CN212695028U - Vibration noise suppressing structure of ceramic element - Google Patents
Vibration noise suppressing structure of ceramic element Download PDFInfo
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- CN212695028U CN212695028U CN202021836264.8U CN202021836264U CN212695028U CN 212695028 U CN212695028 U CN 212695028U CN 202021836264 U CN202021836264 U CN 202021836264U CN 212695028 U CN212695028 U CN 212695028U
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- interposer
- conductive portion
- vibration noise
- substrate
- ceramic element
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Abstract
A vibration noise suppression structure of a ceramic element comprises a first intermediate layer positioned on a top surface of a substrate, the first intermediate layer is provided with a first external terminal and a second external terminal which respectively correspond to a first external electrode and a second external electrode of the ceramic element up and down and also correspond to a first welding pad and a second welding pad of the substrate up and down, and the first intermediate layer is provided with a first dielectric coefficient and a first anti-bending coefficient. A second interposer between the bottom surface of the ceramic element and the first interposer, the second interposer having a second dielectric constant and a second anti-bending constant. The vibration noise suppression structure can suppress or buffer the vibration noise generated by the ceramic element and achieve the required plate bending resistance.
Description
Technical Field
The present invention relates to an attachment structure of a ceramic element, and more particularly to a vibration noise suppressing structure of a ceramic element.
Background
The ceramic element is generally soldered to a predetermined pad on the substrate by a solder material through an extended external electrode. Some ceramic elements contain a dielectric layer material, which may be a ferroelectric material. For example, a multilayer ceramic capacitor is taken as an example, and a typical structure thereof comprises a multilayer ceramic stacked body, a pair of external electrodes, wherein the multilayer ceramic stacked body comprises a ceramic substrate and a plurality of layers of internal electrode plates, and each internal electrode plate is sequentially and alternately embedded in the ceramic substrate.
Since the ferroelectric material has piezoelectric properties, when a voltage is applied to the ceramic element, a piezoelectric phenomenon may occur between internal electrodes of the ceramic element, thereby generating periodic vibration according to the magnitude of the frequency and simultaneously causing the ceramic element to exhibit a vibration condition. These vibrations can be transmitted to the substrate through the external electrodes of the ceramic element and the solder, so that the substrate becomes a surface that reflects acoustic waves to generate vibration noise. The vibration noise may create undesirable sound frequencies and may also create tensile stresses on the ceramic elements and their solder.
In the prior art, there is a structure of an interposer to suppress the vibration noise. However, with the trend of miniaturization and the requirement of wide operating frequency range of ceramic devices, the efficiency of the interposer for absorbing the vibration noise needs to be improved. Furthermore, the ability of the interposer to resist bending is generally not considered in the prior art, such that the pulling stress may directly damage the ceramic element.
SUMMERY OF THE UTILITY MODEL
Accordingly, the present invention is directed to a vibration noise suppressing structure of a ceramic element, which can effectively suppress or buffer vibration noise generated by the ceramic element and has a good plate bending resistance.
The utility model discloses the technical means who adopts sets up a vibration noise suppression structure between ceramic element and base plate, it includes that a first intermediate layer is located a top surface of base plate, this first intermediate layer has a first external terminal and a second external terminal, this first external terminal and this second external terminal are corresponding to a ceramic element's first external electrode and second external electrode from top to bottom respectively, this first external terminal and this second external terminal are also corresponding to the first pad and the second pad of this base plate from top to bottom, this first intermediate layer has a first dielectric coefficient and a first anti board bending coefficient. A second interposer between the bottom surface of the ceramic element and the first interposer, the second interposer having a second dielectric constant and a second anti-bending constant. The vibration noise suppression structure can suppress or buffer the vibration noise generated by the ceramic element and achieve the required plate bending resistance.
Preferably, the first end of the first interposer is formed with a first recess, and the first end forms a first top conductive portion on a surface facing the ceramic element, and forms a first bottom conductive portion on a surface facing the substrate, and forms a first vertical conductive portion between the first top conductive portion and the first bottom conductive portion and along an outer surface of the first recess, and the first bonding material bonds the first external electrode of the ceramic element and the first top conductive portion, the first vertical conductive portion, and the first bottom conductive portion of the first interposer to the first bonding pad of the substrate, so that the first external electrode of the ceramic element and the first bonding pad of the substrate are electrically connected.
