CN212659533U - Heat radiation structure of parallel power module - Google Patents
Heat radiation structure of parallel power module Download PDFInfo
- Publication number
- CN212659533U CN212659533U CN202021112673.3U CN202021112673U CN212659533U CN 212659533 U CN212659533 U CN 212659533U CN 202021112673 U CN202021112673 U CN 202021112673U CN 212659533 U CN212659533 U CN 212659533U
- Authority
- CN
- China
- Prior art keywords
- cooling unit
- cooling
- channel
- outlet
- inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat radiation structure of parallelly connected power module, including the heat dissipation backplate, be equipped with coolant inlet channel in the heat dissipation backplate, the power module cooler, coolant outlet channel, coolant inlet channel and the import intercommunication of power module cooler, coolant outlet channel and the export intercommunication of power module cooler, the power module cooler includes a plurality of cooling units that form heat conduction with the power module that corresponds, coolant passes through coolant inlet channel and gets into the power module cooler and carry out the heat transfer after and discharge through coolant outlet channel. The utility model discloses an integrated flow medium cooling scheme on parallelly connected power module installation backplate has the characteristics that can in time dispel the heat.
Description
Technical Field
The utility model relates to a heat radiation structure, in particular to heat radiation structure of parallelly connected power module belongs to the machine controller field.
Background
Because the peak power output by the half-bridge IGBT module cannot meet the requirements of some large working conditions, in order to obtain larger power output, two identical half-bridge IGBT modules are usually connected in parallel to control a high-power motor, and six half-bridge IGBT modules are used in parallel to control three-phase current output, as shown in the attached figure 1. The six half-bridge IGBT modules generate heat during operation, which must be efficiently dissipated, otherwise the IGBT modules are not efficient. Therefore, how to design the heat dissipation structure of the IGBT module is an urgent problem to be solved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses parallelly connected power module's heat radiation structure discloses new scheme, adopts the mobile medium cooling scheme of integration on parallelly connected power module installation backplate, has solved how to derive the thermal problem that a plurality of parallelly connected power module work produced.
The utility model discloses parallelly connected power module's heat radiation structure is including the heat dissipation backplate, be equipped with coolant inlet channel in the heat dissipation backplate, the power module cooler, coolant outlet channel, coolant inlet channel and power module cooler's import intercommunication, coolant outlet channel and power module cooler's export intercommunication, the power module cooler includes a plurality of cooling units that form heat conduction with the power module that corresponds and be connected, coolant passes through coolant outlet channel and discharges after the coolant inlet channel gets into power module cooler and carries out the heat transfer.
Furthermore, the power module cooler of the scheme comprises a cooling unit A, a cooling unit B, a cooling unit C, a cooling unit D, a cooling unit E and a cooling unit F, wherein the inlet of the cooling unit A is communicated with a cooling medium inlet channel, the outlet of the cooling unit A is communicated with the inlet of the cooling unit B, the outlet of the cooling unit B is communicated with the inlet of the cooling unit C, the outlet of the cooling unit C is communicated with the inlet of the cooling unit D, the outlet of the cooling unit D is communicated with the inlet of the cooling unit E, the outlet of the cooling unit E is communicated with the inlet of the cooling unit F, the outlet of the cooling unit F is communicated with a cooling medium outlet channel, the cooling medium entering the cooling medium inlet channel flows through the cooling unit A, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E and the cooling unit F in sequence for heat exchange and then is discharged through the cooling medium outlet channel.
Further, the cooling unit A of this scheme, cooling unit B, cooling unit C, cooling unit D, cooling unit E, cooling unit F includes the cooling chamber, the cooling intracavity is equipped with half wall baffle, half wall baffle separates the cooling chamber into cooling unit inlet channel, the interface channel, cooling unit exit channel, cooling unit inlet channel, the interface channel, be equipped with the guide plate of arranging side by side along the coolant flow direction in the cooling unit exit channel, form the guiding gutter between adjacent guide plate side by side, coolant flows along the guiding gutter.
Furthermore, the power module cooler of the scheme comprises an inlet main channel, an outlet main channel, a cooling unit A, a cooling unit B, a cooling unit C, a cooling unit D, a cooling unit E and a cooling unit F, wherein the inlet main channel is communicated with a cooling medium inlet channel, the inlets of the cooling unit A, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E and the cooling unit F are communicated with the inlet main channel, the outlets of the cooling unit A, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E and the cooling unit F are communicated with the outlet main channel, the outlet main channel is communicated with a cooling medium outlet channel, cooling media entering the inlet main channel through the cooling medium inlet channel simultaneously flow through the cooling unit A, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E and the cooling unit F to exchange heat and then are discharged into the outlet main channel, the cooling medium in the outlet main channel is discharged through the cooling medium outlet channel.
