CN212725244U

CN212725244U - Rapid forming and processing device for semiconductor material

Info

Publication number: CN212725244U
Application number: CN202021320266.1U
Authority: CN
Inventors: 龚宝义
Original assignee: Chengdu Xinyi Technology Co ltd
Current assignee: Chengdu Xinyi Technology Co ltd
Priority date: 2020-07-07
Filing date: 2020-07-07
Publication date: 2021-03-16
Anticipated expiration: 2030-07-07

Abstract

The utility model discloses a semiconductor material's quick shaping processingequipment relates to semiconductor technology field. The utility model discloses a box, the lower inner wall equidistance of box is fixed with T type bracing piece, and the upper end and the metal net rack butt of T type bracing piece are connected, and the lower inner wall bilateral symmetry rigidity of box has lower heating pipe, and the last inner wall bilateral symmetry rigidity of box has last heating pipe, and the last inner wall intermediate position of box is fixed with temperature sensor, and the upper end of box is fixed with audible-visual annunciator, and the front end from the top down of box is fixed with timer and singlechip in proper order. But through last heating pipe and lower heating pipe rapid heating semiconductor, the heating is even, then through the temperature in the temperature sensor detectable box, unusual as temperature high temperature, the single chip chance automatic control audible-visual annunciator sends sound and reminds people, can set up heating time through the timer at last, the utility model discloses the heating is even, regularly heats, temperature is unusual to be reminded and easy dismantlement clearance.

Description

Rapid forming and processing device for semiconductor material

Technical Field

The utility model relates to the field of semiconductor technology, specifically be a semiconductor material's quick shaping processingequipment.

Background

A semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and economic point of view. The fabrication of semiconductors is a complex process in which rapid prototyping devices, such as oxidation, are used, typically by thermally oxidizing the semiconductor material.

At present, the quick shaping processingequipment of current semiconductor material heating effect is not good, and the heating is inhomogeneous, does not have regularly heating and temperature abnormity and reminds the function, and the function is single, and difficult dismantlement clearance, has increased people's burden, and the limitation is great, can't satisfy the demand in the in-service use, so urgent need can the modified technique on the market to solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

For solving the technical problem who exists among the background art, the utility model provides a semiconductor material's quick shaping processingequipment has the characteristics that the heating is even, regularly heat, temperature abnormity is reminded and easy dismantlement clearance.

(II) technical scheme

For solving the technical problem, the utility model provides a semiconductor material's quick shaping processingequipment, the power distribution box comprises a box body, the lower inner wall equidistance of box is fixed with T type bracing piece, and the upper end and the metal net rack butt of T type bracing piece are connected, the lower inner wall bilateral symmetry rigidity of box has lower heating pipe, the last inner wall bilateral symmetry rigidity of box has last heating pipe, the last inner wall intermediate position of box is fixed with temperature sensor, the upper end of box is fixed with audible-visual annunciator, and the front end from the top down of box is fixed with timer and singlechip in proper order.

Furthermore, the lower inner wall of box equidistance has seted up the recess, and the box passes through the recess and is connected with T type bracing piece joint.

Furthermore, a spring is sleeved on the T-shaped supporting rod, and the upper end and the lower end of the spring are respectively connected with the T-shaped supporting rod and the box body in an abutting mode.

Furthermore, the inner walls of the lower heating pipe and the upper heating pipe are fixed with electric heating wires.

Furthermore, an air blower is fixed at the upper end of the box body, a conveying pipe fixed at the left end of the air blower penetrates through the upper end of the box body, and a ventilation hole is formed in the box body.

Further, the input of singlechip and temperature sensor's output electric connection, and the output of singlechip and the input electric connection of lower heating pipe, last heating pipe, air-blower and audible-visual annunciator, the input of lower heating pipe and last heating pipe and the output electric connection of timer.

Furthermore, the front end of the box body is connected with a box door hinge, and a glass window and a handle are sequentially fixed at the front end of the box door from left to right.

