CN212602301U

CN212602301U - Die-cut mould of chip

Info

Publication number: CN212602301U
Application number: CN202021270782.8U
Authority: CN
Inventors: 李纯; 张宝栋; 李亮
Original assignee: Beijing Xingda Shenghong Mould Technology Co ltd
Current assignee: Beijing Xingda Shenghong Mould Technology Co ltd
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2021-02-26
Anticipated expiration: 2030-07-02

Abstract

The embodiment of the utility model discloses die-cut mould of chip, including terrace die component and die component, the structure of die component passes terrace die component's operation position, makes the terrace die board cooperatees with the die board, be equipped with multiunit cross cutting position on the die board, be equipped with on the terrace die board with cross cutting position complex terrace die piece, the side of cross cutting position is equipped with the ferry mouth, guarantees chip position part not break off after the cutting to can direct whole encapsulation, get rid of after the encapsulation and can directly carry out signal of telecommunication and other operations through the position of breach, lead to the chip pollution through avoiding directly discharging the chip.

Description

Die-cut mould of chip

Technical Field

The embodiment of the utility model provides a relate to mechanical cutting mould technical field, concretely relates to die-cut mould of chip.

Background

The die-cut in-process of chip is the important link of chip production, utilizes die-cut mould to cut the chip, among the current cutting die, all adopts direct whole cutting, is encapsulating after the discharge, but is used for the whole cutting, and the encapsulation degree of difficulty is big after the chip wholly drops, is difficult to reserve outside interlinkage position at the in-process of encapsulation, is difficult to the external electricity signal and other information interaction of removing of direct operation.

In addition, because the width of the template structure of the existing mold is too small, the gap between two surfaces of the mold is small, and the service life of the mold is reduced.

SUMMERY OF THE UTILITY MODEL

Therefore, the embodiment of the utility model provides a die-cut mould of chip to solve among the prior art because the restriction of whole cutting discharge and mould structure itself and the chip that leads to receives the pollution easily and the problem that life name reduces.

In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:

in a first aspect of embodiments of the present invention, there is provided a die-cut die for chips, comprising

The male die assembly comprises a base, wherein a die frame is arranged on the base, a working cavity is arranged in the middle of the die frame to divide the die frame into an upper structure and a lower structure, an operation position with a notch at one side is arranged on the upper structure, a male die plate is arranged on the lower structure, and the male die plate corresponds to the operation position;

the female die assembly comprises an installation block, a die frame is arranged on the installation block, a structural part is supported on the die frame through an elastic part and matched with the operation position, and a female die plate is arranged at the top of the structural part;

the structure of the female die assembly penetrates through the operation position of the male die assembly, so that the male die plate is matched with the female die plate, a plurality of groups of die cutting positions are arranged on the female die plate, a male die block matched with the die cutting positions is arranged on the male die plate, and transition openings are formed in the side faces of the die cutting positions.

Furthermore, the outer edge with the transition opening is a chamfered edge, and the width of the chamfered edge is 0.01 mm.

Furthermore, the outer edge of the concave template is provided with a positioning notch corresponding to the die cutting position.

Furthermore, the module frame is fixed through bolts, and the module frame is provided with guide posts which penetrate through the structural member.

Furthermore, the number of the elastic pieces and the number of the guide columns are four, and the elastic pieces and the guide columns are arranged on the module frame in a staggered mode, so that the geometric center points of the module frame are axially and symmetrically arranged.

Furthermore, the bottom of the installation block is provided with a clamping block, and the clamping block is provided with a clamping groove.

Furthermore, the front end and the rear end of the concave template are respectively provided with an integrally formed guide rail, and the guide rails are fixed on the lower structure of the die frame through countersunk screws.

Furthermore, the outer side of the lower structure of the die frame is provided with a limiting plate, and the limiting plate is fixed on the die frame through screws and stabilizes the convex die plate.

Furthermore, a stop block is arranged at the upper structure of the die frame and is arranged at the notch of the operation position.

Furthermore, the bottom of the base is provided with an integrally formed guide sliding block, and the die frame is installed on the base through bolts.

According to the utility model discloses an embodiment, this die-cut mould of chip has following advantage:

1. in the die of the utility model, the structural part of the female die assembly passes through the operation position of the male die assembly, so that the male die plate is matched with the female die plate, a plurality of groups of die cutting positions are arranged on the female die plate, a male die matched with the die cutting positions is arranged on the male die plate, a transition port is arranged on the side surface of the die cutting positions, and the position part of a chip is ensured not to be disconnected after cutting, thereby being capable of directly and integrally packaging, directly carrying out electric signal output and other operations through the position of a notch after being removed after packaging, and avoiding directly discharging the chip to cause chip pollution;

2. the utility model discloses an in the mould, through the structure to the edge cutting clearance increase chamfer limit to improve the clearance, can effectually avoid improving life to the destruction of chip itself.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.

Fig. 1 is a schematic perspective view of a male die assembly of a die-cutting die for chips according to an embodiment of the present invention;

fig. 2 is a schematic perspective view of a die assembly of a die-cutting die for chips according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a working surface of a cavity plate in a cavity assembly of a die-cutting die for chips according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a working surface of a module frame in a female die assembly of a die-cut die for chips according to an embodiment of the present invention.

In the figure: 1. a base; 2. a mold frame; 2a, a working cavity; 2b, the upper structure; 2c, the lower structure; 3. an operation position; 4. a convex template; 5. mounting blocks; 6. a module frame; 7. an elastic member; 8. a structural member; 9. a cavity plate; 10. die cutting positions; 11. a male module; 12. a transition port; 13. chamfering; 14. positioning the notch; 15. a bolt; 16. a guide post; 17. a clamping block; 18. a guide rail; 19. a limiting plate; 20. a stopper; 21. and a guide slide block.

