CN212721299U - Detection tool and detection system - Google Patents
Detection tool and detection system Download PDFInfo
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- CN212721299U CN212721299U CN202022053729.9U CN202022053729U CN212721299U CN 212721299 U CN212721299 U CN 212721299U CN 202022053729 U CN202022053729 U CN 202022053729U CN 212721299 U CN212721299 U CN 212721299U
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- groove
- baffle
- fixing frame
- frock
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Abstract
The utility model discloses a detect frock and detecting system, this detect frock are used for the semiconductor work piece to detect, it includes frock support and baffle to detect the frock, the baffle with frock support swing joint to enclose and close and form the standing groove, the standing groove is used for spacing work piece, the baffle is used for adjusting the size of standing groove, the diapire of standing groove is equipped with lets the position mouth. The utility model aims at providing a conveniently inspect detection frock on semiconductor work piece both sides surface, this detection frock has effectively improved the product yield, can realize adjusting simultaneously, has improved the commonality that detects the frock.
Description
Technical Field
The utility model relates to a semiconductor test equipment technical field, in particular to detect frock and applied this detecting system who detects frock.
Background
With diversification and complication of semiconductor products and high standards on product quality, processes in the semiconductor packaging industry need to monitor the product quality, check the external dimensions of the product, and the like. In the related technology, a product needs to be placed on a tool and then placed under a microscope to observe and measure the size of the product, and because the semiconductor product has two surfaces, one surface of the semiconductor product is provided with a surface mounted chip, and the other surface is not provided with the surface mounted chip, the tool designed in related technology can only inspect one surface of the semiconductor product, which is provided with the surface mounted chip, and the surface without the surface mounted chip can not be inspected, the quality risk of the product can not be monitored in time, so that the product is scrapped in batches or flows to a client side, and the satisfaction degree of a client; meanwhile, the tool cannot be adjusted, so that the universality is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a detect frock and detecting system, aim at providing the detection frock of a convenient inspection semiconductor work piece both sides surface, should detect the frock and effectively improved the product yield, can realize adjusting simultaneously, improved the commonality that detects the frock.
In order to achieve the purpose, the utility model provides a detect frock for the semiconductor work piece detects, it includes frock support and baffle to detect the frock, the baffle with frock support swing joint to enclose and close and form the standing groove, the standing groove is used for spacing work piece, the baffle is used for adjusting the size of standing groove, the diapire of standing groove is equipped with lets the position mouth.
In an embodiment, the frock support includes mount and a plurality of support bar, and is a plurality of the support bar is parallel arrangement, and follows the extending direction interval of mount is arranged, and is a plurality of the one end of support bar with the mount is connected, and is a plurality of the other end of support bar with baffle swing joint, so that mount, a plurality of the support bar reaches the baffle encloses to close and forms the standing groove, adjacent two form between the support bar let the position mouth, the baffle is used for adjusting the standing groove with let the size of position mouth.
In one embodiment, one end of each support bar, which is far away from the fixing frame, is provided with a plurality of spacing grooves arranged at intervals, and part of the baffle is detachably limited in the spacing grooves.
In an embodiment, the bottom wall of each limiting groove is provided with an adsorption piece, and the baffle is detachably connected with the support bars through the adsorption of the adsorption pieces.
In one embodiment, a mounting groove is formed in the bottom wall of each limiting groove, and the adsorption piece is accommodated and limited in the mounting groove;
and/or the baffle is made of metal, and the adsorption piece is a magnetic piece;
and/or a guide surface is arranged at the position, adjacent to the notch, of the groove wall of the limit groove;
and/or the notch of the limiting groove is in flaring arrangement.
In an embodiment, the tool support further comprises a top plate arranged at one end of the fixing frame, the top plate and the fixing frame are arranged at an included angle and arranged at intervals in parallel with the supporting bars, the yielding port is formed between the top plate and the supporting bars, and one end of the top plate, far away from the fixing frame, is abutted to one end of the baffle.
In an embodiment, a first groove is formed in one side, facing the baffle plate, of the fixing frame, and the first groove extends along the extension direction of the fixing frame and is arranged at intervals with the plurality of supporting bars;
and/or one side of the baffle facing the fixed frame is provided with a second groove which extends along the extension direction of the baffle;
and/or, one side of the top plate facing the supporting strip is provided with a third groove, and the third groove extends along the extension direction of the top plate.
