CN212721823U

CN212721823U - Sensor core and sensor

Info

Publication number: CN212721823U
Application number: CN202021921993.3U
Authority: CN
Inventors: 娄帅
Original assignee: Nanjing Xinligan Electronic Technology Co ltd
Current assignee: Nanjing Xinligan Electronic Technology Co ltd
Priority date: 2020-06-03
Filing date: 2020-09-04
Publication date: 2021-03-16
Anticipated expiration: 2030-09-04
Also published as: CN111397668A

Abstract

The utility model provides a sensor core body, which comprises a rigid shell, a pressure chip and a thermistor, wherein the rigid shell is internally provided with a first through hole and a second through hole, a first terminal is penetrated in the first through hole, a second terminal is penetrated in the second through hole, the pressure chip is welded on one end of the first terminal in an inverted way, the thermistor is welded on one end of the second terminal in an inverted way, the first through hole and the second through hole are both filled with insulating media, the first terminal and the second terminal are fixed on the rigid shell through the insulating media, when the sensor core works and the pressure and the temperature of a measured medium act on the sensor, the signal change caused by the pressure and the temperature can be timely output through the sensor output terminal, the pressure and temperature sensing signals are led to one side of the signal processing unit from one side of the signal sensing unit, thereby realizing the function of simultaneously measuring the temperature parameter and the pressure parameter at the same position.

Description

Sensor core and sensor

Technical Field

The utility model relates to a sensor field of making, in particular to sensor core and sensor.

Background

The sensor, as a kind of detecting device, can sense the information of the person to be measured, and can convert the sensed information into an electric signal or other information output in a required form according to a certain rule, so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like. With the continuous progress of society and the continuous development of scientific technology, the application field of the sensor in daily life is more and more extensive, and the sensor is more and more developed towards the direction of miniaturization, multi-functionalization, systematization and the like.

In the field of existing sensors, a temperature sensor and a pressure sensor are the most important two types of sensors, and the temperature sensor and the pressure sensor are widely used in the fields of automobiles, industries and the like. In the prior art, a temperature sensor and a pressure sensor are often used together, for example, a gas pipeline simultaneously detects temperature and pressure signals to perform flow measurement and control, and a feedback system measures gas pressure and temperature in an air compressor to perform pressure and safety control, and the like, which all reflect the importance of the sensors.

However, the conventional temperature sensor and the conventional pressure sensor are respectively and independently installed at different positions when being used, so that each sensor can only independently measure the temperature parameter or the pressure parameter at the position, and the temperature parameter and the pressure parameter at the same position cannot be simultaneously measured.

SUMMERY OF THE UTILITY MODEL

Based on this, the utility model aims at providing a sensor core to solve prior art's sensor and can not measure the problem of the temperature parameter and the pressure parameter of same position simultaneously.

The utility model provides a sensor core, includes rigid housing, pressure chip and thermistor, first through-hole and second through-hole have been seted up in the rigid housing, wear to be equipped with first terminal in the first through-hole, wear to be equipped with the second terminal in the second through-hole, pressure chip flip-chip bonding in one of first terminal is served, the thermistor flip-chip bonding in one of second terminal is served, all pack in first through-hole and the second through-hole and have insulating medium, first terminal with the second terminal passes through insulating medium is fixed in on the rigid housing.

Preferably, solder joint protecting layers for protecting solder joints are filled between the insulating medium and the pressure chip and between the insulating medium and the thermistor.

Preferably, the filling height of the insulating medium is lower than the height of the side walls of the first through hole and the second through hole.

Preferably, the first terminal and the second terminal are symmetrically distributed on a straight line passing through the center of the rigid shell.

Preferably, the insulating medium is made of glass.

Preferably, the rigid housing is made of kovar alloy or stainless steel.

Another object of the utility model is to provide a sensor, including the shell, set up in circuit board and sensor core in the shell and with the circuit board is connected and is extended to the outer output terminal of shell, the sensor core adopt above the sensor core, the first terminal and the second terminal of sensor core with the circuit board is connected.