Detailed Description

The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the present specification, the terms "upper", "lower", "left", "right", "middle", and the like are used for the sake of clarity only, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof are also considered to be the scope of the present invention without substantial changes in the technical content.

As shown in fig. 1-4, it illustrates a die-cutting die for chips, which includes

The male die assembly comprises a base 1, a die frame 2 is arranged on the base 1, a working cavity 2a is arranged in the middle of the die frame 2 to divide the die frame 2 into an upper structure 2b and a lower structure 2c, an operation position 3 with a notch at one side is arranged on the upper structure 2b, a male die plate 4 is arranged on the lower structure 2c, and the male die plate 4 corresponds to the operation position 3;

the female die assembly comprises a mounting block 5, a die frame 6 is arranged on the mounting block 5, a structural part 8 is supported on the die frame 6 through an elastic part 7, the structural part 8 is matched with the operation position 3, and a female die plate 9 is arranged at the top of the structural part 8, wherein the elastic part 7 is a spring, so that certain resilience is ensured in the working process in the using process, and the direct damage of a chip caused by rigid contact is prevented;

the structural part 8 of the female die assembly penetrates through the operation position 3 of the male die assembly, so that the male die plate 4 is matched with the female die plate 9, a plurality of groups of die cutting positions 10 are arranged on the female die plate 9, a male die block 11 matched with the die cutting positions 10 is arranged on the male die plate 4, and transition openings 12 are formed in the side faces of the die cutting positions 10.

Guarantee chip position part not break off after the cutting to can direct whole encapsulation, get rid of after the encapsulation and can directly carry out the signal of telecommunication and other operations through the position of breach, lead to the chip pollution through avoiding direct discharge chip.

In another specific embodiment, the outer edge of the transition opening 12 is a chamfered edge 13, the width of the chamfered edge 13 is 0.01mm, and the chamfered edge 13 is added to the chamfered edge gap, so that the gap is increased, the damage to the chip can be effectively avoided, and the service life is prolonged.

Referring again to fig. 3, the outer edge of the cavity plate 9 is provided with positioning notches 14 corresponding to the die cutting locations 10, which can ensure that the chip plate is aligned with the chip during the die cutting process.

In some preferred embodiments, the module frame 6 is fixed by bolts 15, the module frame 6 is provided with guide posts 16, the guide posts 16 penetrate through the structural member 8, and the guide posts 16 can ensure that the deviation between the module frame 6 and the structural member 8 cannot occur to cause uneven stress in the working process, so that the working result and the working efficiency are affected.

The number of the elastic members 7 and the number of the guide columns 16 are four, and the elastic members and the guide columns are arranged on the module frame 6 in a staggered manner, so that the geometric center points of the module frame 6 are axially and symmetrically arranged.

Further embodiment, the bottom of installation piece 5 is equipped with joint piece 17, is equipped with the draw-in groove on the joint piece 17, can be convenient for install on cross cutting equipment.

In a preferred embodiment, the die plate 9 is provided at both the front and rear ends thereof with integrally formed guide rails 18, the guide rails 18 are fixed to the lower structure 2c of the die frame 2 by countersunk screws, and the guide rails 18 can ensure the progress of the chips to be cut in order.

Wherein, the outside of the lower structure 2c of the mold frame 2 is provided with a limiting plate 19, the limiting plate 19 is fixed on the mold frame 2 through screws and stabilizes the male mold plate 4, and the limiting plate 19 is fixed through hexagon socket head cap screws.

In the concrete structure, last structure 2b department of mould frame 2 is equipped with dog 20, and dog 20 sets up and prevents to take place the skew in the die subassembly course of operation in the breach department of operation position 3, and dog 20 is fixed through hexagon socket head cap screw.

Wherein, the bottom of base 1 is equipped with integrated into one piece's guide slide 21, and the mould frame 2 is installed on base 1 through bolt 15, the installation of the terrace die subassembly of being convenient for.

Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. A die-cutting die for chips is characterized by comprising

2. The die cutting die according to claim 1, wherein the outer edge having the transition opening is a chamfered edge, and the chamfered edge has a width of 0.01 mm.

3. The die cutting die according to claim 2, wherein the outer edge of the cavity plate is provided with positioning notches corresponding to the die cutting positions.

4. The die-cutting die according to claim 1, wherein the die frame is fixed by bolts, and the die frame is provided with guide posts, and the guide posts are arranged on the structural member in a penetrating manner.

5. The die-cutting die according to claim 4, wherein the number of the elastic members and the number of the guide posts are four, and the elastic members and the guide posts are staggered on the die frame so as to be axially symmetrical about a geometric center point of the die frame.

6. The die-cutting die for chips as claimed in claim 1, wherein the bottom of the mounting block is provided with a clamping block, and the clamping block is provided with a clamping groove.

7. The die-cutting die according to claim 1, wherein the die plate has integrally formed guide rails at both front and rear ends thereof, and the guide rails are fixed to the lower structure of the die frame by means of countersunk screws.

8. The die-cutting die according to claim 7, wherein a limiting plate is provided on the outer side of the lower structure of the die holder, and the limiting plate is fixed to the die holder by screws and stabilizes the male die plate.

9. The die-cutting die according to claim 8, wherein a stopper is provided at the upper structure of the die holder, the stopper being provided at the notch of the operating position.

10. The die-cutting die according to claim 1, wherein the base has a guide slider formed integrally at a bottom thereof, and the die holder is mounted on the base by bolts.