CN212647259U

CN212647259U - Photoresist dip coating equipment

Info

Publication number: CN212647259U
Application number: CN202021667614.2U
Authority: CN
Inventors: 林刘恭
Original assignee: K Laser Technology Inc
Current assignee: K Laser Technology Inc; KLASER Tech Inc
Priority date: 2020-08-12
Filing date: 2020-08-12
Publication date: 2021-03-02
Anticipated expiration: 2030-08-12

Abstract

The utility model discloses a photoresist dip-coating device, which is used for dip-coating a photoresist on the outer surface of a metal roller. The photoresist dip coating apparatus comprises: a roller fixing device for fixing the metal roller; a dip coating device for containing a photoresist liquid; the moving device is used for enabling the roller fixing device and the dip-coating device to move relatively so that the dip-coating device can be used for dip-coating the partial outer surface of the metal roller with the contained photoresist liquid; and a rotating device for selectively rotating the metal roller at a coating speed and a thinning speed, wherein the rotating device can be used for rotating the metal roller at the thinning speed to thin the thickness of the photoresist liquid on the outer surface when the outer surface is uniformly coated with the photoresist liquid and leaves the photoresist liquid in the dip coating device. By applying the photoresist liquid dip coating equipment, the thickness of the photoresist layer formed on the outer surface of the metal roller is uniform, and the problem of excessive layer number superposition does not exist.

Description

Photoresist dip coating equipment

Technical Field

The utility model relates to a dip-coating equipment especially relates to a photoresistance liquid dip-coating equipment.

Background

When a photoresist layer is disposed on an outer surface of a metal roller, a conventional photoresist liquid coating apparatus often employs a droplet spraying method to distribute a photoresist liquid on the outer surface of the metal roller, and then performs a plurality of steps such as low-temperature baking, so that the photoresist liquid distributed on the outer surface of the metal roller is solidified to form the photoresist layer.

However, the conventional photoresist solution coating apparatus often takes a lot of time to complete the above-mentioned operation process, and the photoresist layer formed on the outer surface of the metal roller often has many defects such as too many superimposed layers or uneven thickness, which causes the above-mentioned problems such as the generation of micro-holes if the photoresist layer is further processed by a photolithography process.

Therefore, it is an important issue to be solved by the industry to provide a photoresist immersion plating apparatus to overcome the above-mentioned drawbacks.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a not enough a photoresist dip-coating equipment to prior art, it can improve the defect that probably produces when the outer surface of metal gyro wheel is scribbled to photoresist effectively.

The utility model discloses a one of them embodiment discloses a photoresistance liquid dip-coating equipment for dip-coating a photoresistance liquid on the surface of a metal gyro wheel, photoresistance liquid dip-coating equipment contains: a roller fixing device for fixing the metal roller; a dip coating device for containing the photoresist liquid; the moving device is used for moving the roller fixing device and the dip-coating device relatively so as to enable the dip-coating device to dip-coat the photoresist liquid contained in the dip-coating device on the partial outer surface of the metal roller; and a rotating device for selectively rotating the metal roller at a coating speed and a thinning speed; wherein the rotating device can be used for rotating the metal roller at the coating speed to uniformly coat the outer surface with the photoresist liquid when the metal roller is dipped by the photoresist liquid in the dip coating device; wherein the rotating device can be used for rotating the metal roller at the thinning speed to thin the thickness of the photoresist liquid on the outer surface when the outer surface is uniformly coated with the photoresist liquid and leaves the photoresist liquid in the dip coating device.

Preferably, the photoresist dipping apparatus further comprises a curing device, and the curing device is used for curing the photoresist attached to the outer surface of the metal roller, so that the photoresist is cured to form a photoresist layer.

Preferably, the curing device is an infrared lamp, a near-infrared lamp, or a xenon lamp, and the curing device is used for irradiating the photoresist liquid attached to the outer surface of the metal roller, so that the photoresist liquid is cured to form the photoresist layer.

Preferably, the roller fixing device comprises a clamping mechanism for clamping the metal roller; wherein the clamping mechanism is mounted to the rotating device.

