CN212682786U - Laser processing system with power correction function - Google Patents

Abstract

The utility model discloses a laser processing system with power correction function, which adds a power feedback correction device in the original laser processing system, comprising an electric adjustable laser attenuator and a B/S spectroscope which are sequentially arranged on the light path between each beam expander at the end of the system and each pair of scanners corresponding to the beam expander, a photodiode which is arranged corresponding to each B/S spectroscope and is used for receiving 1% of reflected light of the B/S spectroscope, and an industrial personal computer which is simultaneously electrically connected with each photodiode and the electric adjustable laser attenuator; the industrial personal computer is used for detecting whether the power of the laser beams emitted by each electric adjustable laser attenuator is consistent or not and recording the minimum power value; and the power of the laser beam emitted by the laser attenuator is adjusted to be consistent with the minimum power through the electric adjustable laser attenuator. The utility model discloses can ensure the uniformity of laser beam machining system processing effect, improve processingquality.

Description

Laser processing system with power correction function

Technical Field

The utility model relates to a laser beam machining system with power correction function.

Background

A laser processing system generally refers to a system that transmits a laser beam emitted from a laser oscillator by a laser beam transmitting device and performs tasks such as punching, marking, or welding by irradiating the laser beam onto a substrate to be finally processed.

Conventional laser processing systems often include only a laser oscillator, a beam splitter, two pairs of scanners, and a scan lens. The laser beam emitted from the single laser oscillator is divided into two laser beams each having a ratio determined by the beam splitter, and the two divided laser beams pass through paths different from each other to be respectively deflected to desired positions on the substrate by the two pairs of scanners, and finally are respectively condensed by the single scanning lens and irradiated onto the substrate.

As the cost of electric and electronic devices employing semiconductors has recently decreased due to mass production of semiconductors, a Unit Per Hour (UPH) realized in a single process system is an important factor in the current field of manufacturing semiconductor process equipment. However, since there is a limitation in UPH due to the division of a single laser beam into two laser beams, the conventional laser processing system is limited to be improved as a single processing system. In addition, the conventional laser processing system has the disadvantages that the laser beam cannot be separated or used completely according to the selection of the user, and the flexibility and the response are poor. And when there is a problem with any one of the plurality of members forming the laser beam delivery device, it will result in the entire conventional laser processing system being inoperable.

For this reason, the applicant has improved the conventional laser processing system, and has designed an improved device for upgrading, specifically, see patent No. ZL200810091169.7 issued. A laser processing system (apparatus) disclosed therein can divide a single laser beam into four or more laser beams and condense each of the laser beams thereon using a single scanning lens. The core of the design of this patent is the selective use and separation of the laser beam by the separation device. A plurality of laser beams separated from a single laser beam are irradiated on a substrate for processing and thus the consumed time for processing of each substrate is reduced and realization of UPH in a single processing system can be maximized. In addition, four pairs of scanners and a single scanning lens are combined to correspond to each other to construct one laser processing system, so that the manufacturing cost of the single laser processing system can be reduced compared to a conventional laser processing system in which a pair of scanners and a single scanning lens correspond to each other.

Further, the laser beam traveling path is adjusted by the reciprocating unit including the beam splitting unit and the beam penetrating unit, and the laser processing system can be operated even if any of the components forming the entire laser processing system has a problem. The stability of production is thus improved and the additional purchase expenditure for replacing damaged components is reduced.

As is known, when the laser processing system is applied in the industry, a control system is used in combination, and such a control system mainly uses an industrial personal computer to control the laser processing power. The industrial personal computer is generally internally provided with laser processing control software, can set and control various power parameters, laser action paths and the like of a laser processing system, and is a common technology in the industry.

However, the existing multi-beam laser processing system has exposed the following problems in long-term use:

the optical path of such a system is long, and the power consistency is deteriorated due to the loss of the optical components in the optical path, thereby affecting the consistency of the processing effect, and the existing control system cannot automatically and effectively adjust the power of the multiple laser beams. For this reason, there is currently no better solution other than replacing the worn component.

