CN212660112U - Heat radiation module suitable for stack type inverter - Google Patents
Heat radiation module suitable for stack type inverter Download PDFInfo
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- CN212660112U CN212660112U CN202021084888.9U CN202021084888U CN212660112U CN 212660112 U CN212660112 U CN 212660112U CN 202021084888 U CN202021084888 U CN 202021084888U CN 212660112 U CN212660112 U CN 212660112U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 93
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- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
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- 239000003990 capacitor Substances 0.000 description 7
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- 238000010586 diagram Methods 0.000 description 2
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Abstract
The utility model provides a heat dissipation module suitable for stack formula dc-to-ac converter belongs to new energy automobile motor controller technical field. The utility model discloses a radiating module main part, the inside parallel arrangement of radiating module main part has two cavitys, and two surfaces all are provided with the recess about the radiating module main part, and the inside one end of recess is connected with a cavity through the inside entry of radiating medium, and the other end is connected with another cavity through the inside export of radiating medium, and groove opening part is provided with the heat transfer base plate, the utility model discloses a parallel design, every independent half-bridge IGBT module can contact with radiating medium simultaneously, and independent setting each other, noninterference, and the temperature is therefore comparatively even, and every independent half-bridge IGBT module current output is more average, and the power density of controller can increase.
Description
Technical Field
The utility model relates to a heat dissipation module suitable for stack formula dc-to-ac converter belongs to new energy automobile motor controller technical field.
Background
The inverter is a converter which converts direct current electric energy (batteries and storage batteries) into constant-frequency constant-voltage or frequency-modulation voltage-regulation alternating current (generally 220V,50Hz sine wave). It is composed of inverter bridge, control logic and filter circuit. The multifunctional electric grinding wheel is widely applicable to air conditioners, home theaters, electric grinding wheels, electric tools, sewing machines, DVDs (digital video disks), VCDs (video recorders), computers, televisions, washing machines, range hoods, refrigerators, video recorders, massagers, fans, lighting and the like. In foreign countries, due to the higher popularization rate of automobiles, the inverter can be used for connecting the storage battery to drive electric appliances and various tools to work when going out for work or traveling. The on-board inverter output through the cigarette lighter is of 20W, 40W, 80W, 120W to 150W power specification. And the other larger power inverter power supply is connected to the battery through a connecting wire. Connecting the household appliance to the output of the power converter enables the use of a variety of appliances in the vehicle. Usable electric appliances are: mobile phones, notebook computers, digital video cameras, lighting lamps, electric shavers, CD machines, game machines, palm computers, electric tools, vehicle-mounted refrigerators, and various traveling, camping, medical first-aid appliances.
Due to the limitation of heat dissipation capability, it is difficult for a general IGBT (insulated gate bipolar transistor) module to output its maximum power. In order to meet the control requirement of high-power motors on the market, IGBT modules with the same power must be stacked, and the current output of the IGBT modules is increased to meet the requirement.
In order to meet the structural strength and the safety of current transmission, the design of an input copper bar mechanism of the conventional stack type inverter must meet the sectional area and size requirements of theoretical design, and meanwhile, the design is matched with the overall architecture of the inverter, so that the size of the inverter is inevitably increased, and the power density of a controller is reduced.
In addition, the existing stack-type inverter is arranged due to the structure of the IGBT module, the corresponding heat sink is a hollow integral mechanism, and the heat dissipation medium enters and exits from the inlet and outlet. For the IGBT module, a heat medium flows left and right in the water tank, which is called a series heat dissipation method. Due to the influence of the on-way loss and the local loss in the flow field, the IGBT module has a better heat dissipation effect when being close to the inlet of the heat dissipation medium; when the heat dissipation medium is close to the outlet of the heat dissipation medium, the heat dissipation effect is poor; the temperature of the IGBT module is not uniform, and a temperature difference exists. Therefore, the current output of the IGBT module is limited, and the power of the controller is reduced.