Furthermore, the cooling unit A, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E and the cooling unit F comprise cooling cavities, a plurality of guide plates which are arranged side by side along the flowing direction of the cooling medium are arranged in the cooling cavities, guide grooves are formed between the adjacent guide plates side by side, and the cooling medium flows along the guide grooves.
The utility model discloses parallelly connected power module's heat radiation structure adopts the mobile medium cooling scheme of integration on parallelly connected power module installation backplate, has the characteristics that can in time dispel the heat.
Drawings
Fig. 1 is a schematic diagram of a side-by-side arrangement of six half-bridge IGBT modules.
Fig. 2 is a schematic diagram of a first example of a heat dissipation structure of a parallel power module.
Fig. 3 is a schematic diagram of a second example of a heat dissipation structure of a parallel power module.
Wherein 100 is a heat dissipation back plate, 101 is a cooling medium inlet channel, 102 is a cooling medium outlet channel, 103 is a guide plate, 104 is a guide groove, 111 is a semi-partition baffle, 112 is a cooling unit inlet channel, 113 is a connecting channel, 114 is a cooling unit outlet channel, 121 is an inlet main channel, and 122 is an outlet main channel.
Detailed Description
As shown in fig. 1, 2, 3, the utility model discloses parallelly connected power module's heat radiation structure is including the heat dissipation backplate, be equipped with coolant inlet channel in the heat dissipation backplate, the power module cooler, coolant outlet channel, coolant inlet channel and power module cooler's import intercommunication, coolant outlet channel and power module cooler's export intercommunication, the power module cooler includes a plurality of cooling units that form heat conduction with the power module that corresponds and be connected, coolant passes through coolant outlet channel and discharges after the coolant inlet channel gets into power module cooler and carries out the heat transfer. According to the scheme, the flowing medium cooling scheme integrated on the mounting back plate of the parallel power modules is adopted, so that effective heat dissipation and cooling of the plurality of parallel power modules are realized, and normal work of equipment is guaranteed. In order to meet the heat dissipation and cooling requirements for controlling a three-phase current output mode by six half-bridge IGBT modules side by side, the scheme discloses the following examples.
Example one
As shown in FIG. 2, the present invention discloses a serial cooling heat exchange manner, that is, a power module cooler includes a cooling unit A, a cooling unit B, a cooling unit C, a cooling unit D, a cooling unit E, and a cooling unit F, wherein an inlet of the cooling unit A is communicated with a cooling medium inlet channel, an outlet of the cooling unit A is communicated with an inlet of the cooling unit B, an outlet of the cooling unit B is communicated with an inlet of the cooling unit C, an outlet of the cooling unit C is communicated with an inlet of the cooling unit D, an outlet of the cooling unit D is communicated with an inlet of the cooling unit E, an outlet of the cooling unit E is communicated with an inlet of the cooling unit F, an outlet of the cooling unit F is communicated with a cooling medium outlet channel, and a cooling medium entering the cooling medium inlet channel sequentially flows through the cooling unit A, the cooling unit B, the cooling unit C, the cooling unit D, the cooling, And the cooling unit F exchanges heat and then discharges the heat through a cooling medium outlet channel.
Based on above scheme, in order to realize the function of cooling unit, improve the cooling radiating effect, the cooling unit A of this scheme, cooling unit B, cooling unit C, cooling unit D, cooling unit E, cooling unit F includes the cooling chamber, the cooling intracavity is equipped with half off baffle, half off baffle separates into the cooling chamber cooling unit inlet channel, the connector channel, cooling unit outlet passage, cooling unit inlet channel, the connector channel, be equipped with the guide plate of arranging side by side along the coolant flow direction in the cooling unit outlet passage, form the guiding gutter between adjacent guide plate side by side, coolant flows along the guiding gutter.
Fig. 2 shows a controller box corresponding to the back of the side-by-side IGBT modules, providing a side-by-side IGBT module heat sink channel design. After entering from the cooling medium inlet channel, the cooling medium must flow through the cooling units in sequence and then flow out through the cooling medium outlet channel, so this example is a serial cooling water channel design.
Example two
In practical application, the design of the serial-type heat-dissipating water channel of the first embodiment has the following problems: for the serial-type heat dissipation water channels, heat dissipation media must flow through all the water channels in sequence to take away heat generated by the IGBT module, the heat dissipation media are in the heat dissipation system water channels, and the whole water channel flow is long; secondly, when the water channel of the heat dissipation system is too long, the obtained heat dissipation effect of the IGBT module is different according to the distance between the IGBT module and the water inlet and outlet holes, the shorter the distance between the IGBT module and the water inlet hole is, the better the obtained heat dissipation effect is, and the shorter the distance between the IGBT module and the water outlet hole is, the poorer the obtained heat dissipation effect is; the IGBT modules arranged side by side have different heat dissipation effects, the temperature of each IGBT module is different, the output power of each IGBT module is different, the output current of the IGBT module with higher temperature is smaller, and the output power of the IGBT module with higher temperature is lower, so that the power output of the controller can be influenced by the IGBT module with higher temperature, and the output power of the controller depends on the IGBT module with the smallest output power.