The utility model has the advantages that: the first through hole and the second through hole are arranged in the rigid shell, the insulating medium used for fixing the first terminal and the second terminal is filled in the first through hole and the second through hole, wherein, the pressure chip is welded at one end of the first terminal, the thermistor is welded at one end of the second terminal, thereby realizing the electrical connection between the pressure chip and the thermistor as well as the terminals, the other ends of the first terminal and the second terminal penetrate through the through hole in the rigid shell to be connected with the circuit board of the sensor, thereby realizing the acquisition, calibration and processing of signals, when the pressure and the temperature of the measured medium act on the sensor, the signal change caused by the pressure and the temperature can be timely output through the output terminal of the sensor, the pressure and the temperature sensing signals are led to one side of the signal processing unit from the signal sensing side, the signal processing unit can simultaneously measure the pressure parameter and the temperature parameter at the moment, therefore, the sensor realizes the function of simultaneously measuring the temperature parameter and the pressure parameter at the same position.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic cross-sectional structural view of a sensor core provided in a first embodiment of the present invention;

fig. 2 is a schematic perspective view of a sensor core according to a first embodiment of the present invention;

FIG. 3 is a schematic bottom view of a sensor core according to a first embodiment of the present invention;

fig. 4 is a schematic view of a package structure of a sealing ring and a plug connector according to a third embodiment of the present invention;

fig. 5 is a schematic view of another packaging structure of a sealing ring and a plug connector according to a third embodiment of the present invention;

fig. 6 is a schematic structural diagram of a packaging method by laser welding according to a third embodiment of the present invention.

Description of the main element symbols:

rigid outer casing	10	Pressure chip	20
				Thermal resistor	30	First through hole	11
Second through hole	12	First terminal	40
				Second terminal	50	Insulating medium	60
Welding spot protective layer	70	Sealing ring	80
				Connector assembly	90	Laser welding point	100

The following detailed description of the invention will be further described in conjunction with the above-identified drawings.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are given in the accompanying drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 3, a sensor core according to a first embodiment of the present invention is shown, including: a rigid housing 10, a pressure chip 20, and a thermistor 30.

Wherein: the sensor core body comprises a rigid shell 10, a pressure chip 20 and a thermistor 30, wherein a first through hole 11 and a second through hole 12 are formed in the rigid shell 10, a first terminal 40 is arranged in the first through hole 11 in a penetrating manner, a second terminal 50 is arranged in the second through hole 12 in a penetrating manner, the pressure chip 20 is flip-chip welded on one end of the first terminal 40, the thermistor 30 is flip-chip welded on one end of the second terminal 50, insulating media 60 are filled in the first through hole 11 and the second through hole 12, and the first terminal 40 and the second terminal 50 are fixed on the rigid shell 10 through the insulating media 60.

In this embodiment, as shown in fig. 1 to 3, the sensor core mainly includes a rigid housing 10, a pressure chip 20, and a thermistor 30, wherein a main structure of the rigid housing 10 is configured as a cylinder, a first through hole 11 and a second through hole 12 are opened at a central portion of the rigid housing 10, it should be noted that, in this embodiment, the first through hole 11 is configured as a circular through hole, four first terminals 40 are inserted into the first through hole 11, the second through hole 12 is configured as an elliptical through hole, and two second terminals are inserted into the second through hole 12. As shown in fig. 1, a solder joint protecting layer 70 for protecting the solder joint is filled between the insulating medium 60 and the pressure chip 20, and between the insulating medium 60 and the thermistor 30. In this embodiment, the solder joint protection layer 70 may be made of different materials according to the application environment of the sensor core.

In the present embodiment, as shown in fig. 2, the filling height of the insulating medium 60 is lower than the height of the sidewalls of the first via hole 11 and the second via hole 12. And a plurality of first terminals 40 and second terminals 50 are each disposed on a straight line passing through the center of the rigid housing 10. Note that the insulating medium 60 is made of glass. The glass is made of materials which are widely applied in the field of air conditioning refrigeration, and can resist wide media without corrosion so as to prevent leakage. The glass has extremely low thermal expansion coefficient, does not crack under severe alternating temperature environment, can be applied to the fields of refrigerant pressure detection and the like in severe temperature environment, and can bear very high pressure so as not to damage and leak. Note that the rigid housing 10 is made of kovar or stainless steel. Kovar alloys also have very low coefficients of thermal expansion, do not crack in harsh alternating temperature environments, and at the same time can withstand very high pressures, thereby not damaging leakage.

A second embodiment of the present invention provides a method for manufacturing a sensor core body, which is used for preparing the sensor core body provided by the first embodiment, and the method for manufacturing the sensor core body comprises the following steps:

the first terminal 40 and the second terminal 50 are respectively and correspondingly fixed in the first through hole 11 and the second through hole 12 through the insulating medium 60, one end of the first terminal 40 penetrates through the first through hole 11, one end of the second terminal 50 penetrates through the second through hole 12, the other ends of the first terminal 40 and the second terminal 50 are fixed in the insulating medium 60, and one end surface of the terminal fixed in the insulating medium 60 protrudes out of the lower surface of the insulating medium 60, so that the lower surfaces of the first terminal 40 and the second terminal 50 are conveniently coated with solder, and then the pressure chip 20 and the thermistor 30 are attached to one end surface of the terminal. It should be noted that the pressure chip 20 and the thermistor 30 can be placed on the surface of the terminal by manual clamping and soldering through reflow soldering, so as to be used for small-scale production, and the pressure chip 20 and the thermistor 30 can also be placed on the surface of the terminal by automatic mounting, automatic dispensing or printing of solder paste, the position of the terminal is found by an image after the pressure chip 20 or the thermistor 30 is picked up automatically, the pressure chip 20 and the thermistor 30 are placed on the surface of the terminal after positioning, and soldering is completed through reflow soldering, so as to be suitable for large-scale production.

