CN212721834U - Bus joint temperature measuring device applied to data center - Google Patents

Bus joint temperature measuring device applied to data center Download PDF

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Publication number
CN212721834U
CN212721834U CN202021886556.2U CN202021886556U CN212721834U CN 212721834 U CN212721834 U CN 212721834U CN 202021886556 U CN202021886556 U CN 202021886556U CN 212721834 U CN212721834 U CN 212721834U
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China
Prior art keywords
temperature measuring
taking
power
measuring device
data center
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CN202021886556.2U
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Chinese (zh)
Inventor
徐超
孙运建
严杰
刘静
黄一鸣
张平
缪松林
林仙威
谢清源
周钰鹏
崔寅波
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Acrel Co Ltd
Jiangsu Acrel Electrical Manufacturing Co Ltd
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Acrel Co Ltd
Jiangsu Acrel Electrical Manufacturing Co Ltd
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Priority to CN202021886556.2U priority Critical patent/CN212721834U/en
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Abstract

The utility model relates to a be applied to data center's bus joint temperature measuring device belongs to bus duct temperature measurement technical field. The temperature measuring device comprises a lower shell, an upper shell, a circuit board and a power-taking temperature measuring probe, wherein a guide groove is formed in the lower shell, the power-taking temperature measuring probe is arranged in the guide groove through a sliding switch, and a surface cover is arranged on the guide groove; the power-taking lead plug of the power-taking temperature measuring probe is inserted into a first socket on the circuit board, and the temperature lead plug of the power-taking temperature measuring probe is inserted into a second socket; the upper shell is also provided with a fuse, and the fuse is arranged between the power taking circuit and the bus duct; the upper shell is provided with a rectangular groove, and the display module is arranged in the groove in a matching mode. The utility model discloses a be applied to data center's bus connector temperature measuring device has realized rational in infrastructure small, the manifold purpose of function again simultaneously.