The above technical scheme of the utility model has following profitable technological effect: the utility model discloses the lower inner wall bilateral symmetry position of the box that sets up is fixed with lower heating pipe, and the upper inner wall bilateral symmetry position of box is fixed with upper heating pipe, can heat the lower surface of semiconductor fast through lower heating pipe, and upper heating pipe can heat the upper surface of semiconductor fast, and the heating is even and fast, and the utility model discloses the upper inner wall intermediate position of the box that sets up is fixed with temperature sensor, and temperature sensor can sense the box internal temperature and convert into exportable signal transmission for the singlechip, and when the temperature high temperature is unusual, the singlechip can automatic control audible-visual annunciator sends sound and reminds people, then the utility model discloses the front end of the box that sets up is fixed with the timer, can set up heating time through the timer, and the time one can automatic disconnection upper heating pipe and lower heating pipe power to the timer, reaches the effect of timing heating, labour saving and time saving, finally the utility model discloses the upper end of the T type, during the clearance, but direct separation metal rack and T type bracing piece, then with T type bracing piece follow the recess of box take out can, conveniently dismantle the clearance box body.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the T-shaped support rod and the box body of FIG. 1 according to the present invention;

fig. 3 is a schematic structural view of the upper heating pipe of fig. 1 according to the present invention;

fig. 4 is a front view schematically illustrating the present invention;

fig. 5 is a schematic block diagram of the present invention.

Reference numerals:

1. a box body; 2. a lower heating pipe; 3. a T-shaped support rod; 4. a metal net frame; 5. an upper heating pipe; 6. a temperature sensor; 7. a vent hole; 8. a blower; 9. a transport pipe; 10. an audible and visual alarm; 11. a timer; 12. a single chip microcomputer; 13. a spring; 14. a groove; 15. an electric heating wire; 16. a box door; 17. a glass window; 18. a handle.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

Referring to fig. 1, the utility model relates to a rapid prototyping processing device for semiconductor material, which comprises a box body 1, wherein T-shaped supporting rods 3 are fixed on the lower inner wall of the box body 1 at equal intervals, the upper ends of the T-shaped supporting rods 3 are connected with a metal net rack 4 in an abutting manner, the metal net rack 4 can be used for placing semiconductor material for facilitating heating and oxidation, lower heating pipes 2 are fixed at the left-right symmetrical positions of the lower inner wall of the box body 1, the lower surface of the semiconductor can be rapidly heated through the lower heating pipes 2, upper heating pipes 5 are fixed at the left-right symmetrical positions of the upper inner wall of the box body 1, the lower heating pipes 2 and the upper heating pipes 5 are I PH118-2, the upper surface of the semiconductor can be rapidly heated through the upper heating pipes 5, a temperature sensor 6 is fixed at the middle position of the upper inner wall of the box body 1, the temperature sensor 6 is DS18B20, the temperature, the model of audible and visual alarm 10 is LTE-6101J-AC380V, and the audible and visual alarm 10 of switch on can send out two kinds of alarm signal of sound, light, is convenient for remind people, and the front end from the top down of box 1 is fixed with timer 11 and singlechip 12 in proper order, and the model of timer 11 is 2SC2559, can set for the heating time through timer 11, and the model of singlechip 12 is AT89C 51.

Wherein as shown in fig. 1 and 2, the lower inner wall equidistance of box 1 is seted up flutedly 14, and box 1 is connected with T type bracing piece 3 joint through recess 14, dismantle T type bracing piece 3 through recess 14 easy to assemble, the last spring 13 that has cup jointed of T type bracing piece 3, and the upper and lower end of spring 13 is connected with T type bracing piece 3 and box 1 butt respectively, spring 13 is one kind and utilizes elasticity to come the mechanical part of work, protects T type bracing piece 3 well through spring 13's elastic energy.

As shown in fig. 1 and 3, the inner walls of the lower heating tube 2 and the upper heating tube 5 are fixed with heating wires 15, and the heating wires 15 connected with the power supply can dissipate heat for heating and oxidation.

As shown in fig. 1, an air blower 8 is fixed at the upper end of the box body 1, a transport pipe 9 fixed at the left end of the air blower 8 penetrates through the upper end of the box body 1, the air blower 8 can blow outside air into the box body 1 through the transport pipe 9 to provide sufficient oxygen, a vent hole 7 is formed in the box body 1, and the vent hole 7 can keep air pressure in the box body 1 balanced.

Wherein as shown in fig. 5, the input of singlechip 12 and temperature sensor 6's output electric connection, temperature sensor 6 can give singlechip 12 with signal transmission, be convenient for detect the temperature, and singlechip 12's output and lower heating pipe 2, go up heating pipe 5, the input electric connection of air-blower 8 and audible-visual annunciator 10, the input of lower heating pipe 2 and last heating pipe 5 and the output electric connection of timer 11, the switch of timer 11 steerable lower heating pipe 2 and last heating pipe 5, be convenient for regularly heat.

