CN212645916U - Temperature sensor and injection molding packaging mold thereof - Google Patents
Temperature sensor and injection molding packaging mold thereof Download PDFInfo
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- CN212645916U CN212645916U CN202020878264.8U CN202020878264U CN212645916U CN 212645916 U CN212645916 U CN 212645916U CN 202020878264 U CN202020878264 U CN 202020878264U CN 212645916 U CN212645916 U CN 212645916U
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Abstract
The utility model discloses a temperature sensor and encapsulation mould moulds plastics thereof. The temperature sensor comprises a temperature sensing element, a cable and a terminal; one end of the cable is provided with a terminal, and the other end of the cable is provided with a temperature sensing element; the temperature sensing device is characterized in that a cable a with a length L is arranged at one end of the cable close to the temperature sensing element and is directly connected with the temperature sensing element; the temperature sensing element and the cable a are encapsulated together by a plastic shell which is formed by injection molding; the plastic shell can directly wrap the temperature sensing element and the cable a, and the plastic shell is sealed with the cable a. Therefore, the utility model discloses the outward appearance uniformity is good, and reduce cost reduces the hidden danger of leaking and improves the temperature sensing performance, reduces assembly and encapsulating process maloperation, to the harm of temperature-sensing element.
Description
Technical Field
The utility model relates to a temperature sensor.
The utility model relates to an injection molding packaging mold to the outsourcing casing of injection moulding temperature sensor temperature-sensing element.
Background
At present, most temperature sensor products adopt a plastic shell to wrap a temperature sensing element, and then the temperature sensing element is sealed and protected by a glue filling mode. The packaging method used in the production process is that a manual glue gun or a glue filling system is filled with silica gel or epoxy resin, is leveled, is cooled and formed, and has high skill and long debugging and assembling procedures; and the temperature sensing element is badly positioned, the heat conductivity coefficients of the glue filling and the shell are inconsistent, and the waterproof and temperature sensing performances of the product are influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses not enough to prior art provides a temperature sensor, and it adopts injection moulding technology, wraps up temperature-sensing element and part pencil behind the thermoplastic elastomer material injection moulding, and the outward appearance uniformity is good, and reduce cost reduces the hidden danger of leaking and improves the temperature sensing performance, reduces assembly and encapsulating process maloperation, to the harm of temperature-sensing element.
In order to achieve the technical purpose, the utility model adopts the following technical proposal:
a temperature sensor comprises a temperature sensing element, a cable and a terminal; one end of the cable is provided with a terminal, and the other end of the cable is provided with a temperature sensing element; the temperature sensing device is characterized in that a cable a with a length L is arranged at one end of the cable close to the temperature sensing element and is directly connected with the temperature sensing element; the temperature sensing element and the cable a are encapsulated together by a plastic shell which is formed by injection molding; the plastic shell can directly wrap the temperature sensing element and the cable a, and the plastic shell is sealed with the cable a.
Furthermore, the plastic shell is made of thermoplastic materials through injection molding.
Furthermore, radium is carved LOGO and production serial number on the plastic casing.
Another technical object of the present invention is to provide an injection molding and packaging apparatus, for injection molding the plastic housing to package a to-be-packaged portion of a temperature sensor, wherein the to-be-packaged portion of the temperature sensor includes a temperature sensing element and a cable a directly connected to the temperature sensing element and having a length L; comprises a primary injection mold and a secondary injection mold; wherein:
the one-time injection mold comprises a one-time injection mold cavity, the whole one-time injection mold cavity is arranged in a semi-closed cylindrical shape, the closed end of the one-time injection mold cavity is provided with an outer convex part at the middle position, and the shape of the outer convex part is matched with the shape of the end part of the temperature sensing element; the axial length of the primary injection molding die cavity is matched with the length of the part to be packaged;
the part to be encapsulated, which is arranged in the one-time injection molding cavity, can be positioned through the convex part; injecting glue solution into a gap A between the part to be encapsulated and the cavity wall of the primary injection molding cavity, and forming an outer plastic coating layer capable of directly wrapping the part to be encapsulated after solidification so as to obtain a primary injection molding encapsulation workpiece; the shape of the outer plastic layer is consistent with that of the gap A;
the secondary injection mold comprises a secondary injection mold cavity, and the secondary injection mold cavity is integrally arranged in a semi-closed cylindrical shape; the axial length of the secondary injection molding mold cavity is longer than that of the outer plastic coating layer;
the primary injection molding packaging workpiece is placed in the secondary injection molding die cavity, the distance between the outer packaging plastic layer and the closed end of the secondary injection molding die cavity is d, and at least part of the outer packaging plastic layer has a surface which can be contacted with the cavity wall of the secondary injection molding die cavity, so that the radial positioning between the primary injection molding packaging workpiece and the cavity wall of the secondary injection molding die cavity is realized;
glue solution is injected into a gap B between the cavity wall of the secondary injection molding cavity and the primary injection molding packaging workpiece, and the solidified glue solution and an outer plastic coating layer on the surface layer of the primary injection molding packaging workpiece are condensed into a whole to form a plastic shell capable of directly coating a part to be packaged.