In order to solve the above problems, as shown in fig. 3, the present disclosure discloses a parallel cooling heat exchange manner, that is, a power module cooler includes an inlet main channel, an outlet main channel, a cooling unit a, a cooling unit B, a cooling unit C, a cooling unit D, a cooling unit E, and a cooling unit F, the inlet main channel is communicated with a cooling medium inlet channel, inlets of the cooling unit a, the cooling unit B, the cooling unit C, the cooling unit D, and the cooling unit F are communicated with the inlet main channel, outlets of the cooling unit a, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E, and the cooling unit F are communicated with the outlet main channel, the outlet main channel is communicated with a cooling medium outlet channel, a cooling medium entering the inlet main channel through the cooling medium inlet channel simultaneously flows through the cooling unit a, the cooling unit B, the cooling unit C, and the cooling unit C, And the cooling medium in the outlet main channel is discharged through the cooling medium outlet channel.
Based on above scheme, in order to realize the function of cooling unit, improve the cooling radiating effect, cooling unit A, cooling unit B, cooling unit C, cooling unit D, cooling unit E, the cooling unit F of this scheme include the cooling chamber, are equipped with many guide plates of arranging side by side along the coolant flow direction in the cooling chamber, form the guiding gutter between adjacent guide plate side by side, and coolant flows along the guiding gutter.
As shown in fig. 3, the present embodiment has 6 independent cooling units, and performs heat dissipation simultaneously to form a parallel-type heat dissipation channel design. The parallel water channel design is adopted in the embodiment, so that the parallel IGBT power modules can obtain equal heat dissipation effect of the IGBT modules, the temperature of the IGBT modules is more average, the output power of the IGBT modules is more average, and the output power of the controller can be improved.
This scheme discloses a heat radiation structure of parallelly connected power module, adopted serial-type, the design of parallel heat dissipation water course, wherein the design of parallel heat dissipation water course has 6 independent cooling units, an independent IGBT module that corresponds, independent IGBT module can with correspond the heat dissipation medium effect in the independent cooling unit, conduct the heat for the heat dissipation medium simultaneously, the back is taken away with the heat of independent IGBT module to the heat dissipation medium, the temperature of IGBT module can be maintained in reasonable scope. Since the 6 independent cooling units operate simultaneously, the heat generated by the IGBT modules in parallel can be conducted by the corresponding cooling units at the same time. Therefore, the temperature among the independent IGBT modules is relatively even, the output current is relatively consistent, and the power output is relatively consistent. Therefore, the output power of the IGBT module can be correspondingly improved, and the IGBT module is not limited by the IGBT module with higher temperature due to temperature difference.
The devices, components, etc. disclosed in this embodiment may be implemented in any conventional and customary manner known in the art, unless otherwise specified. The heat dissipation structure of the parallel power module in the present invention is not limited to the content disclosed in the specific embodiment, the technical solutions presented in the embodiments can be extended based on the understanding of those skilled in the art, and simple alternatives made by those skilled in the art according to the present invention in combination with common general knowledge also belong to the scope of the present invention.
Claims (5)
1. The heat dissipation structure of the parallel power modules is characterized by comprising a heat dissipation back plate, wherein a cooling medium inlet channel, a power module cooler and a cooling medium outlet channel are arranged in the heat dissipation back plate, the cooling medium inlet channel is communicated with an inlet of the power module cooler, the cooling medium outlet channel is communicated with an outlet of the power module cooler, the power module cooler comprises a plurality of cooling units which are in heat conduction connection with the corresponding power modules, and cooling media enter the power module cooler through the cooling medium inlet channel for heat exchange and then are discharged through the cooling medium outlet channel.
2. The heat dissipation structure of parallel power modules as claimed in claim 1, wherein the power module cooler includes a cooling unit a, a cooling unit B, a cooling unit C, a cooling unit D, a cooling unit E, and a cooling unit F, an inlet of the cooling unit a communicates with the cooling medium inlet passage, an outlet of the cooling unit a communicates with an inlet of the cooling unit B, an outlet of the cooling unit B communicates with an inlet of the cooling unit C, an outlet of the cooling unit C communicates with an inlet of the cooling unit D, an outlet of the cooling unit D communicates with an inlet of the cooling unit E, an outlet of the cooling unit E communicates with an inlet of the cooling unit F, an outlet of the cooling unit F communicates with the cooling medium outlet passage, and a cooling medium entering the cooling medium inlet passage flows through the cooling unit a, the cooling unit E, and the cooling unit E sequentially, And the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E and the cooling unit F exchange heat and then are discharged through the cooling medium outlet channel.
