CN212727079U - Waterproof smart mobile phone motherboard - Google Patents

Waterproof smart mobile phone motherboard Download PDF

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Publication number
CN212727079U
CN212727079U CN202021027628.8U CN202021027628U CN212727079U CN 212727079 U CN212727079 U CN 212727079U CN 202021027628 U CN202021027628 U CN 202021027628U CN 212727079 U CN212727079 U CN 212727079U
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CN
China
Prior art keywords
waterproof
deckle board
mobile phone
inserting groove
frame plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202021027628.8U
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Chinese (zh)
Inventor
李旋
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Henan Fengtai Photoelectric Technology Co ltd
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Henan Fengtai Photoelectric Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN202021027628.8U priority Critical patent/CN212727079U/en
Application granted granted Critical
Publication of CN212727079U publication Critical patent/CN212727079U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a waterproof smart mobile phone motherboard, including the mainboard main part, go up deckle board and deckle board down, the mainboard main part is installed at last deckle board inboardly, going up the deckle board below and having seted up the inserting groove, and going up the inserting groove below and being connected with waterproof sealing plug one end, the inserting groove has been seted up down to deckle board below, and is connected with the waterproof sealing plug other end below the inserting groove, go up the inserting groove, be equipped with waterproof ventilated membrane of second and first waterproof ventilated membrane between lower inserting groove and the waterproof sealing plug respectively. Has the advantages that: the utility model discloses an install the mainboard main part between last deckle board and lower deckle board, utilize first waterproof ventilated membrane and the waterproof ventilated membrane of second and multilayer breakwater that set up between last deckle board and the lower deckle board, can not influence the normal heat dissipation of mobile phone motherboard under the waterproof prerequisite of assurance, effectually prevent that external water from getting into contact smart mobile phone motherboard, cause the mainboard corruption, the short circuit, the emergence of phenomenons such as burning out has prolonged the life of smart mobile phone motherboard.

