CN212627981U - Wireless communication chip - Google Patents

Abstract

An embodiment of the utility model provides a wireless communication chip, include: the user identification module is positioned in the system-in-package SIP package; and a wireless communication module located within the system-in-package SIP package and connected to the subscriber identity module. According to the utility model discloses a wireless communication chip based on SIP encapsulation has improved user identification module and wireless communication module's in thing networking devices integration, has improved mechanical reliability and safe matching nature to the cost is reduced.

Description

Wireless communication chip

Technical Field

The utility model relates to a wireless communication technical field especially indicates a wireless communication chip based on SIP encapsulation.

Background

The internet of things belongs to one of wireless mobile communication applications, and like a communication terminal, each terminal of the internet of things needs a module, namely a Subscriber Identity Module (SIM) or a Universal Integrated Circuit Card (UICC), which provides network access authentication and identity authentication functions in addition to a wireless communication chip for communication.

In the application of the current internet of things, the SIM or UICC mainly has two implementation modes:

the first is the traditional card plugging and unplugging method. As with conventional personal subscriber handsets, the SIM module consists of a plug-in card and a mechanical card slot. However, the conventional plug-in card implementation has the following disadvantages: firstly, the mechanical strength of connection is not enough, vibration, repeated plugging and unplugging and complex environmental conditions can cause the problems of looseness and aging of a plugging card and a mechanical card slot, and the SIM card cannot work; secondly, the traditional SIM module is large in size and limited in miniaturized applications such as bracelets and watches; thirdly, the SIM card is easy to be taken down, and the problems of machine-card separation, SIM card embezzlement, expense cheating and the like are easy to occur; finally, in most industrial applications, the SIM card needs to be inserted before the terminal of the Internet of things leaves the factory, so that the production procedures are increased, and the production cost is increased.

The other is an embedded sim (esim) or embedded uicc (euicc) single encapsulation implementation. Like a general patch type electronic component, the SIM patch card is soldered to the circuit board. The independent packaging mode of the eSIM or the eUICC meets the requirements of the mechanical strength and the size of the application of the Internet of things to a certain extent, but the integration level of the eSIM or the eUICC is not high, the eSIM or the eUICC which is packaged independently is not effectively matched with a communication chip, and the eSIM or the eUICC which is packaged independently needs to be prepared independently before the terminal manufacturer of the equipment of the Internet of things produces, so that the problems of long supply period, high material management difficulty and the like exist.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a wireless communication chip based on SIP encapsulation, is in the same place eSIM or eUICC and wireless communication chip integration to improve SIM card and communication chip's integrated level, mechanical reliability and security match nature, and the cost is reduced.

In order to solve the technical problem, the technical scheme of the utility model as follows:

a wireless communication chip, comprising:

the user identification module is positioned in the system-in-package SIP package; and

a wireless communication module located within the system-in-package SIP package and connected with the subscriber identity module.

Optionally, the subscriber identity module includes at least one first pin, the wireless communication module includes at least one second pin, and the at least one first pin and the at least one second pin are correspondingly connected.

Optionally, the first pin and the corresponding second pin are connected by a first trace in the system-in-package SIP package.

Optionally, the at least one first pin and the at least one second pin both extend outside the system-in-package SIP package.

Optionally, the first pin and the corresponding second pin are connected by a second trace outside the system in package SIP package.

Optionally, the subscriber identity module includes an embedded subscriber identity module eSIM or an embedded universal integrated circuit card eUICC.

Optionally, the wireless communication module includes a baseband processor.

Optionally, the wireless communication module further includes an application processor, a power management sub-module, and a memory.

Optionally, the wireless communication module supports 2G, 4G, 5G, a narrowband internet of things NB-IOT, and an internet of things eMTC standard based on LTE evolution.

Optionally, the number of the subscriber identity modules is at least one.

The above technical scheme of the utility model at least include following beneficial effect:

the above technical scheme of the utility model, eSIM or eUICC and wireless communication chip package are in the same place, and the integration level improves for the wireless terminal volume has obtained further compression, and on the PCB board, eSIM or eUICC occupation space not alone. The connection mechanical reliability of the eSIM or eUICC and the wireless communication chip is improved, and most industrial requirements can be met. The eSIM or the eUICC has no visible entity outside the wireless communication chip, and is matched with the wireless communication chip in a one-to-one manner, so that the security is greatly improved, and the risk of separating an inorganic card is avoided. An eSIM or eUICC circuit does not need to be additionally designed, so that the development period is shortened, and the development cost is reduced; after large-scale mass production, the material cost is also saved.

Drawings

Fig. 1 is a schematic diagram of a wireless communication chip based on SIP encapsulation according to an embodiment of the present invention;

fig. 2 is a schematic connection diagram of a subscriber identity module and a wireless communication module in a SIP package-based wireless communication chip according to an embodiment of the present invention;

fig. 3 is a schematic diagram of connection between a subscriber identity module and a wireless communication module in a wireless communication chip based on SIP package according to another embodiment of the present invention.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

According to the utility model discloses an embodiment, thing networking device includes but not limited to cell-phone, wearable equipment, intelligent medical equipment, notebook computer, mobile unit, intelligent household equipment etc..

As shown in fig. 1, an embodiment of the present invention provides a schematic diagram of a wireless communication chip based on SIP (system in package). The wireless communication chip based on the SIP package includes: a subscriber identity module 1 located within the SIP package; and a wireless communication module 2 located within the SIP package and connected to the subscriber identity module 1.

The embodiment of the utility model provides an in, subscriber identity module 1 can be eSIM or eUICC for example, and it realizes to thing networking equipment user's authentication and identification function of going into the net, can adopt any identification module that thing networking field is general, does not do specifically to restrict here.