Furthermore, the one-time injection molding die cavity comprises a die cavity a, a die cavity b and a glue inlet a; the die cavity a is of a through structure; the die cavity b is of a semi-closed cavity structure and comprises a main cavity and branch cavities which are uniformly distributed on the periphery of the main cavity in the circumferential direction and communicated with the main cavity; the die cavity a and the open end of the main cavity of the die cavity b are arranged in a through mode, the inner diameter of the die cavity a is smaller than that of the main cavity of the die cavity b, and meanwhile the inner diameter of the die cavity a is matched with the outer diameter of a cable of a part to be packaged; the outer convex part is arranged at the middle part of the closed end of the main cavity of the die cavity b, and the main cavity of the die cavity b is provided with a glue inlet a; the clearance between the inner diameter of the main cavity of the die cavity b and the outer surface of the cable is 10-15% of the outer diameter of the cable;
the outer plastic coating layer is of a hollow semi-closed cylindrical sleeve structure, an inner concave part capable of being embedded with the induction head is arranged at the closed end, a plurality of positioning columns are radially arranged on the outer wall, and the end part of the induction head protrudes out of the inner concave part;
the secondary injection molding die cavity comprises a die cavity c, a die cavity d and a die cavity e, wherein the die cavity c is a semi-closed cylindrical cavity, the die cavity c is provided with a glue injection port b, the die cavity d and the die cavity e are of a hollow cylindrical cavity structure, and the die cavity e, the die cavity d and the die cavity c are communicated in sequence to form the secondary injection molding die cavity;
the inner diameter D3 of die cavity c matches with the circumscribed circle inner diameter D1 of the positioning column of outsourcing plastic layer, the inner diameter D4 of die cavity D matches with the sleeve structure outer diameter D2 of outsourcing plastic layer, and the inner diameter of die cavity e matches with the outer diameter of cable.
6. An injection molding and packaging apparatus as claimed in claim 4, wherein said one-shot molding cavity comprises a mold body, a glue injection port a and an external glue delivery pipe, wherein:
the mould body is internally provided with a one-time injection mould cavity which comprises a mould cavity a and a mould cavity b, wherein the mould cavity a is of a hollow cylindrical cavity structure, the inner diameter of the mould cavity a is matched with the outer diameter of a cable of a part to be packaged, the mould cavity b is of a semi-closed cylindrical cavity structure, the closed end of the mould cavity b is provided with an outer convex part at the middle position, and the shape of the outer convex part is matched with the shape of the end part of the temperature sensing element;
the number of the external conveying pipelines is at least two; the external conveying pipelines are uniformly distributed on the outer side of the die body, the inlet ends of the external conveying pipelines are converged at the glue injection port, the outlet ends of the external conveying pipelines are communicated with the die cavity b through holes penetrating through the die cavity b, and the through holes are arranged close to the connecting step surfaces of the die cavity a and the die cavity b;
the outer wall of the outer plastic layer is in a T shape and comprises a plastic outer sleeve a and a plastic outer sleeve b; the plastic sleeve b is of a hollow semi-closed cylindrical sleeve structure, the closed end of the plastic sleeve b is provided with an inner concave part capable of supporting the temperature sensing element, the temperature sensing element is supported in the inner concave part, the end part of the temperature sensing element protrudes out of the inner concave part, the plastic sleeve a only simply wraps the cable a, and the outer diameter of the plastic sleeve b is larger than that of the plastic sleeve a;
the secondary injection mold comprises a glue injection port b, a mold cavity c and a mold cavity d; the die cavity c is a hollow cylindrical cavity, the die cavity d is a semi-closed cylindrical cavity, the open end of the die cavity c is communicated with the open end of the die cavity d, the closed end of the die cavity d is communicated with the glue injection port through an external short pipe, meanwhile, the inner diameter of the die cavity d is matched with the outer diameter of the plastic outer sleeve a, and the outer diameter of the die cavity c is matched with the outer diameter of the plastic outer sleeve b.
Furthermore, the wire harness fixing seat and the rotary table are further included;
the rotary table is connected with the power output end of the rotary driving mechanism and is provided with a primary injection molding station and a secondary injection molding station; the turntable can rotate around the rotation center of the turntable under the driving of the rotation driving mechanism;
the primary injection mold is arranged at the primary injection station and comprises a primary injection upper mold and a primary injection lower mold which are matched for use, the primary injection upper mold is positioned above the turntable, and the primary injection lower mold is positioned below the turntable;
the secondary injection mold is arranged at the secondary injection station and comprises a secondary injection upper mold and a secondary injection lower mold which are matched with each other, the secondary injection upper mold is positioned above the turntable, and the secondary injection lower mold is positioned below the turntable;
the wire harness fixing seat is arranged on the turntable and can clamp a cable of a to-be-injection-molded packaging workpiece; the rotary disc can be driven by the rotary disc to alternately locate at a primary injection molding station and a secondary injection molding station;
when the wire harness fixing seat for clamping the workpiece to be subjected to injection molding encapsulation is positioned at a primary injection molding station, the clamped workpiece to be subjected to injection molding encapsulation can be subjected to primary injection molding encapsulation through a primary injection mold, so that a primary injection molding encapsulation workpiece is obtained;
when the wire harness fixing seat clamped with the primary injection molding packaging workpiece is positioned at a secondary injection molding station, the clamped primary injection molding packaging workpiece can complete secondary injection molding packaging through a secondary injection mold, so that a finished product is obtained.