Preferably, the dip coating device has an optimal water level height for measuring a minimum total solution amount required by the photoresist solution when the photoresist solution is dip coated on the metal roller; wherein the optimal water level height is 0.5-1 cm.

Preferably, the moving device comprises a lifting mechanism and a supporting mechanism mounted on the lifting mechanism; the supporting mechanism is used for supporting the bottom of the dip coating device, and the lifting mechanism is used for enabling the dip coating device to move along a direction vertical to the axis of the metal roller.

Preferably, the lifting mechanism comprises two moving rails, and one end of each moving rail is adjacent to the roller fixing device, and the other end of each moving rail is adjacent to the dip-coating device; wherein, one end of each moving track adjacent to the roller fixing device is separated from the roller fixing device by a safe distance, so that when each moving device enables the dip coating device and the roller fixing device to move relatively, the dip coating device does not collide with the metal roller.

Preferably, the rotating means comprises a speed control mechanism operable to rotate the metal roller at the coating speed of between 1 rpm and 120 rpm.

Preferably, the rotating device includes a speed control mechanism that can be used to rotate the metal roller at the thinning speed of from 2900 rpm to 4500 rpm.

Preferably, the moving means is used to move the dipping means and relatively move the dipping means toward the roller fixing means.

The utility model has the advantages of, the utility model provides a light resistance liquid dip-coating equipment, it can pass through "with coating speed rotates the metal gyro wheel and makes the metal gyro wheel the even coating of surface has light resistance liquid" and "with thinning speed rotates the metal gyro wheel and thins the metal gyro wheel the surface the technical scheme of the thickness of light resistance liquid makes follow-up being formed at the surface the thickness of light resistance layer is average and not have the number of piles too many problem of stack.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are provided for reference and illustration purposes only and are not intended to limit the present invention.

Drawings

Fig. 1 is a schematic perspective view of a photoresist dip-coating apparatus according to an embodiment of the present invention.

Fig. 2 is another schematic perspective view of a photoresist dip-coating apparatus according to an embodiment of the present invention.

Fig. 3 is a dynamic schematic diagram (one) of a photoresist dip coating apparatus according to an embodiment of the present invention.

Fig. 4 is a dynamic schematic diagram (two) of a photoresist dip coating apparatus according to an embodiment of the present invention.

Fig. 5 is a dynamic schematic view (iii) of a photoresist dip coating apparatus according to an embodiment of the present invention.

Fig. 6 is a dynamic schematic diagram (iv) of a photoresist dip-coating apparatus according to an embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view of section VII-VII of fig. 4.

Detailed Description

The following is a description of the embodiments of the present invention relating to a photoresist dipping apparatus by specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present invention. The utility model discloses the concrete embodiment of accessible other differences is implemented or is used, and each item detail in this specification also can be based on different viewpoints and application, does not deviate from the utility model discloses a carry out various modifications and changes under the design. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. Furthermore, as will be described in greater detail below with reference to and as illustrated in the accompanying drawings, it is emphasized that this description is in general made to the figures, which are referred to more fully, and not to limit the scope of the description. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

Referring to fig. 1 to 7, which are illustrations of embodiments of the present invention, it should be noted that the corresponding drawings and related numbers and shapes are only used for describing embodiments of the present invention in detail, so as to facilitate understanding of the contents of the present invention, but not for limiting the scope of the present invention.

Referring to fig. 1, an embodiment of the present invention provides a photoresist dipping apparatus 100 for dipping a photoresist 300 on an outer surface 201 of a metal roller 200, and the photoresist dipping apparatus 100 is preferably disposed in a dust-free chamber 400, so that the photoresist 300 is not easily contaminated by external environment. In the present embodiment, the grade of the clean room 400 is from federal standard grade 1 to federal standard grade 500, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the photoresist dip coating apparatus 100 may not be disposed in the clean room 400.

In this embodiment, the length of the metal roller 200 is 1 meter (M) to 2 meters, the diameter of the cross section of the metal roller 200 is 10 centimeters (cm) to 45 cm, and the metal roller 200 is preferably made of stainless steel, but the present invention is not limited thereto. For example, the metal roller 200 may be made of tin, lead, zinc, aluminum, copper, brass, iron, nickel, cobalt, tungsten, chromium, or a metal having a hardness greater than that of chromium, and the length and cross section of the metal roller 200 may be designed as desired.

