CN212710199U

CN212710199U - Transfer mechanism of semiconductor packaging product

Info

Publication number: CN212710199U
Application number: CN202020572348.9U
Authority: CN
Inventors: 马继光; 刘鹏
Original assignee: Nantong Smile Precision Equipment Co ltd
Current assignee: Nantong Smile Precision Equipment Co ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2021-03-16
Anticipated expiration: 2030-04-17

Abstract

The utility model discloses a transfer mechanism of semiconductor package product, including hand lead screw, side shield and bottom plate, the side shield sets up with the bottom plate is perpendicular, hand lead screw is fixed on bottom plate and side shield, be equipped with a plurality of magazines and a plurality of location strip on the side shield, magazine and location strip symmetry respectively set up the both sides at hand lead screw, hand lead screw end connection has first linear guide, still including setting up the mounting on first linear guide, be equipped with a plurality of trompils on the location strip, first linear guide passes through the mounting to be fixed in the trompil with the portable setting of location strip, first linear guide both ends are equipped with longitudinal rail respectively, be equipped with transverse guide between the other end of both sides longitudinal rail, the last slip of transverse guide and second linear guide is provided with the clamping jaw. The utility model provides a shift the insecurity that the product leaned on the manual transfer of operative employee after semiconductor seal equipment paster was accomplished, reduced the probability of pressing from both sides damage the product when getting the product, simple structure, simple to operate, long service life.

Description

Transfer mechanism of semiconductor packaging product

Technical Field

The utility model relates to a semiconductor processing field specifically is a transfer mechanism of semiconductor package product.

Background

With the rapid development of the semiconductor packaging industry, the demand of semiconductors is increasing. At present, after the semiconductor product is pasted and mounted, an operator takes out a product from a material box by hands, puts the product into other material boxes and transfers the product to other processes, but the technology has the defect that the risk of falling or product bruising and the like is easy to occur in the process that the operator takes out the product from the material box by hands and puts the product into other material boxes.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a transfer mechanism of semiconductor package product has solved the insecurity that semiconductor encapsulation equipment paster accomplished the back and shifts the product and lean on the manual transfer of operative employee, has reduced the probability of pressing from both sides damage the product when getting the product, and simple structure, simple to operate, long service life.

In order to achieve the purpose of the invention, the utility model adopts the following technical scheme: a transfer mechanism of a semiconductor packaging product comprises a hand-operated screw rod, a side baffle plate and a bottom plate, wherein the side baffle plate is vertically arranged with the bottom plate, the hand-operated screw rod is fixed on the bottom plate and the side baffle, the side baffle is provided with a material box and a positioning strip, the plurality of material boxes and the plurality of positioning strips are respectively and symmetrically arranged at the two sides of the hand-operated screw rod, the end part of the hand-operated screw rod is connected with a first linear guide rail, and the hand-operated screw rod also comprises a fixing piece which is arranged on the first linear guide rail, the positioning strip is provided with a plurality of holes, the first linear guide rail is fixed in the holes through fixing pieces and can be movably arranged with the positioning strip, longitudinal guide rails are respectively arranged at two ends of the first linear guide rail, a transverse guide rail is arranged between the other ends of the longitudinal guide rails at two sides, and a second linear guide rail is fixed on the transverse guide rail, and clamping jaws are arranged on the transverse guide rail and the second linear guide rail in a sliding manner.

Preferably, the side baffle is provided with a fixing clamp, and the fixing clamp is correspondingly arranged below the material box.

Preferably, the magazine is provided with a plurality of product windows, the distance between the product windows being the same as the distance between the apertures.

Preferably, a second connector is arranged at one end of the longitudinal guide rail, the longitudinal guide rail is fixed with the first linear guide rail through the second connector, a first connector is arranged at the other end of the longitudinal guide rail, and the longitudinal guide rail is fixed with the transverse guide rail through the first connector.

Preferably, the clamping jaw is provided with a bushing, and the bushing is an oil-free bushing.

Preferably, the fixing part adopts a heavy-duty ball plunger.

Compared with the prior art, the transfer mechanism of the semiconductor packaging product adopting the technical scheme has the following beneficial effects: adopt the utility model discloses a transfer mechanism of semiconductor package product sets up the magazine on the side shield, guarantees the steady that the magazine was placed to set up between the magazine of both sides and press from both sides the clamping jaw of getting the product, press from both sides the lead frame edge of getting the position at the product, can not touch the product, with the fish tail of avoiding the product, the clamping jaw is fixed on two straight line tracks that the level was placed, guarantees the stationarity in the transportation.

Drawings

Fig. 1 is a front view of a transfer mechanism for semiconductor packages according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a transfer mechanism of the semiconductor package product in this embodiment.

Reference numerals: 1. a side dam; 2. a hand-operated screw rod; 3. a base plate; 4. a positioning bar; 6. a magazine; 8. fixing the clamp; 9. a first linear track; 10. a second linear track; 11. a clamping jaw; 12. a first connector; 13. a transverse guide rail; 14. a second connector; 15. a longitudinal guide rail; 16. a fixing member; 17. a bushing.

Detailed Description

The present invention will be further described with reference to the accompanying drawings.