3. The heat dissipation structure of parallel power modules according to claim 2, wherein the cooling unit a, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E, and the cooling unit F include a cooling cavity, a half partition plate is disposed in the cooling cavity, the half partition plate divides the cooling cavity into a cooling unit inlet channel, a connecting channel, and a cooling unit outlet channel, guide plates are disposed in the cooling unit inlet channel, the connecting channel, and the cooling unit outlet channel, the guide plates are disposed side by side along a flow direction of a cooling medium, guide grooves are formed between the adjacent guide plates, and the cooling medium flows along the guide grooves.
4. The heat dissipation structure of parallel power modules as claimed in claim 1, wherein the power module cooler includes an inlet header channel, an outlet header channel, a cooling unit a, a cooling unit B, a cooling unit C, a cooling unit D, a cooling unit E, and a cooling unit F, the inlet header channel communicates with the cooling medium inlet channel, inlets of the cooling unit a, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E, and the cooling unit F communicate with the inlet header channel, outlets of the cooling unit a, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E, and the cooling unit F communicate with the outlet header channel, the outlet header channel communicates with the cooling medium outlet channel, and a cooling medium entering the inlet header channel through the cooling medium inlet channel simultaneously flows through the cooling unit a, And the cooling medium in the outlet main channel is discharged through the cooling medium outlet channel.
5. The heat dissipation structure of parallel power modules according to claim 4, wherein the cooling unit A, the cooling unit B, the cooling unit C, the cooling unit D, the cooling unit E, and the cooling unit F comprise a cooling cavity, a plurality of flow deflectors arranged side by side along a flow direction of a cooling medium are arranged in the cooling cavity, a flow guiding groove is formed between the adjacent flow deflectors, and the cooling medium flows along the flow guiding groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021112673.3U CN212659533U (en) | 2020-06-16 | 2020-06-16 | Heat radiation structure of parallel power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021112673.3U CN212659533U (en) | 2020-06-16 | 2020-06-16 | Heat radiation structure of parallel power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212659533U true CN212659533U (en) | 2021-03-05 |
Family
ID=74753799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021112673.3U Active CN212659533U (en) | 2020-06-16 | 2020-06-16 | Heat radiation structure of parallel power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212659533U (en) |
-
2020
- 2020-06-16 CN CN202021112673.3U patent/CN212659533U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209882439U (en) | Double-sided heat dissipation high-performance water-cooling radiator and electrical equipment | |
| CN212659533U (en) | Heat radiation structure of parallel power module | |
| CN217691343U (en) | Air duct for energy storage container and energy storage container | |
| CN212785146U (en) | Frequency conversion cabinet | |
| CN213125826U (en) | High-efficient heat dissipation type converter | |
| CN209594132U (en) | A kind of liquid-cooled charge power supply radiator, charge power supply | |
| CN209895255U (en) | Wind-liquid mixed heat dissipation case | |
| CN110891406B (en) | Frequency conversion box body and centrifugal machine | |
| CN212648231U (en) | Heat radiation structure of power module | |
| CN216600638U (en) | Special water-cooling radiator for router | |
| CN114844273A (en) | Skid-mounted explosion-proof air-water cooling integrated equipment for slurry pump | |
| CN211981727U (en) | Power unit | |
| CN215773978U (en) | Power cabinet | |
| CN211508883U (en) | Heat radiator of IGBT module for wind power generation converter | |
| CN217822980U (en) | Liquid cooling heat insulation assembly and battery module | |
| CN215500186U (en) | Water-cooling heat dissipation structure and high-power servo driver heat dissipation assembly | |
| CN212812530U (en) | Dual-drive system power device | |
| CN220554249U (en) | Heat abstractor of magnetic suspension compressor electronic control module | |
| CN210223731U (en) | Reactor thermal management system, liquid cooling device and power system | |
| CN219876264U (en) | Board card structure and chassis | |
| CN218866909U (en) | Cooling device of liquid-cooled capacitor | |
| CN220382195U (en) | Composite cooling structure capable of combining battery pack liquid cooling plate and air cooling | |
| CN218783099U (en) | Direct-current cooling device, battery box and new energy automobile | |
| CN218733837U (en) | Converter power module | |
| CN214482079U (en) | Heat abstractor and machine controller cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |