CN212676226U - Semiconductor etching equipment - Google Patents
Semiconductor etching equipment Download PDFInfo
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- CN212676226U CN212676226U CN202021909862.3U CN202021909862U CN212676226U CN 212676226 U CN212676226 U CN 212676226U CN 202021909862 U CN202021909862 U CN 202021909862U CN 212676226 U CN212676226 U CN 212676226U
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Abstract
The utility model provides a semiconductor etching equipment, include: at least one load lock chamber and a suction pump; the air suction port of the loading and unloading chamber is connected with the air inlet of the air suction pump through a pipeline; and the pipeline between each loading and unloading chamber and the air pump is respectively provided with an air flow control device for preventing gas from reversely flowing into the loading and unloading chamber. That is to say, this semiconductor etching equipment has solved the circumstances that gas irritates backward, has realized carrying out evacuation processing to at least one loading and unloading room simultaneously, and its evacuation mode's efficiency is higher, and then the very big degree improvement semiconductor etching equipment's productivity.
Description
Technical Field
The utility model relates to a semiconductor technology technical field, more specifically say, relate to a semiconductor etching equipment.
Background
With the continuous development of science and technology, semiconductor etching equipment has been widely applied to various manufacturing industries, and brings great convenience to the life and work of people.
However, in the conventional semiconductor etching equipment, the vacuum pumping mode of the loading and unloading chamber has low efficiency, and the problem of gas back filling exists, so that the capacity of the semiconductor etching equipment is greatly reduced.
SUMMERY OF THE UTILITY MODEL
In view of this, in order to solve the above problem, the utility model provides a semiconductor etching device, technical scheme is as follows:
a semiconductor etching apparatus, comprising: at least one load lock chamber and a suction pump;
the air suction port of the loading and unloading chamber is connected with the air inlet of the air suction pump through a pipeline;
and the pipeline between each loading and unloading chamber and the air pump is respectively provided with an air flow control device for preventing gas from reversely flowing into the loading and unloading chamber.
Optionally, in the semiconductor etching apparatus, the number of the loading and unloading chambers is two;
the air suction port of one of the loading and unloading chambers is connected with the first port of the pipeline, the air suction port of the other loading and unloading chamber is connected with the second port of the pipeline, and the air inlet of the air suction pump is connected with the third port of the pipeline.
Optionally, in the semiconductor etching apparatus, the pipeline is an integrated pipeline;
the number of the ports of the pipeline is the same as the sum of the number of the loading and unloading chambers and the number of the air suction pumps.
Optionally, in the semiconductor etching apparatus, the gas flow control device is a check valve.
Optionally, in the semiconductor etching apparatus, the suction pump is a dry pump.
Optionally, in the semiconductor etching apparatus, the semiconductor etching apparatus further includes:
a pressure sensor disposed within the load lock chamber.
Optionally, in the semiconductor etching apparatus, the pressure sensor is a vacuum pressure sensor.
Compared with the prior art, the utility model discloses the beneficial effect who realizes does:
the utility model provides a pair of semiconductor etching equipment includes: at least one load lock chamber and a suction pump; the air suction port of the loading and unloading chamber is connected with the air inlet of the air suction pump through a pipeline; and the pipeline between each loading and unloading chamber and the air pump is respectively provided with an air flow control device for preventing gas from reversely flowing into the loading and unloading chamber. That is to say, this semiconductor etching equipment has solved the circumstances that gas irritates backward, has realized carrying out evacuation processing to at least one loading and unloading room simultaneously, and its evacuation mode's efficiency is higher, and then the very big degree improvement semiconductor etching equipment's productivity.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic partial structural diagram of a semiconductor etching apparatus according to an embodiment of the present invention;
fig. 2 is a schematic partial structural diagram of another semiconductor etching apparatus according to an embodiment of the present invention;
fig. 3 is a schematic partial structural diagram of another semiconductor etching apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, fig. 1 is a schematic partial structure diagram of a semiconductor etching apparatus according to an embodiment of the present invention.
The semiconductor etching apparatus includes: at least one load lock 11 and a suction pump 12.
The suction port of the load lock chamber 11 and the inlet of the suction pump 12 are connected by a pipe 13.
A gas flow control device 14 is provided on each of the pipes between the load lock chamber 11 and the suction pump 12, for preventing gas from flowing back into the load lock chamber 11.
Fig. 1 illustrates one load lock chamber 11 as an example.
In this embodiment, the gas flow control device 14 can prevent the gas of the pump 12 and other load lock chambers 11 from flowing back to the load lock chamber 11, so as to simultaneously perform the vacuum-pumping process on at least one load lock chamber 11, and the efficiency of the vacuum-pumping process is higher, thereby greatly improving the productivity of the semiconductor etching apparatus.
Further, based on the above-mentioned embodiment of the present invention, referring to fig. 2, fig. 2 is a schematic view of a local structure of another semiconductor etching apparatus provided by an embodiment of the present invention.
