CN212626887U - Micron-sized wire insulation layer removing device - Google Patents

Micron-sized wire insulation layer removing device Download PDF

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Publication number
CN212626887U
CN212626887U CN202021239244.2U CN202021239244U CN212626887U CN 212626887 U CN212626887 U CN 212626887U CN 202021239244 U CN202021239244 U CN 202021239244U CN 212626887 U CN212626887 U CN 212626887U
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China
Prior art keywords
laser
laser generator
micron
limiting mechanism
removing device
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Application number
CN202021239244.2U
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Chinese (zh)
Inventor
吕祥
蔡成新
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Suzhou Jiaqishi Technology Co ltd
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Suzhou JQS Info Tech Co Ltd
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Priority to CN202021239244.2U priority Critical patent/CN212626887U/en
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  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)

Abstract

The utility model discloses a micron-sized wire insulation layer removing device, which is characterized by comprising a laser, a laser generator and at least one group of limiting mechanisms; the laser is connected with a laser generator; the limiting mechanism is positioned below the laser generator and fixedly arranged on the laser; the limiting mechanism enables the cable to pass through the laser generator along the horizontal direction; the utility model ensures the wires to be at the same level by transmitting the wires through the limiting mechanism, thereby improving the wire stripping precision; the utility model discloses a set up laser generator and carry out the wire stripping to the insulating layer, fast, the precision is high and can not cause the damage to the product.

Description

Micron-sized wire insulation layer removing device
Technical Field
The utility model relates to a micron order electric wire removes insulating layer device belongs to cable technical field.
Background
At present, get rid of electric wire insulating layer often utilizes instruments such as wire cable stripping pincers, scissors, art designing sword to carry out manual destratifying, need give reasonable power way with the user, and too little can cause the insulating layer can't strip totally, and too big can damage the intraformational copper wire of insulating layer of power way, leads to one section electric wire to be unable to use, and indirect loss and the inefficiency that has caused on the cost.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome and remove the not enough of insulating layer inefficiency among the prior art, provide a micron order electric wire removes insulating layer device.
A micron-sized wire insulation layer removing device comprises a laser, a laser generator and at least one group of limiting mechanisms;
the laser is connected with a laser generator;
the limiting mechanism is positioned below the laser generator and fixedly arranged on the laser; the limiting mechanism enables the cable to pass through the laser generator along the horizontal direction.
Furthermore, the limiting mechanism comprises a base, a correcting column and a movable block, the base is connected with an adjusting screw, the correcting column is located on the movable block, the adjusting screw is in threaded connection with the base, and the output end of the adjusting screw is fixedly connected with the movable block.
Furthermore, any side of the limiting mechanism is provided with a supporting column, and the supporting column is used for supporting the cable.
Further, the laser emitter is provided with a protective cover.
Furthermore, the bottom of the laser is provided with a ground foot.
Further, the model of the laser generator is BFL-UVL 10W.
Compared with the prior art, the utility model discloses the beneficial effect who reaches: the utility model ensures the wires to be at the same level by transmitting the wires through the limiting mechanism, thereby improving the wire stripping precision;
the utility model discloses a set up laser generator and carry out the wire stripping to the insulating layer, fast, the precision is high and can not cause the damage to the product.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a partial front view of the present invention;
fig. 3 is a schematic view of the limiting mechanism of the present invention.
In the figure: 1. a laser; 2. a laser generator; 3. a protective cover; 4. a limiting mechanism; 41. a base; 42. adjusting the screw rod; 43. a correction column; 44. a movable block; 5. a porcelain bushing; 6. and (4) a support column.
Detailed Description
The present invention will be further described with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
As shown in fig. 1-3, a micrometer-sized wire insulation-removing device is disclosed, which comprises a laser 1, a laser generator 2 and at least one set of limiting mechanism 4; the laser 1 is connected with a laser generator 2; the limiting mechanism 4 is positioned below the laser generator 2 and is fixedly arranged on the laser 1; the limiting mechanism 4 enables the cable to pass through the laser generator 2 along the horizontal direction; the model of the laser generator is BFL-UVL 10W.
As shown in fig. 2 to fig. 3, the limiting mechanism 4 includes a base 41, a correcting column 43 and a movable block 44, the base 41 is connected with an adjusting screw 42, the correcting column 43 is located on the movable block 44, the adjusting screw 42 is in threaded connection with the base 41, and the output end is fixedly connected with the movable block 44.
As shown in fig. 2, a support column 6 is arranged on any side of the limiting mechanism 4, and the support column 6 is used for supporting a cable and supporting the cable from the bottom of a wire, so that the wire is conveniently arranged on the same horizontal plane, and the accuracy of removing an insulating layer is improved.
As shown in fig. 1, the laser emitter 2 is provided with a protective cover 3, so that the safety of the equipment is improved;
as shown in fig. 1, the bottom of the laser 1 is provided with a ground pin; the stability is increased.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.

Claims (6)

1. A micron-sized wire insulation layer removing device is characterized by comprising a laser (1), a laser generator (2) and at least one group of limiting mechanisms (4);
the laser (1) is connected with a laser generator (2);
the limiting mechanism (4) is positioned below the laser generator (2) and is fixedly arranged on the laser (1); the limiting mechanism (4) enables the cable to pass through the laser generator (2) along the horizontal direction.
2. The insulation removing device for the micron-sized electric wire according to claim 1, wherein the limiting mechanism (4) comprises a base (41), a correcting column (43) and a movable block (44), the base (41) is connected with an adjusting screw (42), the correcting column (43) is positioned on the movable block (44), the adjusting screw (42) is in threaded connection with the base (41), and the output end of the adjusting screw is fixedly connected with the movable block (44).
3. The micron-sized wire insulation removing device according to claim 1, wherein a support column (6) is arranged on either side of the limiting mechanism (4), and the support column (6) is used for supporting a cable.
4. The micron-sized wire de-jacketing device according to claim 1, wherein the laser generator (2) is provided with a shield (3).
5. The micron-sized wire de-insulation device according to claim 1, wherein the bottom of the laser (1) is provided with a ground pin.
6. The micron-sized wire de-jacketing device according to claim 1, wherein the laser generator (2) is of the type BFL-UVL 10W.
CN202021239244.2U 2020-06-30 2020-06-30 Micron-sized wire insulation layer removing device Active CN212626887U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021239244.2U CN212626887U (en) 2020-06-30 2020-06-30 Micron-sized wire insulation layer removing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021239244.2U CN212626887U (en) 2020-06-30 2020-06-30 Micron-sized wire insulation layer removing device

Publications (1)

Publication Number Publication Date
CN212626887U true CN212626887U (en) 2021-02-26

Family

ID=74756505

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021239244.2U Active CN212626887U (en) 2020-06-30 2020-06-30 Micron-sized wire insulation layer removing device

Country Status (1)

Country Link
CN (1) CN212626887U (en)

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GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address

Address after: 215011 No. 2, Kunlunshan Road, high tech Zone, Suzhou, Jiangsu

Patentee after: Suzhou Jiaqishi Technology Co.,Ltd.

Address before: 215000 No. 2 Kunlunshan Road, Suzhou High-tech Zone, Jiangsu Province

Patentee before: SUZHOU JIAQISHI INFORMATION SCIENCE & TECHNOLOGY Co.,Ltd.

CP03 Change of name, title or address