Description

Waterproof smart mobile phone motherboard
Technical Field
The utility model relates to a cell-phone accessory technical field particularly, relates to waterproof smart mobile phone motherboard.
Background
In the current society, people can not leave the smart phone for a long time, and as a most common carrier of the internet, it is difficult to imagine that another tool can replace the smart phone, and the mobile phone motherboard is a most important part forming the mobile phone and is a carrier for interconnecting all hardware of the mobile phone, and the performance of the mobile phone motherboard seriously affects the functions of the mobile phone, so that the mobile phone motherboard has an irreplaceable function in the whole mobile phone.
Water machine mainboard is intake and not only can lead to corroding the components and parts on circuit board and the circuit board, the component on the majority mainboard can deteriorate, serious still can lead to the short circuit, the phenomenon that the mainboard burns out takes place, current smart mobile phone mainboard is in order to prevent that the mobile phone mainboard from intaking often adopts full seal structure, though can play better water-proof effects, but serious influence the heat dispersion of mobile phone mainboard, thereby the normal operating and the life of mobile phone mainboard have been influenced, so a waterproof smart mobile phone mainboard that does not influence the mainboard normal heat dissipation has been proposed.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a waterproof smart mobile phone motherboard possesses the advantage that does not influence the normal radiating waterproof function of mobile phone motherboard, and then solves the problem among the above-mentioned background art.
(II) technical scheme
For the above-mentioned advantage that does not influence the normal radiating waterproof function of mobile phone motherboard, the utility model discloses a concrete technical scheme as follows: waterproof smart mobile phone motherboard, including mainboard main part, go up deckle board and deckle board, mainboard main part installs at last deckle board inboardly, going up the deckle board below and having seted up the inserting groove, and going up the inserting groove below and being connected with waterproof sealing plug one end, the inserting groove has been seted up down to deckle board below, and is connected with the waterproof sealing plug other end below the inserting groove, go up the inserting groove, be equipped with waterproof ventilated membrane of second and first waterproof ventilated membrane between lower inserting groove and the waterproof sealing plug respectively.
Further, the waterproof sealing plug includes the waterproof stopper main part, waterproof stopper main part top is connected with the grafting piece, and goes up the grafting piece and peg graft in last inserting groove, waterproof stopper main part below is connected with down the grafting piece, and the grafting piece is pegged graft under in the inserting groove.
Furthermore, the inner cavity of the frame of the lower frame plate is provided with high water absorption fibers, the inner side of the lower frame plate is provided with a plurality of layers of water baffles which are staggered up and down, and one end of each water baffle is connected with and contacts with the high water absorption fibers.
Furthermore, the water baffle comprises a water baffle main body, wherein the upper surface of the water baffle main body is uniformly provided with a plurality of upper guide grooves which are parallel to each other, and the lower surface of the water baffle main body is uniformly provided with a plurality of lower guide grooves which are parallel to each other.
Furthermore, the top of the upper frame plate is connected with one end of a second waterproof adhesive tape, the other end of the second waterproof adhesive tape is connected with the front surface of the mobile phone shell, the bottom of the lower frame plate is connected with one end of a first waterproof adhesive tape, and the other end of the first waterproof adhesive tape is connected with the back surface of the mobile phone shell.
Furthermore, an included angle of seventy-five degrees is formed between the water baffle and the lower frame plate, and the position of a heat dissipation hole of the mobile phone shell is arranged below the inner side of the lower frame plate.
Furthermore, the high water absorption fiber adopts the fiber with the ultrahigh water absorption function, can absorb fifteen times of the weight of the fiber, cannot cause the change of the length of the fiber material due to water absorption, and cannot reduce the physical property of the fiber.
(III) advantageous effects
Compared with the prior art, the utility model provides a waterproof smart mobile phone motherboard possesses following beneficial effect:
(1) the utility model discloses a through install the mainboard main part between upper frame plate and lower frame plate, upper frame plate top is equipped with second waterproof adhesive tape and is connected with the cell-phone shell, lower frame plate below is equipped with first waterproof adhesive tape and is connected with the cell-phone shell, and pass through waterproof sealing plug between upper frame plate and the lower frame plate, and waterproof sealing plug both ends are equipped with first waterproof ventilated membrane and second waterproof ventilated membrane, can effectively isolate the mainboard main part from external water droplet, play waterproof function, simultaneously the lower frame plate inboard is provided with the multilayer breakwater that interlocks each other, the breakwater is certain angle, can block the water droplet that the louvre got into, also can flow the water droplet water conservancy diversion that waterproof ventilated membrane blocked flows out, or introduce the high water absorption fibre of lower frame plate intussuseption, can prevent external water effectively from getting into and contacting the smart mobile phone mainboard, cause the mainboard corruption, the short circuit, the emergence of phenomenon such as burnout, the service life of the smart phone mainboard is prolonged.
