CN212625495U - High-efficiency chemical etching tank - Google Patents

Abstract

The utility model discloses a high-efficiency chemical etching bath, which comprises a bottom plate, a solution tank and a spraying shell, wherein the upper surface of the bottom plate is fixedly connected with the solution tank, a through hole is arranged in the middle of the bottom plate, the upper part of the bottom plate is provided with a mesh plate which is fixedly connected with the inner wall of the solution tank, the outer wall of the solution tank is fixedly connected with the spraying shell, the spraying shell is positioned at one end of the solution tank, which is far away from the bottom plate, the inner wall of the spraying shell is symmetrically and fixedly connected with a spraying pipe, the spraying pipe is equidistantly and fixedly connected with a spraying head, the lower surface of the bottom plate is fixedly connected with a fixed seat, the inside of the fixed seat is fixedly connected with a quick-release valve which is concentric with the through hole on the bottom plate, a waist-shaped hole is symmetrically arranged on one side surface, simple structure, strong safety, low cost and strong practicability.

Description

High-efficiency chemical etching tank

Technical Field

The utility model relates to an etching device field specifically is a high-efficient chemical etching groove.

Background

In the field of semiconductor manufacturing, dry etching may be employed, but the cost of dry etching is high. The wet etching method is low in cost, and in order to save cost, a metal wet etching method is generally used. In the existing wet bench process, an etching part is soaked in a chemical tank, and the soaking time of the etching part in the chemical tank is long, so that the wet etching uniformity in the prior art is poor, defects of a plurality of products are caused, such as inaccurate critical dimension and the like, the poor uniformity can influence the whole subsequent process, data becomes uncontrollable, and a plurality of defects are generated on a device, and therefore, the metal wet etching method cannot meet the process requirements. Therefore, a method for improving the uniformity and efficiency of wet etching of metal is urgently needed, and a high-efficiency chemical etching tank is proposed for the method.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a high-efficiency chemical etching bath to solve the problems in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a high-efficiency chemical etching tank.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient chemical etching groove, includes bottom plate, solution tank, sprays the casing, its characterized in that: the improved spraying device is characterized in that a solution tank is fixedly connected to the upper surface of the bottom plate, a through hole is formed in the middle of the bottom plate, a mesh plate is arranged on the upper portion of the bottom plate, the mesh plate is fixedly connected with the inner wall of the solution tank, a spraying shell is fixedly connected to the outer wall of the solution tank, the spraying shell is located at the solution tank and is far away from one end of the bottom plate, symmetrical and fixedly connected spray pipes are arranged on the inner wall of the spraying shell, spray heads are fixedly connected with the spray pipes at equal intervals, a fixing seat is fixedly connected with the lower surface of the bottom plate, a quick-release valve.

Preferably, waist shape hole has been seted up to the symmetry on a solution tank side, fixedly connected with rodless cylinder on the solution tank side outer wall in waist shape hole has been seted up, the external atmospheric pressure generating device of rodless cylinder, a side fixedly connected with material bracket of solution tank is kept away from to rodless cylinder, the material bracket passes waist shape hole and is located inside the solution tank, and is located the mesh board top.

Preferably, a second through hole is formed in one side face, away from the rodless cylinder, of the solution tank, a thermometer is arranged on the outer wall of the solution tank, and the thermometer penetrates through the second through hole and is connected to the outer wall of the solution tank through a bolt.

Preferably, the outer wall of one end, close to the bottom plate, of the solution tank is fixedly connected with supporting seats, and the four supporting seats are provided with third through holes.

Preferably, spray casing upper portion and seted up the square hole, and spray casing upper portion and be provided with the protective cover, the protective cover bottom surface is provided with the lug, the protective cover lower surface with spray shell upper surface contact, the lug is located the square hole.

