CN212696036U - Shockproof mobile phone motherboard - Google Patents
Shockproof mobile phone motherboard Download PDFInfo
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- CN212696036U CN212696036U CN202022156049.XU CN202022156049U CN212696036U CN 212696036 U CN212696036 U CN 212696036U CN 202022156049 U CN202022156049 U CN 202022156049U CN 212696036 U CN212696036 U CN 212696036U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 230000001413 cellular effect Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 9
- 239000006096 absorbing agent Substances 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000003139 buffering effect Effects 0.000 description 3
- 210000001503 joint Anatomy 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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Abstract
The utility model discloses a type of taking precautions against earthquakes mobile phone motherboard, including cell-phone casing and mainboard body, the both ends of mainboard body are provided with fixed frame, and one side outer wall of fixed frame is provided with the sleeve, telescopic one side inner wall is provided with the second spring, the equal fixedly connected with telescopic link of four corners of cell-phone casing one side inner wall, and the one end of telescopic link and the one end fixed connection of second spring, the inside of cell-phone casing is provided with heat dissipation mechanism, heat dissipation mechanism includes absorber plate and heat dissipation wing, the absorber plate sets up between mainboard body and cell-phone casing. The utility model discloses well rubber pad can play the guard action to the mainboard body, and the sleeve that is located on fixed frame can overlap on the telescopic link on the cell-phone casing, and through second spring coupling between sleeve and the telescopic link, drops and when producing vibrations when the cell-phone, and the second spring is compressed and can play certain cushioning effect, avoids the mainboard to be shaken badly.
Description
Technical Field
The utility model relates to a mobile phone motherboard technical field especially relates to a type mobile phone motherboard takes precautions against earthquakes.
Background
With the rapid development of information technology, personal communication equipment such as mobile phones and the like is more and more widely applied, the internal structure of a mobile phone mainboard is different according to the types of the mobile phones, necessary accessories are receivers, loudspeakers, microphones, screen keyboard mainboards and chips, the integration level of the previous mobile phones is not very high, a plurality of single elements are welded on the mainboard, a plurality of parts of the existing mobile phones are concentrated on each chip, and a circuit on the mainboard can be divided into four plates: the device comprises a radio frequency part, a logic part, a power supply part and an interface part.
At present, the existing mobile phone motherboard still has certain disadvantages, when the mobile phone falls to the ground, the motherboard in the mobile phone has a poor shockproof effect, and is easily damaged due to the vibration of the mobile phone, so that the mobile phone cannot be used, and therefore, it is urgently needed to design a shockproof mobile phone motherboard to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a shockproof mobile phone mainboard.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a type mobile phone motherboard takes precautions against earthquakes, includes cell-phone casing and mainboard body, the both ends of mainboard body are provided with fixed frame, and one side outer wall of fixed frame is provided with the sleeve, telescopic one side inner wall is provided with the second spring, the equal fixedly connected with telescopic link of four corners of cell-phone casing one side inner wall, and the one end of telescopic link and the one end fixed connection of second spring, the inside of cell-phone casing is provided with heat dissipation mechanism.
As a further aspect of the present invention: the heat dissipation mechanism comprises a heat absorption plate and heat dissipation fins, the heat absorption plate is arranged between the mainboard body and the mobile phone shell, and the heat dissipation fins are fixedly arranged on the outer walls of the two sides of the heat absorption plate.
As a further aspect of the present invention: the outer wall of one side of absorber plate is provided with the first spring that the equidistance distributes, and the one end of first spring and the inner wall fixed connection of one side of cell-phone casing.
As a further aspect of the present invention: and a rubber strip is arranged on the outer wall of one side of the fixing frame.
As a further aspect of the present invention: the inner wall of the fixing frame is provided with a rubber pad, and the rubber pad is clamped between the fixing frame and the main board body.
As a further aspect of the present invention: one side outer wall of cell-phone casing is opened there is square groove, and the inner wall in square groove is provided with square frame, and square frame's inside is provided with the rubber circle.