Disclosure of Invention

The utility model discloses the purpose is: a laser processing system with power correction function is provided, which can correct laser beams emitted to a processed substrate in multiple paths to be consistent in power and the same as preset power, thereby ensuring the consistency of processing effect of the laser processing system and improving the processing quality.

The technical scheme of the utility model is that: a laser processing system with power correction, comprising:

a laser oscillator for emitting laser beam, and a separation device group with more than three stages, wherein the number of separation devices in the separation device group with nth stage is A =2^n-1N is a positive integer; the separation devices in the separation device group at the next stage are paired, and the pairs of the separation devices correspond to the separation devices in the separation device group at the previous stage one by one; any separating device in the former-stage separating device set and a pair of separating devices corresponding to the separating device in the latter-stage separating device set form a light splitting unit set together,

each separating device of the previous stage can selectively separate the laser beam incident thereon to travel along at least one path of a pair of paths; one of the separating devices of the next-stage pair of separating devices can selectively separate the laser beam incident along one of the paths of the previous pair so as to travel along at least one path of the new pair of paths, and the other separating device of the pair can selectively separate the laser beam incident along the other path of the pair so as to also travel along at least one path of the new pair of paths;

further comprising, for the scanners, the laser beams passing through the respective separating means of the last-stage separating means group are incident on the respective scanners so as to be each deflected to a desired position of the substrate to be processed thereby;

a single scanning lens on which the laser beam passed through the pair of scanners B is incident so as to be condensed on a spot having a predetermined diameter and irradiated on the substrate; and

b beam expanders disposed on an upstream side of the B pairs of scanners for adjusting a diameter of each of the laser beams, wherein the B beam expanders correspond to the each of the laser beams, respectively, wherein each of the B pairs of scanners includes an X-axis galvanometer scanner for controlling an incident laser beam to an X-axis direction and a Y-axis galvanometer scanner for controlling an incident laser beam to a Y-axis direction; b is the number of separating devices in the last stage separating device group;

the power feedback correction device comprises an electric adjustable laser attenuator, a B/S spectroscope, a photodiode and an industrial personal computer, wherein the electric adjustable laser attenuator and the B/S spectroscope are sequentially arranged on a light path between each beam expander and a pair of scanners corresponding to the beam expander, the photodiode is arranged corresponding to each B/S spectroscope and is used for receiving 1% of reflected light of the B/S spectroscope, and the industrial personal computer is simultaneously electrically connected with each photodiode and the electric adjustable laser attenuator; the industrial personal computer is used for detecting whether the power values of the laser beams emitted by the electric adjustable laser attenuators are consistent or not and recording the minimum power value; and then the power value of each laser beam emitted by the electric adjustable laser attenuator is adjusted to be consistent with the minimum power value.

Further, the utility model discloses in power feedback correcting unit is still including the laser power detector who is used for detecting the actual output power value who shines the laser beam on the substrate, and the automatic power calibrator APC of being connected with the laser power detector electricity, automatic power calibrator promptly, and automatic power calibrator with the industrial computer electricity is connected for power analog value signal conversion that detects the laser beam that obtains with the laser power detector gives the industrial computer digital signal transmission, and the actual output power value that differentiates the laser beam that detects by the laser power detector when the industrial computer is different with presetting the power value, will be by the laser beam power value that has been adjusted unanimously of its outgoing by each electronic adjustable laser attenuator of industrial computer control and adjust to all with presetting the power value the same.

The laser power detector, that is, the laser power detection probe, can be held by hand or fixed by a bracket or a mechanical arm to measure the laser beam power. For example, Iisrael OPHIR corporation, model number F100A-PF-DIF-18, FL250A-BB-35, L300W-LP, 1000W-LP, 100K-W, etc.

An automatic power calibrator, abbreviated as APC, that is, a laser power meter, is a common device in the industry, can be developed by each company or purchased from the market directly, has functions of displaying a power value and performing digital-to-analog conversion, and functions to convert a power analog value signal detected and obtained by a laser power detector into a digital signal so as to transmit the digital signal to an industrial personal computer so as to be identified by laser processing control software installed inside the industrial personal computer. For example, a VEGA model by the company OPHIR, israel.

