CN212588422U - Thermal imaging monitoring device - Google Patents
Thermal imaging monitoring device Download PDFInfo
- Publication number
- CN212588422U CN212588422U CN202021720205.4U CN202021720205U CN212588422U CN 212588422 U CN212588422 U CN 212588422U CN 202021720205 U CN202021720205 U CN 202021720205U CN 212588422 U CN212588422 U CN 212588422U
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- Prior art keywords
- module
- imaging
- end cover
- monitoring device
- heat
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- Expired - Fee Related
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- 238000001931 thermography Methods 0.000 title claims abstract description 17
- 238000012806 monitoring device Methods 0.000 title claims abstract description 15
- 238000003384 imaging method Methods 0.000 claims abstract description 41
- 238000003331 infrared imaging Methods 0.000 claims abstract description 18
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims description 13
- 238000000429 assembly Methods 0.000 claims description 13
- 230000005494 condensation Effects 0.000 claims description 11
- 238000009833 condensation Methods 0.000 claims description 11
- 238000005057 refrigeration Methods 0.000 claims description 9
- 230000008020 evaporation Effects 0.000 claims description 7
- 238000001704 evaporation Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 abstract description 4
- 230000006978 adaptation Effects 0.000 abstract description 3
- 241000271566 Aves Species 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
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Abstract
The utility model relates to a thermal imaging monitoring device. The imaging device comprises an imaging module, a data processing module and an output port module, wherein the data processing module is connected with the output port module; the imaging modules comprise three groups, namely a natural light imaging module, a short wave infrared imaging module and a medium wave infrared imaging module, and the three groups of imaging modules are connected with the data processing module respectively. The utility model discloses utilize natural light imaging module can realize ordinary video monitoring, utilize shortwave infrared imaging module's high discernment degree in order to realize the discernment and the all-weather adaptation of target, and utilize the infrared imaging module of medium wave then can catch the target of farther distance.
Description
Technical Field
The utility model relates to a thermal imaging monitoring device.
Background
The thermal imaging monitoring device is suitable for all-weather accurate alarm for personnel invasion in a defense area with high safety protection requirements; if the surrounding branches are disturbed a lot, the small animals such as birds and cats often cross the surrounding wall, and the conventional surrounding scheme is difficult to realize accurate alarm in all weather. And a thermal imaging perimeter/area intrusion alarm system is equipped, so that an intruder can be effectively alarmed.
However, the existing thermal imaging monitoring device has single function and is difficult to capture a target at a longer distance.
Disclosure of Invention
The utility model aims at providing a thermal imaging monitoring device, which comprises an imaging module, a data processing module and an output port module, wherein the data processing module is connected with the output port module; the imaging modules comprise three groups, namely a natural light imaging module, a short wave infrared imaging module and a medium wave infrared imaging module, and the three groups of imaging modules are respectively connected with the data processing module; each group of imaging modules comprises a lens assembly, a bracket and a sensor assembly, wherein the lens assembly and the sensor assembly are both arranged on the bracket; the thermal imaging monitoring device also comprises a heat dissipation module; the heat dissipation module comprises a radiator and three groups of heat conduction assemblies; each group of heat conducting assemblies comprises a semiconductor refrigeration piece and a heat pipe, the heat pipe comprises an evaporation section and a condensation section which are communicated with each other, the evaporation section is connected with the hot end of the semiconductor refrigeration piece, and the condensation section is connected with a radiator; the cold ends of the semiconductor refrigeration pieces of each group of heat conduction assemblies are respectively attached to the sensor assemblies of one group of imaging modules.
The utility model discloses utilize natural light imaging module can realize ordinary video monitoring, utilize shortwave infrared imaging module's high discernment degree in order to realize the discernment and the all-weather adaptation of target, and utilize the infrared imaging module of medium wave then can catch the target of farther distance.
Drawings
Fig. 1 shows a block diagram of the present invention;
fig. 2 and 3 show perspective views of the present invention from two different angles, respectively;
fig. 4 and 5 show exploded perspective views of the present invention at two different angles, respectively;
fig. 6 to 8 show three different angle perspective views of three groups of imaging modules and heat dissipation modules of the present invention, respectively;
fig. 9 shows an exploded perspective view of three imaging modules and a heat sink module of the present invention;
fig. 10 and 11 show perspective views from two different angles of a set of imaging modules of the present invention, respectively;
fig. 12 and 13 respectively show perspective exploded views of a set of imaging modules of the present invention at two different angles.
