CN212675089U - Packaging detection equipment with automatic clamping function for semiconductor - Google Patents
Packaging detection equipment with automatic clamping function for semiconductor Download PDFInfo
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- CN212675089U CN212675089U CN202021742503.3U CN202021742503U CN212675089U CN 212675089 U CN212675089 U CN 212675089U CN 202021742503 U CN202021742503 U CN 202021742503U CN 212675089 U CN212675089 U CN 212675089U
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Abstract
The invention discloses a packaging detection device for a semiconductor with an automatic clamping function, which comprises a main body frame, wherein an air cylinder is arranged in the middle of the lower part in the main body frame, a movable groove is arranged in the upper part of an air rod, a sliding groove is arranged on the right side of a fixed shaft, a steering block is arranged on the right side of a guide block, a first sliding rod is welded on the left side of the steering block, and a pushing block is arranged on the lower left side of the fixed shaft. The rotation of a process is completed, the automation of packaging detection is realized, and the detection efficiency is improved.
Description
Technical Field
The invention relates to the technical field of packaging detection, in particular to packaging detection equipment with an automatic clamping function for a semiconductor.
Background
With the progress of society, the development of economy, the continuous improvement of science and technology, the high efficiency of semiconductors, it is convenient to be applied in various fields, in order to improve the stability of semiconductors in work, it is necessary to package and detect semiconductors, so-called package test is actually the test after packaging, the semiconductor elements which are manufactured are confirmed for structure and electrical function, so as to ensure that the semiconductor elements meet the requirements of the system, the process is called the test after packaging, the current semiconductor packaging and detecting equipment can not realize the automatic clamping function of semiconductor boards, can not well meet the use requirements of people, and for the above situation, technical innovation is carried out on the basis of the existing semiconductor packaging and detecting equipment.
Disclosure of Invention
The invention aims to provide a packaging detection device with an automatic clamping function for a semiconductor, which is used for solving the problem that the general automatic clamping function of a semiconductor plate cannot be realized to well meet the use requirement of people in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a packaging detection device with an automatic clamping function for a semiconductor comprises a main body frame, wherein a cylinder is arranged in the middle of the lower portion inside the main body frame, a gas rod is arranged above the cylinder, a movable groove is arranged inside the upper portion of the gas rod, a fixed shaft is arranged above the movable groove, a sliding groove is formed in the right side of the fixed shaft, a guide block is arranged above the sliding groove, a steering block is arranged on the right side of the guide block, a first sliding rod is welded on the left side of the steering block, a limiting block is welded on the left side of the first sliding rod, a push block is arranged below the left side of the fixed shaft, a first lock pin is arranged on the left side of the push block, a first connecting rod is connected to the left side of the first lock pin in a screwed mode, a second lock pin is connected to the upper portion of the first connecting rod in a screwed mode, a first clamping plate is connected to the upper portion of the second lock pin in a, a first spring is installed on the outer side of the lower portion of the second sliding rod, a second clamping plate is arranged on the outer side of the upper portion of the second sliding rod, a clamp frame is arranged on the left side of the lower portion of the first clamping plate, a second spring is installed in the middle of the lower portion of the inner portion of the clamp frame, a movable plate is installed on the upper portion of the second spring, a third lock pin is installed on the left side of the movable plate, a second connecting rod is screwed on the left side of the third lock pin, a fourth lock pin is installed on the upper portion of the second connecting rod, a clamping block is screwed on the left side of the fourth lock pin, a fifth lock pin is screwed on the lower portion of the clamping block, a lifting column is installed on the upper portion of the movable plate, a pressing plate is welded on the upper portion of the lifting column, a servo motor is installed on the right side of the upper portion of the inner portion of the main body frame, and a packaging detector is arranged on the left side below the suspension beam.
Preferably, the central axis of the fixed shaft coincides with the vertical central line of the push block, and the central axis of the fixed shaft coincides with the vertical central line of the steering block.
Preferably, the length of the first sliding rod is the same as that of the first connecting rod.
Preferably, the number of the guide blocks is three, and the position relationship of the three guide blocks is that the guide blocks are distributed in a circle around the central axis of the fixed shaft.
Preferably, the number of the sliding grooves is three, and the three sliding grooves are circumferentially distributed around the central axis of the fixing shaft as a circle center.
Preferably, the middle position of the sliding groove is spirally raised, and the rotation angle is 120 °.
Preferably, the right side of the second clamping plate is trapezoidal, and the height of the trapezoid is equal to the distance between the first clamping plate and the second clamping plate.
Preferably, the number of the clamping blocks is two, and the two clamping blocks are symmetrically distributed on the central axis of the lifting column.