Then, the pressure chip 20 is flip-chip bonded to one end surface of the first terminal 40 by solder, the thermistor 30 is flip-chip bonded to one end surface of the second terminal 50 by solder, the solder paste can be printed or dispensed on the one end surfaces of the first terminal 40 and the second terminal 50 by clamping the rigid housing 10 by a tool, judging the position of the terminal by an image system and rotating the rigid housing 10 to a required angle, the surface of the terminal is covered by a silk screen, and the solder paste is brushed onto the surface of the terminal through small holes on the silk screen. The realization mode of point-coating the solder paste is that a visual point solder paste system is adopted, the position of the terminal is determined by an image, the solder paste is sprayed onto the surface of the terminal by a spray valve, and the minimum radius of the sprayed solder paste can be 0.4 mm.

The pad protection layer 70 is filled among the first terminal 40, the insulating medium 60, and the pressure chip 20, and the pad protection layer 70 is filled among the second terminal 50, the insulating medium 60, and the thermistor 30. In this embodiment, the solder joint protection layer 70 can be made of different materials according to different application environments, for example, when the solder joint protection layer is applied to a water environment, a water-resistant silicone gel material can be selected, when the solder joint protection layer is applied to a medium such as engine oil, epoxy filling can be selected, when the solder joint protection layer is applied to a refrigerant field, a nano-plating layer can be selected, and the like, which are within the protection scope of this.

The process for protecting the welding spot by adopting the waterproof silicone gel comprises the steps of putting the sensor core into vacuum dispensing equipment, drawing the cavity of the equipment to a certain vacuum degree, dispensing the gel, simultaneously drawing out air in the gel, pressing the gel to a bottom gap after releasing vacuum, and protecting the periphery of the welding spot.

The realization mode of the nano coating is as follows: 1. the parylene vacuum coating is characterized in that solid tetrachloro-p-xylene cyclic dimer is sublimated into gas at about 150 ℃ in a vacuum environment, the tetrachloro-p-xylene cyclic dimer is cracked into active 2, 5-dichloro-p-dimethylene benzene with free radicals at about 650 ℃, and the free 2, 5-dichloro-p-dimethylene benzene is deposited and polymerized on the surface of a solid substrate at room temperature (25 ℃) to form a layer of conformal film without pinholes. By plating a 5-10 mu m plating layer, the coating can resist acid and alkali corrosion and has the functions of moisture resistance, water resistance, oxidation resistance and medium resistance. 2. And (3) immersing the lower half part of the core body into SiO2 nano coating liquid in a dip-coating mode, taking out after 5 seconds, surface drying for about 30 minutes, obtaining the thickness of a coating layer of 1-3 mu m on the surface, and completely curing after 2-5 days. The cured paint film has excellent hydrophobic and oleophobic performances, good weather resistance, water resistance, corrosion resistance, high hardness, scratch resistance and electric insulation performance.

It should be noted that the apparatus provided in the second embodiment of the present invention has the same implementation principle and produces some technical effects as the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents in the first embodiment without reference to this embodiment.

Referring to fig. 4 to fig. 6, a method for packaging a sensor core according to a third embodiment of the present invention is shown, for packaging the sensor core according to the first embodiment, the method includes:

as shown in fig. 4 to 5, the sensor core is hermetically sealed and fitted into the sensor case by a seal ring 80 and a connector 90, and a plurality of seal rings are provided on the inner wall of the sensor case, and the sensor core is fixed inside the sensor case by a plug 90. The specific implementation mode is that a sensor shell is manufactured, the sensor shell has specific characteristics of threaded connection and the like, the appearance of the sensor shell is changed according to different customers, and the inside of the sensor shell is processed into a standard size according to the size of the sensor core. A plurality of sealing rings are placed in a sensor shell, the sealing rings are positioned by circular grooves, a sensor core body is placed above the sealing rings, the edge of a riveted sensor shell is connected to the periphery of the sensor core body in a pressing mode to compress the sealing rings to 30% of compression amount, and the sealing rings form sealing for an insulating medium. The middle of the sensor core and sensor housing may also be riveted into a customer-specific component such as connector 90 to form an external electrical and mechanical connection