(2) The utility model discloses be equipped with first waterproof ventilated membrane and the waterproof ventilated membrane of second and multilayer breakwater at the mainboard main part between the cell phone case louvre, can block external water droplet and mainboard main part contact in, take a breath the heat transfer with the hot-air around the mainboard main part through louvre and external air to can not influence the normal heat dissipation of mobile phone motherboard under the waterproof prerequisite of assurance, prolonged the life of smart mobile phone motherboard.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a waterproof smart phone motherboard according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a waterproof sealing plug of a waterproof smart phone motherboard according to an embodiment of the present invention;
fig. 3 is according to the utility model discloses waterproof smart mobile phone motherboard's breakwater structure sketch map.
In the figure:
1. a main board main body; 2. an upper frame plate; 3. a waterproof sealing plug; 31. a waterproof plug body; 32. an upper plug-in block; 33. a lower plug-in block; 4. a lower frame plate; 5. a water baffle; 51. a breakwater main body; 52. an upper diversion trench; 53. a lower diversion trench; 6. a first waterproof breathable film; 7. high water absorption fiber; 8. a first waterproof adhesive tape; 9. a lower insertion groove; 10. an upper insertion groove; 11. a second waterproof rubber strip; 12. a second waterproof breathable film.
Detailed Description
For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.
According to the utility model discloses an embodiment provides waterproof smart mobile phone motherboard.
Referring now to the drawings and the detailed description, as shown in fig. 1-3, a waterproof smart phone motherboard according to an embodiment of the present invention comprises a motherboard main body 1, an upper frame plate 2 and a lower frame plate 4, wherein the motherboard main body 1 is installed inside the upper frame plate 2, an upper plugging groove 10 is formed below the upper frame plate 2, one end of a waterproof sealing plug 3 is connected below the upper plugging groove 10, a lower plugging groove 9 is formed below the lower frame plate 4, the other end of the waterproof sealing plug 3 is connected above the lower plugging groove 9, the upper plugging groove 10, a second waterproof breathable film 12 and a first waterproof breathable film 6 are respectively arranged between the lower plugging groove 9 and the waterproof sealing plug 3, the waterproof breathable films are mature technologies, and do not need to be described in detail herein, so as to isolate the motherboard main body 1 from external water drops, thereby effectively preventing external water from entering and contacting the smart phone motherboard, the phenomena of corrosion, short circuit, burning out and the like of the mainboard are caused, and the service life of the mainboard of the smart phone is prolonged.
In one embodiment, waterproof sealing plug 3 includes waterproof stopper main part 31, waterproof stopper main part 31 main part top is connected with grafting piece 32, and it pegs graft in last inserting groove 10 to go up grafting piece 32, waterproof stopper main part 31 main part below is connected with down grafting piece 33, and grafting piece 33 pegs graft under in inserting groove 9, it can be when blocking external water droplet and mainboard main part 1 contact to have played, the effect of taking a breath the heat transfer through louvre and outside air with the hot-air around mainboard main part 1, thereby can not influence the normal heat dissipation of cell-phone mainboard under the waterproof prerequisite of assurance, the life of smart mobile phone mainboard has been prolonged.
In one embodiment, the inner cavity of the frame of the lower frame plate 4 is provided with high water absorption fibers 7, the inner side of the lower frame plate 4 is provided with the multi-layer water baffle plates 5 which are staggered up and down, one end of each water baffle plate 5 is connected and contacted with the high water absorption fibers 7, the effects of blocking and absorbing water permeating into the mobile phone shell are achieved, and the situation that the external water enters and contacts with a main board of a smart phone to cause the main board of the mobile phone to be damaged is prevented.
In one embodiment, the water baffle 5 comprises a water baffle main body 51, the upper surface of the water baffle main body 51 is uniformly provided with a plurality of upper diversion trenches 52 which are parallel to each other, the lower surface of the water baffle main body 51 is uniformly provided with a plurality of lower diversion trenches 53 which are parallel to each other, when a mobile phone screen is placed upwards, the upper diversion trenches 52 can guide water drops blocked by the waterproof breathable film to flow out, when the mobile phone screen is placed downwards, the lower diversion trenches 53 introduce the water drops into the high water absorption fibers 7 filled in the lower frame plate 4, the water is adsorbed, and the waterproof performance of the mobile phone mainboard is improved.
In one embodiment, the top of the upper frame plate 2 is connected with one end of a second waterproof rubber strip 11, the other end of the second waterproof rubber strip 11 is connected with the front surface of the mobile phone shell, the bottom of the lower frame plate 4 is connected with one end of a first waterproof rubber strip 8, and the other end of the first waterproof rubber strip 8 is connected with the back surface of the mobile phone shell.
In one embodiment, the water baffle 5 and the lower frame plate 4 form an included angle of seventy-five degrees, and the position of the heat dissipation hole of the mobile phone shell is arranged below the inner side of the lower frame plate 4, so that the function of blocking and guiding water entering the inner part of the mobile phone shell is achieved.
In one embodiment, the super absorbent fiber 7 is a fiber with super high water absorption function, which can absorb fifteen times of its own weight of water, and will not cause the change of length of the fiber material due to water absorption, and the fiber physical property will not be reduced, thus playing a strong water absorption protection function.
The working principle is as follows: when the waterproof sealing device is installed, the mainboard main body 1 is installed between the inner sides of the upper frame plates 2, the upper frame plates 2 are connected with a mobile phone shell through the second waterproof adhesive tape 11 arranged above, then the second waterproof breathable film 12 is laid below the mainboard main body 1, the peripheral edges of the second waterproof breathable film 12 are placed in the upper inserting groove 10, the upper inserting block 32 of the waterproof sealing plug 3 is inserted in the upper inserting groove 10 to complete the fixing of the second waterproof breathable film 12, as mentioned above, the lower inserting block 33 of the waterproof sealing plug 3 is inserted in the lower inserting groove 9 arranged below and above the lower frame plate 4 to complete the fixing of the first waterproof breathable film 6, the first waterproof heat dissipation hole 8 is arranged below the lower frame plate 4 to be connected with the mobile phone shell, meanwhile, the inner sides of the lower frame plate 4 are provided with the plurality of water baffle plates 5 which are staggered with each other, the water baffle plates 5 are in a certain angle to block entering water drops, when the mobile phone screen is placed upwards, the upper diversion trench 52 can divert water drops blocked by the waterproof breathable film to flow out, when the mobile phone screen is placed downwards, the lower diversion trench 53 introduces the water drops into the high water absorption fibers 7 filled in the lower frame plate 4 to absorb water, so that the main board body 1 can be effectively isolated from external water drops, a waterproof function is achieved, external water can be effectively prevented from entering and contacting the main board of the smart phone to cause corrosion, short circuit, burning out and the like of the main board, the service life of the main board of the smart phone is prolonged, when the mobile phone is operated, the main board body 1 generates heat to heat ambient air, the hot air passes through gaps between the first waterproof breathable film 6 and the second waterproof breathable film 12 and between the multi-layer water baffle plates 5 and is finally discharged through heat dissipation holes of the mobile phone shell, so that when the external water drops are prevented from contacting the main board body 1, the hot air around the mainboard main part 1 is ventilated and exchanged with the outside air through the louvre to can not influence the normal heat dissipation of mobile phone motherboard under the waterproof prerequisite of assurance, prolong the life of smart mobile phone motherboard.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. Waterproof smart mobile phone motherboard, including mainboard main part (1), goes up deckle board (2) and deckle board (4), its characterized in that, install at deckle board (2) inboardly in mainboard main part (1), go up deckle board (2) below and seted up inserting groove (10), and go up inserting groove (10) below and be connected with waterproof sealing plug (3) one end, inserting groove (9) have been seted up down to deckle board (4) below, and inserting groove (9) top is connected with the waterproof sealing plug (3) other end down, go up inserting groove (10), be equipped with waterproof ventilated membrane (12) of second and first waterproof ventilated membrane (6) between lower inserting groove (9) and waterproof sealing plug (3) respectively.
2. The mainboard of claim 1, wherein the waterproof sealing plug (3) comprises a waterproof plug body (31), an upper plug block (32) is connected above the waterproof plug body (31) body, the upper plug block (32) is plugged in the upper plug groove (10), a lower plug block (33) is connected below the waterproof plug body (31) body, and the lower plug block (33) is plugged in the lower plug groove (9).
3. The waterproof smart phone motherboard according to claim 1, wherein the inner cavity of the frame of the lower frame plate (4) is provided with high water absorption fibers (7), and the inner side of the lower frame plate (4) is provided with a plurality of layers of water baffles (5) which are staggered up and down, and one end of each water baffle (5) is connected and contacted with the high water absorption fibers (7).
4. The waterproof smart phone motherboard of claim 3, wherein the water baffle (5) comprises a water baffle main body (51), the upper surface of the water baffle main body (51) is uniformly provided with a plurality of upper flow guide grooves (52) which are parallel to each other, and the lower surface of the water baffle main body (51) is uniformly provided with a plurality of lower flow guide grooves (53) which are parallel to each other.
5. The waterproof smart phone motherboard according to claim 1, wherein one end of a second waterproof rubber strip (11) is connected to the top of the upper frame plate (2), the other end of the second waterproof rubber strip (11) is connected to the front of the phone case, one end of a first waterproof rubber strip (8) is connected to the bottom of the lower frame plate (4), and the other end of the first waterproof rubber strip (8) is connected to the back of the phone case.
6. The waterproof smart phone motherboard of claim 3, wherein the water baffle (5) and the lower frame plate (4) form an included angle of seventy-five degrees, and the position of the heat dissipation hole of the phone case is below the inner side of the lower frame plate (4).
CN202021027628.8U 2020-06-05 2020-06-05 Waterproof smart mobile phone motherboard Expired - Fee Related CN212727079U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021027628.8U CN212727079U (en) 2020-06-05 2020-06-05 Waterproof smart mobile phone motherboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021027628.8U CN212727079U (en) 2020-06-05 2020-06-05 Waterproof smart mobile phone motherboard

Publications (1)

Publication Number Publication Date
CN212727079U true CN212727079U (en) 2021-03-16

Family

ID=74949643

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021027628.8U Expired - Fee Related CN212727079U (en) 2020-06-05 2020-06-05 Waterproof smart mobile phone motherboard

Country Status (1)

Country Link
CN (1) CN212727079U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210316

Termination date: 20210605

CF01 Termination of patent right due to non-payment of annual fee