Preferably, the second connecting rod and the clamping block form a rotating structure through a fourth lock pin, and the fourth lock pin and the clamping block form a rotating structure through a fifth lock pin.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the sliding groove is arranged, when the steering block moves upwards, the guide block moves along the sliding groove, when the steering block moves to the middle of the sliding groove, the sliding groove spirally rises, and the rotation angle is 120 degrees, so that the first sliding rod is driven to rotate 120 degrees, the rotation of one process is completed, the automation of packaging detection is realized, and the detection efficiency is improved.
2. According to the semiconductor plate clamping device, the second clamping plate is arranged, when the first clamping plate moves leftwards, the second clamping plate is driven to move leftwards, the second clamping plate is trapezoidal, when the trapezoidal portion of the second clamping plate meets the limiting block, the second clamping plate is pressed downwards under the action of the trapezoid, when the first clamping plate moves towards the group, the second clamping plate and the first clamping plate are separated through the first spring, and therefore automatic clamping operation of a semiconductor plate is achieved.
3. According to the automatic picking device, the first connecting rod is arranged, the air cylinder drives the push block to move through the air rod, the push block conveniently drives the first lock pin to move, the first lock pin drives the first connecting rod to move, and the first connecting rod drives the first clamping plate to move through the second lock pin, so that the automatic picking function of a semiconductor is realized.
4. According to the automatic clamp, the pressing plate is arranged, the semiconductor plate is placed on the pressing plate, the pressing plate moves downwards due to gravity to drive the movable plate to move downwards, and when the semiconductor is taken away, the movable plate is bounced upwards by the second spring, so that the automatic homing function of the automatic clamp is realized.
5. According to the invention, the clamping block is arranged, the groove is formed in the right side of the clamping block, the second connecting rod drives the clamping block to rotate around the center of the fifth lock pin through the fourth lock pin, the groove part can clamp the semiconductor board, and the two clamping blocks are arranged, so that the packaging detection of the semiconductor board is facilitated to realize the water flowing operation, and the clamping efficiency is improved.
Drawings
FIG. 1 is a schematic side view of the present invention;
FIG. 2 is a schematic view of a sliding groove structure according to the present invention;
FIG. 3 is a schematic view of the structure of FIG. 1A according to the present invention;
FIG. 4 is a schematic view of a frame structure of the clamp of the present invention;
FIG. 5 is a schematic top view of the present invention.
In the figure: 1. a main body frame; 2. a cylinder; 3. a gas lever; 4. a movable groove; 5. a fixed shaft; 6. a sliding groove; 7. a guide block; 8. a turning block; 9. a first slide bar; 10. a limiting block; 11. a push block; 12. a first lock pin; 13. a first link; 14. a second lock pin; 15. a first splint; 16. a second slide bar; 17. a first spring; 18. a second splint; 19. a clamp frame; 20. a second spring; 21. a movable plate; 22. a third lock pin; 23. a second link; 24. a fourth locking pin; 25. a clamping block; 26. a fifth locking pin; 27. a lifting column; 28. pressing a plate; 29. a servo motor; 30. a screw rod; 31. a suspension beam; 32. a third slide bar; 33. the detector is encapsulated.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a packaging detection equipment that is used for semiconductor to have automatic clamping function, includes main body frame (1), install cylinder (2) in the middle of the inside below of main body frame (1), and gas pole (3) are installed to the top of cylinder (2), the inside activity recess (4) that is provided with of top of gas pole (3), and fixed axle (5) are installed to the top of activity recess (4), what fixed axle (5) had the right side is provided with slip recess (6), and is provided with guide block (7) above the inside of slip recess (6), the intermediate position of slip recess (6) is spiral rising, and rotation angle is 120, has realized the conversion to conveying and packaging detection operation, slip recess (6) are provided with threely, and the position relation of three slip recess (6) is for being the circumference distribution for the centre of a circle about the axis of fixed axle (5), the conversion of the transmission and packaging detection operation is realized, the three guide blocks (7) are arranged, the position relation of the three guide blocks (7) is that the guide blocks are distributed in a circle around the central axis of the fixed shaft (5), the conversion of the transmission and packaging detection operation is realized, the right side of each guide block (7) is provided with a steering block (8), the left side of each steering block (8) is welded with a first sliding rod (9), the left side of each first sliding rod (9) is welded with a limiting block (10), the lower part of the left side of the fixed shaft (5) is provided with a push block (11), the left side of each push block (11) is provided with a first lock pin (12), the central axis of the fixed shaft (5) is coincided with the vertical central line of the push