Each module of the stacked IGBT module is formed by integrating 3 parallel half-bridge modules into a whole, the heat dissipation module is also of an integrated structure, a heat dissipation medium flows in from the input hole of the water tank, and the stacked IGBT module acts with the heat dissipation medium in the water tank to transfer heat to the heat dissipation medium; the heat dissipation medium flows out from the water channel output hole, so that the heat conduction of the stacked IGBT is discharged out of the water channel, and the function of heat dissipation of the stacked IGBT module is achieved. Because the medium only flows in one direction in the water tank, the water tank is called a series type heat dissipation system. For the stacked IGBT module, a half-bridge IGBT module of the whole module close to the external inlet of the heat-radiating medium can contact with the heat-radiating medium firstly, the temperature difference between the half-bridge IGBT module and the heat-radiating medium is large, more heat exchange is carried out between the half-bridge IGBT module and the heat-radiating medium, and the temperature of the half-bridge IGBT module is lower; with a half-bridge IGBT module of the nearer whole module of heat-dissipating medium outside export, because of heat-dissipating medium has flowed through two other half-bridge IGBT modules in the basin, heat-dissipating medium's temperature rises because of having absorbed heat, and its and the temperature difference between heat-dissipating medium is less, and the heat exchange between heat-dissipating medium is less, and the temperature of this half-bridge IGBT module can be higher. Therefore, in the series-connection type heat dissipation system, the half-bridge IGBT modules in the whole module have temperature difference, and the output current of the stack IGBT module is reduced under the influence of the half-bridge IGBT modules with higher temperature, so that the output power is influenced.
SUMMERY OF THE UTILITY MODEL
In view of the above disadvantages of the prior art, an object of the present invention is to provide a heat dissipation module suitable for a stacked inverter, for solving the problem that the existing stacked inverter in the prior art is arranged due to the framework of an IGBT module, a corresponding heat dissipation sink is a hollow integral mechanism, a heat dissipation medium enters and exits from an entrance and an exit, for the IGBT module, the heat dissipation medium flows left and right in the sink, which is called a series type heat dissipation manner, and due to the influence of path and local loss in a flow field, the IGBT module is close to the entrance of the heat dissipation medium, thereby having a better heat dissipation effect; when the heat dissipation medium is close to the outlet of the heat dissipation medium, the heat dissipation effect is poor; the temperature of the IGBT module is not uniform, and temperature difference exists, so that the current output of the IGBT module is limited, and the power of the controller is reduced.
In order to achieve the above objects and other related objects, the present invention provides a heat dissipation module for a stacked inverter, comprising: the heat radiation module comprises a heat radiation module body, wherein two cavities are arranged in the heat radiation module body in parallel, grooves are formed in the upper surface and the lower surface of the heat radiation module body, one end of the inside of each groove is connected with one cavity through an inside inlet of a heat radiation medium, the other end of the inside of each groove is connected with the other cavity through an inside outlet of the heat radiation medium, and a heat transfer substrate is arranged at the position of the opening of each.
By adopting the technical scheme: the IGBT module is locked on the heat dissipation module and tightly connected with the heat transfer substrate, when the IGBT module normally works, a heat dissipation medium enters the cavity and then enters the groove through an internal inlet of the heat dissipation medium, the heat dissipation medium is in contact with the heat transfer substrate, the IGBT module performs heat exchange with the heat dissipation medium through the heat transfer substrate to dissipate heat of the IGBT module, and the heat dissipation medium flows out through an internal outlet of the heat dissipation medium to enter another cavity after heat exchange and discharges heat, so that heat dissipation of the IGBT module is realized.
In an embodiment of the present invention, the heat dissipation module body has a heat dissipation medium inlet and a heat dissipation medium outlet, and the heat dissipation medium inlet and the heat dissipation medium outlet are respectively connected to a cavity.
By adopting the technical scheme: the heat dissipation medium enters one cavity through the heat dissipation medium external inlet, enters the other cavity after heat exchange is completed, and is discharged through the heat dissipation medium external outlet, so that heat is discharged.
In an embodiment of the present invention, the upper and lower surfaces of the heat dissipation module main body are provided with three grooves, and the three grooves are arranged in parallel.
By adopting the technical scheme: two surfaces all are provided with three recess about the radiating module main part, and radiating module can dispel the heat the operation to six IGBT modules simultaneously to every recess sets up independently, each other does not influence.
In an embodiment of the present invention, the heat transfer substrate is connected to the heat dissipation module body by welding.
By adopting the technical scheme: the heat transfer substrate is connected with the heat dissipation module main body in a welding mode, so that the sealing performance between the heat transfer substrate and the groove is improved, and the leakage of a heat dissipation medium is prevented.