The utility model provides an electronic adjustable laser attenuator, for known technique in the trade, it installs the polarization beam direction of incident with rotatable half-wave plate. By rotating the half-wave plate through a rotating shaft driven by a motor, the ratio of the light intensity of s light to the light intensity of p can be continuously changed without changing the parameters of the light intensity ratio. Thus, the intensity of the outgoing light beam and the s/p intensity ratio can be adjusted over a large range. The p light can be completely transmitted, the s light is almost zero, the intensity of the s light can be maximized, and the intensity of the p light is almost zero, so that the emergent power of the laser beam is changed. Such as the LPA-a model of the Optogama corporation.

The utility model provides an industrial computer is equipment commonly used in laser beam machining control field, for example, the IPC-610-H model industrial computer of the company of studying china, and the inside mountable laser beam machining control software of this kind of industrial computer for set for and control the various power parameters of laser beam machining system, be familiar for technical personnel in the field.

Further, in the present invention, for the three separation devices in each of the light splitting unit groups, at least one is a reciprocating unit including a beam separating unit reflecting a portion of the incident laser beam and allowing the remaining portion of the incident laser beam to penetrate, a beam penetrating unit allowing the entire incident laser beam to penetrate, and a transfer device changing a position of the beam separating unit or the beam penetrating unit so that the laser beam is incident on any one of the beam separating unit and the beam penetrating unit.

Further, the beam splitting unit of the present invention is a beam splitter, which reflects 50% of the incident laser beam and allows the remaining 50% of the incident laser beam to penetrate.

Further, the beam penetration unit of the present invention is a through lens, and the through lens allows more than 99% of the incident laser beam to penetrate.

Further, in the present invention, the transfer device includes a support bracket supporting the beam splitting unit and the beam penetrating unit and a power transmission unit transmitting driving power of the driving source to the support bracket to thereby move the support bracket back and forth in the left and right directions, a driving source and a power transmission unit.

Further, in the present invention, for the three separation devices in each light splitting unit group, at least one is an acousto-optic modulator AOM which emits an incident laser beam after modulating the laser beam using an acoustic wave, the acousto-optic modulator emitting the laser beam by dividing the laser beam into two beams traveling along different paths from each other or by adjusting the light quantity of the incident laser beam so that the laser beam travels along a single path.

Further, in the present invention, for the three separation devices in each light splitting unit group, at least one is an electro-optical modulator EOM that emits an incident laser beam after modulating the laser beam using an electric field, the electro-optical modulator adjusting the light quantity of the incident laser beam and emitting the laser beam so that the laser beam travels along a single path.

Further, the utility model discloses well laser beam shines and is used for punching, beating mark or welding to the substrate on the substrate.

The utility model discloses a laser processing system according to actual need, can be used for punching, beating mark or welding. Depending on the combination of the separating devices and on the selective function of the separating devices for separating or transmitting incident beams, the separating devices can separate single laser beams into 2 or 3 or more than 4 laser beams. By means of the power feedback correction device, the working quality of the system is further improved.

The operation process of the power feedback correction device comprises the following steps:

(1) power harvesting for a laser beam that is about to enter each pair of scanners

Before entering a corresponding pair of scanners, the main laser beams emitted by each beam expander pass through the electric adjustable laser attenuator and are refracted and reflected by the B/S spectroscope, wherein 1% of reflected light is captured by the photodiode, converted into electric signals and input into the industrial personal computer, and the industrial personal computer acquires the corresponding power value of the main laser beams.

(2) Power is initially corrected to a minimum value

The industrial personal computer judges the power value of each main laser beam through comparison, if the power values are not consistent, the power value of the laser beam with the minimum detection power is recorded as a power reference value, the power reference value is fed back to each electric adjustable laser attenuator, and the power value of each path of corresponding main laser beam is adjusted to be consistent with the power reference value.