block (11), the central axis of the fixed shaft (5) is coincided with the vertical central line of the steering block (8), and the precision of the motion path of automatic clamping, a first connecting rod (13) is screwed on the left side of the first lock pin (12), a second lock pin (14) is screwed above the first connecting rod (13), the length of the first sliding rod (9) is the same as that of the first connecting rod (13), the automatic picking function of the semiconductor plate is solid, a first clamping plate (15) is screwed above the second lock pin (14), a second sliding rod (16) is arranged on the right side above the first clamping plate (15), a first spring (17) is installed on the outer side below the second sliding rod (16), a second clamping plate (18) is arranged on the outer side above the second sliding rod (16), the right side of the second clamping plate (18) is trapezoidal, the height of the trapezoidal shape is equal to the distance between the first clamping plate (15) and the second clamping plate (18), the automatic clamping operation of the semiconductor plate is facilitated, a clamp frame (19) is arranged on the left side below the first clamping plate (15), a second spring (20) is installed in the middle of the lower portion inside the clamp frame (19), a movable plate (21) is installed above the second spring (20), a third lock pin (22) is installed on the left side of the movable plate (21), a second connecting rod (23) is screwed to the left side of the third lock pin (22), a fourth lock pin (24) is installed above the second connecting rod (23), a clamping block (25) is screwed to the left side of the fourth lock pin (24), a fifth lock pin (26) is screwed to the lower portion of the clamping block (25), a rotating structure is formed between the second connecting rod (23) and the clamping block (25) through the fourth lock pin (24), a rotating structure is formed between the fourth lock pin (24) and the clamping block (25) through the fifth lock pin (26), automatic clamping operation of the semiconductor plate is facilitated, a lifting column (27) is installed above the movable plate (21), and a pressing plate (28) is welded above the lifting column (27), the utility model discloses a semiconductor device, including clamping block (25), servo motor (29) and lead screw (30) are installed on the left side of servo motor (29), the left side of lead screw (30) is installed and is hung roof beam (31), and hangs the left side of roof beam (31) and install third slide bar (32), encapsulation detector (33) are installed in the below left side of hanging roof beam (31), and the position distribution of two clamping blocks (25) is for the axis symmetry about lift post (27), realizes the automatic clamping function of semiconductor plate, servo motor (29) are installed on the inside top right side of main body frame (1), and the left side of servo motor (29).
The working principle is as follows: when the packaging detection device with the automatic clamping function for the semiconductor is used, firstly, a semiconductor board is placed on a pressure plate 28 in a clamp frame 19, due to gravity, the pressure plate 28 drives a lifting column 27 to move downwards, the lifting column 27 drives a third lock pin 22 to use downwards, the third lock pin 22 drives a second connecting rod 23 to move downwards, the second connecting rod 23 drives a clamping block 25 to rotate around a fifth lock pin 26 through a fourth lock pin 24, a groove part of the clamping block 25 clamps the semiconductor board, then, a cylinder 2 drives a push block 11 to move through an air rod 3, the push block 11 drives a first lock pin 12 to move, the first lock pin 12 drives a second lock pin 14 to move through a first connecting rod 13, the second lock pin 14 drives a first clamping plate 15 to move, when the left side of the first clamping plate 15 completely passes through the lower part of the semiconductor board, a trapezoidal part of a second clamping plate 18 meets a limiting block 10, the second clamping plate 18 moves downwards, clamping a semiconductor plate, then, pushing a turning block 8 to move upwards by a pushing block 11, wherein in the turning block 8, a guide block 7 moves along a sliding groove 6, then when the guide block 7 moves to a spiral part of the sliding groove 6, a first slide rod 9 is driven to rotate by 120 degrees, the semiconductor plate on a transmission belt is clamped on a packaging detection transmission belt, packaging detection operation is carried out, then, a servo motor 29 rotates to drive a screw rod 30 to rotate, the screw rod 30 drives a packaging detector 33 on a suspension beam 31 to move along a third slide rod 32, and packaging detection operation is carried out, namely, the working principle of the packaging detection equipment with the automatic clamping function for the semiconductor is realized.