Compared with the prior art, the beneficial effects of the utility model are that:

in the wafer production process, when etching is needed, the protective cover on the upper part of the equipment is opened, the protective cover can well prevent foreign matters from entering the device in the etching process and protect the safety of operators due to the outward splashing of etching liquid, then the materials with etching can be placed into the spraying shell, at the moment, the material bracket fixed on the rodless cylinder needs to be moved upwards, the whole moving process is more stable and efficient due to the use of the rodless cylinder, compared with the traditional manual operation, the efficiency and the accuracy are higher, the etching liquid sprayed out by the spraying head etches the materials, the solution sprayed out by the spraying head can play a role of scouring, solid wastes generated due to etching are taken away, the material bracket on the rodless cylinder is descended to drive the materials to descend into the solution tank, so that the materials are soaked in the solution, secondary etching is realized, and the etching is more uniform, after the etching is finished, the material bracket is moved upwards to separate the material from the solution, fewer operators are in direct contact with the solution, the temperature inside the device can be observed through the thermometer in the whole process, the process parameters of the etching can be accurately controlled, and the etching process can be finished more efficiently and reliably.

Drawings

FIG. 1 is a half-sectional perspective view of the structure of the present invention;

fig. 2 is a side perspective view of the present invention;

fig. 3 is a top view of the present invention.

In the figure: 1. a base plate; 2. a solution tank; 3. spraying the shell; 4. a first through hole; 5. a mesh plate; 6. a shower pipe; 7. a shower head; 8. a fixed seat; 9. a quick discharge valve; 10. a waist-shaped hole; 11. a rodless cylinder; 12. a material bracket; 13. a second through hole; 14. a thermometer; 15. a supporting seat; 16. a third through hole; 17. a square hole; 18. a protective cover; 19. and (4) a bump.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, a high-efficiency chemical etching bath includes a bottom plate 1, a solution tank 2, and a spraying housing 3, wherein the upper surface of the bottom plate 1 is fixedly connected with the solution tank 2, a first through hole 4 is formed in the middle of the bottom plate 1, a fixing seat 8 is fixedly connected to the lower surface of the bottom plate 1, a quick exhaust valve 9 is fixedly connected inside the fixing seat 8, the quick exhaust valve 9 is concentric with the first through hole 4 on the bottom plate 1, the quick exhaust valve 9 is used for quickly exhausting waste liquid after etching, the quick exhaust valve 9 can prevent the material from being damaged due to too long etching time because the etching time is strict, the quick exhaust valve 9 does not need to be described in detail in the prior art, a supporting seat 15 is fixedly connected to the outer wall of one end of the solution tank 2 close to the bottom plate 1, third through holes 16 are formed in the four supporting seats 15, and the supporting seats 15 are formed on the outer wall of the solution tank 2, so that the, make whole equipment more stable to the third through-hole 16 that sets up on it can make things convenient for equipment and other equipment fixed and jointly use, spray 3 upper portions of casing and seted up square hole 17, and spray 3 upper portions of casing and be provided with protective cover 18, protective cover 18 bottom surface is provided with lug 19, protective cover 18 lower surface and spray 3 upper surface contact, lug 19 is located square hole 17, and the etching solution has the corrosivity consequently to increase protective cover 18 and can play the effect of protection, increase the security.

Referring to fig. 2, a waist-shaped hole 10 is symmetrically formed on one side of the solution tank 2, a rodless cylinder 11 is fixedly connected to an outer wall of the solution tank 2 on the side where the waist-shaped hole 10 is formed, the rodless cylinder 11 is externally connected with an air pressure generating device, one side surface of the rodless cylinder 11, which is far away from the solution tank 2, is fixedly connected with a material bracket 12, the material bracket 12 passes through the waist-shaped hole 10 and is positioned in the solution tank 2, and is positioned above the mesh plate 5, a second through hole 13 is arranged on one side surface of the solution tank 2 far away from the rodless cylinder 11, the thermometer 14 is arranged on the outer wall of the solution tank 2, the thermometer 14 passes through the second through hole 13 and is connected on the outer wall of the solution tank 2 through a bolt, the requirement on the temperature in the etching process is very strict, the added thermometer 14 thus serves to constantly observe the internal temperature and thus improve the manufacturing process, resulting in better product quality.