Preferably, the second end of the first interposer is formed with a second recess, and the second end forms a second top conductive portion on a surface facing the ceramic element, and forms a second bottom conductive portion on a surface facing the substrate, and forms a second vertical conductive portion between the second top conductive portion and the second bottom conductive portion and along an outer surface of the second recess, and the second solder material solders the second external electrode of the ceramic element and the second top conductive portion, the second vertical conductive portion, and the second bottom conductive portion of the second interposer to the second pad of the substrate, so that the second external electrode of the ceramic element and the second pad of the substrate are electrically connected.
Preferably, the ceramic element is a multilayer ceramic capacitor. Preferably, the first intermediate layer is made of aluminum oxide (Al)2O3) The first interposer is fabricated.
Preferably, the second interposer is a second interposer made of silicone.
Preferably, the first dielectric constant of the first interposer is between 5 and 10, and the second dielectric constant of the second interposer is between 1 and 4.
Preferably, the first bending resistance coefficient of the first interposer is between 8.0 and 20.0, and the second bending resistance coefficient of the second interposer is between 30.0 and 50.0.
Preferably, the first interposer has a thickness of 2.0 mm to 5.0 mm, and the second interposer has a thickness of 10 μm to 50 μm.
In the aspect of the effect, through the utility model discloses a vibration noise suppression structure except can effectively restrain or cushion the produced vibration noise of ceramic element, and can reach required anti board ability of bending in step. Even if a large pulling force is generated due to severe vibration, the first or second intermediate layer will be broken first, but not the ceramic element. Moreover, the second intermediate layer is made of a material with a proper dielectric coefficient, good heat dissipation capability and high plate bending resistance, so that ripple current (ripple current) of the product can be improved and the reliability of the product can be improved.
The specific techniques adopted by the present invention will be further explained by the following embodiments and accompanying drawings.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for helping the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. The skilled person in the art can, under the teaching of the present invention, choose various possible shapes and proportional dimensions to implement the invention according to the specific situation.
Fig. 1 shows an exploded perspective view of the first embodiment of the present invention with relevant elements separated.
Fig. 2 is a schematic cross-sectional view of the related components of the first embodiment of the present invention separated and assembled on a substrate.
Fig. 3 is a schematic cross-sectional view of the related components of the first embodiment of the present invention assembled on a substrate.
Fig. 4 shows an exploded perspective view of the second embodiment of the present invention with the relevant elements separated.
Description of reference numerals:
100 vibration noise suppressing structure;
1a ceramic element;
11a first external electrode;
11a second external electrode;
2a substrate;
21a first pad;
21a second pad;
3a first interposer;
31a first end portion;
311a first recess;
321a first top surface conductive portion;
322a first bottom conductive portion;
323a first vertical conductive portion;
31a second end portion;
311a second recess;
321a second top surface conductive portion;
322a second bottom conductive portion;
323a second vertical conductive portion;
4 a second interposer;
5 first welding material;
5a second solder material.
Detailed Description
The details of the present invention can be more clearly understood with reference to the accompanying drawings and the description of the embodiments of the present invention. However, the specific embodiments of the present invention described herein are for the purpose of explanation only, and should not be construed as limiting the invention in any way. Given the teachings of the present invention, the skilled person can conceive of any possible variants based on the invention, which should all be considered as belonging to the scope of the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may be present.
Referring to fig. 1, a ceramic device 1 is shown having a first external electrode 11 and a second external electrode 11a disposed at opposite ends thereof. In the design of the present invention, a vibration noise suppressing structure 100 is disposed between the ceramic element 1 and the substrate 2, and the vibration noise suppressing structure 100 includes a first interposer 3 and a second interposer 4 from bottom to top.
Fig. 2 is a schematic cross-sectional view of the related components of the first embodiment of the present invention separated and assembled on a substrate. As shown in the figure, the first end portion 31 of the first interposer 3 is formed with a first concave portion 311, and the first end portion 31 is formed with a first top conductive portion 321 on the surface facing the ceramic element 1, a first bottom conductive portion 322 on the surface facing the substrate 2, and a first vertical conductive portion 323 between the first top conductive portion 321 and the first bottom conductive portion 322 and along the outer surface of the first concave portion 311. That is, the first top conductive portion 321 and the first bottom conductive portion 322 may be electrically communicated through the first vertical conductive portion 323.
