CN212727864U - Heat dissipation equipment of electronic product - Google Patents
Heat dissipation equipment of electronic product Download PDFInfo
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- CN212727864U CN212727864U CN202021926797.5U CN202021926797U CN212727864U CN 212727864 U CN212727864 U CN 212727864U CN 202021926797 U CN202021926797 U CN 202021926797U CN 212727864 U CN212727864 U CN 212727864U
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- electronic product
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Abstract
The utility model discloses a heat dissipation equipment of electronic product, including the cold wind case, cold wind case one side is equipped with the semiconductor refrigeration piece, and the inside air-cooling case that is equipped with pushes away the aerofoil, push away aerofoil one side fixedly connected with guide bar, and guide bar one end outer wall fixedly connected with fixed plate, and fixed plate one side outer wall fixedly connected with spring, the spring cup joints in the guide bar outer wall, and spring one side outer wall fixed connection in cold wind case one side outer wall, guide bar one side outer wall fixedly connected with fixed block, and fixed block one side outer wall overlap joint has the pulley, and the pulley below is equipped with the cylinder, cylinder bottom outer wall fixedly connected with install bin. The utility model discloses a set up the semiconductor refrigeration piece, can reduce the temperature of surrounding environment, then under the effect of pushing away the aerofoil, push electronic product department with air conditioning, this structure is obvious to electronic product's radiating effect, and the radiating effect is obvious, improves electronic product's work efficiency and life-span.
Description
Technical Field
The utility model relates to an electronic product technical field especially relates to a heat dissipation equipment of electronic product.
Background
Electronic products are electrical products applied by taking electronic circuits as basic technologies, and are used in various fields such as entertainment, communication, documents, machinery, transportation and the like, so that the life of the modern society is closely related to the electronic products.
Electronic product is in long-time work operation, and its operation part can produce a large amount of heats, leads to electronic product to send out the boiling hot to generate heat, and electronic product is in for a long time and probably causes the operation part to damage under the high temperature to lead to electronic product not to move, so electronic product can use radiating equipment to dispel the heat and cool down and guarantee operating temperature, but current radiating equipment uses radiator fan to dispel the heat, can not carry out effectual scattering and disappearing to the heat, leads to the efficiency of dispelling the heat not high.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a heat dissipation device of an electronic product.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a heat dissipation equipment of electronic product, includes the cold wind case, cold wind case one side is equipped with the semiconductor refrigeration piece, and the inside air-cooling case that is equipped with pushes away the aerofoil, push away aerofoil one side fixedly connected with guide bar, and guide bar one end outer wall fixedly connected with fixed plate, and fixed plate one side outer wall fixedly connected with spring, the spring cup joints in the guide bar outer wall, and spring one side outer wall fixed connection in cold wind case one side outer wall, guide bar one side outer wall fixedly connected with fixed block, and fixed block one side outer wall overlap joint has the pulley, and the pulley below is equipped with cylinder, cylinder bottom outer wall fixedly connected with install bin.
Further, the top of the air pushing plate and the outer wall of the bottom of the air pushing plate are fixedly connected with sliding blocks, and the outer walls of the two sliding blocks are connected with sliding rails in a sliding mode.
Furthermore, one of them slide rail fixed connection is in cold-blast box top outer wall, and another slide rail fixed connection is in cold-blast box bottom outer wall.
Furthermore, a plurality of ventilation holes are formed in the outer wall of one side of the cold air box.
Further, install bin fixed connection is in cold wind box one end outer wall, and install bin one end outer wall is equipped with the switch.
Furthermore, the outer wall of one side of the semiconductor refrigeration sheet is fixedly connected with a plurality of heat dissipation aluminum sheets, and the outer wall of one side of each heat dissipation aluminum sheet is fixedly connected with a heat dissipation fan.
Furthermore, the outer wall of one side of the semiconductor refrigeration sheet is provided with a connecting wire, and one side of the connecting wire is provided with a plug.
Furthermore, the outer wall of one end of the top of the cold air box is fixedly connected with a temperature detector.