In one embodiment, a first groove is formed in one side, facing the baffle plate, of the fixing frame, a second groove is formed in one side, facing the fixing frame, of the baffle plate, and a third groove is formed in one side, facing the supporting bar, of the top plate;
and two ends of the third groove are respectively communicated with the first groove and the second groove.
In one embodiment, the fixing frame, the plurality of supporting bars and the top plate are of an integrally formed structure;
and/or the top plate is vertically arranged with the fixed frame;
and/or each support bar is vertically arranged with the fixed frame;
and/or the baffle and the fixing frame are arranged in parallel.
The utility model also provides a detecting system, a serial communication port, including check out test set and the aforesaid detect the frock, check out test set is just right detect the standing groove notch setting of frock.
The detection tool adopts the movable connection mode of the baffle and the tool bracket, so that the baffle and the tool bracket are enclosed to form the placing groove, the placing groove is utilized to realize the limiting installation of the semiconductor workpiece, and the size of the placing groove is adjusted by adjusting the position of the baffle on the tool bracket, thus the universality of the detection tool can be improved, the purposes of one device and multiple purposes are achieved, and the management cost is reduced; simultaneously, let a mouthful through the diapire setting at the standing groove, so the notch of usable standing groove with let a mouthful cooperation realize the two sides to detect semiconductor workpiece, realize in time monitoring product quality, reduce the product and scrap. The utility model discloses a detection frock has not only solved the validity of semiconductor package trade product quality inspection, has still avoided frequent change frock.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of a semiconductor workpiece assembled on a detection tool according to an embodiment of the present invention;
fig. 2 is an exploded view of a detection tool and a semiconductor workpiece according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of an embodiment of the present invention illustrating a semiconductor workpiece assembled in a detection tool;
fig. 4 is a schematic structural view of a tool holder according to an embodiment of the present invention.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
Also, the meaning of "and/or" and/or "appearing throughout is meant to encompass three scenarios, exemplified by" A and/or B "including scenario A, or scenario B, or scenarios where both A and B are satisfied.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
With diversification and complication of semiconductor products and high standards on product quality, processes in the semiconductor packaging industry need to monitor the product quality, check the external dimensions of the product, and the like. In the related technology, a product needs to be placed on a tool and then placed under a microscope to observe and measure the size of the product, and because the semiconductor product has two surfaces, one surface of the semiconductor product is provided with a surface mounted chip, and the other surface is not provided with the surface mounted chip, the tool designed in related technology can only inspect one surface of the semiconductor product, which is provided with the surface mounted chip, and the surface without the surface mounted chip can not be inspected, the quality risk of the product can not be monitored in time, so that the product is scrapped in batches or flows to a client side, and the satisfaction degree of a client; meanwhile, the tool cannot be adjusted, so that the universality is poor.
Based on the above conception and problem, the utility model provides a detect frock 100. As can be appreciated, inspection tool 100 is used for inspection of semiconductor workpiece 5. In the present embodiment, the semiconductor workpiece 5 may be a semiconductor product, a semi-finished product, or the like, and as shown in fig. 1, 2, and 3, the semiconductor workpiece 5 includes a substrate 51 and a chip 52 provided on the substrate 51.
Please refer to fig. 1 to 4 in combination, in an embodiment of the present invention, the detecting tool 100 includes a tool support 1 and a baffle 2, the baffle 2 is movably connected to the tool support 1 and encloses and closes to form a placing groove 3, the placing groove 3 is used for limiting a semiconductor workpiece 5, the baffle 2 is used for adjusting the size of the placing groove 3, and a yielding port 4 is disposed on a bottom wall of the placing groove 3.
It is understood that the tooling support 1 is used for mounting and carrying the baffle 2 and the semiconductor workpiece 5, and the structure of the tooling support 1 may be a structure capable of mounting a frame, a mounting table, a carrier frame or a mounting plane, and is not limited herein.
In this embodiment, baffle 2 encloses with frock support 1 and closes and form standing groove 3, this standing groove 3 is used for spacing semiconductor workpiece 5, chip 52 one side of semiconductor workpiece 5 at this moment places towards standing groove 3, one side of base plate 51 back to chip 52 is towards the diapire of standing groove 3, also be the same with the mouth 4 of stepping down, it is so to utilize check out test set to detect semiconductor workpiece 5 on the frock 100, it is earlier to detect one side that semiconductor workpiece 5 set up chip 52 from the notch direction of standing groove 3, then detect the base plate 51 that semiconductor workpiece 5 did not set up chip 52 one side through letting the mouth 4, thereby effectively improve the yield of semiconductor workpiece 5, realize in time monitoring product quality simultaneously, it is scrapped to reduce the product.