(3) Collecting the actual output power of the laser beam irradiated on the processed substrate

Detecting the actual output power value of any laser beam irradiated on the substrate by using a laser power detector, wherein the power value is an analog signal and is transmitted to an automatic power calibrator, and the power value is converted into a digital signal by the automatic power calibrator and then is transmitted to an industrial personal computer;

(4) correcting the actual output power of the laser beam irradiated onto the substrate to be processed to a standard value

As in the known art, the industrial personal computer is installed with laser processing control software for setting and controlling various power parameters of the laser processing system. In actual processing, according to different requirements of a processed substrate, a processor can preset a power value required by laser processing (namely, a laser beam output to the substrate) through an industrial personal computer, and the power value is called as a preset power value; the industrial personal computer judges whether the actual output power value of the laser beam detected by the laser power detector is the same as the preset power value, if not, the industrial personal computer controls each electric adjustable laser attenuator to adjust the power value of the laser beam emitted by the electric adjustable laser attenuator to be the same as the preset power value.

The utility model has the advantages that:

(1) the utility model discloses on original laser processing system basis, further increased power feedback correcting unit, it can be unanimous to the power with the laser beam correction of multichannel outgoing on to the processed substrate to it is the same with the predetermined power, thereby ensures the uniformity of this type of laser processing system processing effect, improves processingquality.

(2) The utility model discloses in one set of power feedback correcting unit who increases, it has high automation to the correction of laser beam power and execution, can avoid frequently changing among the common technique or replace loss and the inconvenience that spare part caused, effectual saving manufacturing cost.

(3) The utility model discloses in one set of power feedback correcting unit that increases, it itself does not have any improvement and interference to original laser beam machining system, can remain original laser beam machining system's functional advantage and characteristic.

Drawings

The invention will be further described with reference to the following drawings and examples:

fig. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a perspective view of the four pairs of scanners and a single scanning lens of FIG. 1;

FIG. 3 is a schematic view of the incident area of each laser beam incident on the single scan lens shown in FIG. 2;

FIG. 4 is a perspective view of the reciprocating unit of the embodiment of FIG. 1;

FIG. 5 is a front view of the reciprocating unit of the embodiment of FIG. 1;

fig. 6 is a schematic diagram of an execution flow of the middle power feedback correction device of the present invention.

Detailed Description

The invention will be described in more detail below with reference to the appended drawings, in which exemplary embodiments of the invention are shown.

Referring to fig. 1, the laser processing system 100 of the present embodiment is configured to converge four laser beams divided from a single laser beam by using a single scan lens 150. The laser processing system 100 includes a laser oscillator 101, a reciprocating unit 120 as first, second and third separating means, respectively, four pairs of scanners 140, a single scanning lens 150, and an additional power feedback correction means.

The laser oscillator 101 generates a laser beam as an energy source for the laser processing. The laser oscillator 101 capable of generating a laser beam (for example, ultraviolet rays, visible rays, and infrared rays) having a wavelength selected from various wavelengths and most suitable for a desired process is selected according to the type of the substrate 2 to be processed or the processing method.

The first, second and third separating devices selectively separate the incident laser beam to travel (or propagate) along at least one of a pair of paths. The laser beam emitted from the laser oscillator 101 is incident on the first separating means to be reflected on and/or pass through the first separating means.

In this embodiment, the reciprocating unit 120 serves as each of the first, second and third separating means and each of the reciprocating units 120 includes a beam separating unit 121, a beam penetrating unit 122, and a transferring means. The first, second and third separating devices having the reciprocating unit 120 constitute a spectroscopic unit train.

The beam splitting unit 121 splits an incident laser beam into two laser beams. The beam splitting unit 121 thus reflects one laser beam to the side on which the laser beam is incident, and the other laser beam penetrates to the side opposite to the side on which the laser beam is incident. In this embodiment, a beam splitter, which splits an incident laser beam into two laser beams each having 50% of the total energy of the incident laser beam, is used as the beam splitting unit 121. In the beam splitter, a reflective film having a reflectivity of about 50% is coated on one surface on which the laser beam is incident, and an anti-reflective film having a transmittance of about 99.9% is coated on the other surface through which the split laser beam passes.