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A package inspection apparatus for a semiconductor having an automatic chucking function, comprising a main body frame (1), characterized in that: the air cylinder (2) is installed in the middle of the lower portion of the inner portion of the main body frame (1), the air rod (3) is installed above the air cylinder (2), a movable groove (4) is arranged inside the upper portion of the air rod (3), a fixed shaft (5) is installed above the movable groove (4), a sliding groove (6) is arranged on the right side of the fixed shaft (5), a guide block (7) is arranged above the inner portion of the sliding groove (6), a steering block (8) is installed on the right side of the guide block (7), a first sliding rod (9) is welded on the left side of the steering block (8), a limiting block (10) is welded on the left side of the first sliding rod (9), a push block (11) is installed below the left side of the fixed shaft (5), a first lock pin (12) is installed on the left side of the push block (11), and a first connecting rod (13) is screwed on the left side of the first lock, a second lock pin (14) is screwed above the first connecting rod (13), a first clamping plate (15) is screwed above the second lock pin (14), a second sliding rod (16) is arranged on the right side above the first clamping plate (15), a first spring (17) is installed on the outer side below the second sliding rod (16), a second clamping plate (18) is arranged on the outer side above the second sliding rod (16), a clamp frame (19) is arranged on the left side below the first clamping plate (15), a second spring (20) is installed in the middle of the lower portion inside the clamp frame (19), a movable plate (21) is installed above the second spring (20), a third lock pin (22) is installed on the left side of the movable plate (21), a second connecting rod (23) is screwed on the left side of the third lock pin (22), a fourth lock pin (24) is installed on the upper portion of the second connecting rod (23), and the left side of fourth lockpin (24) has connect clamp splice (25) soon, the below of clamp splice (25) has connect fifth lockpin (26) soon, lift post (27) are installed to the top of fly leaf (21), and the top welding of lift post (27) has clamp plate (28), servo motor (29) are installed on the inside top right side of main body frame (1), and the left side of servo motor (29) installs lead screw (30), cantilever beam (31) are installed in the left side of lead screw (30), and third slide bar (32) are installed in the left side of cantilever beam (31), encapsulation detector (33) are installed in the below left side of cantilever beam (31).
2. The package inspection apparatus for semiconductor with automatic clamping function according to claim 1, wherein: the central axis of the fixed shaft (5) coincides with the vertical central line of the push block (11), and the central axis of the fixed shaft (5) coincides with the vertical central line of the steering block (8).
3. The package inspection apparatus for semiconductor with automatic clamping function according to claim 1, wherein: the length of the first slide bar (9) is the same as the length of the first connecting rod (13).
4. The package inspection apparatus for semiconductor with automatic clamping function according to claim 1, wherein: the number of the guide blocks (7) is three, and the position relation of the three guide blocks (7) is that the guide blocks are distributed in a circle around the central axis of the fixed shaft (5).
5. The package inspection apparatus for semiconductor with automatic clamping function according to claim 1, wherein: the number of the sliding grooves (6) is three, and the position relation of the three sliding grooves (6) is that the sliding grooves are distributed in a circle around the central axis of the fixed shaft (5).
6. The package inspection apparatus for semiconductor with automatic clamping function according to claim 1, wherein: the middle position of the sliding groove (6) is spirally raised, and the rotating angle is 120 degrees.
7. The package inspection apparatus for semiconductor with automatic clamping function according to claim 1, wherein: the right side of the second clamping plate (18) is trapezoidal, and the height of the trapezoid is equal to the distance between the first clamping plate (15) and the second clamping plate (18).
8. The package inspection apparatus for semiconductor with automatic clamping function according to claim 1, wherein: the two clamping blocks (25) are arranged, and the positions of the two clamping blocks (25) are symmetrically distributed about the central axis of the lifting column (27).
9. The package inspection apparatus for semiconductor with automatic clamping function according to claim 1, wherein: the second connecting rod (23) and the clamping block (25) form a rotating structure through a fourth lock pin (24), and the fourth lock pin (24) and the clamping block (25) form a rotating structure through a fifth lock pin (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021742503.3U CN212675089U (en) | 2020-08-20 | 2020-08-20 | Packaging detection equipment with automatic clamping function for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021742503.3U CN212675089U (en) | 2020-08-20 | 2020-08-20 | Packaging detection equipment with automatic clamping function for semiconductor |
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| Publication Number | Publication Date |
|---|---|
| CN212675089U true CN212675089U (en) | 2021-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021742503.3U Active CN212675089U (en) | 2020-08-20 | 2020-08-20 | Packaging detection equipment with automatic clamping function for semiconductor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113864130A (en) * | 2021-08-31 | 2021-12-31 | 江西大唐国际新能源有限公司 | Clamping equipment for wind power generation blade |
-
2020
- 2020-08-20 CN CN202021742503.3U patent/CN212675089U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113864130A (en) * | 2021-08-31 | 2021-12-31 | 江西大唐国际新能源有限公司 | Clamping equipment for wind power generation blade |
| CN113864130B (en) * | 2021-08-31 | 2024-01-26 | 江西大唐国际新能源有限公司 | Clamping equipment for wind power generation blade |
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