Description

Bus joint temperature measuring device applied to data center
Technical Field
The utility model relates to a be applied to data center's bus joint temperature measuring device belongs to bus duct temperature measurement technical field.
Background
Under the prior art, most bus duct temperature measuring devices are complex in structure and single in function.
For example, chinese patent with patent publication No. CN107607208A discloses a bus duct joint temperature measuring device, which includes a fixed guide rail, a temperature sensor clamp and a temperature acquisition terminal, wherein the temperature sensor clamp is arranged on the fixed guide rail, and the temperature sensor clamp can slide along the fixed guide rail; the temperature sensor clamp is provided with a temperature sensor, the fixed guide rail is placed on the bus duct joint, and the temperature sensor is positioned between metal plates inside the bus duct joint to acquire the temperature of the bus; the temperature sensor is connected with a temperature acquisition terminal positioned above the fixed guide rail through a wiring terminal; the temperature sensor can be conveniently installed, but a temperature sensor clamp is adopted to match with a fixed guide rail to slide, and the clamp comprises a moving part, a long key, an upper cover, a straight spring and a clamping body; the movable piece is of a hollow structure, and the interior of the movable piece is divided into an upper section, a middle section and a lower section; the upper section is internally provided with a straight spring, and the lower section is connected with a clamping body for fixing a temperature sensor; the upper part of the moving part is connected with the fixed guide rail and can slide along the sliding groove of the fixed guide rail, and the top of the moving part is also provided with an upper cover; the long key is a hollow cylinder, and the outer surface of the long key is provided with an annular boss; the long key is positioned in the movable piece, and the annular boss is contacted with the upper part of the straight spring; therefore, the clamp is complex in structure, and although the temperature sensor can slide along the fixed guide rail by using the clamp, the structure greatly increases the manufacturing cost.
If chinese patent with patent publication No. CN205246239U discloses an online temperature measuring device for plug-in type bus duct, including insulating side plate frame, plug-in box, leading body, embedded microprocessor and optic fibre temperature sensor, leading body outer parcel has insulating side plate frame, plug-in box is connected to insulating side plate frame up end, plug-in box upper portion is equipped with the case lid, is equipped with binding post in the box, is equipped with a plurality of optic fibres in the binding post, optic fibre end connection optic fibre temperature sensor, on the embedded microprocessor is connected to the optic fibre upper end, embedded microprocessor inlays in the gasket, the case lid surface is equipped with liquid crystal display bottle, operating button, warning indicator and audible-visual annunciator, an online temperature measuring device for plug-in type bus duct, it is convenient to detect, and insulating grade is high, and the stable performance can be high, monitors the temperature of leading body different positions in real time, has improved, The efficiency of feedback, processing and early warning improves the safety and the informatization management level of the operation of the main conductor; however, it is powered by a storage battery, not only occupies a large space and causes the device to be too large, but also faces the situation that the battery life is exhausted and the device may stop working.
Therefore, in order to solve the above problems, it is socially desirable to develop a bus bar connector temperature measuring device that has various functions, a reasonable structure, and a small size, and can be applied to a data center.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem of proposing in the above-mentioned background problem, provide a be applied to data center's bus connector temperature measuring device, it can realize rational in infrastructure small, the manifold purpose of function again simultaneously.
The purpose of the utility model is realized like this: a bus joint temperature measuring device applied to a data center comprises a lower shell, an upper shell, a circuit board and a power-taking temperature measuring probe, wherein a guide groove is formed in the lower shell, the power-taking temperature measuring probe is installed in the guide groove through a sliding switch, and a surface cover is arranged on the guide groove;
the power-taking lead plug of the power-taking temperature measuring probe is inserted into a first socket on the circuit board, and the temperature lead plug of the power-taking temperature measuring probe is inserted into a second socket;
the upper shell is also provided with a fuse, and the fuse is arranged between the power taking circuit and the bus duct;
the upper shell is provided with a rectangular groove, and the display module is arranged in the groove in a matching mode.
And the outgoing line plug of the fuse is inserted into a third socket on the circuit board, and the incoming line plug of the fuse is inserted into a fourth socket on the circuit board.
The display module is connected with the circuit board through a contact pin.
And sealing rings are further arranged on the installation contact surfaces of the bottom of the lower shell and the bus duct cover plate.
Compared with the prior art, the utility model discloses a be applied to data center's bus joint temperature measuring device has following advantage:
1. the structure is clear and reasonable, all the functional modules contained in the device are integrated in one shell, and the device has small volume, is convenient for field installation and after sale;
2. the probe directly gets electricity, is stable and reliable, and a fuse is arranged between the electricity getting circuit of the device and the bus duct, so that the device is safe and reliable;
3. the distance between each electricity-taking temperature measuring probe is adjustable, and the bus duct is suitable for most types of bus ducts in the market.
4. A sealing ring is arranged on the installation contact surface of the bottom of the device and the bus duct, and the protection level is high.
Drawings
Fig. 1 is the utility model relates to a be applied to data center's bus joint temperature measuring device's inferior valve structure cooperation sketch map.
Fig. 2 is the utility model relates to a be applied to data center's bus joint temperature measuring device's epitheca structure cooperation sketch map.
Fig. 3 is the utility model relates to a be applied to data center's bus joint temperature measuring device's fuse installation schematic diagram.
Fig. 4 is a view of the bottom of the lower casing of the bus bar joint temperature measuring device applied to the data center.
Fig. 5 is the utility model relates to a be applied to data center's bus joint temperature measuring device's theory of operation frame diagram.
Wherein: 1. a lower case; 2. an upper shell; 3. a circuit board; 4. a display module; 5. a guide groove; 6. taking a power and temperature measuring probe; 7. a slide switch; 8. a face cover;
21. a fuse;
31. a first socket; 32. a second socket; 33. a third socket; 34. a fourth socket; 35. an MCU chip; 36. an RS485 communication module; 37. a humidity detection module; 38. an alarm module;
41. inserting a pin; 42. a display screen; 43. an LED lamp; 44. a wireless module; 45. an infrared communication module; 46. and (6) pressing a key.
Detailed Description
The invention is described below with reference to the accompanying drawings and specific embodiments:
as shown in fig. 1 to 5, a bus joint temperature measuring device applied to a data center includes a lower case 1, an upper case 2, a circuit board 3 and a power-taking temperature measuring probe 6, wherein the lower case 1 is provided with a guide groove 5, the power-taking temperature measuring probe 6 is loaded into the guide groove 5 through a slide switch 7, and the guide groove 5 is provided with a face cover 8;
the power-taking conducting wire plug of the power-taking temperature measuring probe 6 is inserted into the first socket 31 on the circuit board 3, and the temperature conducting wire plug of the power-taking temperature measuring probe 6 is inserted into the second socket 32;
the upper shell 2 is also provided with a fuse 21, and the fuse 21 is arranged between the power taking circuit and the bus duct;
the upper shell 2 is provided with a rectangular groove, and the display module 4 is arranged in the groove in a matching manner.
In this embodiment, exemplarily, the guide slot 5 may be composed of two guide rails arranged in parallel, the bottom of the sliding switch 7 is provided with a groove according to the structure matching of the guide slot 5, the sliding switch 7 is further provided with a power-taking temperature probe 6 in a matched manner to be provided with a U-shaped groove, and the temperature probe 6 is installed in the sliding switch 7 through the matching of the U-shaped groove and is in clearance fit with the sliding switch 7.
The outlet plug of the fuse 21 is inserted into a third socket 33 on the circuit board 3, and the inlet plug of the fuse 21 is inserted into a fourth socket 34 on the circuit board 3.
The display module 4 is connected to the circuit board 3 via pins 41.
In this embodiment, there are two sets of guide slots 5, each set is two, and four electricity-taking temperature probes 6 are arranged in a matching manner.
In this embodiment, the circuit board 3 includes an MCU chip 35, an RS485 communication module 36, a humidity detection module 37, and an alarm module 38.
In this embodiment, the display module 4 includes a display screen 42, an LED lamp 43, a wireless module 44, an infrared communication module 45, and a key 46.
In this embodiment, the upper case 2 and the lower case 1 are assembled together to form the whole device.
And sealing rings are further arranged on the installation contact surfaces of the bottom of the lower shell 1 and the bus duct cover plate.
In this embodiment, the seal ring is a rubber seal ring.
In this embodiment, the utility model relates to a be applied to data center's bus joint temperature measuring device's installation flow as follows:
during installation, the device for adjusting the distance between the electricity-taking temperature probes 6 is fixed on a bus duct cover plate with a hole opened in advance through a screw hole on the shell, a rubber sealing ring is fixed between the bottom of the lower shell and the cover plate, and at the moment, 4 electricity-taking temperature probes 6 extend into gaps between the busbars to achieve electricity taking and temperature and humidity detection of the device.
In this embodiment, in practical application, the voltage on the bus duct A, B, C, N enters the device for power supply through the power-taking temperature measurement probe 6 and the fuse 21, and at the same time, the power-taking temperature measurement probe 6 starts to detect the temperature in the bus duct and transmits data to the MCU chip 35 on the circuit board 3 through a wire and a plug, after the MCU chip 35 processes the data, the RS485 communication module 36, the wireless module 44 or the infrared communication module 45 transmits the data to the background monitoring center, so as to read the temperature and device parameter information of the bus duct in real time, and the display screen 42 and the LED lamp 43 on the device display module 4 display the temperature of each phase of the bus duct and partial parameter information of the device in real time;
when the temperature in the bus duct exceeds the alarm value set by the device, the device alarm module 38 sends out a sound alarm, and meanwhile, the background monitoring center receives alarm information sent by the device.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims (4)