Furthermore, the two wire harness fixing seats are respectively a wire harness fixing seat a and a wire harness fixing seat b; the two wire harness fixing seats can be alternately positioned at a primary injection molding station and a secondary injection molding station along with the rotation of the rotary table.
According to foretell technical scheme, for prior art, the utility model discloses following beneficial effect has:
the utility model discloses an injection moulding technology, with parcel temperature-sensing element and part pencil behind the thermoplastic elastomer material injection moulding, the outward appearance uniformity is good, and reduce cost reduces the hidden danger of leaking and improves the temperature sensing performance, reduces assembly and encapsulating process maloperation, to the harm of temperature-sensing element.
Drawings
Fig. 1 is a schematic structural diagram of a temperature sensor according to the present invention;
fig. 2 is an exploded view of the temperature sensor according to the present invention;
FIG. 3 is a schematic view of a first structure of the injection molding and packaging apparatus for a temperature sensor according to the present invention;
FIG. 4 is an enlarged schematic view of the primary injection mold (assembled with the packaged workpiece to be injection molded, in a mold clamping state) in FIG. 3;
FIG. 5 is a schematic structural diagram of a packaged workpiece to be injection molded;
FIG. 6 is a schematic structural view of the one-shot injection mold of FIG. 3;
FIG. 7 is an enlarged schematic view of the secondary injection mold (assembled with the primary injection-molded package workpiece, in a mold-closed state) of FIG. 3;
FIG. 8 is a schematic structural diagram of a primary injection-molded packaged workpiece obtained after the primary injection-molded packaged workpiece is subjected to injection molding and packaging by the primary injection mold shown in FIG. 4;
FIG. 9 is a schematic structural view of the two-shot mold of FIG. 3;
FIG. 10 is a second schematic structural view of the injection molding and packaging apparatus for a temperature sensor according to the present invention;
FIG. 11 is an enlarged schematic view of the primary injection mold of FIG. 10 (assembled with a work piece to be injection molded and packaged, in a mold clamping state);
FIG. 12 is a schematic structural view of the one-shot injection mold of FIG. 10;
FIG. 13 is an enlarged schematic view of the secondary injection mold of FIG. 10 (fitted with a primary injection molded package workpiece, in a closed position);
fig. 14 is a schematic structural diagram of a one-time injection-molded packaged workpiece obtained after the one-time injection-molded packaged workpiece is subjected to injection molding and packaging through the one-time injection mold shown in fig. 10;
FIG. 15 is a schematic structural view of the two-shot mold of FIG. 10;
in the figure: 1-plastic shell, 2-temperature sensing element, 3-cable, 4-terminal; 5-1, fixing a wire harness seat; 6-1, encapsulating the workpiece to be injection molded; 6-2, performing one-time injection molding to package the workpiece; 6-1-1, and an outer plastic layer a; 6-1-2 and a positioning column; 7-one-time injection molding; 7-1, a die cavity a; 7-2, a main cavity of the die cavity b; 7-2-1 and a branch cavity of the die cavity b; 7-3, a glue inlet a; 7-4, external convex part; 7-5, externally connecting a glue conveying pipeline; 8-secondary injection molding; 8-1, a glue injection port b; 8-2, die cavity c; 8-3, a die cavity d; 8-4, a die cavity e; 9-a turntable; d1 is the space between the positioning columns on both sides of the outer plastic layer a; d2 is the outer diameter of the outer plastic layer a; d3 is the inner diameter of cavity c; d4 is the inner diameter of die cavity D; h is the axial length of the die cavity d.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention. Unless specifically stated otherwise, the relative arrangement of the components and steps, expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may also be oriented in other different ways (rotated 90 degrees or at other orientations).
Example 1
As shown in fig. 1 and 2, the temperature sensor of the present invention includes a temperature sensing element 2, a cable 3 and a terminal 4; a terminal 4 is installed at one end of the cable 3, the cable 3 and the terminal 4 are connected through a crimping tool, the temperature sensing element 2 is installed at the other end of the cable 3, and the temperature sensing element 2 and the cable 3 are connected in a soldering mode; the cable 3 is arranged at one end close to the temperature sensing element 2, and a section of cable 3a with the length L is packaged in the plastic shell 1 together with the temperature sensing element 2 in an injection molding mode; the plastic shell 1 is directly wrapped on the peripheries of the temperature sensing element 2 and the cable 3a, and the plastic shell 1 and the cable 3a are sealed. The plastic shell 1 is formed by adopting thermoplastic materials through injection molding. And the plastic shell 1 is laser-etched with LOGO and production numbers.
The part to be encapsulated of the temperature sensor (comprising the temperature sensing element 2 and a part of cable 3 which is directly connected with the temperature sensing element 2 and has a length of L) is encapsulated by injection molding, and one of the difficulties lies in the positioning of the temperature sensing element 2; if a good positioning measure cannot be applied to the temperature sensing element 2 during the packaging process, poor contact between the temperature sensing element and the cable 3 is easily caused, which affects the performance of the product.