The beam penetration unit 122 allows the incident laser beam to penetrate to the opposite side on which the laser beam is incident. In this embodiment, a member in which a penetrating hole is formed in the middle is used as the beam penetrating unit 122. Meanwhile, a penetration mirror through which more than 99% of the incident laser beam passes may be used as the beam penetration unit 122, and antireflection films having a transmittance of about 99.9% are coated on both sides of the through lens.

The transfer device changes the position of the beam splitting unit 121 or the beam penetrating unit 122 so that the laser beam incident on the side of the transmission unit 120 is incident on at least one of the beam splitting unit 121 and the beam penetrating unit 122, and includes a support bracket 123, a base 127, a driving source, and a power transmission unit.

As shown in fig. 4 and 5, the support bracket 123 supports the beam splitting unit 121 and the beam penetrating unit 122. The driving source supplies energy to move the support bracket back and forth in the left-right direction, and the motor 124 mainly serves as the driving source. The support bracket 123 is configured to move in the right-and-left direction with respect to a base 127, and the motor 124 is fixed to the base 127. The power transmission unit may report the pinion member 125 and the rack member 126. The pinion member 125 is coaxially connected to a rotation shaft of the motor 124 and is engaged with the rack member 126 fixed to the support bracket 123. When the motor 124 and the pinion member 125 rotate forward or backward, the rack member 126 engaged with the pinion member 125 moves linearly in the left-right direction, and the support bracket 123 to which the rack member 126 is fixed moves together with the rack member 126, and thus, the positions of the beam splitting unit 121 and the beam penetrating unit 122 can be changed.

Since the position of the beam splitting unit 121 or the beam penetrating unit 122 may be changed, the traveling path of the laser beam may be controlled, that is, when the beam splitting unit 121 is located on the traveling path of the laser beam, a part of the incident laser beam is reflected from the incident surface of the beam splitting unit 121 to the side on which the laser beam is incident, and the remaining laser beam is penetrated to the opposite side on which the laser beam is incident. Meanwhile, when the beam penetration unit 122 is located on the traveling path of the laser beam, the entire incident laser beam penetrates to the opposite side to which the laser beam is incident.

The laser beam passing through the reciprocating unit 120 and reflected from the reflecting mirror 102 is incident on the beam expander 130. If the diameter of the laser beam is adjusted by the beam expander 130, the focusing distance at which the laser beam is condensed and the size of the condensed spot can be changed by the scanning lens 150, and thus various processing methods and types of the substrate 2 can be used. The beam expanders 130 are arranged on the upstream side of the four pairs of scanners 140. There are four beam expanders 130 corresponding to the four laser beams, respectively.

As shown in connection with fig. 2 and 3, four pairs of scanners 140 deflect the incident laser beam to a desired location on the substrate 2 and typically include an X-axis galvanometer scanner for controlling the incident laser beam in the X-axis direction and a Y-axis galvanometer scanner for controlling the incident laser beam in the Y-axis direction. Each pair of scanners 140 means a pair of scanners comprising an X-axis galvanometer scanner and a Y-axis galvanometer scanner. In this embodiment, there are four pairs of scanners 140 corresponding to the four laser beams, respectively.

As still shown in fig. 2 and 3 in conjunction, the single scanning lens 150 condenses the laser beams incident on the four pairs of scanners 140 onto a spot having a predetermined diameter and irradiates the condensed laser beams onto the substrate 2 to be processed. In this embodiment, four laser beams are incident on the incident surface 151 of the single scan lens 150. As shown in fig. 3, each of the laser beams passing through the four pairs of scanners 140 is incident on one side of a single scanning lens 150 to form one of the incident regions 103 on an incident surface 151 of the scanning lens 150, respectively. In general, an f-theta lens may function primarily as the scan lens 150.

The added power feedback correction device is the key point of the improvement of the scheme, and is composed of four electric adjustable laser attenuators 170, four photodiodes 180, four B/S spectroscopes 190, an industrial personal computer 201, an automatic power calibrator 202 and a single laser power detector 203.