1. The utility model provides a be applied to data center's bus joint temperature measuring device, includes inferior valve (1), epitheca (2), circuit board (3) and gets electric temperature probe (6), its characterized in that: the lower shell (1) is provided with a guide groove (5), the electricity-taking temperature measuring probe (6) is arranged in the guide groove (5) through a sliding switch (7), and the guide groove (5) is provided with a surface cover (8);
the power-taking lead plug of the power-taking temperature measuring probe (6) is inserted into a first socket (31) on the circuit board (3), and the temperature lead plug of the power-taking temperature measuring probe (6) is inserted into a second socket (32);
the upper shell (2) is also provided with a fuse (21), and the fuse (21) is arranged between the power taking circuit and the bus duct;
the upper shell (2) is provided with a rectangular groove, and the display module (4) is arranged in the groove in a matching manner.
2. The bus bar joint temperature measuring device applied to the data center according to claim 1, wherein: the outlet plug of the fuse (21) is inserted into a third socket (33) on the circuit board (3), and the inlet plug of the fuse (21) is inserted into a fourth socket (34) on the circuit board (3).
3. The bus bar joint temperature measuring device applied to the data center according to claim 1, wherein: the display module (4) is connected with the circuit board (3) through a contact pin (41).
4. The bus bar joint temperature measuring device applied to the data center according to claim 1, wherein: and sealing rings are further arranged on the bottom of the lower shell (1) and the mounting contact surface of the bus duct cover plate.
CN202021886556.2U 2020-09-02 2020-09-02 Bus joint temperature measuring device applied to data center Active CN212721834U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021886556.2U CN212721834U (en) 2020-09-02 2020-09-02 Bus joint temperature measuring device applied to data center

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021886556.2U CN212721834U (en) 2020-09-02 2020-09-02 Bus joint temperature measuring device applied to data center

Publications (1)

Publication Number Publication Date
CN212721834U true CN212721834U (en) 2021-03-16

Family

ID=74926027

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021886556.2U Active CN212721834U (en) 2020-09-02 2020-09-02 Bus joint temperature measuring device applied to data center

Country Status (1)

Country Link
CN (1) CN212721834U (en)

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