In the disclosed embodiment, the wireless communication module may be a communication module of a mainstream wireless communication technology applied to the internet of things, such as a short-distance communication technology of Zigbee, WiFi, bluetooth, Z-wave, or a low-power Wide-Area Network (LPWAN), that is, a Wide-Area Network communication technology, which is not limited herein.

According to the utility model discloses an embodiment, eSIM or eUICC and wireless communication module encapsulation are in the same place, and the integrated level improves to on the PCB board, eSIM or eUICC do not only occupy the space, make the wireless terminal volume obtain further compression. The connection mechanical reliability of the eSIM or eUICC and the wireless communication module is improved, and most industrial requirements can be met. The eSIM or the eUICC has no visible entity outside the wireless communication module, so that one-to-one matching is realized, the security is greatly improved, and the risk of separating an inorganic card is avoided. Besides, an additional eSIM or eUICC circuit is not required to be designed separately, so that the development period is shortened, and the development cost is reduced; after large-scale mass production, the material cost can be saved.

As shown in fig. 2, in the embodiment of the present disclosure, the subscriber identity module 1 includes at least one first pin, and the at least one first pin may implement a general port function of the SIM module, including but not limited to a VDD port, a GND port, a clock port, a data port and a reset port. The wireless communication module 2 comprises at least one second pin, the at least one first pin and the at least one second pin corresponding. As shown in fig. 2, in an embodiment of the present invention, the first pin and the corresponding second pin are connected by a first trace in the SIP package, where the first trace is, for example, a substrate trace or a bonding wire.

According to the utility model discloses an embodiment, eSIM or eUICC and wireless communication module encapsulation are in the same place to through walking the line connection in the SIP encapsulation, make the integrated level obtain improving, and on the PCB board, eSIM or eUICC do not take up space, and the volume at thing networking terminal has obtained further compression. The connection mechanical reliability of the eSIM or eUICC and the wireless communication module is greatly improved, absolute one-to-one matching is carried out, the safety is greatly improved, and the risk of separating the inorganic card is avoided.

As shown in fig. 3, in another embodiment of the present invention, at least one first pin and at least one second pin both extend outside the SIP package. The at least one first pin may implement a general port of the SIM module function, including but not limited to a VDD port, a GND port, a clock port, a data port, and a reset port. The at least one first pin and the at least one second pin correspond.

According to the utility model discloses an embodiment, first pin and the second pin that corresponds pass through the line connection is walked to the outside second of SIP encapsulation, and the second is walked the line for example and is walked on the PCB board outside the SIP encapsulation.

The pin of the eSIM or the eUICC and the pin of the wireless communication module are led out to the outside of the SIP package, so that a more flexible pin connection mode can be realized, the eSIM or the eUICC and the wireless communication module are packaged together, the mechanical reliability of connection of the eSIM or the eUICC and the wireless communication module is greatly improved, absolute one-to-one matching is achieved, the safety is greatly improved, and the risk of separating an inorganic card is avoided.

According to the utility model discloses an embodiment, the figure of the eSIM or the eUICC of thing networking equipment can be one or more. Therefore, the multi-SIM card Internet of things equipment can be supported.

According to the utility model discloses an embodiment, wireless communication module 2 is used for realizing the wireless communication function of thing networking device, and it can be the communication chipset of any kind or multimode standard in 2G, 4G, 5G or NB-IOT, eMTC standard.

In an embodiment of the present invention, the wireless communication chipset at least includes a baseband chip, and may also include other chips such as an application processor, a power management chip, and a memory chip.

According to the above technical scheme of the utility model, eSIM or eUICC and wireless communication chip package are in the same place, and the integrated level improves, and on the PCB board, eSIM or eUICC do not only monopolize the space for the wireless terminal volume has obtained further compression. The connection mechanical reliability of the eSIM or eUICC and the wireless communication chip is improved, and most industrial requirements can be met. The eSIM or the eUICC has no visible entity outside the wireless communication chip, and is matched with the wireless communication chip in a one-to-one manner, so that the security is greatly improved, and the risk of separating an inorganic card is avoided. An additional independent eSIM or eUICC circuit is not required, so that the development period is shortened, and the development cost is reduced; after large-scale mass production, the material cost is also saved.

The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. A wireless communication chip, comprising:

a subscriber identity module (1) located within a system-in-package SIP package; and

a wireless communication module (2) located within the system in package SIP package and connected with the subscriber identity module (1).

2. The wireless communication chip according to claim 1,

the subscriber identity module (1) comprises at least one first pin, the wireless communication module (2) comprises at least one second pin, and the at least one first pin and the at least one second pin are correspondingly connected.

3. The wireless communication chip according to claim 2,

the first pin and the corresponding second pin are connected through a first wire in the system-in-package SIP package.

4. The wireless communication chip according to claim 2,

the at least one first pin and the at least one second pin each extend outside the system-in-package SIP package.

5. The wireless communication chip according to claim 4,

the first pins and the corresponding second pins are connected through second routing lines outside the system-in-package SIP package.

6. The wireless communication chip according to any one of claims 1 to 5,

the subscriber identity module (1) comprises an embedded subscriber identity module (eSIM) or an embedded universal integrated circuit card (eUICC).

7. The wireless communication chip according to any one of claims 1 to 5,

the wireless communication module (2) comprises a baseband processor.

8. The wireless communication chip according to claim 7,

the wireless communication module (2) further comprises an application processor, a power management submodule and a memory.

9. The wireless communication chip according to any one of claims 1 to 5,

the wireless communication module (2) supports 2G, 4G, 5G, narrow-band internet of things NB-IOT and an internet of things eMTC system based on LTE evolution.

10. The wireless communication chip according to any one of claims 1 to 5,

the number of the subscriber identity modules (1) is at least one.

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