radiation quantity generated by the same interference source. Optionally, the occupied size of the pasting material 200 is smaller than the plate size of the probe body 100, so that the detachment convenience of the near-field probe after the near-field detection is completed is improved on the basis of stabilizing the adhesion effect of the probe body 100.

Specifically, the use method of the near field probe can be as follows: step 1, adhering a probe body 100 to a position near a to-be-detected point (an interference source) of a sample machine to be detected through an adhering material 200; step 2, reading the radiation quantity of the interference source before rectification of the prototype to be tested through external test equipment connected with the near field probe, wherein the radiation quantity of the interference source can be represented through the amplitude of an electric signal excited by the near field probe; step 3, correcting the prototype to be tested according to the obtained interference condition; step 4, reading the radiation quantity of the rectified interference source of the prototype to be tested through external test equipment, and longitudinally comparing the radiation quantity of the rectified interference source with the radiation quantity of the rectified interference source before and after rectification; step 5, if the rectification effect is not qualified, returning to the step 3, and if the rectification effect is qualified, entering the step 6; and 6, taking down the near field probe, and enabling the prototype to be qualified and to work normally.

According to the near-field probe provided by the embodiment of the application, the probe body 100 is arranged in a plate shape, the pasting material 200 is arranged on one side plate surface of the probe body 100 in a laminating mode, so that the probe body 100 is accurately fixed near a point to be detected like labeling through the pasting material 200, on the basis, on one hand, the probe body 100 is favorable for accurately and continuously detecting the radiation quantity generated by the same interference source, and therefore the probe body 100 is favorable for longitudinally comparing the effects before and after the rectification of the interference source; on the other hand, the adhesive material 200 can facilitate the fixing and detaching of the probe body 100, and does not cause large restriction to the size of the probe body 100, so that the probe body 100 is further miniaturized, the overall volume of the near-field probe is reduced, and the near-field probe can be used in a complex or narrow test environment.

Referring to fig. 1-3, in the present embodiment, the adhesive material 200 is glue, double-sided tape, foam or hot melt adhesive. By adopting the scheme, on one hand, the probe body 100 can be stably and accurately fixed based on the adhesive material 200, so that the relative stability of the probe body 100 during near-field detection is improved, and the accuracy of the probe body 100 in longitudinal comparison of the effects before and after rectification and modification of an interference source is further ensured; on the other hand, the overall manufacturing cost of the near-field probe can be correspondingly reduced.

Referring to fig. 1-3, in the present embodiment, the near field probe further includes a protection film adhered to the film surface of the adhesive material 200 on the side away from the probe body 100. It should be noted that, due to the arrangement of the protective film, when the near field probe is not used, the adhesive material can be protected by the protective film to maintain the adhesion performance of the adhesive material, so that the usability of the near field probe can be improved. When the near-field probe is used, the probe body 100 can be accurately fixed near a point to be detected like labeling through the adhesive material 200 only by tearing off the protective film, and the near-field probe is very convenient to use.

Referring to fig. 1 to 3, in the present embodiment, the probe body 100 at least includes a first shielding structure 110, a near-field detection structure 120 and a second shielding structure 130, which are sequentially stacked, the near-field detection structure 120 includes a signal stripline 121 and a detection stripline 122, the signal stripline 121 is arranged in a straight line, and the detection stripline 122 is arranged in a split ring; the first shielding structure 110 includes a first shielding body 111 and a first shielding ring 112 for shielding the detection stripline 122, and the second shielding structure 130 includes a second shielding body 131 and a second shielding ring 132 for shielding the detection stripline 122; the detection strip line 122 has a connection end 1221 connected to the signal strip line 121 and a free end 1222 opposite to the connection end 1221, the probe body 100 has at least one first through hole 101 formed through the free end 1222, and the free end 1222 is connected to the first shielding ring 112 and the second shielding ring 132 through each first through hole 101.

It should be noted here that the near-field detection structure 120 is used to implement near-field detection. The first shielding structure 110 and the second shielding structure 130 are respectively disposed on two opposite sides of the near field detection structure 120, and are commonly used for shielding the near field detection structure 120 to suppress interference signals and prevent the near field detection structure 120 from being subjected to electromagnetic interference when implementing near field detection.

It should be further noted that, in the present embodiment, there is no limitation on the size and number of the first through holes 101, the detection stripline 122 can form a good connection with the first shielding ring 112 and the second shielding ring 132 through each first through hole 101, and based on the detection stripline 122 arranged as an open ring, the detection stripline 122 can capture electromagnetic energy in a free space, and excite an electrical signal when the detection stripline 122 induces a near field, so that near field detection and induction can be achieved; and the transfer of the electrical signal is realized based on the signal strip line 121. Correspondingly, the shapes of the first shielding ring 112 and the second shielding ring 132 are similar to the shape of the detection strip line 122, and both can shield the detection strip line 122, so as to provide a good interference signal suppression effect for the detection strip line 122 on the basis of ensuring the near-field detection function of the detection strip line 122, so as to ensure and improve the near-field detection effect of the near-field probe. Alternatively, the detection strip line 122 may be, but is not limited to, a circular open ring or a rectangular open ring.

