CN212694357U

CN212694357U - High-efficient radiating desk-top DRAM of overfrequency

Info

Publication number: CN212694357U
Application number: CN202021553089.1U
Authority: CN
Inventors: 栗立杨
Original assignee: Beijing Timesrunner Technology Co ltd
Current assignee: Beijing Timesrunner Technology Co ltd
Priority date: 2020-07-31
Filing date: 2020-07-31
Publication date: 2021-03-12
Anticipated expiration: 2030-07-31

Abstract

The utility model discloses a radiating desk-top DRAM of high-efficient overfrequency, including casing, memory pedestal, memory body, resettlement groove and arc draw-in groove, the memory pedestal is installed on the inside top of casing, and the inside central point of memory pedestal puts the department and installs the memory body, and the bottom of memory body extends to the outside of casing to all be equipped with the arc draw-in groove on two lateral walls of memory pedestal, the inside resettlement groove that is equipped with of casing of memory pedestal both sides, the one end of resettlement groove extends to the outside of casing, and the inside one side of resettlement groove installs the nut, and the inside threaded connection of nut has the lead screw, the inside heat radiation structure that is equipped with of casing of resettlement groove below to heat radiation structure keeps away from the inside location structure that is equipped with of casing of resettlement groove one side. The utility model discloses not only reduced the phenomenon that the DRAM burns out because of high temperature produces when using, guaranteed the stability when the DRAM uses, improved the convenience when the DRAM uses moreover.

Description

High-efficient radiating desk-top DRAM of overfrequency

Technical Field

The utility model relates to a computer technology field specifically is a radiating desk-top DRAM of high-efficient overfrequency.

Background

The computer is a computer, is a modern electronic computing machine for high-speed computing, can perform numerical computation and logic computation, has a memory function, can run according to a program, is a modern intelligent electronic device for automatically processing mass data at high speed, consists of a hardware system and a software system, and is required to be arranged in a case to improve the running speed of the computer.

The memory bank in the market is various and can basically meet the use requirements of people, but certain defects still exist, and the specific problems are as follows.

(1) The existing memory bank has the advantages that the memory bank is easy to burn due to high temperature and short in service life because of common heat dissipation performance;

(2) the existing memory bank is inconvenient to be positioned in the case, so that the memory bank is easy to deviate due to vibration and has general stability;

(3) the existing memory bank is not convenient for rapidly disassembling and processing the memory bank body, so that the memory bank is inconvenient to overhaul and maintain, and troubles people frequently.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a radiating desk-top DRAM of high-efficient overfrequency to the heat dispersion that provides the DRAM among the above-mentioned background art is general, be not convenient for fix a position in the inside of quick-witted case and be not convenient for carry out the problem of quick dismantlement processing to the DRAM body.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a radiating desk-top DRAM of high-efficient overfrequency, includes casing, memory pedestal, memory body, resettlement groove and arc draw-in groove, the memory pedestal is installed on the inside top of casing, and the inside central point of memory pedestal puts the department and installs the memory body, and the bottom of memory body extends to the outside of casing to all be equipped with the arc draw-in groove on two lateral walls of memory pedestal, the inside resettlement groove that is equipped with of casing of memory pedestal both sides, the one end of resettlement groove extends to the outside of casing, and the nut is installed to one side of resettlement inslot portion to the inside threaded connection of nut has the lead screw, and the both ends of lead screw all extend to the outside of nut, the inside heat radiation structure that is equipped with of casing of resettlement groove below to heat radiation structure keeps away from the inside location structure that is equipped with of.

Preferably, the heat dissipation structure is internally provided with a heat dissipation fin column, a heat dissipation fin ring, a heat collection plate, a corrugated heat dissipation sheet and a heat dissipation cavity in sequence, the heat dissipation cavity is arranged inside the shell below the placement groove, and the corrugated heat dissipation sheet is arranged on one side inside the heat dissipation cavity, so that heat energy dissipated by the memory bank body is guided into the heat dissipation cavity.

Preferably, the heat collecting plate is installed on the outer wall of the shell at the position of the heat radiating cavity, the heat radiating fins at equal intervals are arranged on the inner wall of the heat radiating cavity on one side of the corrugated heat radiating fin, one end of each heat radiating fin extends to the outside of the shell and is fixedly connected with the outer wall of the heat collecting plate, and two groups of heat radiating fin rings are sleeved on the surfaces of the heat radiating fins inside the heat radiating cavity so as to guide heat energy inside the heat radiating cavity to the outside of the shell.