In the present embodiment, the photoresist solution 300 is a positive photoresist, which is mainly made of Phenol-formaldehyde resin (Phenol-formaldehyde resin), but the present invention is not limited thereto. For example, the photoresist liquid 300 may be made of a positive photoresist material such as Epoxy resin (Epoxy resin).

As shown in fig. 1, the photoresist dip coating apparatus 100 includes: a roller fixing device 1 disposed adjacent to both ends of the metal roller 200, a dip coating device 2 disposed at an interval from the metal roller 200, a moving device 3 connected to the dip coating device 2, a rotating device 4 installed at the roller fixing device 1, and a curing device 5 having a position corresponding to the dip coating device 2. Wherein the metal roller 200 is arranged between the dip coating device 2 and the curing device 5 at intervals. It should be noted that, in other embodiments not shown in the present invention, the photoresist immersion coating apparatus 100 may not include the curing device 5.

The roller fixing device 1 is used for fixing the metal roller 200, and the roller fixing device 1 includes a clamping mechanism 11 for clamping the metal roller 200. The clamping mechanism 11 includes a circular elastic collet chuck, and the clamping mechanism 11 is driven by oil pressure to clamp the metal roller 200, but the present invention is not limited thereto. For example, the circular elastic collet may be a lathe chuck or other fixture, and the clamping mechanism 11 may be driven by air pressure or manually so that the circular elastic collet can clamp the metal roller 200.

The clamping mechanism 11 is attached to the rotating device 4. When the rotating device 4 is operated, the rotating device 4 may rotate the clamping mechanism 11, so that the metal roller 200 is rotated by the clamping mechanism 11, but the present invention is not limited thereto. For example, the clamping mechanism 11 may not be mounted to the rotating device 4.

As shown in fig. 1 and 7, the dip coating device 2 is used to contain the photoresist solution 300, and the dip coating device 2 has an optimal water level height H, which is used to measure a minimum amount of the photoresist solution 300 required by the photoresist solution 300 when the photoresist solution 300 is dip coated on the metal roller 200, so that the amount of the photoresist solution 300 can be precisely controlled and is not wasted. Wherein the optimal water level height H is 0.5-1 cm.

It should be noted that the optimal water level height H is not the maximum height of the dip coating device 2, and the optimal water level height H is preferably half of the maximum height of the dip coating device 2, so that when the metal roller 200 is disposed in the dip coating device 2, the metal roller 200 does not occupy the accommodating space of the dip coating device 2, and further the photoresist 300 may overflow the dip coating device 2, but the present invention is not limited thereto. For example, the optimal water level height H may also be adjusted flexibly according to the aspect ratio of the dip coating device 2, so that it is lower or higher than half of the maximum height of the dip coating device 2.

As shown in fig. 3, the moving device 3 is used to move the roller fixing device 1 and the dip coating device 2 relatively, so that the dip coating device 2 can be used to dip coat the photoresist solution 300 contained therein on a part of the outer surface 201 of the metal roller 200. In more detail, in the embodiment, the moving device 3 is used for moving the dip coating device 2 and relatively moving the dip coating device 2 toward the roller fixing device 1, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the moving device 3 may also be used to move the roller fixing device 1 and relatively move the roller fixing device 1 to the dip coating device 2.

The moving device 3 comprises a lifting mechanism 31 and a supporting mechanism 32 mounted on the lifting mechanism 31; the supporting mechanism 32 is used to support the bottom of the dip coating apparatus 2, and the lifting mechanism 31 is used to move the dip coating apparatus 2 along a direction perpendicular to the axial direction of the metal roller 200. It should be noted that the mobile device 3 mainly operates in the manner depicted in fig. 1 in the embodiment, but the present invention is not limited thereto. For example, the mobile device 3 may also operate in the manner depicted in FIG. 2 or other ways not depicted.