The number of the load lock chambers 11 is two.
The pumping hole of one of the load lock chambers 11 is connected to the first port a of the pipeline 13, the pumping hole of the other load lock chamber 11 is connected to the second port b of the pipeline 13, and the air inlet of the air pump 12 is connected to the third port c of the pipeline 13.
In this embodiment, as shown in fig. 2, when the number of the loading and unloading chambers 11 is greater than 1, one gas flow control device 14 is respectively arranged at the gas exhaust port of each loading and unloading chamber 11.
Further, according to the above embodiment of the present invention, as shown in fig. 2, the pipeline 13 is an integrated pipeline;
the number of ports of the piping 13 is the same as the sum of the number of the load lock 11 and the number of the suction pumps 12.
In this embodiment, the load lock chamber 11 and the suction pump 12 are connected by integrally formed pipes 13 based on the semiconductor etching apparatus having different numbers of load lock chambers 11. Compared with the prior art, the method has the advantages that the risk of air leakage can be reduced by splicing the multiple sections of pipelines, and the vacuumizing quality of the semiconductor etching equipment is further improved.
Further, based on the above embodiments of the present invention, referring to fig. 3, fig. 3 is a schematic partial structure diagram of another semiconductor etching apparatus provided by an embodiment of the present invention.
The air flow control device 14 is a one-way valve 15.
In this embodiment, the check valve 15 is a valve body structure that allows the medium to flow in one direction only and prevents the medium from flowing in the opposite direction, and is an automatic operation mode in which the valve flap is opened by the pressure of the fluid flowing in one direction; when the flow is reversed, the flap and valve seat coincide, shutting off the flow.
That is, the utility model discloses ingenious set up check valve 15 respectively on each the load lock 11 with pipeline 13 between the aspiration pump 12 for prevent that gas from flowing backward to load lock 11. And the vacuum-pumping treatment of at least one loading and unloading chamber 11 can be realized, the efficiency of the vacuum-pumping mode is higher, and the productivity of the semiconductor etching equipment is further improved to a great extent.
Further, based on the above embodiment of the present invention, the air pump 12 is a dry pump.
In this embodiment, the dry pump is an oil-free dry mechanical vacuum pump, which has the advantages of no process contamination and high stability.
Further, based on the utility model discloses above-mentioned embodiment, semiconductor etching equipment still includes:
a pressure sensor disposed in the load lock chamber 11.
In this embodiment, the vacuum degree monitoring in the load lock 11 can be realized by arranging a pressure sensor in the load lock 11 and matching with an external controller, an upper computer and other devices, so as to control the working state of the air pump 12 and realize the accurate control of the vacuum degree in the load lock 11.
Optionally, the pressure sensor is a vacuum pressure sensor, and can directly detect the vacuum degree in the loading and unloading chamber, and a common pressure sensor is not required to measure the vacuum degree, so that the measurement difficulty of the vacuum degree is further reduced.
The semiconductor etching device provided by the present invention is introduced in detail, and the principle and the implementation of the present invention are explained by using specific examples, and the descriptions of the above examples are only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include or include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A semiconductor etching apparatus, characterized in that the semiconductor etching apparatus comprises: at least one load lock chamber and a suction pump;
the air suction port of the loading and unloading chamber is connected with the air inlet of the air suction pump through a pipeline;
and the pipeline between each loading and unloading chamber and the air pump is respectively provided with an air flow control device for preventing gas from reversely flowing into the loading and unloading chamber.
2. The semiconductor etching apparatus according to claim 1, wherein the number of the load lock chambers is two;
the air suction port of one of the loading and unloading chambers is connected with the first port of the pipeline, the air suction port of the other loading and unloading chamber is connected with the second port of the pipeline, and the air inlet of the air suction pump is connected with the third port of the pipeline.
3. The semiconductor etching apparatus according to claim 2, wherein the pipe is an integrated pipe;
the number of the ports of the pipeline is the same as the sum of the number of the loading and unloading chambers and the number of the air suction pumps.
4. The semiconductor etching apparatus according to claim 1, wherein the gas flow control device is a check valve.
5. The semiconductor etching apparatus according to claim 1, wherein the suction pump is a dry pump.
6. The semiconductor etching apparatus according to claim 1, further comprising:
a pressure sensor disposed within the load lock chamber.
7. The semiconductor etching apparatus according to claim 6, wherein the pressure sensor is a vacuum pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021909862.3U CN212676226U (en) | 2020-09-03 | 2020-09-03 | Semiconductor etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021909862.3U CN212676226U (en) | 2020-09-03 | 2020-09-03 | Semiconductor etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212676226U true CN212676226U (en) | 2021-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021909862.3U Active CN212676226U (en) | 2020-09-03 | 2020-09-03 | Semiconductor etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212676226U (en) |
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2020
- 2020-09-03 CN CN202021909862.3U patent/CN212676226U/en active Active
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