Referring to fig. 3, a mesh plate 5 is arranged on the upper portion of the bottom plate 1, the mesh plate 5 is fixedly connected with the inner wall of the solution tank 2, a spraying shell 3 is fixedly connected to the outer wall of the solution tank 2, the spraying shell 3 is located at one end of the solution tank 2, which is far away from the bottom plate 1, spraying pipes 6 are symmetrically and fixedly connected to the inner wall of the spraying shell 3, spraying heads 7 are fixedly connected to the spraying pipes 6 at equal intervals, and water sprayed from the spraying heads 7 can take away solid waste generated in the etching process, so that the etching effect is better.

The working principle is as follows:

in the wafer production process, when etching is needed, the protective cover 18 on the upper part of the equipment is opened, the protective cover 18 can well prevent foreign matters from entering the inside of the device in the etching process and protect the safety of operators due to the outward splashing of etching liquid, then the materials with etching can be placed in the spraying shell 3, at the moment, the material bracket 12 fixed on the rodless cylinder 11 needs to be moved upwards, the whole moving process is more stable and efficient due to the use of the rodless cylinder 11, compared with the traditional manual operation, the efficiency and the accuracy are higher, the materials are etched by the etching liquid sprayed out by the spraying head 7, the solution sprayed out by the spraying head 7 can play a role of scouring, solid wastes generated due to etching are taken away, the material bracket 12 on the rodless cylinder 11 is descended to drive the materials to descend to the inside of the solution tank 2, so that the materials are soaked in the solution and are etched for the second time, the etching can be more uniform, after the etching is finished, the material bracket 12 is moved upwards to separate the material from the solution, fewer operators are in direct contact with the solution, the temperature inside the device can be observed through the thermometer 14 in the whole process, the process parameters of the etching can be accurately controlled, and the etching process can be finished more efficiently and reliably.

There may be any such actual relationship or order between these entities or operations. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (5)

1. The utility model provides a high-efficient chemical etching groove, includes bottom plate (1), solution tank (2), sprays casing (3), its characterized in that: fixed surface is connected with solution tank (2) on bottom plate (1), just first through-hole (4) are seted up at bottom plate (1) middle part, bottom plate (1) upper portion is provided with mesh board (5), mesh board (5) and solution tank (2) inner wall fixed connection, fixedly connected with sprays casing (3) on solution tank (2) outer wall, spray casing (3) and be located solution tank (2) and keep away from bottom plate (1) one end, spray casing (3) inner wall symmetry fixedly connected with shower (6), equidistance fixedly connected with shower (7) on shower (6), fixed surface is connected with fixing base (8) below bottom plate (1), inside fixedly connected with fast row valve (9) in fixing base (8), and fast row valve (9) and first through-hole (4) are concentric on bottom plate (1).

2. A high efficiency chemical etch bath as defined in claim 1, wherein: waist shape hole (10) have been seted up to the symmetry on solution groove (2) a side, fixedly connected with rodless cylinder (11) on the side outer wall that waist shape hole (10) was seted up in solution groove (2), rodless cylinder (11) external air pressure generating device, a side fixedly connected with material bracket (12) of solution groove (2) are kept away from in rodless cylinder (11), material bracket (12) pass waist shape hole (10) and are located inside solution groove (2), and are located mesh board (5) top.

3. A high efficiency chemical etch bath as defined in claim 1, wherein: a second through hole (13) is formed in one side face, away from the rodless cylinder (11), of the solution tank (2), a thermometer (14) is arranged on the outer wall of the solution tank (2), and the thermometer (14) penetrates through the second through hole (13) and is connected to the outer wall of the solution tank (2) through a bolt.

4. A high efficiency chemical etch bath as defined in claim 1, wherein: the outer wall of one end, close to the bottom plate (1), of the solution tank (2) is fixedly connected with supporting seats (15), and the four supporting seats (15) are provided with third through holes (16).

5. A high efficiency chemical etch bath as defined in claim 1, wherein: spray casing (3) upper portion and seted up square hole (17), and spray casing (3) upper portion and be provided with protective cover (18), protective cover (18) bottom surface is provided with lug (19), protective cover (18) downside and spray casing (3) upper surface contact, lug (19) are located square hole (17).

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