The utility model has the advantages that:
1. through setting up the semiconductor refrigeration piece, can reduce the temperature of surrounding environment, then under the effect of pushing away the aerofoil, push electronic product department with air conditioning, this structure is obvious to electronic product's radiating effect, and the radiating effect is obvious, improves electronic product's work efficiency and life-span.
2. Through set up the ventilation hole in cold wind case one side, the gas and the external gas in the cold wind case of being convenient for exchange, promote radiating efficiency.
3. Through setting up temperature detector, can monitor the operating temperature of electronic product, when the high temperature, opening device dispels the heat, and closing device after the heat dissipation is ended is favorable to resources are saved.
Drawings
Fig. 1 is a left partial sectional view of a heat dissipation apparatus of an electronic product according to embodiment 1;
fig. 2 is a right partial sectional view of a heat dissipation device of an electronic product according to embodiment 1;
fig. 3 is a right side view of a heat dissipation apparatus of an electronic product according to embodiment 2.
In the figure: 1-cooling fan, 2-cooling aluminum sheet, 3-cold air box, 4-semiconductor refrigerating sheet, 5-spring, 6-fixing plate, 7-fixing block, 8-switch, 9-mounting box, 10-pulley, 11-cylinder, 12-plug, 13-connecting line, 14-vent hole, 15-air pushing plate, 16-slide rail, 17-slide block, 18-guide rod and 19-temperature detector.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1 and 2, a heat dissipation apparatus for electronic products includes a cold air box 3, a semiconductor cooling fin 4 is disposed on one side of the cold air box 3, an air pushing plate 15 is disposed inside the cold air box 3, a guide rod 18 is fixedly connected to one side of the air pushing plate 15, a fixing plate 6 is fixedly connected to an outer wall of one end of the guide rod 18, a spring 5 is fixedly connected to an outer wall of one side of the fixing plate 6, the spring 5 is sleeved on an outer wall of the guide rod 18, an outer wall of one side of the spring 5 is fixedly connected to an outer wall of one side of the cold air box 3, a fixing block 7 is fixedly connected to an outer wall of one side of the fixing block 7, a pulley 10 is lapped on the outer wall of one side of the fixing block 7, an air cylinder 11 is disposed below the pulley 10, a mounting box 9 is fixedly connected to an outer wall at the bottom of the air cylinder 11, the semiconductor cooling fin 4 can, the radiating effect is good, and the working efficiency and the service life of the electronic product are improved.
Wherein, the equal fixedly connected with slider 17 of push pedal 15 top and bottom outer wall, and the equal sliding connection of two slider 17 outer walls has slide rail 16.
Wherein, one of them slide rail 16 fixed connection is in the outer wall of cold wind box 3 top, and another slide rail 16 fixed connection is in the outer wall of cold wind box 3 bottom.
Wherein, the outer wall of 3 one sides of cold air box is equipped with a plurality of ventilation hole 14, and the gaseous exchange in the cold air box 3 of being convenient for promotes radiating work efficiency.
Wherein, mounting box 9 fixed connection is in the outer wall of 3 one ends of cold wind box, and 9 one end outer walls of mounting box are equipped with switch 8.
Wherein, the outer wall fixedly connected with a plurality of radiator aluminum sheet 2 of 4 one sides of semiconductor refrigeration piece, and radiator fan 1 of radiator aluminum sheet 2 one side outer wall fixedly connected with.
Wherein, the outer wall of one side of the semiconductor refrigeration piece 4 is provided with a connecting wire 13, and one side of the connecting wire 13 is provided with a plug 12.
The working principle is as follows: the plug 12 of the device is well inserted, the device starts to operate through the switch 8, the semiconductor refrigeration sheet 4 can reduce the temperature of air in the cold air box 3, then the air cylinder 11 pushes the fixed block 7 to horizontally move through the pulley 10, at the moment, the spring 5 is compressed, so that the air pushing plate 15 arranged on the guide rod 18 slides forwards, the air with the reduced temperature in the cold air box 3 is conveyed to an electronic product, and the heat dissipation effect is achieved; when cylinder 11 contracts, under the elastic potential energy effect of spring 5, push away aerofoil 15 and slide backward, carry out gas exchange through ventilation hole 14, so operation repeatedly has fine radiating effect, can guarantee that electronic product's operating temperature is in suitable within range to promote electronic product's work efficiency and life.