Referring to fig. 1-2, in the present embodiment, the probe body 100 further includes a first dielectric layer 140 stacked between the first shielding structure 110 and the near-field detecting structure 120, and a second dielectric layer 150 stacked between the near-field detecting structure 120 and the second shielding structure 130. Through the arrangement of the first dielectric layer 140 and the second dielectric layer 150, on one hand, the probe body 100 can have certain structural strength, bending strength and mechanical bearing performance, so that the service life of the probe body 100 can be ensured and prolonged; on the other hand, the probe body 100 can have a certain characteristic impedance based on the dielectric constants of the first dielectric layer 140 and the second dielectric layer 150, so that the first shielding structure 110, the near-field detection structure 120 and the second shielding structure 130 can be effectively prevented from interfering with each other, and the transmission quality of the electric signals is improved.

Referring to fig. 1-3, in the present embodiment, the near-field detection structure 120 further includes a ground plate 123 connected to a side of the signal stripline 121 away from the detection stripline 122, the first shielding body 111 is provided with a microstrip line 113 aligned with the ground plate 123, the ground plate 123 and the microstrip line 113 are used together for implementing electromagnetic energy transfer, the probe body 100 is provided with a second via hole 102 penetrating through the signal stripline 121 at an end of the signal stripline 121 facing the ground plate 123, and the signal stripline 121 is connected to the microstrip line 113 through the second via hole 102.

Here, one end of the signal strip line 121 facing the ground plate 123 is connected to the microstrip line 113 through the second via hole 102. The ground plate 123 and the microstrip line 113, which are oppositely arranged, form an electromagnetic energy transfer structure together, which is beneficial to stably and reliably converting and outputting the electrical signals excited and transferred by the strip line to external test equipment. Therein, the ground plate 123 may be a rectangular copper sheet with a thin shape as shown by way of example. The characteristic impedance of the microstrip line 113 is influenced by factors such as the thickness and width of the microstrip line 113, the distance between the microstrip line 113 and the ground plane 123, and the dielectric constant of the dielectric medium, and optionally, the characteristic impedance of the microstrip line 113 is 50 Ω, so that the signal reflection between the microstrip line 113 and the strip line can be reduced to some extent. Optionally, the length of microstrip line 113 is 5 ~ 10mm, based on this setting, can be on the basis of guaranteeing its electromagnetic energy transfer effect, do benefit to the miniaturized design of near field probe.

Referring to fig. 1-3, in the present embodiment, the first shielding body 111 is further provided with a signal pad 114 connected to the microstrip line 113, and the signal pad 114 is connected to an external testing device through a coaxial line 115. It should be noted that, in the present embodiment, the microstrip line 113 is connected to an external test device through the signal pad 114 and the coaxial line 115, where the signal pad 114 can ensure the connection stability between the coaxial line 115 and the microstrip line 113. Based on the arrangement, the probe body 100 can be flexibly, stably and reliably connected with external test equipment through the extended, slender and flexible coaxial line 115 after penetrating into a complex or narrow test environment, so that the external test equipment can effectively read the radiation quantity of the interference source before and after rectification of the prototype to be tested, and the service performance of the near-field probe is improved to a certain extent.

Referring to fig. 1-3, in the present embodiment, an angle between the coaxial line 115 and the microstrip line 113 is 0 to 90 °. By adopting the above scheme, a proper included angle can be formed between the coaxial line 115 and the microstrip line 113, so that when the probe body 100 is adhered to the vicinity of a point to be detected by the adhesive material 200, the coaxial line 115 can extend outwards, and is flexibly, stably and reliably connected with external test equipment under the condition of no winding, thereby ensuring the connection strength between the coaxial line 115 and the signal pad 114, avoiding the coaxial line 115 from falling off from the signal pad 114 in the detection process, and further improving the service performance of the near-field probe.

Referring to fig. 1-3, in the present embodiment, the first shielding structure 110 has an opening region 116, a first slot region 117 located on a side of the first shielding ring 112 away from the first shielding body 111, and a first copper-clad region 118 located outside the opening region 116 and the first slot region 117, the microstrip line 113 and the signal pad 114 are both located in the opening region 116, and the first slot region 117 is used to cut off a current path of the first shielding ring 112, so as to improve the capability of the probe body 100 to suppress an interference signal; the second shielding structure 130 has a land forbidden region 133 corresponding to the second communication hole 102, a second slit region 134 located on a side of the second shielding ring 132 facing away from the second shielding body 131, and a second copper clad region 135 located outside the land forbidden region 133 and the second slit region 134, and the second slit region 134 is used for cutting off a current path of the second shielding ring 132.

It should be noted that, on the surface of the first shielding structure 110, the windowing region 116 and the first slot region 117 are not covered with copper, the microstrip line 113 and the signal pad 114 made of copper are disposed inside the windowing region 116, and the other regions except the windowing region 116 and the first slot region 117 are covered with copper, so that the microstrip line 113 and the signal pad 114 can be prevented from being short-circuited with the first copper-covered region 118 by the arrangement of the windowing region; through the arrangement of the first slit area 117, the first shielding ring 112 can break a current path at the first slit area 117, so that the capability of suppressing an interference signal can be ensured and improved; through the setting of first copper-clad zone 118, can shield near field detection structure 120, play electromagnetic shield's effect to can prevent that near field detection structure 120's signal stripline 121 and survey stripline 122 from receiving electromagnetic interference, thereby the guarantee improves near field probe's near field detection effect.