Preferably, location structure's inside is equipped with pinhole, spacing groove in proper order, pushes away handle, constant head tank and locating plate, the both sides of casing bottom all are equipped with the constant head tank, and the inside central point department of putting of constant head tank is equipped with the locating plate to the inside one end of locating plate is equipped with the pinhole, and the both ends of pinhole all extend to the outside of locating plate to carry out location processing to the DRAM.

Preferably, the inside spacing groove that is equipped with of casing of constant head tank one side, the one end of spacing groove extends to the outside of casing, and the housing face of spacing groove position department installs and pushes away the handle, pushes away the one end of handle and runs through the spacing groove and be connected with the fixed surface of locating plate to it slides to drive the inside that the locating plate is located the constant head tank.

Preferably, the hand wheel is installed to the one end that the memory pedestal was kept away from to the lead screw, and the lead screw keeps away from the one end of hand wheel and installs the arc fixture block, and the one end that the lead screw was kept away from to the arc fixture block extends to the inside of arc draw-in groove to drive the arc fixture block and carry out the translation.

Compared with the prior art, the beneficial effects of the utility model are that: the efficient over-frequency heat dissipation table type memory bank not only reduces the phenomenon that the memory bank is burnt due to high temperature when in use, ensures the stability of the memory bank when in use, but also improves the convenience of the memory bank when in use;

(1) the memory bank is provided with the heat dissipation fin column, the heat dissipation fin ring, the heat collection plate, the corrugated heat dissipation fin and the heat dissipation cavity, heat energy generated in the operation process of the memory bank body is guided into the heat dissipation cavity through the corrugated heat dissipation fin, the heat dissipation performance of the heat dissipation fin column is amplified through the heat dissipation fin ring, the heat energy in the heat dissipation cavity is guided out to the outside of the heat dissipation cavity by the heat dissipation fin column, and then is absorbed by the heat collection plate in a gathering mode, the efficient heat dissipation function of the memory bank is achieved, and the phenomenon that the memory bank is burnt due to high temperature when in use is reduced;

(2) the positioning device is provided with the pin hole, the limiting groove, the push handle, the positioning groove and the positioning plate, the push handle is slid to enable the push handle to be positioned in the limiting groove and slide downwards, the push handle drives the positioning plate to be positioned in the positioning groove and slide downwards, the pin hole is positioned outside the positioning groove at the moment, the pin hole is screwed into the case through the external screw distribution hole, positioning processing can be carried out on the memory bank, the phenomenon that the memory bank deviates due to factors such as vibration is reduced, and therefore stability of the memory bank in use is guaranteed;

(3) through being provided with the resettlement groove, the arc draw-in groove, the arc fixture block, the lead screw, nut and hand wheel, through rotatory hand wheel, make it drive the inside rotation and the translation that the lead screw is located the nut to make the lead screw drive the synchronous translation of arc fixture block, and then make the inside translation to the resettlement groove of arc fixture block translation to the inside of arc draw-in groove or by the inside translation of arc draw-in groove, so that carry out quick assembly disassembly to the DRAM body and handle, thereby the convenience when having improved the DRAM and using.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

fig. 2 is an enlarged schematic structural view of a point a in fig. 1 according to the present invention;

FIG. 3 is a schematic view of the heat dissipation structure of the present invention;

fig. 4 is a schematic diagram of the positioning structure of the present invention showing a side view and an enlarged structure.

In the figure: 1. a housing; 2. a heat dissipation structure; 201. a heat dissipation fin column; 202. a heat dissipation fin ring; 203. a heat collecting plate; 204. a corrugated fin; 205. a heat dissipation cavity; 3. a memory seat body; 4. a memory bank body; 5. a positioning structure; 501. a pin hole; 502. a limiting groove; 503. a push handle; 504. positioning a groove; 505. positioning a plate; 6. a placing groove; 7. an arc-shaped clamping groove; 8. an arc-shaped fixture block; 9. a screw rod; 10. a nut; 11. a handwheel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: a desk type memory bank with high-efficiency overfrequency heat dissipation comprises a shell 1, a memory seat body 3, a memory bank body 4, a placing groove 6 and an arc clamping groove 7, wherein the memory seat body 3 is installed at the top end inside the shell 1, the memory bank body 4 is installed at the central position inside the memory seat body 3, the bottom end of the memory bank body 4 extends to the outside of the shell 1, the arc clamping grooves 7 are arranged on two outer side walls of the memory seat body 3, the placing groove 6 is arranged inside the shell 1 on two sides of the memory seat body 3, one end of the placing groove 6 extends to the outside of the shell 1, a nut 10 is installed on one side inside the placing groove 6, a lead screw 9 is connected with the inner thread of the nut 10, two ends of the lead screw 9 extend to the outside of the nut 10, a hand wheel 11 is installed at one end of the lead screw 9 far away from the memory seat body 3, an arc clamping block 8 is installed at one end of the lead screw 9 far away from the hand wheel 11, one end, so as to drive the arc-shaped clamping block 8 to translate;

