CN212694271U - Thing networking solid state relay - Google Patents
Thing networking solid state relay Download PDFInfo
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- CN212694271U CN212694271U CN202021900167.0U CN202021900167U CN212694271U CN 212694271 U CN212694271 U CN 212694271U CN 202021900167 U CN202021900167 U CN 202021900167U CN 212694271 U CN212694271 U CN 212694271U
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Abstract
An Internet of things solid-state relay comprises a control circuit, a photoelectric isolation circuit, a solid-state switch circuit, an NB-IOT module, a current detection circuit and a temperature detection circuit; the control circuit is connected with the input control end and comprises a power supply circuit and a driving conduction circuit, and the driving conduction circuit conducts or breaks the solid-state switch circuit through the photoelectric isolation circuit to enable a load circuit of the relay to be conducted or broken; the NB-IOT module comprises an MCU circuit, the MCU circuit is connected with the drive conduction circuit, the current detection circuit and the temperature detection circuit, and the MCU circuit is used for processing and uploading temperature and current signals to the cloud server. The utility model discloses a thing networking solid state relay can monitor and upload the inside temperature of solid state relay and the electric current size of flowing through solid state switch circuit, monitors the true state of solid state switch tube, does benefit to the normal use of guaranteeing solid state relay.
Description
Technical Field
The utility model relates to a switch field, concretely relates to thing networking solid state relay.
Background
The solid-state relay is a non-contact switch composed of a discrete electronic device and a power electronic power device, the isolation device is adopted to realize the isolation of a control end and a load end, and a small control signal can be used at an input end to directly drive a heavy-current load. The normal working temperature of the solid-state relay cannot exceed 80 ℃, and if the temperature is too high, the solid-state co-current capacity is greatly reduced, so that the solid-state relay is easy to damage.
Although the existing solid-state relay is provided with the status indicator lamp which is formed by connecting a light emitting diode in series at the input end of a photoelectric coupler, the working state of the solid-state relay can be directly reflected, under abnormal conditions, particularly when the output circuit part of the solid-state relay breaks down, the status of a solid-state switch tube cannot be truly reflected, and the existing solid-state relay is not provided with a device for monitoring the temperature and the current flowing through the solid-state switch, so that the normal use of the solid-state relay is not ensured. In addition, the existing solid-state relay does not have a technical means of networked management, and is not suitable for the development requirement of the Internet of things.
Disclosure of Invention
An object of the utility model is to overcome prior art's defect, provide a thing networking solid state relay that can monitor temperature and electric current.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
an Internet of things solid-state relay comprises a control circuit, a photoelectric isolation circuit, a solid-state switch circuit, an NB-IOT module, a current detection circuit and a temperature detection circuit;
the control circuit is connected with the input control end and comprises a power supply circuit and a driving conduction circuit, the power supply circuit is used for supplying power to the NB-IOT module, the current detection circuit and the temperature detection circuit, and the driving conduction circuit conducts or breaks the solid-state switch circuit through the photoelectric isolation circuit to enable the load circuit of the relay to be conducted or broken;
the NB-IOT module is used for being connected with the cloud server, the NB-IOT module comprises an MCU circuit, the MCU circuit is connected with a drive conduction circuit, a current detection circuit and a temperature detection circuit, the current detection circuit is connected between the solid-state switch circuit and the load circuit in series and used for detecting current signals flowing through the solid-state switch circuit, the temperature detection circuit is used for detecting the internal temperature of the solid-state relay, and the MCU circuit is used for processing and uploading the temperature and the current signals to the cloud server.
Preferably, the photoelectric isolation circuit comprises a photoelectric coupler IC3, a connection signal is input at an input control end, the control circuit generates a current signal and a voltage signal, the current signal is used for driving the photoelectric coupler IC3 to be conducted so as to conduct the solid-state switch circuit, and the voltage signal is used for supplying power to the NB-IOT module, the current detection circuit and the temperature detection circuit; the NB-IOT module, the current detection circuit and the temperature detection circuit do not work when the input end does not receive the connection signal.
Preferably, the NB-IOT module further includes a transparent transmission module, and the transparent transmission module is configured to transmit the signal processed by the MCU circuit to the cloud server.
Preferably, the MCU circuit further includes a protection circuit, the protection circuit is controlled by the cloud server, the protection circuit is connected to the drive on circuit, and when the input control terminal inputs the on signal, the NB-IOT module can receive the off control signal from the cloud server, and the drive on circuit is turned off by the protection circuit to turn off the load circuit of the relay.
Preferably, the MCU circuit includes a chip IC1, the IC1 has a plurality of I/O ports for transmitting signals, and the signal output terminal of the current detection circuit, the signal output terminal of the temperature detection circuit, and the signal output terminal of the protection circuit are respectively connected to the three I/O ports; the protection circuit comprises a resistor R10, a light emitting diode D4 and a triode Q5, wherein one end of the resistor R10 is connected with an I/O port of the IC1, the other end of the resistor R10 is connected with a base electrode of the triode Q5, a cathode of the light emitting diode D4 is connected with a collector of the triode Q5, and an emitter of the triode Q5 and an anode of the light emitting diode D4 are respectively connected with a driving conduction circuit.
Preferably, the temperature detection circuit comprises a temperature sensor IC2, and a signal output pin DQ of the temperature sensor IC2 is connected with an MCU circuit of the NB-IOT module; and a signal output pin DQ of the temperature sensor IC2 is connected with a power supply circuit through a resistor R5.
Preferably, the current detection circuit includes a current sampling chip IC4, a capacitor C3 and a capacitor C4, a current signal output terminal VIOUT of the current sampling chip IC4 is connected to the MCU circuit of the NB-IOT module, one end of the capacitor C3 is connected to the current signal output terminal VIOUT of the current sampling chip IC4, one end of the capacitor C4, a power supply terminal VCC of the current sampling chip IC4 are connected to the power supply circuit of the control circuit, and the other ends of the capacitor C3, the capacitor C4 and a ground terminal GND of the current sampling chip IC4 are connected to GND.
Preferably, the control circuit is connected with two input control terminals, the control circuit comprises a resistor R3, a resistor R4, a capacitor C2, a capacitor C5, a triode Q2, a light emitting diode D3 and a diode D2, one end of the resistor R3 is connected with an input control end, the other end of the resistor R3 is connected with the resistor R4 and the collector of the triode Q2 respectively, the emitter of the triode Q2 is used for supplying power for the MCU circuit, the temperature detection circuit and the current detection circuit, the other end of the resistor R4 is connected with the anode of the capacitor C5, one end of the capacitor C2 and the anode of the light-emitting diode D3 are connected with the base of the triode Q2, the cathode of the light-emitting diode D3 and the anode of the diode D2 are connected with two input ends of the photoelectric isolation circuit respectively, and the cathode of the capacitor C5, the other end of the capacitor C2 and the cathode of the diode D2 are connected with the other input control end and are connected with GND.
Preferably, the photoelectric isolation circuit comprises a photocoupler IC3, a resistor R6, a resistor R7, a resistor R8, a triode Q3, a thyristor Q4 and a rectifier bridge D1;
the fourth pin of the photoelectric coupler IC3 is connected with one end of a resistor R6, the other end of a resistor R6 and one end of a resistor R7 are connected with the base electrode of a triode Q3, the other end of a resistor R7, one end of a resistor R8 and the anode of a thyristor Q4 are connected with the positive output end of a rectifier bridge D1, the third pin of the photoelectric coupler IC3, the emitter of the triode Q3 and the cathode of a thyristor Q4 are connected with the negative output end of the rectifier bridge D1, the gate of the thyristor Q4 and the other end of the resistor R8 are connected with the collector of the triode Q3, and two input ends of the rectifier bridge D1 are respectively connected with two ends of the solid-state switching circuit.
Preferably, the solid-state switch circuit includes a triac Q1, a capacitor C1, a resistor R1, a resistor R2, and a resistor R9, a main electrode T1 of the triac is connected to a current output terminal of the current detection circuit, one ends of a gate G of the triac and a resistor R1 of the triac are connected to one end of the photoelectric isolation circuit, one end of a resistor R9 is connected to the other end of the photoelectric isolation circuit, the other end of the resistor R9 is connected to a current input terminal of the current detection circuit, the other ends of a main electrode T2 of the triac Q1 and a resistor R1 are connected to one end of a resistor R2, the other end of the resistor R2 is connected to one end of a capacitor C1, and the other end of a capacitor C1 is connected to the other end of a resistor R.
Preferably, the solid-state switching circuit includes an electronic power device, and the electronic power device is an IGBT power tube, a MOSFET power tube, an NPN power tube, or a thyristor.
The utility model discloses a thing networking solid state relay on realizing the basis through small control signal direct drive heavy current load function, has increased and can connect NB-IOT module, current detection circuit and the temperature detection circuit who forms complete signal path, can monitor and upload the inside temperature of solid state relay and the electric current size of flowing through solid state switch circuit, monitors the true state of solid state switch pipe, does benefit to the normal use of guaranteeing solid state relay.
In addition, a transparent transmission module is further arranged in the NB-IOT module and can be connected with a cloud server, and the temperature of the solid-state relay and the current flowing through the solid-state switch circuit are monitored through the cloud server.
In addition, a protection circuit is added in the MCU circuit, is controlled by the cloud server and controls the on-off of the drive conducting circuit after receiving a control signal of the cloud server, and is not interfered by a signal of the input control end.
Drawings
Fig. 1 is a circuit diagram of an internet of things solid-state relay of the present invention;
fig. 2 is a schematic diagram of a remote monitoring system of the present invention;
fig. 3 is a circuit diagram of a conventional solid-state relay, including a control circuit, a photo-isolation circuit, and a solid-state switching circuit.
Detailed Description
The following further illustrates a specific implementation of the solid-state relay of the internet of things according to the present invention, with reference to the embodiments shown in fig. 1 to 3. The utility model discloses a thing networking solid state relay is not limited to the description of following embodiment.
An Internet of things solid-state relay comprises a control circuit, a photoelectric isolation circuit, a solid-state switch circuit, an NB-IOT module, a current detection circuit and a temperature detection circuit; the control circuit is connected with an external input control end and comprises a power supply circuit and a driving conduction circuit, the power supply circuit is used for supplying power to the NB-IOT module, the current detection circuit and the temperature detection circuit, and the driving conduction circuit conducts or breaks the solid-state switch circuit through the photoelectric isolation circuit to enable a load circuit of the relay to be conducted or broken; the NB-IOT module is used for being connected with the cloud server, the NB-IOT module comprises an MCU circuit, the MCU circuit is connected with a drive conduction circuit, a current detection circuit and a temperature detection circuit, the current detection circuit is connected between the solid-state switch circuit and the load circuit in series and used for monitoring current signals flowing through the solid-state switch circuit, the temperature detection circuit is used for monitoring the internal temperature of the solid-state relay, and the MCU circuit is used for processing and uploading the temperature and the current signals to the cloud server.
The utility model discloses a thing networking solid state relay on realizing the basis through small control signal direct drive heavy current load function, has increased and can connect NB-IOT module, current detection circuit and the temperature detection circuit who forms complete signal path, can monitor the inside temperature of solid state relay and flow through solid state switch circuit's electric current size, does benefit to the normal use of guaranteeing solid state relay.
Preferably, the internet of things solid-state relay further comprises a protection circuit, the MCU circuit of the NB-IOT module is connected to the protection circuit, the protection circuit is connected to the drive conduction circuit, the protection circuit can be controlled by the cloud server, when the input control end inputs a connection signal, the NB-IOT module can receive a disconnection or conduction control signal from the cloud server, and the drive conduction circuit is disconnected or conducted through the protection circuit to disconnect or conduct a load circuit of the relay. For example, when the cloud server judges that the temperature or the current of the relay is abnormal according to the signal uploaded by the NB-IOT module, the MCU circuit turns off the relay through the protection circuit when receiving the control signal for executing protection transmitted by the cloud server.
In conjunction with fig. 1, an embodiment of an internet of things solid-state relay is provided, which includes a control circuit, a photoelectric isolation circuit, a solid-state switch circuit, an NB-IOT module, a current detection circuit, and a temperature detection circuit;
the control circuit is connected with an external input control end and comprises a power supply circuit and a drive conduction circuit, the power supply circuit is used for supplying power to the NB-IOT module, the current detection circuit and the temperature detection circuit, the drive conduction circuit conducts or disconnects the solid-state switch circuit through the photoelectric isolation circuit to enable a load circuit of the relay to be conducted, the photoelectric isolation circuit comprises a photoelectric coupler IC3, a connection signal is input at the input control end, the connection signal is usually a 3-32V direct-current voltage signal, the control circuit generates a current signal and a voltage signal, the current signal is used for driving the photoelectric coupler IC3 to be conducted, and the voltage signal is used for supplying power to the NB-IOT module, the current detection circuit and the temperature detection circuit; when the input end does not receive a switch-on signal and does not input a 3-32V direct-current voltage signal, the NB-IOT module, the current detection circuit and the temperature detection circuit do not work, and the power consumption is greatly reduced.
The NB-IOT module is connected with the cloud server, the NB-IOT module comprises an MCU circuit and a transparent transmission module, the transparent transmission module is integrated in the NB-IOT module, the MCU circuit is connected with a drive conduction circuit, a current detection circuit and a temperature detection circuit, the current detection circuit is connected in series between the solid-state switch circuit and a load circuit and is used for detecting current signals flowing through the solid-state switch circuit, the temperature detection circuit is used for monitoring the internal temperature of the solid-state relay, the MCU circuit controls the conduction or disconnection of the drive conduction circuit under the control of the cloud server, meanwhile, the MCU circuit is also used for receiving and processing the temperature and current signals, the transparent transmission module is used for transmitting the signals processed by the MCU circuit to the cloud server, the cloud server is used for monitoring the temperature and the current flowing through the solid-state switch circuit, and the defect that the temperature and the current flowing through the solid-state switch circuit are not monitored in the prior art is, the method is suitable for development and application of the Internet of things.
The MCU circuit is provided with a plurality of I/O ports for transmitting signals, particularly, the chip IC1 is provided with a plurality of I/O ports, the power supply terminal VCC of the chip IC1 is connected with the power supply circuit, the signal output end of the current detection circuit is connected with one I/O port of the MCU circuit, and the signal output end of the temperature detection circuit is connected with the other I/O port of the MCU circuit. The model of the chip IC1 in the embodiment is WH-NB 73-BA.
The temperature detection circuit comprises a temperature sensor IC2, the temperature sensor IC2 adopts a high-precision double-pin digital pulse output temperature sensor NST1001, has the characteristics of pulse counting type output and high precision in a wide temperature range, a signal output pin DQ of the temperature sensor IC2 is connected with an MCU circuit of an NB-IOT module, the power consumption is extremely low, and meanwhile, the signal output pin DQ is connected with a power supply circuit through a resistor R5.
The current detection circuit comprises a current sampling chip IC4, a capacitor C3 and a capacitor C4, wherein the current sampling chip IC4 adopts a Hall current sampling chip ACS758, a current signal output end VIOUT of the current sampling chip IC4 is connected with an MCU circuit of an NB-IOT module, one end of a capacitor C3 is connected with a current signal output end VIOUT of a current sampling chip IC4, one end of a capacitor C4 and a power supply end VCC of the current sampling chip IC4 are connected with a power supply circuit of a control circuit, and the other end of the capacitor C3, the other end of the capacitor C4 and a ground end GND of the current sampling chip IC4 are connected with GND.
The MCU circuit further comprises a protection circuit, the protection circuit is connected with the drive conduction circuit, the protection circuit is connected to one I/O port in the MCU circuit and controlled by the cloud server, and after the NB-IOT module receives a control signal for disconnection or conduction from the cloud server, the protection circuit enables the drive conduction circuit to be disconnected or conducted to enable a load circuit of the relay to be disconnected or conducted. At this time, the input control terminal keeps the input on signal, the MCU circuit makes the drive on circuit unable to turn on the photo-coupler IC3 of the photo-isolation circuit through the protection circuit, and turns off the photo-coupler IC3 and the load circuit. The MCU circuit preferably includes a chip IC1 having multiple I/O ports.
Preferably with control circuit, optoelectronic isolation circuit, solid state switch circuit, NB-IOT module, current detection circuit, temperature detection circuit solidification in a casing, the structure does not have the wiring port that can manually switch on thing networking solid state relay like this, avoids manual operation to compare with current solid state relay, have the function that can long-range shutoff and open. The solid-state relay of the internet of things adopts the technology of the internet of things, has extremely low power consumption, and can work for several years or even longer time only by one section of standby battery.
The specific connection relationship is as shown in fig. 1, the control circuit is connected with two input control terminals, the control circuit includes a resistor R3, a resistor R4, a capacitor C2, a capacitor C5, a transistor Q2, a light emitting diode D3 and a diode D2, one end of the resistor R3 is connected with one input control terminal, the other end of the resistor R3 is connected with a resistor R4 and a collector of the transistor Q23, an emitter of the transistor Q2 is used for supplying power to the MCU circuit, the temperature detection circuit and the current detection circuit, the other end of the resistor R638 is connected with a positive electrode of a capacitor C5, one end of the capacitor C2 and a positive electrode of the light emitting diode D3 are connected with a base of the transistor Q2, a cathode of the light emitting diode D3 and a positive electrode of the diode D42 are connected with two input terminals of the optoelectronic isolation circuit, that is connected with two input pins of the optoelectronic coupler IC3 of the optoelectronic isolation circuit, a negative electrode of the capacitor C5, The other end of the capacitor C2 and the cathode of the diode D2 are connected to the other input control terminal and to GND. The resistor R3 and the resistor R4 are current-limiting resistors, the resistor R1 provides a current-limiting function for the triode Q2 voltage stabilizing circuit, the resistor R4 provides voltage bias for the triode Q2, and the capacitor C2 and the capacitor C5 are filter capacitors.
The driving conduction circuit in the control circuit comprises a resistor R3, a resistor R4, a capacitor C2, a capacitor C5, a light-emitting diode D3 and a diode D2, the driving conduction circuit shares a resistor R3, a resistor R4, a capacitor C2, a capacitor C5, a light-emitting diode D3 and a diode D2 with the power circuit, and the cathode of the light-emitting diode D3 and the anode of the diode D2 are respectively connected with two input ends of the photoelectric isolation circuit, namely two input pins of a photoelectric coupler IC3 of the photoelectric isolation circuit and used for conducting the photoelectric coupler IC 3. The two input control ends input a switching-on electric signal to drive the conduction circuit to conduct the photoelectric coupler IC3 to conduct the solid-state switch circuit and supply power for the NB-IOT module, the current detection circuit and the temperature detection circuit. When the two input control ends are not powered, the relay does not work.
The protection circuit for driving the conducting circuit in the driving control circuit comprises a resistor R10, a light emitting diode D4 and a triode Q5, wherein one end of the resistor R10 is connected with an I/O port of a chip IC1 in the MCU circuit, the other end of the resistor R10 is connected with a base electrode of a triode Q5, a cathode of the light emitting diode D4 is connected with a collector of a triode Q5, an emitter of the triode Q5 and an anode of the light emitting diode D4 are respectively connected with the driving conducting circuit, specifically, an anode of a light emitting diode D4 is connected with an anode of the light emitting diode D3 in the control circuit, and an emitter of the triode Q5 is connected with a second pin of a photoelectric coupler IC3 in the control circuit.
When the two input control ends keep inputting a switching-on electric signal state, and the cloud server judges the temperature or the current of the relay to be abnormal according to a signal uploaded by the NB-IOT module, the MCU circuit receives a control signal for executing protection transmitted by the cloud server, at the moment, the MCU circuit outputs a high-level signal to the protection circuit to drive the transistor Q5 to be switched on, as the transistor Q5 is saturated and switched on, the tube voltage drop between the collector and the emitter is smaller than the switching-on voltage of the photoelectric coupler IC3, the photoelectric coupler IC3 is switched off, the solid-state switch circuit is switched off, the load circuit is switched off, the cloud server switches off the relay through the protection circuit, whether the photoelectric coupler IC3 is switched on or not or the threshold point of the switching-on is controlled by the cloud server, and.
Meanwhile, the cloud server can also realize a remote control function through a protection circuit, when the input end of the solid-state relay supplies power and the power supply state is maintained for a long time, even if the cloud server does not monitor a fault, when the load needs to be closed, the MCU circuit is controlled by the cloud server and sends a high-level signal, the drive conduction circuit cannot conduct the photoelectric coupler IC3 through the protection circuit, the photoelectric coupler IC3 is closed, and the load circuit is closed; on the contrary, the MCU circuit is controlled by the cloud server, does not send a high level signal, drives the conduction circuit to conduct the photoelectric coupler IC3, and the load circuit is switched on, so that the solid-state relay realizes the remote control function.
The photoelectric isolation circuit comprises a photoelectric coupler IC3, a resistor R6, a resistor R7, a resistor R8, a triode Q3, a thyristor Q4 and a rectifier bridge D1; the fourth pin of the photoelectric coupler IC3 is connected with one end of a resistor R6, the other end of a resistor R6 and one end of a resistor R7 are connected with the base electrode of a triode Q3, the other end of a resistor R7, one end of a resistor R8 and the anode of a thyristor Q4 are connected with the positive output end of a rectifier bridge D1, the third pin of the photoelectric coupler IC3, the emitter electrode of the triode Q3 and the cathode of a thyristor Q4 are connected with the negative output end of the rectifier bridge D1, the gate electrode of the thyristor Q4 and the other end of the resistor R8 are connected with the collector electrode of the triode Q3, and two input ends of the rectifier bridge D1 are respectively connected with two ends of the solid-state switching circuit.
The solid-state switching circuit comprises an electronic power device, and the electronic power device can be an IGBT power tube, a MOSFET power tube, an NPN power tube, a thyristor or the like. In this embodiment, the electronic power device is a triac Q1. Specifically, the solid-state switch circuit comprises a triac Q1, a capacitor C1, a resistor R1, a resistor R2 and a resistor R9, a main electrode T1 of the triac is connected with a current output end of a current detection circuit, one ends of a gate G and a resistor R1 of the triac are connected with one end of a photoelectric isolation circuit, one end of the resistor R9 is connected with the other end of the photoelectric isolation circuit, the other end of the resistor R9 is connected with a current input end of the current detection circuit, the other ends of the main electrode T2 and the resistor R1 of the triac Q1 are connected with one end of the resistor R2, the other end of the resistor R2 is connected with one end of the capacitor C1, and the other end of the capacitor C1 is connected with the other end of the resistor R9.
The solid-state relay of the Internet of things embeds the sensors (the current sensor and the temperature sensor) into the solid-state relay of the Internet of things, compared with the existing solid-state relay equipment, the Internet of things solid-state relay can sense the running conditions of the Internet of things solid-state relay and the load circuit thereof in the dangerous environment and the safety information in the peripheral environment, the current and temperature data of a plurality of internet-of-things solid-state relays with the same purpose are acquired and subjected to big data analysis by the cloud server, the temperature, the current and other information in a normal state are made into a mathematical model, when the monitored electric appliance parameter value obviously exceeds the connection of the mathematical model, or when the abnormal alarm value of the preset relay is approached, the early warning information is sent out, so that the system can sense in real time and make accurate identification and quick response.
As shown in fig. 2, based on the remote control function of the internet of things solid-state relay, a remote monitoring system is established, including cloud server, internet of things solid-state relay and by the load circuit of internet of things solid-state relay control, local control equipment are responsible for the circuit through the internet of things solid-state relay control that corresponds, and a plurality of internet of things solid-state relays are connected with cloud server, and cloud server is used for receiving the state information that internet of things solid-state relay uploaded, internet of things solid-state relay connects the power supply that is used for controlling load equipment in load circuit, state information includes electric current and temperature information, cloud server can to internet of things solid-state relay sends control signal makes internet of things solid-state relay switch on or break off load circuit. When the cloud server monitors that current information uploaded by the Internet of things solid-state relay is larger than a current threshold value or smaller than the current threshold value, or the cloud server monitors that temperature information uploaded by the Internet of things solid-state relay is larger than a temperature threshold value or smaller than the temperature threshold value, early warning information is sent and/or the Internet of things solid-state relay is disconnected.
As a preferred embodiment, the cloud server has an internet of things solid-state relay grouping function, groups a plurality of internet of things solid-state relays which are networked, and performs different monitoring protection configurations; the user can be according to the service environment of thing networking solid state relay, conditions such as the equipment of the load circuit of its control divide into groups, sets for the current threshold and the temperature threshold of each group thing networking solid state relay, and when sending out early warning information and monitoring that the current information that certain thing networking solid state relay uploaded is greater than the current threshold of corresponding group, perhaps is less than the current threshold of corresponding group, perhaps monitors that the temperature information that certain thing networking solid state relay uploaded is greater than the temperature threshold of corresponding group, perhaps is less than the temperature threshold of corresponding group, sends out early warning information andor disconnection thing networking solid state relay. It should be noted that the current threshold and the temperature threshold herein do not refer to a rated current or an overload current of the internet of things solid-state relay or an applicable temperature threshold of the internet of things solid-state relay, and the protection of the rated current or the overload current or the applicable temperature threshold is generally performed by self-protection through an MCU circuit of the internet of things solid-state relay; the current threshold and the temperature threshold refer to monitoring of a load circuit controlled by the Internet of things solid-state relay, and the cloud server protects the load circuit based on information uploaded by the Internet of things solid-state relay. For example, the temperature signal is uploaded to the cloud server by the Internet of things solid-state relay, the Internet of things solid-state relay and the load equipment connected to the load circuit are arranged nearby, and the temperature signal of the Internet of things solid-state relay can reflect the temperatures of the Internet of things solid-state relay, the load equipment and the working environment of the Internet of things solid-state relay and the load equipment simultaneously. The current signal that thing networking solid state relay uploaded to cloud ware has also reflected load device's power consumption condition.