In an embodiment of the present invention, the heat transfer substrate is made of aluminum alloy or copper material.
By adopting the technical scheme: the heat transfer substrate is made of aluminum alloy or copper, so that the heat exchange performance of the heat transfer substrate is improved.
As described above, the utility model discloses a heat radiation module suitable for stack formula dc-to-ac converter has following beneficial effect:
compared with the current series-connection type cooling system, the utility model discloses a parallel design, every independent half-bridge IGBT module can be simultaneously with the contact of heat dissipation medium, and each other independent setting, do not disturb, therefore the temperature is comparatively even, every independent half-bridge IGBT mould current output is more average, and the power density of controller can increase.
Drawings
Fig. 1 is a schematic diagram illustrating an overall structure of a heat dissipation module suitable for a stacked inverter according to an embodiment of the present invention.
Fig. 2 is a schematic top view of a heat dissipation module suitable for a stacked inverter according to an embodiment of the present invention.
Fig. 3 is a schematic diagram illustrating a top view of a heat dissipation module suitable for a stacked inverter according to an embodiment of the present invention.
30, a heat dissipation module main body; 31. a heat transfer substrate; 32. a groove; 33. a heat-dissipating medium external inlet; 34. an external outlet for the heat-dissipating medium; 35. an internal inlet for a heat-dissipating medium; 36. an internal outlet for the heat-dissipating medium; 37. a cavity.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1 to 3. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
A stacked inverter structure comprising: direct current hookup electric capacity 1, IGBT module 2, thermal module 3, direct current generating line input copper bar 4 and output module 5, IGBT module 2 be provided with two sets ofly, the longitudinal symmetry sets up, is provided with thermal module 3 between two sets of IGBT modules 2, IGBT module 2 one end is connected with direct current hookup electric capacity 1, output module 5 is connected to the other end, direct current generating line input copper bar 4 be connected with direct current hookup electric capacity 1.
Two sets of IGBT modules 2 are all formed by three independent IGBT half-bridge modules arranged side by side.
Two cavities are arranged inside the heat dissipation module 3 in parallel, and three grooves are formed in the upper surface and the lower surface of the heat dissipation module 3.
The upper part and the lower part of the inner part of the groove are provided with openings which are connected with the cavity and used for the heat dissipation medium to come in and go out.
The direct-current coupling capacitor 1 comprises a direct-current coupling capacitor main body 10, an upper row of output contacts 12 and a lower row of output contacts 14 are arranged on one side surface of the direct-current coupling capacitor main body 10, the upper row of output contacts 12 and the lower row of output contacts 14 are symmetrically arranged up and down, the upper row of output contacts 12 and the lower row of output contacts 14 are respectively provided with three groups, and each group is respectively provided with a positive contact and a negative contact.
One corner of one side surface of the direct current connection capacitor main body 10 is also provided with two input copper bar contacts 11.
The upper row of output contacts 12 is provided with three groups, each group is provided with a positive contact and a negative contact, wherein the left side is the positive contact, and the right side is the negative contact; the lower row of output contacts 14 is provided with three sets, each set is provided with a positive contact and a negative contact, wherein the left side is the negative contact, and the right side is the positive contact.
Fixing mechanisms 13 are provided on both side surfaces of the dc link capacitor body 10 adjacent to the upper row output contact 12 and the lower row output contact 14.
The heat dissipation module 3 includes a heat dissipation module main body 30, two cavities 37 are arranged in the heat dissipation module main body 30 in parallel, grooves 32 are arranged on the upper surface and the lower surface of the heat dissipation module main body 30, one end of the inside of each groove 32 is connected with one cavity 37 through an inside inlet 35 of a heat dissipation medium, the other end of the inside of each groove 32 is connected with the other cavity 37 through an inside outlet 36 of the heat dissipation medium, and a heat transfer substrate 31 is arranged at the opening of each groove 32.
The heat dissipating module body 30 is provided at one end with a heat dissipating medium external inlet 33 and a heat dissipating medium external outlet 34, and the heat dissipating medium external inlet 33 and the heat dissipating medium external outlet 34 are connected to a cavity 37, respectively.