In this embodiment, the baffle 2 and the tool holder 1 are movably connected, that is, the baffle 2 and the tool holder 1 may be slidably connected, detachably connected, or fixedly connected with an adjustable position, and the like, and any mode may be used as long as the mode can realize the movable connection between the baffle 2 and the tool holder 1, which is not limited herein. It can be understood that, with baffle 2 and 1 swing joint of frock support, through adjusting the position of baffle 2 on frock support 1 to realize standing groove 3's size, so make standing groove 3 can be suitable for or place the semiconductor work piece 5 of different size dimensions, thereby improve the commonality that detects frock 100, reach one and adorn multi-purpose, reduce administrative cost.
The utility model discloses a detection frock 100 is through adopting the swing joint mode with baffle 2 and frock support 1 for baffle 2 and frock support 1 enclose to close and form standing groove 3, utilize standing groove 3 to realize spacing installation to semiconductor workpiece 5, thereby through adjusting the position of baffle 2 at frock support 1, realize adjusting the size of standing groove 3, so can improve the commonality of detection frock 100, reach one and adorn multi-purpose, reduce administrative cost; simultaneously, let a mouthful 4 through the diapire setting at standing groove 3, so usable standing groove 3's notch with let a mouthful 4 cooperation realize the two sides to detect semiconductor workpiece 5, realize in time monitoring product quality, reduce the product and scrap. The utility model discloses a detection frock 100 has not only solved the validity of semiconductor package trade product quality inspection, has still avoided frequent change frock.
As can be understood, the detection tool 100 effectively solves the problem that the product cannot be inspected, monitors the product quality in time and reduces the product scrap by arranging the relief opening 4 on the bottom wall of the placing groove 3, that is, arranging the bottom wall of the placing groove 3 as a hollow structure; meanwhile, aiming at the current situations of various types of products with different sizes, the detection tool 100 is made into two adjustable parts, one part is the baffle 2, the other part is the tool support 1, the range of the tool support 1 is set for different sizes, and the aims of one-assembling multi-purpose and management cost reduction are achieved by adjusting the position of the fixed baffle 2.
In an embodiment, as shown in fig. 1 to 4, the tool holder 1 includes a fixing frame 11 and a plurality of supporting bars 12, the supporting bars 12 are arranged in parallel and arranged at intervals along an extending direction of the fixing frame 11, one end of each supporting bar 12 is connected to the fixing frame 11, the other end of each supporting bar 12 is movably connected to the baffle 2, so that the fixing frame 11, the supporting bars 12 and the baffle 2 enclose the placing groove 3, the concealer opening 4 is formed between two adjacent supporting bars 12, and the baffle 2 is used for adjusting the size of the placing groove 3 and the concealer opening 4.
In this embodiment, the fixing frame 11 and the plurality of supporting bars 12 may be fixedly connected, for example, welded, interference-assembled or integrally formed, so as to improve the structural strength of the tool holder 1 and simplify the processing steps of the tool holder 1. Of course, the fixing frame 11 and the plurality of supporting bars 12 may also be detachably connected, for example, by using a snap connection, an insertion fit, a screw connection, a pin connection, or a threaded connection, and the like, as long as the fixing frame 11 and the plurality of supporting bars 12 can be detachably connected, which is not limited herein. It can be understood that the detachable connection mode is adopted, which is beneficial to the disassembly, assembly, replacement or maintenance of the detection tool 100.
It will be appreciated that the fixing frame 11 is located opposite the baffle 2 and at both ends of each support bar 12. A plurality of the support bars 12 are arranged in parallel and are arranged along the extension direction of the fixing frame 11 at intervals, so that the fixing frame 11, a plurality of the support bars 12 and the baffle plate 2 enclose and form the placing groove 3, thereby the fixing frame 11, the plurality of the support bars 12 and the baffle plate 2 are conveniently utilized to realize the installation limit of the semiconductor workpiece 5.
In this embodiment, the let position opening 4 is formed between two adjacent support bars 12, so that the area of the let position opening 4 can be effectively increased, the comprehensive detection of the side of the semiconductor workpiece 5, which faces away from the chip 52, is realized, the product yield is further improved, and the structure of the detection tool 100 is simplified.