In this embodiment, four electrically adjustable laser attenuators 170 are respectively disposed corresponding to the four beam expanders 130 and the four pairs of scanners 140. An electrically adjustable laser attenuator 170 and a B/S beam splitter 190, and a photodiode 180 disposed corresponding to each B/S beam splitter 190 for receiving 1% of the reflected light of the B/S beam splitter 190, are sequentially disposed on the optical path between the reflecting mirror 120 at the exit end of each beam expander 130 and the corresponding pair of scanners 140.

The industrial personal computer 201 is simultaneously electrically connected with each photodiode 180 and the electric adjustable laser attenuator 170; the industrial personal computer 201 is used for detecting whether the power values of the laser beams emitted by the electric adjustable laser attenuators 170 are consistent and recording the minimum power value; the power value of each laser beam emitted by the electrically adjustable laser attenuator 170 is adjusted to be consistent with the minimum power value.

The laser power detector 203 is used for detecting the actual output power value of the laser beam irradiated on the substrate 2, the automatic power calibrator 202 is electrically connected with the laser power detector 203 and is also electrically connected with the industrial personal computer 201, the automatic power calibrator 202 is used for converting a power analog value signal of the laser beam obtained by the detection of the laser power detector 203 into a digital signal and transmitting the digital signal to the industrial personal computer 201, and when the industrial personal computer 201 judges that the actual output power value of the laser beam detected by the laser power detector 203 is different from a preset power value, the industrial personal computer 201 controls each electric adjustable laser attenuator 170 to adjust the power value of the laser beam emitted by the electric adjustable laser attenuator 170 to be the same as the preset power value.

A laser beam travel path in the laser processing system 100 according to an embodiment of the present invention will be described below with reference to fig. 1 to 5. First, the following case is described: the reciprocating unit 120 is adjusted so that the beam splitting unit 121 is located on the traveling path of the laser beam.

The laser beam emitted from the laser oscillator 101 is incident on one side of the beam splitting unit 121 of the shuttle unit 120 and a single laser beam is split into two laser beams by the beam splitting unit 121. The laser beam reflected by the beam splitting unit 121 travels along a first path 161a on the laser incident side, while the laser beam penetrating the beam splitting unit 121 travels along a first path 161b on the opposite side to the laser beam incident side.

The laser beam traveling along the first path 161a on the laser incident side is again incident on the side of the beam splitting unit 121 of the reciprocating unit 120, the laser beam reflected by the beam splitting unit 121 travels along the second path 162a on the laser incident side, and the laser beam penetrating the beam splitting unit 121 travels along the second path 162b on the opposite side to the laser beam incident side.

The laser beam traveling along the first path 161b on the opposite side to the side on which the laser beam is incident is also incident on the side of the beam splitting unit 121 of the shuttle unit 120, the laser beam reflected by the beam splitting unit 121 travels along the third path 163a on the side on which the laser beam is incident, and the laser beam penetrating the beam splitting unit 121 travels along the third path 163b on the opposite side to the side on which the laser beam is incident.

As such, the paths of the four laser beams are adjusted by the reflection mirrors 102 so as to be incident on the four pairs of scanners 140, and the four laser beams passing through the four pairs of scanners 140 are incident on the single scanning lens 150 so as to be irradiated on the substrate 2.

Meanwhile, according to a combination of various cases, for example, any one of the three reciprocating units 120 positions the beam separating unit 121 on the laser beam traveling path and the other two reciprocating units 120 of the three reciprocating units 120 position the beam penetrating unit 122 on the laser beam traveling path, a single laser beam may be separated into four or three or two to complete the machining process or the single laser beam may complete the machining process by itself.

The laser processing system according to the embodiment of the present invention is configured to irradiate four laser beams separated from a single laser beam onto a substrate for processing and thus the consumed time for each substrate processing can be reduced and UPH realized in a single processing system can be maximized. In addition, four pairs of scanners and a single scanning lens are combined to correspond to each other to construct one laser processing system, so that the manufacturing cost of the single laser processing system can be reduced as compared with a conventional laser processing system in which a pair of scanners and a single scanning lens correspond to each other.