the heat dissipation structure 2 is arranged inside the shell 1 below the placement groove 6, the heat dissipation structure 2 is internally provided with a heat dissipation fin column 201, a heat dissipation fin ring 202, a heat collection plate 203, a corrugated heat dissipation fin 204 and a heat dissipation cavity 205 in sequence, the heat dissipation cavity 205 is arranged inside the shell 1 below the placement groove 6, the corrugated heat dissipation fin 204 is arranged on one side inside the heat dissipation cavity 205, the heat collection plate 203 is arranged on the outer wall of the shell 1 at the position of the heat dissipation cavity 205, the heat dissipation fin columns 201 with equal intervals are arranged on the inner wall of the heat dissipation cavity 205 on one side of the corrugated heat dissipation fin 204, one end of each heat dissipation fin column 201 extends to the outside of the shell 1 and is fixedly connected with the outer wall of the heat collection plate 203, and the surfaces of the heat dissipation fin columns 201;

heat energy generated in the operation process of the memory bank body 4 is guided into the heat dissipation cavity 205 through the corrugated heat dissipation fins 204, after the heat dissipation performance of the heat dissipation fin column 201 is enhanced through the heat dissipation fin ring 202, the heat energy inside the heat dissipation cavity 205 is guided out of the heat dissipation cavity 205 by the heat dissipation fin column 201, and then is collected and absorbed by the heat collection plate 203, so that the function of efficient heat dissipation of the memory bank is realized, and the phenomenon that the memory bank is burnt due to high temperature when in use is reduced;

a positioning structure 5 is arranged inside the casing 1 on one side of the heat dissipation structure 2 away from the placement groove 6, a pin hole 501, a limiting groove 502, a push handle 503, a positioning groove 504 and a positioning plate 505 are sequentially arranged inside the positioning structure 5, the positioning groove 504 is arranged on both sides of the bottom of the casing 1, the positioning plate 505 is arranged at the central position inside the positioning groove 504, the pin hole 501 is arranged at one end inside the positioning plate 505, both ends of the pin hole 501 extend to the outside of the positioning plate 505, the limiting groove 502 is arranged inside the casing 1 on one side of the positioning groove 504, one end of the limiting groove 502 extends to the outside of the casing 1, the push handle 503 is arranged on the surface of the casing 1 at the position of the limiting groove 502, and one end of the push handle 503 penetrates through the limiting groove 502 and;

the push handle 503 is slid to slide the positioning plate in the limiting groove 502, the push handle 503 drives the positioning plate 505 to slide downwards in the positioning groove 504, the pin hole 501 is located outside the positioning groove 504, and the external screw is screwed into the case through the pin hole 501 to position the memory bank, so that the phenomenon of deviation caused by vibration and other factors is reduced, and the stability of the memory bank during use is ensured.

The working principle is as follows: when the memory bank is used, firstly, heat energy generated in the operation process of the memory bank body 4 is guided into the inside of the heat dissipation cavity 205 through the corrugated heat dissipation sheet 204, the heat dissipation performance of the heat dissipation finned column 201 is amplified through the heat dissipation finned ring 202, the heat energy inside the heat dissipation cavity 205 is guided out to the outside of the heat dissipation cavity 205 by the heat dissipation finned column 201, and then is collected and absorbed by the heat collection plate 203, so that the function of high-efficiency heat dissipation of the memory bank is realized, the phenomenon that the memory bank is burnt due to high temperature in use is reduced, then the memory bank is positioned inside the limit groove 502 to slide through sliding the push handle 503, the positioning plate 505 is positioned inside the positioning groove 504 to slide downwards through being driven by the push handle 503, at the moment, the pin hole 501 is positioned outside the positioning groove 504, the memory bank can be positioned by screwing an external screw into the case through the pin hole 501, and the phenomenon that the memory bank is deviated due to factors such as the like is reduced, stability when having ensured the DRAM use, at last through rotatory hand wheel 11, make it drive the inside rotation and the translation that lead screw 9 is located nut 10, and make lead screw 9 drive the synchronous translation of arc fixture block 8, and then make the inside translation of arc fixture block 8 to arc draw-in groove 7 or by arc draw-in groove 7 to the inside of resettlement groove 6, so that carry out quick assembly disassembly to memory body 4 and handle, the convenience when having improved the memory use, thereby accomplish the use of memory.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a radiating desk-top DRAM of high-efficient overfrequency, includes casing (1), memory pedestal (3), memory bank body (4), resettlement groove (6) and arc draw-in groove (7), its characterized in that: the top end of the interior of the shell (1) is provided with a memory seat body (3), the central position of the interior of the memory seat body (3) is provided with a memory bank body (4), the bottom end of the memory bank body (4) extends to the exterior of the shell (1), arc-shaped clamping grooves (7) are arranged on the two outer side walls of the memory seat body (3), a placing groove (6) is arranged inside the shell (1) on the two sides of the memory seat body (3), one end of the placing groove (6) extends to the outside of the shell (1), a nut (10) is arranged on one side inside the placing groove (6), and the inner thread of the nut (10) is connected with a screw rod (9), both ends of the screw rod (9) extend to the outer part of the nut (10), a heat dissipation structure (2) is arranged in the shell (1) below the placing groove (6), and a positioning structure (5) is arranged in the shell (1) on one side of the heat dissipation structure (2) far away from the placement groove (6).

2. The efficient over-frequency heat dissipation desktop memory bank of claim 1, wherein: the heat dissipation structure is characterized in that a heat dissipation fin column (201), a heat dissipation fin ring (202), a heat collection plate (203), corrugated fins (204) and a heat dissipation cavity (205) are sequentially arranged inside the heat dissipation structure (2), the heat dissipation cavity (205) is arranged inside the shell (1) below the placement groove (6), and the corrugated fins (204) are arranged on one side inside the heat dissipation cavity (205).

3. The efficient over-frequency heat dissipation desktop memory bank of claim 2, wherein: the heat dissipation structure is characterized in that a heat collection plate (203) is mounted on the outer wall of the shell (1) at the position of the heat dissipation cavity (205), heat dissipation fins (201) with equal intervals are arranged on the inner wall of the heat dissipation cavity (205) on one side of the corrugated type heat dissipation sheet (204), one end of each heat dissipation fin (201) extends to the outside of the shell (1) and is fixedly connected with the outer wall of the heat collection plate (203), and two groups of heat dissipation fin rings (202) are sleeved on the surfaces of the heat dissipation fins (201) inside the heat dissipation cavity (205).

4. The efficient over-frequency heat dissipation desktop memory bank of claim 1, wherein: the inside of location structure (5) is equipped with pinhole (501), spacing groove (502), pushes away handle (503), constant head tank (504) and locating plate (505) in proper order, the both sides of casing (1) bottom all are equipped with constant head tank (504), and the inside central point department of putting of constant head tank (504) is equipped with locating plate (505) to the inside one end of locating plate (505) is equipped with pinhole (501), and the both ends of pinhole (501) all extend to the outside of locating plate (505).

5. The efficient over-frequency heat dissipation desktop memory bank of claim 4, wherein: the locating groove structure is characterized in that a limiting groove (502) is arranged inside the shell (1) on one side of the locating groove (504), one end of the limiting groove (502) extends to the outside of the shell (1), a push handle (503) is installed on the surface of the shell (1) at the position of the limiting groove (502), and one end of the push handle (503) penetrates through the limiting groove (502) and is fixedly connected with the surface of the locating plate (505).

6. The efficient over-frequency heat dissipation desktop memory bank of claim 1, wherein: the hand wheel (11) is installed to the one end that memory pedestal (3) were kept away from in lead screw (9), and the one end that the hand wheel (11) was kept away from in lead screw (9) installs arc fixture block (8), and the one end that lead screw (9) were kept away from in arc fixture block (8) extends to the inside of arc draw-in groove (7).