As a more preferable embodiment, the cloud server groups a plurality of internet of things solid-state relays which are networked, analyzes the collected current and temperature data of the internet of things solid-state relays which are in the same group, makes a mathematical model of the temperature and current information in a normal state, and sends out early warning information and/or disconnects the internet of things solid-state relays when the parameter values of the temperature and the current of the internet of things solid-state relays which are in the group are monitored to be obviously beyond the corresponding threshold values of the mathematical model or under the condition of being close to a preset abnormal alarm value of the relay. For example, when 1000 internet of things solid-state relays monitored simultaneously have a working environment similar to that of the load circuit, one of the internet of things solid-state relays has current or temperature information obviously higher or lower than that of the other internet of things solid-state relays, which indicates that the working environment or the load circuit may have an abnormality.
For example, a simplest mathematical model is an average mode, the cloud server performs average calculation (which may be a real-time data average value, or an average value combining long-term use data) on the collected current and temperature information of the internet of things solid-state relays in the same group respectively to obtain a current average value and a temperature average value, weights the current average value to determine a maximum current threshold value and/or a minimum current threshold value, and weights the temperature average value to determine a maximum temperature threshold value and/or a minimum temperature threshold value. For example, the maximum current threshold is 130% of current mean value weighting, the minimum current threshold is 50% of current mean value weighting, and when the cloud server monitors that the current value of a certain internet of things solid-state relay in the group is larger than the maximum current threshold or smaller than the minimum current threshold, the cloud server sends out early warning information or disconnects the internet of things solid-state relay. For example, the maximum temperature threshold is 120% of the weighted average value of the temperature, the minimum temperature threshold is 60% of the weighted average value, and when the cloud server monitors that the temperature value of a certain internet of things solid-state relay in the group is greater than the maximum temperature threshold or less than the minimum temperature threshold, the cloud server sends out early warning information and or disconnects the internet of things solid-state relay.
As an embodiment mode of another mathematical model, the cloud server makes a mathematical model of a fitting curve based on the collected temperature and current information, fits the temperature and/or current information as variables to obtain the fitting curve, moves according to a certain proportion based on the fitting curve to obtain a maximum threshold curve and/or a minimum threshold curve, obtains the maximum threshold curve if moving upwards, obtains the minimum threshold curve if moving downwards, sends out early warning information and/or disconnects the internet of things solid-state relay when the cloud server monitors that the temperature and/or current variables of a certain internet of things solid-state relay of the group are located outside the maximum threshold curve and the minimum threshold curve, and the fitting method can be a least square method, a newton interpolation method and the like.
Of course, the mathematical model may also be a square error method, a deep learning-based model, or the like.
As a preferred scheme, as shown in fig. 2, an operation platform of software is provided on the cloud server, and the user performs corresponding monitoring management through the operation platform, including user management, permission setting, networking and grouping of the internet of things solid-state relays, setting of a threshold, selection of a mathematical model (a system is preset with multiple mathematical models, and the mathematical model is used for self-defining monitoring as well), and the like.
The internet of things solid-state relay and the load circuit controlled by the internet of things solid-state relay can be multiple, the internet of things solid-state relay and the load circuit are controlled by the same cloud server and the operation platform to form a remote centralized control system, and when a fault occurs, a user can realize point-to-point or centralized protection on related equipment based on the cloud server.
The remote monitoring system can also be applied to an industrial safety production management system, the solid-state relay uploads temperature or current information to the cloud server, the cloud server carries out big data operation and processing on the acquired state information, when parameter data are found to have abnormal trends, abnormal information can be found in early stage, such as component aging, poor wiring of a circuit, and bad information such as overload and rotation blockage of load equipment, and the cloud server sends out early warning or directly carries out fault protection.
The remote monitoring system of this embodiment makes thing networking solid state relay control load circuit under the control of cloud ware and has realized remote control, and simultaneously, thing networking solid state relay uploads state information to the cloud ware, makes the operating platform in time acquire thing networking solid state relay and load circuit's operating condition, has realized remote monitoring, and the monitoring that is applicable to in particular to chemical industry, light industry etc. have the contamination field and inconvenient workplaces that carry out real time monitoring such as smelting pot, oil well.
Preferably, the cloud server can also be used for monitoring the service life of the load equipment, the cloud server records the original state parameters of the internet of things solid-state relay and the original parameters of the load equipment connected to the load circuit, the original parameters of the internet of things solid-state relay and the original parameters of the load equipment comprise service life attenuation curves, the Internet of things solid-state relay uploads a current signal to the cloud server when being turned on and off every time, the cloud server calculates the electricity service life of the Internet of things solid-state relay by counting the times of uploading the current signal by the Internet of things solid-state relay and combining the original state parameters of the Internet of things solid-state relay, meanwhile, the opening and closing of the solid state relay of the Internet of things are related to the opening and closing of load equipment connected with a load circuit, when the cloud server obtains the electricity life of the Internet of things solid-state relay according to the counted current signal times, the electricity life of the load equipment can be calculated. For example, the electricity life of thing networking solid state relay is 10000 times, and load device's electricity life is 5000 times, and when thing networking solid state relay opened with or closed reach 4500 times, the cloud server can remind the change load device, and when thing networking solid state relay opened with or closed reach 9000 times, the cloud server can remind the change thing networking solid state relay. The cloud server acquires state information of the Internet of things solid-state relay connected with the cloud server, determines the turn-on and/or turn-off times of the relay, and compares the turn-on and/or turn-off times with the acquired rated service life threshold of the Internet of things solid-state relay to obtain the electric service life of the Internet of things solid-state relay; and the cloud server also acquires a load electrical life threshold of the load equipment corresponding to the Internet of things solid-state relay connected with the cloud server, determines the turn-on and/or turn-off times of the load equipment based on the state information uploaded by the Internet of things solid-state relay, and compares the turn-on and/or turn-off times with the load electrical life threshold to obtain the electrical life of the load equipment.