Example 2
Referring to fig. 3, compared with embodiment 1, the heat dissipation apparatus for electronic products has a temperature detector 19 fixedly connected to an outer wall of one end of the top of the cold air box 3, and can monitor the temperature inside the cold air box 3.
The working principle is as follows: compare in embodiment 1, through set up temperature detector 19 at the juncture of cold air box 3 and installation electronic product, can monitor the temperature, when electronic product's operating temperature was higher, open the heat dissipation through switch 8, after the heat dissipation was accomplished the certain time, closing means operation, can resources are saved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (8)
1. A heat dissipation device of an electronic product comprises a cold air box (3) and is characterized in that a semiconductor refrigeration sheet (4) is arranged on one side of the cold air box (3), an air pushing plate (15) is arranged in the cold air box (3), one side of the air pushing plate (15) is fixedly connected with a guide rod (18), and the outer wall of one end of the guide rod (18) is fixedly connected with a fixed plate (6), the outer wall of one side of the fixed plate (6) is fixedly connected with a spring (5), the spring (5) is sleeved on the outer wall of the guide rod (18), and the outer wall of one side of the spring (5) is fixedly connected with the outer wall of one side of the cold air box (3), the outer wall of one side of the guide rod (18) is fixedly connected with a fixed block (7), and the outer wall overlap joint of fixed block (7) one side has pulley (10), and pulley (10) below is equipped with cylinder (11), cylinder (11) bottom outer wall fixedly connected with install bin (9).
2. The heat dissipation apparatus of an electronic product according to claim 1, wherein the top and bottom outer walls of the air pushing plate (15) are fixedly connected with sliding blocks (17), and the outer walls of the two sliding blocks (17) are slidably connected with sliding rails (16).
3. The heat dissipation apparatus for electronic products according to claim 2, wherein one of the slide rails (16) is fixedly connected to the outer wall of the top of the cold air box (3), and the other slide rail (16) is fixedly connected to the outer wall of the bottom of the cold air box (3).
4. The heat dissipating device for electronic products according to claim 3, wherein the cooling air box (3) has a plurality of ventilation holes (14) on one side of the outer wall.
5. The heat dissipation device of the electronic product according to claim 1, wherein the mounting box (9) is fixedly connected to an outer wall of one end of the cold air box (3), and a switch (8) is arranged on an outer wall of one end of the mounting box (9).
6. The heat dissipation apparatus of an electronic product according to claim 1, wherein the semiconductor refrigeration sheet (4) is fixedly connected with a plurality of heat dissipation aluminum sheets (2) on one side of the outer wall, and the heat dissipation fan (1) is fixedly connected with one side of the outer wall of the heat dissipation aluminum sheet (2).
7. The heat dissipation apparatus of an electronic product according to claim 6, wherein the semiconductor cooling plate (4) is provided with a connection line (13) on an outer wall of one side thereof, and the connection line (13) is provided with a plug (12) on one side thereof.
8. The heat dissipation apparatus of the electronic product according to claim 1, wherein a temperature detector (19) is fixedly connected to an outer wall of one end of the top of the cold air box (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021926797.5U CN212727864U (en) | 2020-09-07 | 2020-09-07 | Heat dissipation equipment of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021926797.5U CN212727864U (en) | 2020-09-07 | 2020-09-07 | Heat dissipation equipment of electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212727864U true CN212727864U (en) | 2021-03-16 |
Family
ID=74925288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021926797.5U Active CN212727864U (en) | 2020-09-07 | 2020-09-07 | Heat dissipation equipment of electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212727864U (en) |
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2020
- 2020-09-07 CN CN202021926797.5U patent/CN212727864U/en active Active
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