In more detail, as shown in fig. 1, the moving device 3 is a lifting platform, preferably an oil pressure lifting platform, but the present invention is not limited thereto. For example, the moving device 3 may also be a hydraulic lifting platform or an electric lifting platform. Specifically, the lifting mechanism 31 includes a lifting bracket of the oil pressure lifting platform and a base for supporting the lifting bracket, and the supporting mechanism 32 includes a supporting platform disposed on the lifting bracket.

In more detail, as shown in fig. 2, the lifting mechanism 31 includes two symmetrical moving rails 311 disposed adjacent to two ends of the dip coating apparatus 2 in the length direction, respectively, and the supporting mechanism 32 includes two symmetrical moving platforms disposed on the two moving rails 311, respectively. Wherein one end of each of the moving rails 311 is adjacent to the roller fixture 1, the other end is adjacent to the dip coating device 2, and one end of each of the moving rails 311 adjacent to the roller fixture 1 is spaced apart from the roller fixture 1 by a safety distance S, so that the dip coating device 2 does not collide with the metal roller 200 when each of the moving devices 3 moves the dip coating device 2 relative to the roller fixture 1.

The rotating device 4 is used for selectively rotating the metal roller 200 at a coating speed C and a thinning speed T, and the rotating device 4 comprises a speed control mechanism (not shown) which can be used for controlling the speed of the rotating device 4 rotating the metal roller 200. In more detail, as shown in fig. 4, the rotating device 4 can be used to rotate the metal roller 200 at the coating speed C by the speed control mechanism when the metal roller 200 is dip-coated by the photoresist liquid 300 in the dip-coating device 2, so that the outer surface 201 is uniformly coated with the photoresist liquid 300. Wherein the speed control mechanism is operable to rotate the metal roller 200 at the coating speed C between 1 and 120 Revolutions Per Minute (RPM).

In more detail, as shown in fig. 5, the rotating device 4 can be used to thin the thickness of the photoresist liquid 300 coated on the outer surface 201 by rotating the metal roller 200 at the thinning speed T by the speed control mechanism when the outer surface 201 is uniformly coated with the photoresist liquid 300 and leaves the photoresist liquid 300 in the dip coating device 2. Wherein the speed control mechanism can be used to rotate the metal roller 200 at the thinning speed of 2900 rpm to 4500 rpm.

As shown in fig. 6, the curing device 5 is used for curing the photoresist solution 300 attached to the outer surface 201 of the metal roller 200, so that the photoresist solution 300 is cured to form a photoresist layer 301. In more detail, the curing device 5 is used for irradiating the photoresist solution 300 attached to the outer surface 201 of the metal roller 200, so that the photoresist solution 300 is cured to form the photoresist layer 301. The thickness of the photoresist layer is 0.1 micrometers (μm) to 0.5 micrometers, preferably 0.3 micrometers to 0.5 micrometers, but the invention is not limited thereto.

It should be noted that the curing device 5 is an infrared lamp in this embodiment, and is disposed at an interval and fixedly on one side of the metal roller 200 relatively far away from the dip coating device 2, but the present invention is not limited thereto. For example, the solidifying device 5 may be disposed at a position spaced apart from and movable to a side of the metal roller 200 opposite to the dip coating device 2, and the solidifying device 5 may be a near infrared lamp or a xenon lamp; alternatively, the curing device 5 may be disposed in spaced and adjacent relation to the dip coating device 2.

It should be noted that, when the xenon lamp irradiates the photoresist liquid 300, the photoresist liquid 300 will be cured, thereby effectively reducing the time required for curing the photoresist liquid 300; when the near infrared ray lamp irradiates the photoresist 300, the photoresist 300 is cured and the photoresist layer 301 is formed without remaining temperature, so that the metal roller 200 can enter the next process without waiting.

[ advantageous effects of the embodiments ]

The utility model discloses an one of them beneficial effect lies in, the utility model provides a light blockage liquid dip-coating equipment 100, it can pass through "with coating speed C rotates metal gyro wheel 200 and makes metal gyro wheel 200 the even coating of surface 201 has light blockage liquid 300" and "with thinning speed T rotates metal gyro wheel 200 and thins metal gyro wheel 200 the surface 201 the technical scheme of the thickness of light blockage liquid 300 makes follow-up being formed at the surface 201 the thickness of light blockage layer 301 is average and not have the too many problems of the number of piles of stack.