The utility model has the advantages that:
1. through the arranged fixing frame, the sleeve, the second spring, the telescopic rod, the rubber strip and the rubber pad, the mainboard body can be fixed in the rubber pad in the fixing frame, the rubber pad can play a role in protecting the mainboard body, the sleeve on the fixing frame can be sleeved on the telescopic rod on the mobile phone shell, and the sleeve and the telescopic rod are connected through the second spring;
2. through the arranged heat absorbing plate, the heat dissipation fins and the first spring, the first spring positioned between the heat absorbing plate and the mobile phone shell can enable the heat absorbing plate to always abut against the main board body, so that heat on the main board can be absorbed and dissipated through the heat dissipation fins on the heat absorbing plate, an effective heat dissipation effect can be achieved, the service life of the main board is further prolonged, and the use effect is better;
3. through square groove, square frame and the rubber circle that sets up, when the butt joint seals between the cell-phone casing, the rubber circle that is located square frame can be extruded and produce deformation, can play certain sealed effect for the cell-phone possesses certain water-proof effects, and the result of use is better.
Drawings
Fig. 1 is a schematic front view of a shockproof mobile phone motherboard according to embodiment 1;
fig. 2 is a schematic side view of a shockproof mobile phone motherboard according to embodiment 1;
fig. 3 is a schematic view of a fixing frame structure of a shockproof mobile phone motherboard according to embodiment 1;
fig. 4 is a schematic overall structure diagram of a shockproof mobile phone motherboard according to embodiment 2;
fig. 5 is an enlarged schematic view of a portion a in fig. 4.
In the figure: 1 cell-phone casing, 2 mainboard bodies, 3 fixed frames, 4 rubber strips, 5 absorber plates, 6 heat dissipation wings, 7 first springs, 8 rubber pads, 9 sleeves, 10 second springs, 11 telescopic links, 12 square grooves, 13 square frames, 14 rubber rings.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1-3, a type of taking precautions against earthquakes mobile phone motherboard, including cell-phone casing 1 and mainboard body 2, the both ends of mainboard body 2 are provided with fixed frame 3, and one side outer wall of fixed frame 3 is provided with sleeve 9, and one side inner wall of sleeve 9 is provided with second spring 10, the equal fixedly connected with telescopic link 11 in four corners of cell-phone casing 1 one side inner wall, and the one end of telescopic link 11 and the one end fixed connection of second spring 10, the inside of cell-phone casing 1 is provided with heat dissipation mechanism.
The heat dissipation mechanism comprises a heat absorption plate 5 and heat dissipation fins 6, the heat absorption plate 5 is arranged between the mainboard body 2 and the mobile phone shell 1, and the heat dissipation fins 6 are fixedly arranged on the outer walls of the two sides of the heat absorption plate 5.
The outer wall of one side of absorber plate 5 is provided with the first spring 7 that the equidistance distributes, and the one end of first spring 7 and one side inner wall fixed connection of cell-phone casing 1 for absorber plate 5 can remain throughout and mainboard body 2 contact.
The outer wall of one side of the fixed frame 3 is provided with the rubber strip 4, so that the fixed frame 3 is prevented from contacting with the inner wall of the mobile phone when the mobile phone drops, and the buffering effect is further achieved.
The inner wall of the fixed frame 3 is provided with a rubber pad 8, and the rubber pad 8 is clamped between the fixed frame 3 and the mainboard body 2, and the rubber pad 8 can play a role in protecting the mainboard body 2.
The working principle is as follows: when in use, the mainboard body 2 can be fixed in the rubber pad 8 in the fixed frame 3, the rubber pad 8 can play a role in protecting the mainboard body 2, the sleeve 9 positioned on the fixed frame 3 can be sleeved on the telescopic rod 11 on the mobile phone shell 1, and the sleeve 9 and the telescopic rod 11 are connected through the second spring 10, when the mobile phone drops to generate vibration, the second spring 10 is compressed to play a certain role in buffering, so as to prevent the mainboard from being damaged by vibration, and the rubber strip 4 positioned on the fixed frame 3 can prevent the fixed frame 3 from contacting with the inner wall of the mobile phone when the mobile phone drops, so as to further play a role in buffering, the first spring 7 positioned between the heat absorbing plate 5 and the mobile phone shell 1 can enable the heat absorbing plate 5 to always abut against the mainboard body 2, so as to absorb heat on the mainboard and emit the heat through the heat radiating fins 6 on the heat absorbing plate 5, thereby, thereby prolonging the service life of the mainboard and having better use effect.
Example 2
Referring to fig. 4-5, in this embodiment, compared with embodiment 1, the shockproof mobile phone motherboard further includes a square groove 12 formed on an outer wall of one side of the mobile phone housing 1, a square frame 13 is disposed on an inner wall of the square groove 12, and a rubber ring 14 is disposed inside the square frame 13.
The working principle is as follows: during the use, when butt joint seals between the cell-phone casing 1, the rubber circle 14 that is located square frame 13 can be extruded and produce deformation, can play certain sealed effect for the cell-phone possesses certain water-proof effects, and the result of use is better.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a type mobile phone motherboard takes precautions against earthquakes, includes cell-phone casing (1) and mainboard body (2), its characterized in that, the both ends of mainboard body (2) are provided with fixed frame (3), and one side outer wall of fixed frame (3) is provided with sleeve (9), one side inner wall of sleeve (9) is provided with second spring (10), four equal fixedly connected with telescopic links (11) of corner of cell-phone casing (1) one side inner wall, and the one end of telescopic link (11) and the one end fixed connection of second spring (10), the inside of cell-phone casing (1) is provided with heat dissipation mechanism.
2. The vibration-proof mobile phone motherboard according to claim 1, wherein the heat dissipation mechanism comprises a heat absorption plate (5) and heat dissipation fins (6), the heat absorption plate (5) is disposed between the motherboard body (2) and the mobile phone shell (1), and the heat dissipation fins (6) are fixedly disposed on the outer walls of both sides of the heat absorption plate (5).
3. A vibration-proof type cellular phone main board according to claim 2, wherein the heat absorbing plate (5) is provided with first springs (7) at an equal distance on an outer wall of one side, and one end of the first springs (7) is fixedly connected with an inner wall of one side of the cellular phone case (1).
4. The main board of a shockproof mobile phone according to claim 1, wherein the outer wall of one side of the fixing frame (3) is provided with a rubber strip (4).
5. A vibration-proof mobile phone motherboard according to claim 1, wherein the inner wall of the fixed frame (3) is provided with a rubber pad (8), and the rubber pad (8) is sandwiched between the fixed frame (3) and the motherboard body (2).
6. The vibration-proof mobile phone motherboard according to claim 1, wherein the outer wall of one side of the mobile phone housing (1) is provided with a square groove (12), the inner wall of the square groove (12) is provided with a square frame (13), and the inside of the square frame (13) is provided with a rubber ring (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022156049.XU CN212696036U (en) | 2020-09-27 | 2020-09-27 | Shockproof mobile phone motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022156049.XU CN212696036U (en) | 2020-09-27 | 2020-09-27 | Shockproof mobile phone motherboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212696036U true CN212696036U (en) | 2021-03-12 |
Family
ID=74885749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022156049.XU Active CN212696036U (en) | 2020-09-27 | 2020-09-27 | Shockproof mobile phone motherboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212696036U (en) |
-
2020
- 2020-09-27 CN CN202022156049.XU patent/CN212696036U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240226 Address after: 200000 floor 2, building 2, No. 1508, Kunyang Road, Minhang District, Shanghai Patentee after: Shanghai Ruizhi Information Technology Co.,Ltd. Country or region after: China Address before: 518101 floor 4, building C, Dagang Industrial Zone, Dagang community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HENGXUNTONG ELECTRONICS Co.,Ltd. Country or region before: China |