In an embodiment, as shown in fig. 1 to 4, one end of each supporting bar 12 away from the fixing frame 11 is provided with a plurality of spacing grooves 121, and a part of the baffle 2 is detachably retained in the spacing grooves 121.
In this embodiment, a plurality of limiting grooves 121 are disposed at one end of the supporting bar 12 away from the fixing frame 11, and a plurality of limiting grooves 121 of two adjacent supporting bars 12 are disposed in a one-to-one correspondence manner, that is, a plurality of limiting grooves 121 of a plurality of supporting bars 12 are disposed in a one-to-one correspondence manner in the extending direction of the fixing frame 11, so that the portions of the baffle 2 are respectively detachably limited in one limiting groove 121 of a plurality of supporting bars 12.
It can be understood that the baffle 2 and the limiting groove 121 of the supporting bar 12 are detachably connected by adopting a plug fit. Through pegging graft baffle 2 in the different spacing grooves 121 of support bar 12, realize adjusting baffle 2 in the position of support bar 12 to realize adjusting standing groove 3 and the size of letting a mouthful 4, with the semiconductor work piece 5 that is applicable to different sizes, thereby improve the commonality that detects frock 100, reach one and adorn multi-purpose.
In an embodiment, as shown in fig. 2, 3 and 4, an adsorption member 122 is disposed on a bottom wall of each of the limiting grooves 121, and the baffle 2 is detachably connected to the supporting bars 12 by the adsorption of the adsorption member 122.
In this embodiment, by disposing the adsorbing member 122 in the limiting groove 121, the baffle 2 can be detachably connected by using the adsorbing member 122. Alternatively, the absorption member 122 may be disposed on a bottom wall or a side wall of the limiting groove 121.
It can be understood that the absorption member 122 can be fixed in the limiting groove 121, for example, by welding, interference fit, or integral molding, so as to improve the installation stability of the absorption member 122. Of course, in other embodiments, the absorption member 122 is detachably disposed in the limiting groove 121, for example, by using a snap connection, a plug-fit connection, a screw connection, a pin connection, or a threaded connection, which is not limited herein. The arrangement facilitates the detachment and replacement of the adsorbing member 122, thereby improving the convenience of use. Alternatively, the spacing groove 121 may be a groove or a through groove structure.
In an embodiment, as shown in fig. 2, 3 and 4, a mounting groove 123 is formed in a bottom wall of each of the limiting grooves 121, and the absorbing member 122 is received and limited in the mounting groove 123. It can be understood that, by arranging the installation groove 123, the installation of the suction piece 122 is further limited by the installation groove 123, and the installation stability is improved.
In an embodiment, the material of the baffle 2 may be a metal material, and the adsorbing member 122 may be a magnetic member, such as a magnet, and the like, which is not limited herein.
In one embodiment, as shown in fig. 1 to 4, a guiding surface 124 is disposed on a groove wall of the limiting groove 121 adjacent to the notch; so set up to when baffle 2 installs in spacing groove 121, slide into spacing groove 121 through the spigot surface 124 of notch department, improve assembly efficiency and speed. It will be appreciated that the guide surface 124 is provided as a ramp or arc surface, the guide surface 124 being inclined towards the bottom wall of the retention slot 121. Optionally, the notch of the limiting groove 121 is flared.
In an embodiment, as shown in fig. 1 to 4, the tool holder 1 further includes a top plate 13 disposed at one end of the fixing frame 11, the top plate 13 is disposed at an included angle with the fixing frame 11, and is disposed at an interval and in parallel with the supporting strip 12, the let position opening 4 is formed between the top plate 13 and the supporting strip 12, and one end of the top plate 13, which is far away from the fixing frame 11, is abutted to one end of the baffle 2.
In this embodiment, through set up roof 13 in the one end of mount 11, make the one end of mount 11 and baffle 2 all be connected with roof 13 or butt, thereby make mount 11, roof 13 and the cooperation of baffle 2 form U type frame, make a plurality of support bars 12 lay in this U type frame, form standing groove 3 with enclosing, and keep away from the one end of roof 13 at mount 11 and form the entry of intercommunication standing groove 3, so can make things convenient for semiconductor workpiece 5 to put into standing groove 3 from the entry, make the periphery of semiconductor workpiece 5 spacing with mount 11, roof 13 and baffle 2 butt respectively, thereby realize spacing assembly to semiconductor workpiece 5.