Similarly, the second end 31a of the first interposer 3 is formed with a second recess 311a, and the second end 31a is formed with a second top conductive portion 321a on the surface facing the ceramic element 1, a second bottom conductive portion 322a on the surface facing the substrate 2, and a second vertical conductive portion 323a between the second top conductive portion 321a and the second bottom conductive portion 322a and along the outer surface of the second recess 311 a. That is, the second top conductive portion 321a and the second bottom conductive portion 322a may be electrically communicated through the second vertical conductive portion 323 a.
When the present invention is assembled, the first interposer 3, the second interposer 4, and the ceramic element 1 are assembled on the substrate 2 from bottom to top, and the first external electrode 11 of the ceramic element 1, the first end 31 of the first interposer 3, and the first pad 21 of the substrate 2 are aligned with each other in the vertical direction. Meanwhile, the second external electrode 11a of the ceramic element 1, the second end 31a of the first interposer 3, and the second pad 21a of the substrate 2 are also aligned with each other in the vertical direction. In this case, the second interposer 4 is located between the bottom surface of the ceramic element 1 and the first interposer 3.
Fig. 3 is a schematic cross-sectional view of the first embodiment of the present invention, after assembling the related components and assembling the related components on a substrate. After the alignment of the above-mentioned components is completed, the first external electrode 11 of the ceramic component 1 and the first top conductive portion 321, the first vertical conductive portion 323, and the first bottom conductive portion 322 of the first interposer 3 are soldered to the first pad 21 of the substrate 2 by the first soldering material 5, so that the first external electrode 11 of the ceramic component 1 and the first pad 21 of the substrate 2 are electrically connected.
Similarly, the second external electrode 11a of the ceramic element 1 and the second top surface conductive portion 321a, the second vertical conductive portion 323a, and the second bottom surface conductive portion 322a of the first interposer 3 are bonded to the second pad 21a of the substrate 2 with the second bonding material 5 a.
After the above-mentioned bonding process is completed, the second external electrode 11a of the ceramic element 1 and the second bonding pad 21a of the substrate 2 are electrically connected, and the second interposer 4 is located between the bottom surface of the ceramic element 1 and the first interposer 3.
Fig. 4 shows an exploded perspective view of the second embodiment of the present invention with the relevant elements separated. The constituent elements of this embodiment are substantially the same as those of the first embodiment, and therefore the same elements are designated by the same element numbers for correspondence. In the present embodiment, a plurality (two or more) of juxtaposed ceramic elements 1 are disposed on a substrate 2, and a vibration noise suppressing structure 100 is disposed between the plurality of ceramic elements 1 and the substrate (not shown), wherein the vibration noise suppressing structure 100 also includes an enlarged first interposer 3 and a second interposer 4.
In the embodiment shown in the above drawings, the ceramic element is a multilayer ceramic capacitor, and can also be applied to other ceramic elements. The first intermediate layer 3 is made of, for example, aluminum oxide (Al)2O3) Is made of a material having a thickness of about 2.0 millimeters (mm) to about 5.0 mm. The second interposer 4 is made of a material such as silicon gel and has a thickness of about 10 to 50 micrometers (um).
In the aforementioned embodiments of the present invention, the first interposer 3 has a first dielectric coefficient (e.g., the dielectric coefficient is 5 to 10), and the second interposer 4 has a second dielectric coefficient (e.g., the dielectric coefficient is 1.0 to 4.0) different from the first dielectric coefficient of the first interposer 3, so that the vibration noise with different frequency ranges can be effectively suppressed or buffered.
Furthermore, the first interposer 3 has a first bending resistance (e.g., a bending resistance of 8.0 to 20.0), and the second interposer 4 has a second bending resistance (e.g., a bending resistance of 30.0 to 50.0) different from the first bending resistance of the first interposer 3, so that it has sufficient bending resistance in case of a tensile stress applied to the ceramic element, the substrate, or the solder, thereby ensuring that the ceramic element is not damaged.
The above-mentioned embodiments are merely illustrative and not intended to limit the scope of the present invention, and all other equivalent modifications and substitutions which do not depart from the spirit of the present invention are intended to be included within the scope of the appended claims.