Similarly, on the surface of the second shielding structure 130, the no-laying region 133 (the second communication hole 102 is arranged in the region) and the second gap region 134 are not covered with copper, and the other regions are covered with copper, wherein the microstrip line 113 and the signal strip line 121 can be effectively prevented from being short-circuited with the second shielding structure 130 by the second communication hole 102 through the arrangement of the no-laying region 133; through the arrangement of the second slit area 134, the second shielding ring 132 can cut off a current path at the second slit area 134, so that the capability of suppressing interference signals can be ensured and improved; through the setting of second copper-clad zone 135, can further shield near field detection structure 120 to play electromagnetic shield's effect, thereby can further prevent that near field detection structure 120's signal stripline 121 and survey stripline 122 from receiving electromagnetic interference, thereby further improved near field probe's near field detection effect.

Referring to fig. 1-3, in the present embodiment, the aperture of the second communication hole 102 is 0.2-0.4 mm. By adopting the scheme, the conversion of the electric signal between the microstrip line 113 and the signal strip line 121 can be rapidly and reliably realized, and the service performance of the near-field probe is further improved.

Referring to fig. 1-3, in the present embodiment, the length of the signal strip line 121 is 5-10 mm, and the diameter of the open ring formed by the detection strip line 122 is 5-7 mm. By adopting the above scheme, the near field detection range and the near field detection precision of the detection strip line 122 can be coordinated, and the transmission effect of the electric signal excited by the detection strip line 122 when the near field is sensed when the electric signal is transmitted through the signal strip line 121 can be improved, so that the near field detection effect of the near field probe can be improved, and the miniaturization design of the near field probe can be facilitated.

Example two

The difference between this embodiment and the first embodiment is:

referring to fig. 4, in the present embodiment, the microstrip line 113 is connected to an external test device through an SMA radio frequency connector 119. By adopting the scheme, a stable electric connection relation can be established between the near field probe and the external test equipment, and the loss condition of electric signals between the near field probe and the external test equipment can be reduced through the SMA radio frequency connector 119.

EXAMPLE III

The difference between this embodiment and the first embodiment is:

referring to fig. 1 or fig. 4, in the present embodiment, the microstrip line 113 is connected to an external test device through an SMA radio frequency connector 119 and a coaxial line 115. In this embodiment, the SMA radio frequency connector 119 and the coaxial line 115 are used in combination to establish a stable electrical connection relationship between the near field probe and the external test equipment, which not only makes the connection between the near field probe and the external test equipment flexible through the coaxial line 115, but also reduces the loss of electrical signals between the near field probe and the external test equipment to a certain extent through the SMA radio frequency connector 119.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A near field probe, comprising:

the probe body is of a plate-shaped structure;

2. The near field probe of claim 1, wherein the adhesive material is glue, double-sided tape, foam, or hot melt.

3. The near field probe of claim 1, further comprising a protective film adhered to a side of the adhesive material facing away from the probe body film surface.

4. The near-field probe according to any one of claims 1 to 3, wherein the probe body comprises at least a first shielding structure, a near-field detection structure and a second shielding structure which are sequentially stacked, the near-field detection structure comprises a signal strip line and a detection strip line, the signal strip line is arranged in a straight line, and the detection strip line is arranged in a split ring;

5. The near-field probe of claim 4, wherein the near-field probe structure further includes a ground plate connected to a side of the signal stripline opposite to the detection stripline, the first shielding body is provided with a microstrip line disposed opposite to the ground plate, the ground plate and the microstrip line are used together for realizing electromagnetic energy transfer, one end of the probe body facing the ground plate is provided with a second via hole penetrating the probe body, and the signal stripline is connected to the microstrip line through the second via hole.

6. The near-field probe of claim 5, wherein the first shield body is further provided with a signal pad connected to the microstrip line, and the signal pad is connected to an external test device through a coaxial line.

7. The near field probe of claim 6, wherein the first shield structure has a windowed area, a first slotted area located on a side of the first shield ring facing away from the first shield body, and a first copper-clad area located outside the windowed area and the first slotted area, the microstrip line and the signal pad are both located in the windowed area, and the first slotted area is used for cutting off a current path of the first shield ring;

8. The near field probe of claim 5, wherein the microstrip line is connected to external test equipment through an SMA radio frequency connector.

9. The near field probe according to claim 5, wherein the aperture of the second communicating hole is 0.2 to 0.4 mm.

10. The near field probe of claim 4, wherein the signal stripline has a length of 5 to 10mm, and the open loop formed by the detection stripline has a diameter of 5 to 7 mm.

11. The near field probe of claim 4, wherein the probe body further comprises a first dielectric layer disposed in a stack between the first shielding structure and the near field probing structure, and a second dielectric layer disposed in a stack between the near field probing structure and the second shielding structure.