It is understood that the length of the fixing frame 11 in the extending direction is equivalent to the length of the baffle 2 in the extending direction. The thickness of the fixing frame 11 in the depth direction of the placing groove 3 is equal to that of the baffle plate 2 in the depth direction of the placing groove 3, so that the semiconductor workpiece 5 can be conveniently taken and placed. Alternatively, the structure, shape and contour of the fixing frame 11 are the same as those of the baffle 2.
In an embodiment, as shown in fig. 1 to 4, a first groove 111 is formed on a side of the fixing frame 11 facing the baffle 2, and the first groove 111 extends along an extension direction of the fixing frame 11 and is spaced apart from the plurality of supporting bars 12.
In the present embodiment, the first groove 111 is disposed on the fixing frame 11, so that the first groove 111 can be utilized to realize the limit mounting on the side of the substrate 51 of the semiconductor workpiece 5, thereby further improving the mounting stability of the semiconductor workpiece 5.
In an embodiment, as shown in fig. 1 to 3, a second groove 21 is provided on a side of the baffle plate 2 facing the fixing frame 11, and the second groove 21 extends along an extension direction of the baffle plate 2. It can be understood that the arrangement is such that the second groove 21 is conveniently utilized to realize the limit installation on the side edge of the substrate 51 of the semiconductor workpiece 5, thereby further improving the installation stability of the semiconductor workpiece 5.
In an embodiment, as shown in fig. 1 to 3, a third groove 131 is formed on a side of the top plate 13 facing the supporting bar 12, and the third groove 131 extends along an extension direction of the top plate 13. It can be understood that the third groove 131 is arranged to facilitate the limit installation of the side edge of the substrate 51 of the semiconductor workpiece 5, so as to further improve the installation stability of the semiconductor workpiece 5.
In an embodiment, as shown in fig. 1 to 3, a first groove 111 is formed on a side of the fixing frame 11 facing the baffle plate 2, a second groove 21 is formed on a side of the baffle plate 2 facing the fixing frame 11, and a third groove 131 is formed on a side of the top plate 13 facing the supporting bar 12; both ends of the third groove 131 communicate with the first groove 111 and the second groove 21, respectively.
It can be understood that two ends of the third groove 131 are respectively communicated with the first groove 111 and the second groove 21, that is, the first groove 111 and the second groove 21 are oppositely and oppositely disposed, so that the first groove 111 and the second groove 21 can be used to respectively limit two opposite sides of the substrate 51. The two ends of the third groove 131 are respectively communicated with the first groove 111 and the second groove 21, so that the substrate 51 of the semiconductor workpiece 5 slides into the first groove 111 and the second groove 21 from the inlet of the detection tool 100, slides towards the third groove 131, and slides into the third groove 131, the top edge of the substrate 51 is limited in the third groove 131, and the limited installation of the semiconductor workpiece 5 is realized.
In the present embodiment, the bottom side wall of the first groove 111 is flush with the supporting bar 12, and may also be higher than the supporting bar 12, which is not limited herein.
In one embodiment, as shown in fig. 4, the fixing frame 11, the plurality of supporting bars 12 and the top plate 13 are an integral structure. It can be understood that the fixing frame 11, the plurality of supporting bars 12 and the top plate 13 are integrally formed to be an integrally formed structure, so that the structural strength of the tool support 1 is improved, and the processing steps of the tool support 1 are simplified.
Optionally, the top plate 13 is vertically disposed with the fixing frame 11; each supporting strip 12 is perpendicular to the fixing frame 11; the baffle 2 and the fixing frame 11 are arranged in parallel.
The detection tool 100 of the utility model can adjust the position of the baffle 2 according to the size of the substrate 51 of the semiconductor workpiece 5, thereby playing the role of a flexible tool, having multiple purposes, improving the universality of the detection tool 100 and reducing the management cost; after the semiconductor workpiece 5 is assembled, the front side and the back side of the semiconductor workpiece 5 can be inspected, so that the product quality can be monitored in time, the product scrapping is reduced, the effectiveness of product quality inspection in the semiconductor packaging industry is solved, and the frequent replacement of tools is avoided.