Furthermore, the utility model provides a photoresist solution dip-coating apparatus 100 can pass through "dip-coating device 2 has the optimum water level height H, it is used for measuring when photoresist solution 300 dip-coats metal gyro wheel 200, the required minimum solution total amount of photoresist solution 300" the technical scheme, make the quantity of photoresist solution 300 can be controlled by accurate and not wasted.

Furthermore, the present invention provides a photoresist dipping apparatus 100, which can prevent the dipping device 2 from colliding with the metal roller 200 when the moving device 3 moves the dipping device 2 and the roller fixing device 1 relatively, by using the technical scheme that "each moving rail 311 is adjacent to one end of the roller fixing device 1 and the roller fixing device 1 are spaced by the safety distance S".

The above disclosure is only a preferred and practical embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention, so that all the modifications of the equivalent technology made by the disclosure and drawings are included in the scope of the claims of the present invention.

Claims

1. A photoresist dip-coating apparatus for dip-coating a photoresist on an outer surface of a metal roller, the photoresist dip-coating apparatus comprising:

a roller fixing device for fixing the metal roller;

a dip coating device for containing the photoresist liquid;

the moving device is used for moving the roller fixing device and the dip-coating device relatively so as to enable the dip-coating device to dip-coat the photoresist liquid contained by the dip-coating device on the partial outer surface of the metal roller; and

a rotating device for selectively rotating the metal roller at a coating speed and a thinning speed; wherein the rotating device can be used for rotating the metal roller at the coating speed to uniformly coat the outer surface with the photoresist liquid when the metal roller is dipped by the photoresist liquid in the dip coating device; wherein the rotating device can be used for rotating the metal roller at the thinning speed to thin the thickness of the photoresist liquid on the outer surface when the outer surface is uniformly coated with the photoresist liquid and leaves the photoresist liquid in the dip coating device.

2. The immersion lithography apparatus according to claim 1, further comprising a curing device, wherein said curing device is used for curing said photoresist solution attached to said outer surface of said metal roller to cure said photoresist solution to form a photoresist layer.

3. The immersion lithography apparatus according to claim 2, wherein said curing device is an infrared lamp, a near-infrared lamp or a xenon lamp, and said curing device is used to irradiate said photoresist liquid attached to said outer surface of said metal roller to cure said photoresist liquid to form said photoresist layer.

4. The photoresist immersion plating apparatus of claim 1, wherein the roller fixing device comprises a clamping mechanism for clamping the metal roller; wherein the clamping mechanism is mounted to the rotating device.

5. The immersion coating apparatus according to claim 1, wherein the immersion coating device has an optimal water level height for measuring a minimum total amount of the solution required for the photoresist solution to dip-coat the metal roller; wherein the optimal water level height is 0.5-1 cm.

6. The photoresist immersion plating apparatus according to claim 1, wherein the moving device comprises a lifting mechanism and a supporting mechanism installed on the lifting mechanism; the supporting mechanism is used for supporting the bottom of the dip coating device, and the lifting mechanism is used for enabling the dip coating device to move along a direction perpendicular to the axis of the metal roller.

7. The photoresist immersion plating apparatus according to claim 6, wherein the lifting mechanism comprises two moving rails, and one end of each moving rail is adjacent to the roller fixing device, and the other end is adjacent to the immersion plating device; wherein, one end of each moving track adjacent to the roller fixing device is separated from the roller fixing device by a safe distance, so that when each moving device enables the dip coating device and the roller fixing device to move relatively, the dip coating device does not collide with the metal roller.

8. The photoresist immersion plating apparatus of claim 1 wherein the rotation device comprises a speed control mechanism operable to rotate the metal roller at the coating speed of between 1 rpm and 120 rpm.

9. The photoresist immersion plating apparatus of claim 1 wherein the rotation device comprises a speed control mechanism operable to rotate the metal roller at the thinning speed of from 2900 rpm to 4500 rpm.

10. The photoresist immersion plating apparatus of claim 1, wherein the moving device is configured to move the immersion plating device and relatively move the immersion plating device toward the roller fixing device.