For example, an embodiment is provided in which a remote monitoring system is applied to the fields of chemical industry, light industry and the like with pollution, a load circuit in the remote monitoring system is a sewage valve circuit, state information uploaded to a cloud server by an internet of things solid-state relay includes a current signal, and the current signal is used for feeding back an on-off state of the internet of things solid-state relay and an on-off state of the sewage valve circuit. Compare with current blowdown control and monitored control system, this application has more directness, more accurate advantage, need not to reform transform blowdown valve circuit or blowdown motor, for example when the electric current signal that thing networking solid state relay uploaded is greater than blowdown valve and opens the threshold value, explains that the blowdown valve opens, is in the blowdown state, otherwise the blowdown valve is in the closed condition. The cloud server records the opening times of the blowdown valve circuit based on the acquired current signal, is used for calculating the service life of the blowdown valve and reminds when the service life is close to the service life. Meanwhile, the service condition of the blowdown valve is monitored based on the current signal, and when abnormal current is excessive or too small in advance, the solid-state relay of the Internet of things is alarmed, prompted or turned off.
The utility model provides a remote monitering system is applied to the oil well field, load circuit among the remote monitering system is the petroleum equipment circuit, and the state information that thing networking solid state relay uploaded to cloud server includes current signal and temperature signal, current signal is used for opening and close state and the petroleum equipment circuit of the state of opening and close of feedback thing networking solid state relay, temperature signal is used for feeding back thing networking solid state relay's temperature and oil well equipment's temperature, is applicable to the application environment that the petroleum equipment dispersion was laid. The user sets up through the operation platform, the thing networking solid state relay that is used for controlling oil well equipment that will be connected with cloud ware is divided into groups, the mathematical model that the current and the temperature information that set up adoption Newton's interpolation method carry out the fitting is monitored (can wrap the data that include the oil well equipment of storage before, also can include the data of gathering afterwards), the fitting curve that obtains based on mathematical model, obtain maximum threshold value curve and minimum threshold value curve, when cloud ware monitored that electric current and the temperature variation of a certain thing networking solid state relay lie in outside maximum threshold value curve and the minimum threshold value curve, send early warning information andor disconnection thing networking solid state relay.
Of course, the remote monitoring system can also be applied to heating furnace equipment, and can also be suitable for places where operators such as wind energy and the like are not easy to reach, or where detectors are inconvenient to reach the site, such as meteorological or geological disaster monitoring equipment.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (11)
1. The utility model provides a thing networking solid state relay which characterized in that: the photoelectric isolation circuit comprises a control circuit, a photoelectric isolation circuit, a solid-state switch circuit, an NB-IOT module, a current detection circuit and a temperature detection circuit;
the control circuit is connected with the input control end and comprises a power supply circuit and a driving conduction circuit, the power supply circuit is used for supplying power to the NB-IOT module, the current detection circuit and the temperature detection circuit, and the driving conduction circuit conducts or breaks the solid-state switch circuit through the photoelectric isolation circuit to enable the load circuit of the relay to be conducted or broken;
the NB-IOT module is used for being connected with the cloud server, the NB-IOT module comprises an MCU circuit, the MCU circuit is connected with a drive conduction circuit, a current detection circuit and a temperature detection circuit, the current detection circuit is connected between the solid-state switch circuit and the load circuit in series and used for detecting current signals flowing through the solid-state switch circuit, the temperature detection circuit is used for detecting the internal temperature of the solid-state relay, and the MCU circuit is used for processing and uploading the temperature and the current signals to the cloud server.
2. The internet of things solid-state relay according to claim 1, wherein: the photoelectric isolation circuit comprises a photoelectric coupler IC3, a switch-on signal is input at an input control end, a control circuit generates a current signal and a voltage signal, the current signal is used for driving the photoelectric coupler IC3 to be switched on so as to switch on the solid-state switch circuit, and the voltage signal is used for supplying power for the NB-IOT module, the current detection circuit and the temperature detection circuit; the NB-IOT module, the current detection circuit and the temperature detection circuit do not work when the input end does not receive the connection signal.
3. The internet of things solid-state relay according to claim 1, wherein: the NB-IOT module further comprises a transparent transmission module, and the transparent transmission module is used for transmitting the signals processed by the MCU circuit to the cloud server.
4. The internet of things solid-state relay according to claim 1, wherein: the MCU circuit further comprises a protection circuit, the protection circuit is controlled by the cloud server and is connected with the drive conducting circuit, when the input control end inputs a switch-on signal, the NB-IOT module can receive a switch-off control signal from the cloud server, and the drive conducting circuit is switched off through the protection circuit to switch off a load circuit of the relay.