Claims (9)
1. A vibration noise suppressing structure of a ceramic element, a vibration noise suppressing structure is provided between a ceramic element and a substrate, both ends of the ceramic element are respectively provided with a first external electrode and a second external electrode, the substrate is provided with a first bonding pad and a second bonding pad, the first bonding pad and the second bonding pad respectively correspond to the first external electrode and the second external electrode of the ceramic element, and are respectively welded to the first external electrode and the second external electrode of the ceramic element with a first welding material and a second welding material, characterized in that the vibration noise suppressing structure comprises:
a first interposer on a top surface of the substrate, the first interposer having a first external terminal and a second external terminal, the first external terminal and the second external terminal respectively corresponding to the first external electrode and the second external electrode of the ceramic element, the first external terminal and the second external terminal also corresponding to the first bonding pad and the second bonding pad of the substrate, the first interposer having a first dielectric coefficient and a first bending resistance coefficient;
a second interposer between the bottom surface of the ceramic element and the first interposer, the second interposer having a second dielectric constant and a second anti-bending constant.
2. The vibration noise suppressing structure of ceramic component as claimed in claim 1, wherein the first external terminal of the first interposer is formed with a first recess, and the first external terminal is formed with a first top surface conductive portion at a surface facing the ceramic component, and is formed with a first bottom surface conductive portion at a surface facing the substrate, and is formed with a first vertical conductive portion between the first top surface conductive portion and the first bottom surface conductive portion and along an outer surface of the first recess, and the first solder material is soldered the first external electrode of the ceramic component and the first top surface conductive portion, the first vertical conductive portion, and the first bottom surface conductive portion of the first interposer to the first pad of the substrate, so that the first external electrode of the ceramic component and the first pad of the substrate are electrically connected.
3. The vibration noise suppressing structure of ceramic component as claimed in claim 1, wherein the second external terminal of the first interposer is formed with a second recess, and the second external terminal is formed with a second top surface conductive portion on a surface facing the ceramic component, a second bottom surface conductive portion on a surface facing the substrate, a second vertical conductive portion between the second top surface conductive portion and the second bottom surface conductive portion and along an outer surface of the second recess, and the second solder material is used to solder the second external electrode of the ceramic component and the second top surface conductive portion, the second vertical conductive portion, and the second bottom surface conductive portion of the second interposer to the second pad of the substrate, so that the second external electrode of the ceramic component and the second pad of the substrate are electrically connected.
4. The vibration noise suppressing structure of ceramic element as claimed in claim 1, wherein said ceramic element is a laminated ceramic capacitor.
5. The vibration noise suppressing structure of claim 1, wherein the first intermediate layer is made of alumina.
6. The vibration noise suppressing structure of claim 1, wherein the second intermediate layer is made of silicon rubber.
7. The vibration noise suppressing structure of claim 1, wherein the first dielectric constant of the first intermediate layer is between 5 and 10, and the second dielectric constant of the second intermediate layer is between 1 and 4.
8. The vibration noise suppressing structure of claim 1, wherein the first bending resistance coefficient of the first interposer is between 8.0 and 20.0, and the second bending resistance coefficient of the second interposer is between 30.0 and 50.0.
9. The vibration noise suppressing structure of a ceramic component according to claim 1, wherein the first interposer has a thickness of 2.0 mm to 5.0 mm, and the second interposer has a thickness of 10 μm to 50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021836264.8U CN212695028U (en) | 2020-08-28 | 2020-08-28 | Vibration noise suppressing structure of ceramic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021836264.8U CN212695028U (en) | 2020-08-28 | 2020-08-28 | Vibration noise suppressing structure of ceramic element |
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| Publication Number | Publication Date |
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| CN212695028U true CN212695028U (en) | 2021-03-12 |
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| CN202021836264.8U Expired - Fee Related CN212695028U (en) | 2020-08-28 | 2020-08-28 | Vibration noise suppressing structure of ceramic element |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153564A (en) * | 2023-09-06 | 2023-12-01 | 潮州三环（集团）股份有限公司 | Composite electronic element and preparation method and application thereof |
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2020
- 2020-08-28 CN CN202021836264.8U patent/CN212695028U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153564A (en) * | 2023-09-06 | 2023-12-01 | 潮州三环（集团）股份有限公司 | Composite electronic element and preparation method and application thereof |
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Granted publication date: 20210312 Termination date: 20210828 |