As shown in fig. 6, or the rigid shell 10 of the sensor core and the inner wall of the sensor shell are welded together by laser, as shown in the figure, the laser welding point 100 is disposed at the joint of the side wall surface of the rigid shell 10 and the inner wall surface of the sensor shell, and in other cases, the laser welding point 100 can be disposed at other positions, which is within the protection scope of the present embodiment. The specific implementation mode is that the appearance of the sensor shell is customized according to different requirements of customers, and the inside of the sensor shell is unified in size according to the sensor core. A groove slightly larger than the outer diameter of the sensor core body is processed in the sensor shell, and the sensor core body is placed in the groove. And the laser welding is adopted to weld a circle at the joint of the sensor core body and the sensor shell, and the welding seam can form sealing and form the bursting strength of more than 40 Mpa.

Installing the sensor circuit board in the sensor shell, connecting one end of the first terminal 40 far away from the pressure chip 20 with the sensor circuit board, and connecting one end of the second terminal 50 far away from the thermistor 30 with the sensor circuit board;

and one end of the sensor output terminal is welded on the sensor circuit board, and the other end of the sensor output terminal is led out to the outside of the sensor shell.

It should be noted that the third embodiment of the present invention provides an apparatus, which has the same implementation principle and produces some technical effects as the first embodiment, and for the sake of brief description, the corresponding contents in the first embodiment can be referred to where this embodiment is not mentioned.

A fourth embodiment of the invention provides a sensor comprising a housing, a circuit board and a sensor core disposed within the housing, and an output terminal connected to the circuit board and extending outside the housing, the sensor core being disposed as the sensor core provided in the first embodiment, the first terminal 40 and the second terminal 50 of the sensor core being connected to the circuit board.

It should be noted that the device provided by the fourth embodiment of the present invention has the same implementation principle and produces some technical effects as the first embodiment, and for the sake of brief description, reference may be made to the corresponding contents in the first embodiment without reference to this embodiment.

The specific embodiment of the invention is that a first through hole 11 and a second through hole 12 are opened in the rigid shell 10, an insulating medium 60 for fixing a first terminal 40 and a second terminal 50 is filled in the first through hole 11 and the second through hole 12, wherein, one end of the first terminal 40 is welded with a pressure chip 20, one end of the second terminal 50 is welded with a thermistor 30, thereby realizing the electrical connection between the pressure chip 20 and the thermistor 30 and the terminals, the other ends of the first terminal 40 and the second terminal 50 penetrate through the through holes in the rigid shell 10 to be connected with the circuit board of the sensor, thereby realizing the acquisition, calibration and processing of signals, when the pressure and temperature of the measured medium act on the sensor, the signal change caused by the pressure and temperature can be timely output through the output terminal of the sensor, the pressure and temperature sensing signals are led to one side of the signal processing unit from the signal sensing side, the signal processing unit can simultaneously measure the pressure parameter and the temperature parameter at the moment, so that the sensor can simultaneously measure the temperature parameter and the pressure parameter at the same position.

It should be noted that the above implementation process is only for illustrating the applicability of the present application, but this does not represent that the sensor core of the present application has only the above-mentioned one implementation flow, and on the contrary, the sensor core of the present application can be incorporated into the feasible embodiments of the present application as long as the sensor core of the present application can be implemented.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A sensor core, characterized by: including rigid shell, pressure chip and thermistor, first through-hole and second through-hole have been seted up in the rigid shell, wear to be equipped with first terminal in the first through-hole, wear to be equipped with the second terminal in the second through-hole, pressure chip flip-chip bonding in one of first terminal is served, thermistor flip-chip bonding in one of second terminal is served, all pack in first through-hole and the second through-hole has insulating medium, first terminal with the second terminal passes through insulating medium is fixed in on the rigid shell.

2. The sensor core of claim 1, wherein: solder joint protection layers for protecting solder joints are filled between the insulating medium and the pressure chip and between the insulating medium and the thermistor.

3. The sensor core of claim 1, wherein: the filling height of the insulating medium is lower than the height of the side walls of the first through hole and the second through hole.

4. The sensor core of claim 1, wherein: the first terminal and the second terminal are distributed on a straight line passing through the circle center of the rigid shell.

5. The sensor core of claim 1, wherein: the insulating medium is arranged as glass.

6. The sensor core of claim 1, wherein: the rigid shell is made of kovar alloy or stainless steel.

7. A sensor comprising a housing, a circuit board and a sensor core disposed within the housing, and an output terminal connected to the circuit board and extending outside the housing, wherein the sensor core is the sensor core of any one of claims 1-6, and wherein the first and second terminals of the sensor core are connected to the circuit board.