The utility model also provides a detecting system, this detecting system include check out test set and the aforesaid detect frock 100, check out test set is just right detect the 3 notch settings of standing groove of frock 100. The specific structure of the detection tool 100 refers to the foregoing embodiments, and since the detection system adopts all the technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
The above is only the optional embodiment of the present invention, and not therefore the limit to the patent scope of the present invention, all the concepts of the present invention utilize the equivalent structure transformation of the content of the specification and the attached drawings, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a detect frock for semiconductor workpiece detects, its characterized in that, it includes frock support and baffle to detect the frock, the baffle with frock support swing joint to enclose and close and form the standing groove, the standing groove is used for spacing semiconductor workpiece, the baffle is used for adjusting the size of standing groove, the diapire of standing groove is equipped with lets the position mouth.
2. The detection tool according to claim 1, wherein the tool support comprises a fixing frame and a plurality of supporting bars, the supporting bars are arranged in parallel and are arranged at intervals along the extension direction of the fixing frame, one ends of the supporting bars are connected with the fixing frame, the other ends of the supporting bars are movably connected with the baffle plate, so that the fixing frame, the supporting bars and the baffle plate are enclosed to form the placing groove, the yielding opening is formed between every two adjacent supporting bars, and the baffle plate is used for adjusting the size of the placing groove and the yielding opening.
3. The detection tool according to claim 2, wherein a plurality of spacing grooves are formed in one end, away from the fixing frame, of each supporting bar, and part of the baffle is detachably limited in the spacing grooves.
4. The detection tool according to claim 3, wherein an adsorption piece is arranged on the bottom wall of each limiting groove, and the baffle is detachably connected with the supporting bars through adsorption of the adsorption piece.
5. The detection tool according to claim 4, wherein a mounting groove is formed in the bottom wall of each limiting groove, and the adsorption piece is accommodated and limited in the mounting groove;
and/or the baffle is made of metal, and the adsorption piece is a magnetic piece;
and/or a guide surface is arranged at the position, adjacent to the notch, of the groove wall of the limit groove;
and/or the notch of the limiting groove is in flaring arrangement.
6. The detection tool according to any one of claims 2 to 5, wherein the tool support further comprises a top plate disposed at one end of the fixing frame, the top plate is disposed at an included angle with the fixing frame and is spaced from and parallel to the supporting bars, the relief opening is formed between the top plate and the supporting bars, and one end of the top plate, which is far away from the fixing frame, abuts against one end of the baffle plate.
7. The detection tool according to claim 6, wherein a first groove is formed in one side of the fixing frame facing the baffle, extends along the extension direction of the fixing frame, and is spaced from the plurality of support bars;
and/or one side of the baffle facing the fixed frame is provided with a second groove which extends along the extension direction of the baffle;
and/or, one side of the top plate facing the supporting strip is provided with a third groove, and the third groove extends along the extension direction of the top plate.
8. The detection tool according to claim 7, wherein a first groove is formed in one side, facing the baffle, of the fixing frame, a second groove is formed in one side, facing the fixing frame, of the baffle, and a third groove is formed in one side, facing the supporting bar, of the top plate;
and two ends of the third groove are respectively communicated with the first groove and the second groove.
9. The detection tool of claim 6, wherein the fixing frame, the plurality of supporting bars and the top plate are of an integrally formed structure;
and/or the top plate is vertically arranged with the fixed frame;
and/or each support bar is vertically arranged with the fixed frame;
and/or the baffle and the fixing frame are arranged in parallel.
10. The detection system is characterized by comprising detection equipment and the detection tool according to any one of claims 1 to 9, wherein the detection equipment is arranged right opposite to a placing groove notch of the detection tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022053729.9U CN212721299U (en) | 2020-09-17 | 2020-09-17 | Detection tool and detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022053729.9U CN212721299U (en) | 2020-09-17 | 2020-09-17 | Detection tool and detection system |
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| CN212721299U true CN212721299U (en) | 2021-03-16 |
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| CN202022053729.9U Active CN212721299U (en) | 2020-09-17 | 2020-09-17 | Detection tool and detection system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115025911A (en) * | 2022-07-14 | 2022-09-09 | 东莞市中麒光电技术有限公司 | Production tool and inking and spraying method for display module |
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2020
- 2020-09-17 CN CN202022053729.9U patent/CN212721299U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115025911A (en) * | 2022-07-14 | 2022-09-09 | 东莞市中麒光电技术有限公司 | Production tool and inking and spraying method for display module |
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