Therefore, the utility model provides an injection molding packaging method, it adopts "two-step method" to accomplish the encapsulation of moulding plastics of the whole part of waiting to encapsulate of temperature sensor. Specifically, glue is directly injected to a part to be packaged of the temperature sensor assembly in a step-by-step glue injection mode, and finally a plastic shell 1 capable of directly wrapping the part to be packaged is formed, so that the packaging of the temperature sensor assembly is completed; the method specifically comprises the following steps:
(1) fixing a cable 3 outside a part to be packaged of the temperature sensor assembly by using a wire harness fixing seat 5-1;
(2) placing a part to be packaged of the temperature sensor assembly into a primary injection molding mold cavity, wherein the end part of the primary injection molding mold cavity adopts an outer convex part 7-4 with the shape matched with the shape of the top of the induction head to position the top of the induction head;
(3) directly pouring glue into the primary injection molding cavity through a glue injection port A of the primary injection molding cavity, so that a gap A between the part to be packaged and the cavity wall of the primary injection molding cavity is filled with the glue solution, and after solidification, forming an outer plastic coating layer with a shape matched with the shape of the gap A on the part to be packaged, so that the primary injection molding of the part to be packaged can be completed, and a primary injection molding packaging workpiece 6-2 is obtained;
(4) the primary injection molding packaging workpiece 6-2 is moved out of the primary injection molding die cavity to the secondary injection molding die cavity; at least part of the outer surface of the outer plastic coating layer can contact with the cavity wall of the secondary injection molding cavity to radially position the primary injection molding packaging workpiece 6-2 in the secondary injection molding cavity, and a distance d is reserved between the end part of the secondary injection molding cavity and the outer plastic coating layer of the primary injection molding packaging workpiece 6-2;
(5) directly pouring glue into the secondary injection molding die cavity through a glue injection port B8-1 of the secondary injection molding die cavity, so that a gap B between the primary injection molding packaging workpiece 6-2 and the cavity wall of the secondary injection molding die cavity is filled with glue, and the glue and an outer plastic coating layer on the surface layer of the primary injection molding packaging workpiece 6-2 are condensed into a whole after being solidified, thereby forming the plastic shell 1 capable of directly wrapping the part to be packaged.
Therefore, the injection molding packaging method of the present invention is also applicable to packaging of the to-be-packaged portion of other sensors, and is not limited to the temperature sensor including the temperature sensing element 2.
In order to realize the injection molding and packaging method, the utility model provides an injection molding and packaging device, which is specifically referred to the following embodiment 2 and embodiment 3.
Example 2
As shown in fig. 3-9, the injection molding and packaging device of the present invention includes a turntable 9, a wire harness fixing seat 5-1, a primary injection mold 7, and a secondary injection mold 8; in fig. 3, the primary injection mold 7 and the secondary injection mold 8 are both in a mold closing state.
The turntable 9 can rotate around its center under the driving of a rotation driving mechanism (such as a motor) as shown in fig. 3. The turntable 9 is respectively provided with a primary injection molding station and a secondary injection molding station, so that a workpiece 6-1 to be subjected to injection molding and packaging (specifically, in a temperature sensor, an assembly formed by assembling a terminal 4, a cable 3 and a temperature sensing element 2 is adopted, and at the moment, a part needing packaging in the temperature sensor is still in an unencapsulated state) can be subjected to primary injection molding and packaging at the primary injection molding station, then can reach the secondary injection molding station along with the rotation of the turntable 9, and then is subjected to secondary injection molding and packaging at the secondary injection molding station, so as to obtain a finished product.
The harness fixing seat 5-1 is fixedly arranged on the turntable 9 and can rotate along with the rotation of the turntable 9 as shown in fig. 3; and can clamp the cable 3 of the encapsulated workpiece 6-1 to be injection-molded. The number of the wire harness fixing seats 5-1 can be 1, or a plurality of wire harness fixing seats can be configured as required. In the attached drawings, the two wire harness fixing seats 5-1 are respectively a wire harness fixing seat 5-1a and a wire harness fixing seat 5-1 b; at this time, the injection molding and packaging equipment is double-station equipment, and the two harness fixing seats 5-1 can be alternately positioned at a primary injection molding station and a secondary injection molding station along with the rotation of the turntable 9, so that a primary injection molding and packaging process and a secondary injection molding and packaging process can be respectively applied to two products during production.
The primary injection mold 7 is arranged at a primary injection station of the turntable 9, and comprises a primary injection upper mold and a primary injection lower mold which are matched for use, wherein the primary injection upper mold is positioned above the turntable 9, and the primary injection lower mold is positioned below the turntable 9, as shown in fig. 3-6. When the wire harness fixing seat 5-1 is located at a primary injection molding station, the workpiece 6-1 to be subjected to injection molding and packaging is clamped through the wire harness fixing seat 5-1, then the primary injection upper mold and the primary injection lower mold are driven to be closed, the part to be packaged of the workpiece 6-1 to be subjected to injection molding and packaging is located in the mold cavity of the primary injection mold 7, then injection molding is carried out on the part to be subjected to injection molding and packaging in the mold cavity of the primary injection mold 7 through the glue injection port a of the primary injection mold 7, the injection molding temperature is 200 ℃, the cycle time is 40S, and primary injection molding and packaging of the workpiece 6-2 to be subjected to injection molding and.
The mold cavity of the primary injection mold 7, as shown in fig. 4-6, is a cylindrical semi-closed structure as a whole, and includes a mold cavity a7-1, a mold cavity b, and a glue inlet a7-3, wherein:
as shown in fig. 6, the mold cavity a7-1 is a through structure; the die cavity b is of a semi-closed cavity structure and comprises a main cavity and branch cavities which are circumferentially and uniformly distributed on two sides of the main cavity and communicated with the main cavity.
The die cavity a7-1 is communicated with the open end of the main cavity of the die cavity b, the inner diameter of the die cavity a7-1 is smaller than that of the main cavity of the die cavity b, and the inner diameter of the die cavity a7-1 is matched with the outer diameter of the cable 3 of the encapsulation workpiece 6-1 to be injection-molded. The outer convex part 7-4 is arranged at the middle position of the closed end of the main cavity of the cavity b to match the shape of the temperature sensing element 2 of the workpiece 6-1 to be subjected to injection molding, and when the workpiece 6-1 to be subjected to injection molding and packaged, which is clamped on the wire harness fixing seat 5-1, is positioned in the cavity of the primary injection mold 7, the outer convex part 7-4 can well position the temperature sensing element 2, so that the connection part between the temperature sensing element 2 and the cable 3 is prevented from being damaged in the glue filling process. Meanwhile, the inner diameter of the main cavity of the die cavity b is slightly larger than the outer diameter of the cable 3, so that a glue layer (an outer plastic layer) with the thickness of d can be formed on the periphery of the cable 3 after glue is poured into the gap between the main cavity of the die cavity b and the outer diameter of the cable 3, as shown in fig. 8, the thickness of the glue layer d is 10-15% of the outer diameter of the cable 3, and the length L of the glue layer is 2.5-3 times of the outer diameter of the cable 3, so that the effects of sealing the connection position of the temperature sensing element 2 and the cable 3 and sealing the temperature sensing element 2 can be realized by tightly. For example, for a cable 3 with an outer diameter of 4mm, the inner diameter of the main cavity of the mold cavity b is set to be 5mm, and an annular gap between the main cavity and the mold cavity b is 0.5mm, that is, the thickness of the formed glue layer is 0.5mm, and the length of the glue layer is 10.68 mm.
After the workpiece 6-1 to be injection-molded and encapsulated is subjected to glue pouring and injection molding by the primary injection mold 7, an outer plastic coating layer is formed on a part of the part to be encapsulated of the temperature sensor below the transverse axis of the temperature sensing element 2 (the reason is that the outer convex part 7-4 is semicircular and has a diameter consistent with the outer diameter of the temperature sensing element 2), as shown in fig. 8, the outer plastic coating layer is of a hollow semi-closed cylindrical sleeve structure so as to wrap the part of the part to be encapsulated of the temperature sensor below the transverse axis of the temperature sensing element 2, a plurality of positioning columns 6-1-2 are formed on the outer wall of the semi-closed sleeve, and an inner concave part matched with the lower half part of the temperature sensing element.
Therefore, the mold cavity structure of the primary injection mold 7 can perform positioning protection on the temperature sensing element 2 when the primary injection molding packaging process is performed on the workpiece 6-1 to be subjected to injection molding packaging, so as to prevent the temperature sensing element 2 from being damaged in the glue filling process, and can perform good positioning support (the combined action of the concave part and the positioning column 6-1-2) on the temperature sensing element 2 to prevent the damage of the connection position between the temperature sensing element 2 and the cable 3 and influence the quality of finished products when the secondary injection molding packaging process is performed on the outer plastic layer formed by the primary injection molding packaging process, and can perform good sealing wrapping on the connection position between the temperature sensing element 2 and the cable 3, so that the service life of the product is prolonged.
The mold cavity of the secondary injection mold 8 is integrally arranged in a semi-closed cylindrical shape as shown in fig. 7 and 9, and includes a mold cavity c8-2, a mold cavity d8-3 and a mold cavity e8-4, wherein the mold cavity c8-2 is a semi-closed cylindrical cavity, the mold cavity d8-3 and the mold cavity e8-4 are hollow cylindrical cavity structures, and the mold cavity e8-4, the mold cavity d8-3 and the mold cavity c8-2 are sequentially communicated to form the mold cavity of the secondary injection mold 8. And a glue injection port b8-1 is arranged at the position, close to the closed end, of the die cavity c8-2 so as to inject glue into the die cavity of the secondary injection mold 8.
The inner diameter of the die cavity c8-2 is matched with the inner diameter D1 of a circumcircle of the positioning column 6-1-2 of the outer plastic layer, the inner diameter of the die cavity D8-3 is matched with the outer diameter of the sleeve structure of the outer plastic layer, and the inner diameter of the die cavity e8-4 is matched with the outer diameter of the cable 3. When the primary injection molding packaging workpiece 6-2 clamped by the wire harness fixing seat 5-1 is positioned in the cavity of the secondary injection mold 8, the end surface of the positioning column 6-1-2 of the outer plastic coating layer of the primary injection molding packaging workpiece 6-2 is contacted with the inner wall surface of the cavity c8-2, the open end surface of the outer plastic coating layer is arranged on the step surfaces of the cavity d8-3 and the cavity e8-4, and the glue injection port is positioned between the temperature sensing element 2 and the closed end of the cavity of the secondary injection mold 8 when being projected onto the cavity axis of the secondary injection mold 8. The axial length of the die cavity d8-3 is H, and the value range of H is 20% of that of the molded plastic shell 1. The distance between the closed end of the die cavity of the secondary injection die 8 and the closed end of the outer plastic layer is 1/2 the axial length of the outer plastic layer.
Therefore, in the secondary injection molding and packaging process, on the one hand, make the annular plastic cover of shaping in the annular clearance between outsourcing plastic layer outer wall and die cavity c8-2 through the encapsulating, in order to solidify into an organic whole with the outsourcing plastic layer, on the other hand, the encapsulating can also make and form the plastic closing cap between outsourcing plastic layer top and secondary injection mold 8's the die cavity blind end, the sizing material that constitutes the plastic closing cap can with annular plastic cover, the outsourcing solidifies into an organic whole, thereby form complete outsourcing in temperature sensor treats the plastic casing 1 of encapsulation part.
In summary, it can be seen that the injection molding and packaging apparatus of the present invention forms the plastic housing 1 by step injection molding and packaging for better positioning the temperature sensing element 2, and specifically, the final molding is realized by one injection molding and packaging process and the secondary injection molding and packaging process for the portion of the plastic housing 1 below the horizontal axis, with the horizontal axis crossing the center of the temperature sensing element 2 as a boundary, and the molding is realized only when the secondary injection molding and packaging process is performed for the portion of the plastic housing 1 above the horizontal axis. This kind of mode can be fixed a position the temperature-sensing element 2 of encapsulating in-process better on the one hand, reduces assembly and encapsulating process maloperation to the harm of temperature-sensing element 2, improves the yields, and on the other hand, the shaping product compactness is good, and tensile strength 13.5MPa, the heat conductivity is unchangeable, reduces the hidden danger of leaking and improves the temperature sensing performance, has again, the utility model discloses can promote finished product uniformity and aesthetic measure.
Example 3
The present embodiment is different from embodiment 2 in that a primary injection mold 7 and a secondary injection mold 8 having different structural forms are used. Specifically, the method comprises the following steps:
as shown in fig. 10-12, the primary injection mold 7 according to this embodiment includes a mold body, a glue injection opening b8-1, and an external glue delivery pipe 7-5, in which a mold cavity a7-1 and a mold cavity b are provided in the mold body, the mold cavity a7-1 is a hollow cylindrical cavity structure, an inner diameter of the mold cavity is matched with an outer diameter of the cable 3 of the temperature sensor, the mold cavity b is a semi-closed cylindrical cavity structure, an outer protrusion 7-4 is provided at a middle position of a closed end of the mold cavity b, and a shape of the outer protrusion 7-4 is matched with a top arc surface of the temperature sensing element 2 of the temperature sensor. The external conveying pipelines are uniformly distributed on the outer side of the mold body, the inlet ends of the external conveying pipelines are converged at the glue injection port, the outlet ends of the external conveying pipelines are communicated with the mold cavity b through holes penetrating through the mold cavity b, and the through holes are arranged close to the connecting step surfaces of the mold cavity a7-1 and the mold cavity b. Therefore, once injection mold 7, keep away from temperature-sensing element 2 setting with the encapsulating site on the one hand, can reduce the sizing material and flow the damage that probably causes temperature-sensing element 2, on the other hand adopts outer convex part 7-4 location temperature-sensing element 2, further reduces the damage that the encapsulating probably caused temperature-sensing element 2.
And applying a one-time injection molding packaging process to the part of the temperature sensing element 2 to be packaged below the transverse axis through a one-time injection mold 7 to obtain the part of the plastic shell 1 below the transverse axis of the temperature sensing element 2.
Through a one-time injection molding packaging process, the obtained one-time injection molding packaging workpiece 6-2 forms an outer plastic coating layer in the part to be injection molded of the temperature sensor, which is below the transverse axis of the temperature sensing element 2, as shown in fig. 14. The outer plastic coating layer can directly wrap the part, to be subjected to injection molding, of the temperature sensor below the transverse shaft of the temperature sensing element 2, and the outer wall of the outer plastic coating layer is in a T shape and comprises a plastic outer sleeve a and a plastic outer sleeve b; the plastic casing a only simply wraps the cable 3, the plastic casing b wraps part of the cable 3, a connecting point between the cable 3 and the temperature sensing element 2 and a part of the temperature sensing element 2 below the transverse axis, and the outer diameter of the plastic casing b is larger than that of the plastic casing a.
As shown in fig. 13-15, the secondary injection mold 8 of the present embodiment includes a filling opening b8-1, a cavity c8-2, and a cavity d 8-3; the die cavity c8-2 is a hollow cylindrical cavity, the die cavity d8-3 is a semi-closed cylindrical cavity, the die cavity c8-2 is communicated with the open end of the die cavity d8-3, the closed end of the die cavity d8-3 is communicated with the glue injection port through an external short pipe, the inner diameter of the die cavity d8-3 is matched with the outer diameter of the plastic outer sleeve a, and the outer diameter of the die cavity c8-2 is matched with the outer diameter of the plastic outer sleeve b.
Through the secondary injection mold 8 of the embodiment, a secondary injection molding packaging process can be applied to a part of the temperature sensing element 2, where the part to be packaged is located above the horizontal axis, so as to solidify above the primary injection molding packaging workpiece 6-2 formed by the primary injection molding packaging process to obtain a part of the plastic shell 1, where the part is located above the horizontal axis of the temperature sensing element 2.
As is clear from the above description, in this example, the process is simplified as compared with example 1, and the cavity structure of the primary and secondary injection molds 8 is also simplified.
Claims (8)
1. A temperature sensor comprises a temperature sensing element, a cable and a terminal; one end of the cable is provided with a terminal, and the other end of the cable is provided with a temperature sensing element; the temperature sensing device is characterized in that a cable a with a length L is arranged at one end of the cable close to the temperature sensing element and is directly connected with the temperature sensing element; the temperature sensing element and the cable a are encapsulated together by a plastic shell which is formed by injection molding; the plastic shell can directly wrap the temperature sensing element and the cable a, and the plastic shell is sealed with the cable a.
2. The temperature sensor of claim 1, wherein the plastic housing is formed by injection molding a thermoplastic material.
3. The temperature sensor of claim 1, wherein the plastic housing is laser etched with LOGO and production number.
4. An injection molding packaging device, which is used for injection molding the plastic shell of claim 1 to package a part to be packaged of a temperature sensor, wherein the part to be packaged of the temperature sensor comprises a temperature sensing element and a cable a which is directly connected with the temperature sensing element and has a length L; the injection molding device is characterized by comprising a primary injection mold and a secondary injection mold; wherein:
the one-time injection mold comprises a one-time injection mold cavity, the whole one-time injection mold cavity is arranged in a semi-closed cylindrical shape, the closed end of the one-time injection mold cavity is provided with an outer convex part at the middle position, and the shape of the outer convex part is matched with the shape of the end part of the temperature sensing element; the axial length of the primary injection molding die cavity is matched with the length of the part to be packaged;
the part to be encapsulated, which is arranged in the one-time injection molding cavity, can be positioned through the convex part; injecting glue solution into a gap A between the part to be encapsulated and the cavity wall of the primary injection molding cavity, and forming an outer plastic coating layer capable of directly wrapping the part to be encapsulated after solidification so as to obtain a primary injection molding encapsulation workpiece; the shape of the outer plastic layer is consistent with that of the gap A;
the secondary injection mold comprises a secondary injection mold cavity, and the secondary injection mold cavity is integrally arranged in a semi-closed cylindrical shape; the axial length of the secondary injection molding mold cavity is longer than that of the outer plastic coating layer;
the primary injection molding packaging workpiece is placed in the secondary injection molding die cavity, the distance between the outer packaging plastic layer and the closed end of the secondary injection molding die cavity is d, and at least part of the outer packaging plastic layer has a surface which can be contacted with the cavity wall of the secondary injection molding die cavity, so that the radial positioning between the primary injection molding packaging workpiece and the cavity wall of the secondary injection molding die cavity is realized;
glue solution is injected into a gap B between the cavity wall of the secondary injection molding cavity and the primary injection molding packaging workpiece, and the solidified glue solution and an outer plastic coating layer on the surface layer of the primary injection molding packaging workpiece are condensed into a whole to form a plastic shell capable of directly coating a part to be packaged.
5. An injection molding and packaging apparatus as claimed in claim 4, wherein said one-shot mold cavity comprises a mold cavity a, a mold cavity b and a glue inlet a; the die cavity a is of a through structure; the die cavity b is of a semi-closed cavity structure and comprises a main cavity and branch cavities which are uniformly distributed on the periphery of the main cavity in the circumferential direction and communicated with the main cavity; the die cavity a and the open end of the main cavity of the die cavity b are arranged in a through mode, the inner diameter of the die cavity a is smaller than that of the main cavity of the die cavity b, and meanwhile the inner diameter of the die cavity a is matched with the outer diameter of a cable of a part to be packaged; the outer convex part is arranged at the middle part of the closed end of the main cavity of the die cavity b, and the main cavity of the die cavity b is provided with a glue inlet a; the clearance between the inner diameter of the main cavity of the die cavity b and the outer surface of the cable is 10-15% of the outer diameter of the cable;
the outer plastic coating layer is of a hollow semi-closed cylindrical sleeve structure, an inner concave part capable of being embedded with the induction head is arranged at the closed end, a plurality of positioning columns are radially arranged on the outer wall, and the end part of the induction head protrudes out of the inner concave part;
the secondary injection molding die cavity comprises a die cavity c, a die cavity d and a die cavity e, wherein the die cavity c is a semi-closed cylindrical cavity, the die cavity c is provided with a glue injection port b, the die cavity d and the die cavity e are of a hollow cylindrical cavity structure, and the die cavity e, the die cavity d and the die cavity c are communicated in sequence to form the secondary injection molding die cavity;
the inner diameter D3 of die cavity c matches with the circumscribed circle inner diameter D1 of the positioning column of outsourcing plastic layer, the inner diameter D4 of die cavity D matches with the sleeve structure outer diameter D2 of outsourcing plastic layer, and the inner diameter of die cavity e matches with the outer diameter of cable.