As shown in fig. 4, the front end of the box body 1 is hinged to the box door 16, and the front end of the box door 16 is fixed with a glass window 17 and a handle 18 which are sequentially fixed from left to right, the glass window 17 facilitates people to observe the semiconductor oxidation condition, and the handle 18 facilitates people to open and close the box door 16.

The working principle is as follows: an external power supply is connected, a semiconductor can be placed at the upper end of a metal net rack 4, then the power supply of a lower heating pipe 2 and an upper heating pipe 5 is connected through a single chip microcomputer 12, the lower heating pipe 2 connected with the power supply can heat the lower surface of the semiconductor, the upper heating pipe 5 connected with the power supply can heat the upper surface of the semiconductor, the power supply of an air blower 8 is connected through the single chip microcomputer 12 during heating, the air blower 8 connected with the power supply can convey outside air into a box body 1 through a conveying pipe 9, then heating time can be set through a timer 11, when the heating time is up, the timer 11 can automatically disconnect the power supply of the lower heating pipe 2 and the upper heating pipe 5, then a normal temperature range of heating oxidation can be set through the single chip microcomputer 12, when the temperature detected by a temperature sensor 6 exceeds the set normal temperature range, the single chip, the audible and visual alarm 10 of switch on can send alarm sound and remind people automatically, when needing to clear up, can open chamber door 16 earlier, then directly take out metal net rack 4, then apply ascending effort to all T type bracing pieces 3 for T type bracing piece 3 moves upwards, until T type bracing piece 3 break away from box 1 completely can, later the inside of clearing up box 1 can.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. The utility model provides a rapid prototyping processingequipment of semiconductor material, includes box (1), its characterized in that: the utility model discloses a box, including box (1), inner wall, heating pipe (5), box (1), inner wall, sound-light alarm (10), and the front end from the top down of box (1) is fixed with T type bracing piece (3) equidistance down, and the upper end and the metal net rack (4) butt of T type bracing piece (3) are connected, the lower inner wall bilateral symmetry rigidity of box (1) has lower heating pipe (2), the last inner wall bilateral symmetry rigidity of box (1) has last heating pipe (5), the last inner wall intermediate position of box (1) is fixed with temperature sensor (6), the upper end of box (1) is fixed with audible-visual alarm (10), and the front end from the top down of box (1) is fixed.

2. The rapid prototyping and processing device for semiconductor materials as set forth in claim 1, wherein the lower inner wall of the box body (1) is provided with grooves (14) at equal intervals, and the box body (1) is connected with the T-shaped support bar (3) in a clamping manner through the grooves (14).

3. The rapid prototyping and processing device for semiconductor material as set forth in claim 1, wherein the T-shaped support bar (3) is sleeved with a spring (13), and the upper and lower ends of the spring (13) are respectively connected with the T-shaped support bar (3) and the box body (1) in an abutting manner.

4. The rapid prototyping processing device of the semiconductor material as set forth in claim 1, wherein the heating wires (15) are fixed to the inner walls of the lower heating tube (2) and the upper heating tube (5).

5. The rapid prototyping and processing device for semiconductor material as claimed in claim 1, wherein an air blower (8) is fixed at the upper end of the box body (1), a conveying pipe (9) fixed at the left end of the air blower (8) penetrates through the upper end of the box body (1), and a vent hole (7) is formed in the box body (1).

6. The rapid prototyping and processing device of semiconductor material as set forth in claim 1, wherein an input terminal of the single chip microcomputer (12) is electrically connected to an output terminal of the temperature sensor (6), an output terminal of the single chip microcomputer (12) is electrically connected to input terminals of the lower heating tube (2), the upper heating tube (5), the blower (8) and the acousto-optic alarm (10), and input terminals of the lower heating tube (2) and the upper heating tube (5) are electrically connected to an output terminal of the timer (11).

7. The rapid prototyping processing device of the semiconductor material as set forth in claim 1, wherein the front end of the box body (1) is hinged with the box door (16), and the front end of the box door (16) is fixed with a glass window (17) and a handle (18) which are fixed in sequence from left to right.