5. The internet of things solid state relay of claim 4, wherein: the MCU circuit comprises a chip IC1, the IC1 is provided with a plurality of I/O ports for transmitting signals, and the signal output end of the current detection circuit, the signal output end of the temperature detection circuit and the signal output end of the protection circuit are respectively connected with the three I/O ports; the protection circuit comprises a resistor R10, a light emitting diode D4 and a triode Q5, wherein one end of the resistor R10 is connected with an I/O port of the IC1, the other end of the resistor R10 is connected with a base electrode of the triode Q5, a cathode of the light emitting diode D4 is connected with a collector of the triode Q5, and an emitter of the triode Q5 and an anode of the light emitting diode D4 are respectively connected with a driving conduction circuit.
6. The internet of things solid-state relay according to claim 1, wherein: the temperature detection circuit comprises a temperature sensor IC2, and a signal output pin DQ of the temperature sensor IC2 is connected with the MCU circuit of the NB-IOT module; and a signal output pin DQ of the temperature sensor IC2 is connected with a power supply circuit through a resistor R5.
7. The internet of things solid-state relay according to claim 1, wherein: the current detection circuit comprises a current sampling chip IC4, a capacitor C3 and a capacitor C4, wherein a current signal output end VIOUT of the current sampling chip IC4 is connected with an MCU circuit of the NB-IOT module, one end of the capacitor C3 is connected with a current signal output end VIOUT of the current sampling chip IC4, one end of the capacitor C4 and a power supply end VCC of the current sampling chip IC4 are connected with a power supply circuit of the control circuit, and the other ends of the capacitor C3 and the capacitor C4 and a ground end GND of the current sampling chip IC4 are connected with GND.
8. The internet of things solid-state relay according to claim 1, wherein: the control circuit is connected with the two input control ends and comprises a resistor R3, a resistor R4, a capacitor C2, a capacitor C5, a triode Q2, a light-emitting diode D3 and a diode D2, one end of the resistor R3 is connected with an input control end, the other end of the resistor R3 is connected with the resistor R4 and the collector of the triode Q2 respectively, the emitter of the triode Q2 is used for supplying power for the MCU circuit, the temperature detection circuit and the current detection circuit, the other end of the resistor R4 is connected with the anode of the capacitor C5, one end of the capacitor C2 and the anode of the light-emitting diode D3 are connected with the base of the triode Q2, the cathode of the light-emitting diode D3 and the anode of the diode D2 are connected with two input ends of the photoelectric isolation circuit respectively, and the cathode of the capacitor C5, the other end of the capacitor C2 and the cathode of the diode D2 are connected with the other input control end and are connected with GND.
9. The internet of things solid-state relay according to claim 1, wherein: the photoelectric isolation circuit comprises a photoelectric coupler IC3, a resistor R6, a resistor R7, a resistor R8, a triode Q3, a thyristor Q4 and a rectifier bridge D1;
the fourth pin of the photoelectric coupler IC3 is connected with one end of a resistor R6, the other end of a resistor R6 and one end of a resistor R7 are connected with the base electrode of a triode Q3, the other end of a resistor R7, one end of a resistor R8 and the anode of a thyristor Q4 are connected with the positive output end of a rectifier bridge D1, the third pin of the photoelectric coupler IC3, the emitter of the triode Q3 and the cathode of a thyristor Q4 are connected with the negative output end of the rectifier bridge D1, the gate of the thyristor Q4 and the other end of the resistor R8 are connected with the collector of the triode Q3, and two input ends of the rectifier bridge D1 are respectively connected with two ends of the solid-state switching circuit.
10. The internet of things solid-state relay according to claim 1, wherein: the solid-state switch circuit comprises a bidirectional thyristor Q1, a capacitor C1, a resistor R1, a resistor R2 and a resistor R9, a main electrode T1 of the bidirectional thyristor is connected with a current output end of a current detection circuit, one ends of a gate G and a resistor R1 of the bidirectional thyristor are connected with one end of a photoelectric isolation circuit, one end of a resistor R9 is connected with the other end of the photoelectric isolation circuit, the other end of the resistor R9 is connected with a current input end of the current detection circuit, the other ends of a main electrode T2 and a resistor R1 of the bidirectional thyristor Q1 are connected with one end of a resistor R2, the other end of the resistor R2 is connected with one end of a capacitor C1, and the other end of a capacitor C1 is connected with the other end of a resistor.
11. The internet of things solid-state relay according to claim 1, wherein: the solid-state switching circuit comprises an electronic power device, and the electronic power device is an IGBT power tube or an MOSFET power tube or an NPN power tube or a thyristor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021900167.0U CN212694271U (en) | 2020-09-03 | 2020-09-03 | Thing networking solid state relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021900167.0U CN212694271U (en) | 2020-09-03 | 2020-09-03 | Thing networking solid state relay |
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| Publication Number | Publication Date |
|---|---|
| CN212694271U true CN212694271U (en) | 2021-03-12 |
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| CN202021900167.0U Active CN212694271U (en) | 2020-09-03 | 2020-09-03 | Thing networking solid state relay |
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| CN (1) | CN212694271U (en) |
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