6. An injection molding and packaging apparatus as claimed in claim 4, wherein said one-shot molding cavity comprises a mold body, a glue injection port a and an external glue delivery pipe, wherein:
the mould body is internally provided with a one-time injection mould cavity which comprises a mould cavity a and a mould cavity b, wherein the mould cavity a is of a hollow cylindrical cavity structure, the inner diameter of the mould cavity a is matched with the outer diameter of a cable of a part to be packaged, the mould cavity b is of a semi-closed cylindrical cavity structure, the closed end of the mould cavity b is provided with an outer convex part at the middle position, and the shape of the outer convex part is matched with the shape of the end part of the temperature sensing element;
the number of the external conveying pipelines is at least two; the external conveying pipelines are uniformly distributed on the outer side of the die body, the inlet ends of the external conveying pipelines are converged at the glue injection port, the outlet ends of the external conveying pipelines are communicated with the die cavity b through holes penetrating through the die cavity b, and the through holes are arranged close to the connecting step surfaces of the die cavity a and the die cavity b;
the outer wall of the outer plastic layer is in a T shape and comprises a plastic outer sleeve a and a plastic outer sleeve b; the plastic sleeve b is of a hollow semi-closed cylindrical sleeve structure, the closed end of the plastic sleeve b is provided with an inner concave part capable of supporting the temperature sensing element, the temperature sensing element is supported in the inner concave part, the end part of the temperature sensing element protrudes out of the inner concave part, the plastic sleeve a only simply wraps the cable a, and the outer diameter of the plastic sleeve b is larger than that of the plastic sleeve a;
the secondary injection mold comprises a glue injection port b, a mold cavity c and a mold cavity d; the die cavity c is a hollow cylindrical cavity, the die cavity d is a semi-closed cylindrical cavity, the open end of the die cavity c is communicated with the open end of the die cavity d, the closed end of the die cavity d is communicated with the glue injection port through an external short pipe, meanwhile, the inner diameter of the die cavity d is matched with the outer diameter of the plastic outer sleeve a, and the outer diameter of the die cavity c is matched with the outer diameter of the plastic outer sleeve b.
7. An injection molding and packaging apparatus as claimed in claim 6, further comprising a harness mounting block and a turntable;
the rotary table is connected with the power output end of the rotary driving mechanism and is provided with a primary injection molding station and a secondary injection molding station; the turntable can rotate around the rotation center of the turntable under the driving of the rotation driving mechanism;
the primary injection mold is arranged at the primary injection station and comprises a primary injection upper mold and a primary injection lower mold which are matched for use, the primary injection upper mold is positioned above the turntable, and the primary injection lower mold is positioned below the turntable;
the secondary injection mold is arranged at the secondary injection station and comprises a secondary injection upper mold and a secondary injection lower mold which are matched with each other, the secondary injection upper mold is positioned above the turntable, and the secondary injection lower mold is positioned below the turntable;
the wire harness fixing seat is arranged on the turntable and can clamp a cable of a to-be-injection-molded packaging workpiece; the rotary disc can be driven by the rotary disc to alternately locate at a primary injection molding station and a secondary injection molding station;
when the wire harness fixing seat for clamping the workpiece to be subjected to injection molding encapsulation is positioned at a primary injection molding station, the clamped workpiece to be subjected to injection molding encapsulation can be subjected to primary injection molding encapsulation through a primary injection mold, so that a primary injection molding encapsulation workpiece is obtained;
when the wire harness fixing seat clamped with the primary injection molding packaging workpiece is positioned at a secondary injection molding station, the clamped primary injection molding packaging workpiece can complete secondary injection molding packaging through a secondary injection mold, so that a finished product is obtained.
8. An injection molding and packaging apparatus according to claim 7, wherein the two wire harness fixing seats are a wire harness fixing seat a and a wire harness fixing seat b; the two wire harness fixing seats can be alternately positioned at a primary injection molding station and a secondary injection molding station along with the rotation of the rotary table.
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| CN202020878264.8U CN212645916U (en) | 2020-05-22 | 2020-05-22 | Temperature sensor and injection molding packaging mold thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114069363A (en) * | 2021-11-04 | 2022-02-18 | 合肥邦立电子股份有限公司 | Sealing and insulating method and device for wire harness terminal of wheel speed sensor after crimping |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114069363A (en) * | 2021-11-04 | 2022-02-18 | 合肥邦立电子股份有限公司 | Sealing and insulating method and device for wire harness terminal of wheel speed sensor after crimping |
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