CN212625103U - Integrated into one piece inductance structure of DIP commentaries on classics SMD - Google Patents

Abstract

The invention discloses an integrally formed inductance structure of a DIP (double in-line package) rotating SMD (surface mounted device), which comprises a winding body and a base body, wherein the winding body consists of a winding coil and winding lead-out pins, and the joint of the winding coil and the winding lead-out pins is a coil lead-out end; the base body is a metal powder pressing forming block body which completely covers the winding coil; a pin outlet is formed in the bottom surface of the seat body, and a pin bending section is arranged at one end of the winding lead-out pin on one side of the bottom surface through the pin outlet; the bent and whole section of the pin is horizontally attached to the bottom surface; the invention adopts the integrally formed inductor with a plug-in piece and a patch piece, and fills the blank which cannot be reached by the current patch type to a great extent, namely the inductor is applicable to both high and low inductance and high and low product; and all requirements of the integrally formed inductor are met simultaneously: the magnetic shielding structure has a closed circuit and strong anti-interference performance.

Description

Integrated into one piece inductance structure of DIP commentaries on classics SMD

Technical Field

The invention belongs to the technical field of inductance components, and particularly relates to an integrally formed inductance structure of a DIP (double in-line package) rotating SMD (surface mounted device).

Background

The integrally formed inductor (MoldingChoke) is one of high-end inductors, is directly formed and manufactured on a coil by using a magnetic core material, and has the characteristics of solid and firm structure, accurate characteristics and the like; the magnetic shielding structure is adopted, and the circuit is closed and has strong anti-interference (EMI); ultra-low buzz, high density; the product has small volume and large current, and still keeps excellent temperature rise characteristic and inductance characteristic in a complex environment. The method is very suitable for a DC-DC (direct current to direct current) power management module (PMU) of a light and thin intelligent mobile terminal product, and is suitable for multiple fields of mobile phones, automobiles, aviation, communication, electric automobiles, charging piles and the like.

The MoldingChock demand has exploded, oligopolistic competition: the MoldingChoke can be used in the fields of mobile phones, automobiles, aviation, communication and the like. Only according to the market demand of mobile phones, MoldingChoke is mainly the leading application of apple and Samsung at present, the usage rate of HOV and other brands is low, and the supply of products is short. By the year 2020, 26 mobile phones are expected to have 70% permeability, 364 hundred million global annual demands, 72.8 hundred million yuan market size and 33% annual composite growth.

MoldingChoke is not in demand at present, and will be a high-speed industrial growth period in the next five years; MoldingChoke has become a second choice for leading brand manufacturers, and with the release of capacity, more mobile phones, automobiles, communication, electric automobiles, charging piles and other fields are expected to be used.

The advantages of MoldingChoke over conventional inductors are: the high-voltage wire has the advantages of small volume, low RDC (remote data center), large rated current, high efficiency, difficult generation of Noise, high load, difficult electromagnetic interference, good quality, high temperature resistance level (over H level) of the used wire, no skin phenomenon and stable change along with frequency.

The SMD of MoldingChoke in the market at present has a narrow range of inductance values and a low product height, and the SMD can not be replaced by traditional inductors; and the processing procedure needs equipment and parameter customization, so the processing cost is high, the adaptability to a mainstream production line is poor, and the popularization and production difficulty is high.

Disclosure of Invention

The invention aims to solve the problems, and provides an integrally formed inductor structure of a DIP (double in-line package) to SMD (surface mounted device), which is an integrally formed inductor adopting a plug-in to patch type, and fills the blank that the current patch type cannot reach to a great extent, namely, the inductor is applicable to both high and low inductance and high and low product; and all requirements of the integrally formed inductor are met simultaneously: the magnetic shielding structure has a closed circuit and strong anti-interference performance; ultra-low buzzing, high density; the high current still keeps good temperature rise characteristic and inductance characteristic and the like under the complex environment.

In order to realize the purpose, the invention adopts the technical scheme that: an integrated inductor structure of a DIP (double in-line package) to SMD (surface mounted device) comprises a winding body and a base body, wherein the winding body consists of a winding coil and winding lead-out pins, and the joint of the winding coil and the winding lead-out pins is a coil lead-out end; the seat body is a metal powder pressing forming block body which completely covers the winding coil; a pin outlet is formed in the bottom surface of the seat body, and a pin bending section is arranged at one end of the winding lead-out pin on one side of the bottom surface through the pin outlet; the pin bending section is horizontally attached to the bottom surface.

Furthermore, the coil leading-out ends of the upper and lower coil winding coils are arranged on the same side of the coil winding, and the pin outlet openings are arranged on one side of the long side of the rectangular bottom surface side by side.

Furthermore, coil leading-out ends on the winding coil are respectively arranged on two sides of the winding coil, and the pin outlet is arranged on one side of the short side of the rectangular bottom surface side by side.

Furthermore, seat cushion layers are arranged above the bottom surface of the seat body and below the bent and integral pin section of the seat body.

Further, it has a height of 3mm to 13 mm.

Furthermore, the inductance L value of the inductor is 0.22uH-68 uH.

Further, the seat body is an alloy powder or hydroxyl iron powder pressed block.

Further, the winding coil is a flat coil.

The invention has the beneficial effects that:

1. according to the invention, the winding body is formed and processed in a plug-in type forming to patch type forming mode through the winding coil and the winding lead-out pin on one side in a matched and integrated forming process, so that the effects of no special requirements on a forming machine table, low price, simplicity in operation and the like are achieved.