Further, since the laser processing system according to the embodiment of the present invention can adjust the traveling path of the laser beam using the reciprocating unit including the beam dividing unit and the beam penetrating unit, the laser processing system can operate even if any of the components forming the entire laser processing system has a problem. The stability of production is thus improved and the additional purchase expenditure for replacing damaged components is reduced.

Referring to fig. 1 and fig. 6, the operation process of the power feedback correction apparatus is divided into:

(1) power harvesting for the laser beam that is about to enter each pair of scanners 140

Before entering the corresponding pair of scanners 140, the main laser beam emitted by each beam expander 130 passes through the electric adjustable laser attenuator 170, is refracted and reflected by the B/S beam splitter 190, and respectively travels along the reflection path 164a and the refraction path 164B, wherein the reflected light which only occupies 1% of the power of the main laser beam travels along the reflection path 164a, is captured by the photodiode 180, is converted into an electric signal, and is input into the industrial personal computer 201, and the corresponding power value of the main laser beam is obtained by calculation inside the industrial personal computer 201.

(2) Power is initially corrected to a minimum value

The industrial personal computer 201 judges the power value of each main laser beam through comparison, if the power values are not consistent, the power value of the laser beam with the minimum detection power is recorded as a power reference value, the power reference value is fed back to each electric adjustable laser attenuator 170, and the power value of each main laser beam is adjusted to be consistent with the power reference value by the electric adjustable laser attenuator.

(3) The actual output power of the laser beam irradiated on the processed substrate 2 is collected

The laser power detector 203 is adopted to detect the actual output power value of any laser beam irradiated on the substrate 2, the power value is an analog signal, the analog signal is transmitted to the automatic power calibrator 202, and the automatic power calibrator 202 converts the analog signal into a digital signal and transmits the digital signal to the industrial personal computer 201;

(4) correcting the actual output power of the laser beam irradiated onto the substrate to be processed to a standard value

As in the known art, the industrial personal computer is installed with laser processing control software for setting and controlling various power parameters of the laser processing system. In actual processing, according to different requirements of the substrate 2 to be processed, a processor can preset a power value required by laser processing (i.e. a laser beam output to the substrate 2) through the industrial personal computer 201, which is called as a preset power value; the industrial personal computer 201 judges whether the actual output power value of the laser beam detected by the laser power detector 203 is the same as the preset power value, if not, the industrial personal computer 201 controls each electric adjustable laser attenuator 170 to adjust the power value of the laser beam emitted by the electric adjustable laser attenuator 170 and adjusted to be the same as the preset power value.

The above-mentioned embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which should not be construed as limiting the scope of the present invention. All modifications made according to the spirit of the main technical scheme of the present invention shall be covered within the protection scope of the present invention.

Claims (9)

1. A laser processing system with power correction, comprising:

a laser oscillator for emitting laser beams and a separation device group with more than three stages, wherein the number of the separation devices in the separation device group with the nth stage is A =2n-1, and n is a positive integer; the separation devices in the separation device group at the next stage are paired, and the pairs of the separation devices correspond to the separation devices in the separation device group at the previous stage one by one; any one separating device in the previous-stage separating device set and a pair of separating devices corresponding to the separating device in the next-stage separating device set form a light splitting unit set, and for each light splitting unit set,

each separating device of the previous stage can selectively separate the laser beam incident thereon to travel along at least one path of a pair of paths; one of the separating devices of the next-stage pair of separating devices can selectively separate the laser beam incident along one of the paths of the previous pair so as to travel along at least one path of the new pair of paths, and the other separating device of the pair can selectively separate the laser beam incident along the other path of the pair so as to also travel along at least one path of the new pair of paths;

further comprising, for the scanners, the laser beams passing through the respective separating means of the last-stage separating means group are incident on the respective scanners so as to be each deflected to a desired position of the substrate to be processed thereby;

a single scanning lens on which the laser beam passed through the pair of scanners B is incident so as to be condensed on a spot having a predetermined diameter and irradiated on the substrate; and