The output module 5 comprises an output copper bar 52 and a connecting copper bar 51, two ends of the connecting copper bar 51 are respectively connected with one ends of two sets of IGBT half-bridge modules which are symmetrically arranged up and down, and the output copper bar 52 is connected with the upper end of the connecting copper bar 51.
The output module 5 is provided with three groups, and each group is independently connected with a group of IGBT half-bridge modules which are symmetrically arranged up and down.
The working principle of the stack type inverter structure is as follows: the polarity of the direct current connecting capacitor 10 is positive and negative, the polarity of the upper row output contact 12 is left positive and right negative, the polarity of the lower row output contact 14 is right positive and left negative to meet the requirement of the corresponding contact polarity on the stack IGBT module 2, the direct current connecting capacitor 10 is directly locked with the stack IGBT module 2, the upper and lower sets of IGBT half-bridge modules 2 are connected with each other by the connecting copper bar 51 to realize the integrated output of the single-phase stack IGBT half-bridge module, the output copper bar 52 is connected with the connecting copper bar 51 and then output by the output copper bar 52, the heat dissipation module 3 dissipates heat of the IGBT module 2 in the working process of the IGBT module 2, the IGBT module 2 is locked on the heat dissipation module 3 and is tightly connected with the heat transfer substrate 31, when the IGBT module 2 normally works, the heat dissipation medium enters the cavity 37 through the heat dissipation medium external inlet 33 and then enters the groove through the heat dissipation medium internal inlet 35, the heat dissipation medium is in contact with the heat transfer substrate 31, the IGBT module 2 exchanges heat with the heat dissipation medium through the heat transfer substrate 31 to dissipate heat of the IGBT module, and the heat dissipation medium flows out through the heat dissipation medium internal outlet 36 into the other cavity 37 after heat exchange, and then is discharged out of the heat dissipation module 3 through the heat dissipation medium external outlet 34 to discharge heat.
To sum up, compare with current serial-type cooling system, the utility model discloses a parallel design, every independent half-bridge IGBT module can be simultaneously with the contact of heat dissipation medium, and each other independent setting, do not disturb, and the temperature is therefore comparatively even, and every independent half-bridge IGBT mould current output is more average, and the power density of controller can increase. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (5)
1. The utility model provides a heat dissipation module suitable for stack formula inverter, its characterized in that, a heat dissipation module suitable for stack formula inverter includes: the heat dissipation module comprises a heat dissipation module body (30), wherein two cavities (37) are arranged inside the heat dissipation module body (30) in parallel, grooves (32) are formed in the upper surface and the lower surface of the heat dissipation module body (30), one end of the inner portion of each groove (32) is connected with one cavity (37) through an inner inlet (35) of a heat dissipation medium, the other end of each groove is connected with the other cavity (37) through an inner outlet (36) of the heat dissipation medium, and a heat transfer substrate (31) is arranged at the opening of each groove (32).
2. The heat dissipation module for a stacked inverter of claim 1, wherein: one end of the heat dissipation module main body (30) is provided with a heat dissipation medium external inlet (33) and a heat dissipation medium external outlet (34), and the heat dissipation medium external inlet (33) and the heat dissipation medium external outlet (34) are respectively connected with a cavity (37).
3. The heat dissipation module for a stacked inverter of claim 1, wherein: the upper surface and the lower surface of the radiating module main body (30) are respectively provided with three grooves (32), and the three grooves (32) are arranged in parallel.
4. The heat dissipation module for a stacked inverter of claim 1, wherein: the heat transfer substrate (31) is connected with the heat dissipation module main body (30) in a welding mode.
5. The heat dissipation module for a stacked inverter of claim 1, wherein: the heat transfer substrate (31) is made of aluminum alloy or copper material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021084888.9U CN212660112U (en) | 2020-06-12 | 2020-06-12 | Heat radiation module suitable for stack type inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021084888.9U CN212660112U (en) | 2020-06-12 | 2020-06-12 | Heat radiation module suitable for stack type inverter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212660112U true CN212660112U (en) | 2021-03-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021084888.9U Expired - Fee Related CN212660112U (en) | 2020-06-12 | 2020-06-12 | Heat radiation module suitable for stack type inverter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212660112U (en) |
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2020
- 2020-06-12 CN CN202021084888.9U patent/CN212660112U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210305 |