2. The normal height of the SMD relative to the market MoldingChoke is 5mmMax, and the L value is 10uH Max; the product of the invention has a height range of 3mm-13mm and an L value of 0.22uH-68 uH; the adjusting range is wide; a set of blank which can not be achieved by the conventional chip inductor, namely the height and the inductance of the product, is provided.

3. The structure of the invention is different from the SMD of the MoldingChoke at present, and the invention adopts the flat coil non-circular wire flattening and the non-special forming machine of the common forming machine and the pin outlet position to discharge the pin from the bottom of the product and the side of the product.

4. The invention adopts the mode of plug-in molding and then patch conversion, and is not special patch molding; the mature plug-in type forming processing technology in the current integrated forming field is perfectly utilized, and the paster type integrated forming inductor which is more in line with the processing requirement is achieved by converting paster processing forming.

5. The invention also has a magnetic shielding structure, and the anti-electromagnetic interference capability is strong; low loss, high efficiency, wide application frequency and wide application range; lightweight design saves space, is fit for functions such as high density SMT.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

FIG. 2 is a schematic longitudinal sectional internal perspective view of the present invention.

Fig. 3 is a schematic perspective view of the SMD before processing.

Fig. 4 is a schematic perspective view of the winding body 1 before SMD processing.

Fig. 5 is a schematic perspective view of the winding body 1 according to the preferred embodiment of the present invention.

FIG. 6 is a schematic longitudinal sectional internal perspective view of a preferred embodiment of the present invention.

In the figure: 1. a winding body; 2. a base body; 3. a winding coil; 4. a winding lead-out pin; 5. a seat cushion layer; 6. a bottom surface; 7. a foot outlet; 8. a side surface; 9. a coil leading-out terminal; 10. and (6) bending the pins into a whole section.

Detailed Description

The following detailed description of the present invention is given for the purpose of better understanding technical solutions of the present invention by those skilled in the art, and the present description is only exemplary and explanatory and should not be construed as limiting the scope of the present invention in any way.

As shown in fig. 1 to 6, the specific structure of the present invention is: an integrated inductor structure of DIP (double in-line package) to SMD (surface mounted device) comprises a winding body 1 and a base body 2, and is characterized in that the winding body 1 consists of a winding coil 3 and winding lead-out pins 4, and the joint of the winding coil 3 and the winding lead-out pins 4 is a coil lead-out end 9; the seat body 2 is a metal powder pressing forming block body which completely covers the winding coil 3; a pin outlet 7 is formed in the bottom surface of the seat body 2, and a pin bending section 10 is arranged at one end of the winding lead-out pin 7 on one side of the bottom surface through the pin outlet 7; the pin bending section 10 is horizontally attached to the bottom surface 6.

Preferably, the coil leading-out ends 9 above and below the winding coil 3 are arranged on the same side of the winding coil 3, and the pin outlet 7 is arranged side by side on the long side of the rectangular bottom surface 6.

Preferably, the coil leading-out ends 9 on the upper side and the lower side of the winding coil 3 are respectively arranged on two sides of the winding coil 3, and the pin outlet 7 is arranged on one side of the short side of the rectangular bottom surface 6 in parallel.

In order to further realize the chip bending processing and positioning of the structure rotating SMD, a seat cushion layer 5 is arranged on the seat body 2 above the bottom surface 6 and below the pin bending section 10.

Preferably, the height of the structure of the invention is 3 mm.

Preferably, the height of the structure of the invention is 13 mm.

Preferably, the inductance value L of the invention is 0.22 uH.

Preferably, the inductance value L of the invention is 68 uH.

Preferably, the seat body 2 is an alloy powder compression-molded block.

Preferably, the seat body 2 is a press-formed block of iron hydroxyl powder.

Preferably, the winding coil 3 is a flat coil.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be directed to other uses and embodiments.

Claims (8)

1. An integrally formed inductance structure of a DIP (double in-line package) to SMD (surface mounted device) comprises a winding body (1) and a base body (2), and is characterized in that the winding body (1) consists of a winding coil (3) and a winding lead-out pin (4), and a coil lead-out end (9) is arranged at the joint of the winding coil (3) and the winding lead-out pin (4); the seat body (2) is a metal powder pressing block body which completely covers the winding coil (3); a pin outlet (7) is formed in the bottom surface of the seat body (2), and a pin bending section (10) is arranged at one end of the winding lead-out pin (4) on one side of the bottom surface through the pin outlet (7); the pin bending section (10) is horizontally attached to the bottom surface (6).

2. The integrated inductor structure of DIP to SMD as claimed in claim 1, wherein said coil terminals (9) on the upper and lower sides of said winding coil (3) are disposed on the same side of said winding coil (3), and said pin outlets (7) are disposed side by side on the long side of the rectangular bottom surface (6).

3. The integrated inductor structure of the DIP rotating SMD as claimed in claim 1, wherein the coil terminals (9) of the upper and lower sides of the winding coil (3) are respectively disposed at both sides of the winding coil (3), and the pin outlets (7) are disposed side by side at one side of the short side of the rectangular bottom surface (6).

4. The integrated inductor structure of the DIP corner SMD as claimed in claim 1, wherein the base body (2) is provided with a base body cushion layer (5) above the bottom surface (6) and below the pin bending sections (10).

5. The integrated inductor structure of DIP rotary SMD as claimed in claim 1, wherein its height is 3mm-13 mm.

6. The integrated inductor structure of DIP to SMD as claimed in claim 1, wherein its inductance L is 0.22uH-68 uH.

7. The integrally formed inductor structure of DIP rotary SMD according to claim 1, wherein said base body (2) is an alloy powder or a hydroxyl iron powder press-formed block.

8. The integrated inductor structure of DIP turns SMD according to claim 1, characterized in that said winding coil (3) is a pancake coil.

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