Fig. 1 is a front view of a structure of an embodiment of a transfer mechanism for semiconductor package products, which includes a hand screw rod 2, a side baffle 1 and a bottom plate 3, wherein the side baffle 1 is perpendicular to the bottom plate 3, and the hand screw rod 2 is fixed on the bottom plate 3 and the side baffle 1. Be equipped with magazine 6 and location strip 4 on the side shield 1, magazine 6 and location strip 4 are equipped with a plurality ofly, and a plurality of magazines 6 and location strip 4 symmetry respectively set up in the both sides of hand lead screw 2, in this embodiment, correspond respectively in the both sides of hand lead screw 2 and set up a magazine 6 and a location strip 4. Be equipped with mounting fixture 8 on side shield 1, mounting fixture 8 corresponds the setting in magazine 6 below for magazine 6 is placed steadily, and can be according to magazine 6's width regulation self width. The magazine 6 is provided with a plurality of product windows, the distance between the product windows being the same as the distance between the apertures.

As shown in fig. 2, which is a schematic structural diagram of a transfer mechanism of a semiconductor package product, an end of the hand screw rod 2 is connected with a first linear guide rail, and further includes a fixing member 16, the fixing member 16 is disposed on the first linear guide rail, the positioning strip 4 is provided with a plurality of holes, the first linear guide rail is fixed in the holes through the fixing member 16 and movably disposed with the positioning strip 4, two ends of the first linear guide rail are respectively provided with a longitudinal guide rail 15, a transverse guide rail 13 is disposed between the other ends of the longitudinal guide rails 15 at two sides, the transverse guide rail 13 is fixed with a second linear guide rail, and the transverse guide rail 13 and the second linear guide rail are slidably.

One end of the longitudinal guide rail 15 is provided with a second connector 14, the longitudinal guide rail 15 is fixed with the first linear guide rail through the second connector 14, the other end of the longitudinal guide rail 15 is provided with a first connector 12, and the longitudinal guide rail 15 is fixed with the transverse guide rail 13 through the first connector 12. Be equipped with bush 17 on the clamping jaw 11, in this embodiment, bush 17 adopts oil-free bush 17, guarantees clamping jaw 11 steady reliable when lateral motion, prevents to damage the product. The mount 16 is a heavy duty ball plunger.

In this embodiment, the clamping jaw 11 takes a product from one of the material boxes 6 and puts the product into the other material box 6, and in order to prevent the product from colliding, the position of the clamping jaw 11 is adjusted by using the high-precision hand screw rod 2 of 0.01mm, so that the clamping jaw 11 clamps the product to the material box 6 product placing window corresponding to the other side from the material box 6 product placing window on one side. When using, wave hand lead screw 2 and make first linear rail 9 remove from top to bottom, adjust the levelness of first linear rail 9 and both sides magazine 6 to steady transportation product to the mouth. After the use position is adjusted, the fixing piece 16 is clamped into the opening of the positioning strip 4 for positioning, and the distance between the second linear guide rail and the first linear guide rail is adjusted through the first connector 12 to adapt to different material boxes 6. The clamping jaws 11 move transversely, and the product is clamped from the magazine 6 on one side and is placed into the idle magazine 6.

The above is the preferred embodiment of the present invention, and a person skilled in the art can make several modifications and improvements without departing from the principle of the present invention, and these should also be regarded as the protection scope of the present invention.

Claims

1. A transfer mechanism of a semiconductor package product, characterized in that: including hand lead screw, side shield and bottom plate, the side shield sets up with the bottom plate is perpendicular, hand lead screw is fixed on bottom plate and side shield, be equipped with magazine and location strip on the side shield, magazine and location strip are equipped with a plurality ofly, and a plurality of magazines and location strip symmetry respectively set up the both sides at hand lead screw, hand lead screw end connection has first linear guide, still includes the mounting, the mounting sets up on first linear guide, be equipped with a plurality of trompils on the location strip, first linear guide passes through the mounting to be fixed in the trompil with the portable setting of location strip, first linear guide both ends are equipped with longitudinal rail respectively, are equipped with transverse guide between the other end of both sides longitudinal guide, be fixed with second linear guide on the transverse guide, the last slip of transverse guide and second linear guide is provided with the clamping jaw.

2. The transfer mechanism of semiconductor packaged products as recited in claim 1, wherein: and the side baffle is provided with a fixing clamp which is correspondingly arranged below the material box.

3. The transfer mechanism of semiconductor packaged products as recited in claim 1, wherein: the magazine is provided with a plurality of product windows, and the distance between the product windows is the same as the distance between the openings.

4. The transfer mechanism of semiconductor packaged products as recited in claim 1, wherein: the longitudinal rail one end is equipped with the second connector, the longitudinal rail passes through the second connector and fixes mutually with first linear guide, the longitudinal rail other end is equipped with first connector, the longitudinal rail passes through first connector and fixes mutually with transverse guide.

5. The transfer mechanism of semiconductor packaged products as recited in claim 1, wherein: be equipped with the bush on the clamping jaw, the bush adopts oil-free bush.

6. The transfer mechanism of semiconductor packaged products as recited in claim 1, wherein: the fixing piece adopts a heavy-duty ball plunger.