b beam expanders disposed on an upstream side of the B pairs of scanners for adjusting a diameter of each of the laser beams, wherein the B beam expanders correspond to the each of the laser beams, respectively, wherein each of the B pairs of scanners includes an X-axis galvanometer scanner for controlling an incident laser beam to an X-axis direction and a Y-axis galvanometer scanner for controlling an incident laser beam to a Y-axis direction; b is the number a of separating devices in the last stage separating device group;

the power feedback correction device comprises an electric adjustable laser attenuator, a B/S spectroscope, a photodiode and an industrial personal computer, wherein the electric adjustable laser attenuator and the B/S spectroscope are sequentially arranged on a light path between each beam expander and a pair of scanners corresponding to the beam expander, the photodiode is arranged corresponding to each B/S spectroscope and is used for receiving 1% of reflected light of the B/S spectroscope, and the industrial personal computer is simultaneously electrically connected with each photodiode and the electric adjustable laser attenuator; the industrial personal computer is used for detecting whether the power values of the laser beams emitted by the electric adjustable laser attenuators are consistent or not, recording the minimum power value, and adjusting the power values of the laser beams emitted by the electric adjustable laser attenuators to be consistent with the minimum power value through the electric adjustable laser attenuators.

2. The laser processing system with power calibration function of claim 1, wherein the power feedback calibration device further comprises a laser power detector for detecting an actual output power value of the laser beam irradiated onto the substrate, and an automatic power calibrator electrically connected to the laser power detector, the automatic power calibrator being electrically connected to the industrial personal computer for converting an analog power value signal of the laser beam detected by the laser power detector into a digital signal and transmitting the digital signal to the industrial personal computer, wherein when the industrial personal computer determines that the actual output power value of the laser beam detected by the laser power detector is different from a preset power value, the industrial personal computer controls each electrically adjustable laser attenuator to adjust the power value of the laser beam emitted by the electrically adjustable laser attenuator to be the same as the preset power value.

3. The laser processing system with power correction function according to claim 1, wherein for three said separating means in each beam splitting unit group, at least one is a reciprocating unit including a beam separating unit that reflects a part of the incident laser beam and allows the remaining part of the incident laser beam to penetrate, a beam penetrating unit that allows the entire incident laser beam to penetrate, and a transfer means that changes the position of the beam separating unit or the beam penetrating unit so that the laser beam is incident on any one of the beam separating unit and the beam penetrating unit.

4. The laser processing system with power correction function as claimed in claim 3, wherein said beam splitting unit is a beam splitter which reflects 50% of the incident laser beam and allows the remaining 50% of the incident laser beam to penetrate.

5. The laser processing system with power correction function as claimed in claim 3, wherein said beam penetration unit is a through lens which allows more than 99% of incident laser beam to penetrate therethrough.

6. The laser processing system with power correction function according to claim 3, characterized in that the transfer device includes a support bracket, a driving source, and a power transmission unit, the support bracket supporting the beam splitting unit and the beam penetrating unit and the power transmission unit transmitting the driving power of the driving source to the support bracket so as to move the support bracket back and forth in the left-right direction.

7. The laser processing system with power correction function according to claim 1, characterized in that for three said separation means in each beam-splitting unit group, at least one is an acousto-optical modulator AOM which emits an incident laser beam after modulating the laser beam with an acoustic wave, said acousto-optical modulator emitting the laser beam by dividing the laser beam into two beams traveling along different paths from each other or by adjusting the light amount of the incident laser beam so that the laser beam travels along a single path.

8. The laser processing system with power correction function according to claim 1, wherein for three said separating means in each light splitting unit group, at least one is an electro-optical modulator EOM which emits an incident laser beam after modulating the laser beam with an electric field, said electro-optical modulator adjusting the light amount of the incident laser beam and emitting the laser beam so that the laser beam travels along a single path.

9. The laser processing system with power correction function as claimed in claim 1, wherein the laser beam is irradiated on the substrate for punching, marking or welding the substrate.

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