Reference numerals:
the system comprises a 10 imaging module, a 101 natural light imaging module, a 102 short wave infrared imaging module, a 103 medium wave infrared imaging module, a 104 lens assembly, a 105 bracket and a 106 sensor assembly;
20 a data processing module;
30 output port modules;
40 semiconductor refrigeration pieces, the hot ends of 401 semiconductor refrigeration pieces and the cold ends of 402 semiconductor refrigeration pieces;
50 heat pipes, 501 evaporation sections of the heat pipes, 502 condensation sections of the heat pipes and 503 metal heat conducting pieces;
60 a heat dissipation fan;
70 heat dissipation fins;
80 side shell, 801 front end cover, 802 rear end cover, 803 window, 804 air hole and 805 mounting hole.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
A thermal imaging monitoring apparatus as shown in fig. 1 to 13 includes an imaging module 10, a data processing module 20 and an output port module 30, wherein the data processing module 20 is connected to the output port module 30;
the imaging modules 10 are three groups, namely a natural light imaging module 101, a short wave infrared imaging module 102 and a medium wave infrared imaging module 103, and the three groups of imaging modules 10 are respectively connected with a data processing module 20;
the natural light imaging module of this embodiment is, for example, a camera, and the short wave infrared imaging module and the medium wave infrared imaging module are, for example, a thermal imager.
According to the technical scheme, the natural light imaging module is utilized to realize common video monitoring, the high identification degree and the fog and smoke penetrating capability of the short wave infrared imaging module are utilized to realize target identification and all-weather adaptation, and the medium wave infrared imaging module is utilized to capture targets at longer distances.
Each set of imaging modules 10 includes a lens assembly 104, a bracket 105, and a sensor assembly 106, where the lens assembly 104 and the sensor assembly 106 are both mounted on the bracket 105;
the thermal imaging monitoring device also comprises a heat dissipation module;
the heat dissipation module comprises a radiator and three groups of heat conduction assemblies, wherein each group of heat conduction assemblies is arranged to be respectively used for conducting heat of a sensor assembly of one group of imaging modules;
each group of heat conducting components comprises a semiconductor refrigeration piece 40, a metal heat conducting piece 503 and a heat pipe 50, wherein the heat pipe 50 comprises an evaporation section 501 and a condensation section 502 which are communicated with each other, the evaporation section 501 is connected with the metal heat conducting piece 503, the metal heat conducting piece 503 is connected with a hot end 401 of the semiconductor refrigeration piece, and the condensation section 502 is connected with a radiator;
the cold ends 402 of the semiconductor chilling plates of each set of thermal conductive assemblies respectively abut against the sensor assemblies 106 of a set of imaging modules, so that the sensor assemblies obtain chilling of the semiconductor chilling plates.
This technical scheme can dispel the heat to each group's like module through setting up heat dissipation module to guarantee each imaging quality and the life who constitutes like module. The semiconductor refrigerating sheet and the heat pipe are used as the heat conducting assembly, so that heat dissipation can be accelerated, and heat dissipation efficiency is improved.
The heat sink comprises a heat dissipation fan 60 and heat dissipation fins 70 stacked together, in this embodiment, the heat dissipation fan 60 can be connected with the data processing module 20, and the data processing module 20 can control the opening and closing of the heat dissipation fan 60;
the connection between the condensation section 502 of the heat pipe and the heat sink means that the condensation section 502 of the heat pipe is connected with the heat dissipation fins 70.
The thermal imaging monitoring device further comprises a front end cap 801, a side shell 80 and a rear end cap 802;
the front cover 801 and the rear cover 802 are respectively installed at two ends of the side casing 80, the front cover 801, the side casing 80 and the rear cover 802 enclose a casing cavity,
the imaging module 10, the data processing module 20, the output port module 30 and the heat dissipation module are all arranged in the shell cavity;
a window 803 for installing the heat dissipation fan 60 is formed on the side casing 80;
the rear end cover 802 is provided with a plurality of air holes 804 communicated with the shell cavity, and the air holes are arranged in the technical scheme so that air in the shell cavity can be discharged, and the design is reasonable;
the front end cover 801 is provided with three mounting holes 805, and the bracket 105 of each imaging module is respectively mounted in one mounting hole 805. This technical scheme is through setting up the mounting hole in order to realize three group imaging module's support and installation, in this embodiment, three mounting hole is the distribution of article font.
In this embodiment, the cross-sectional shape of mounting hole is square, and the support of every imaging module of group is the cubic form, borrows this so that the support can be injectd to the mounting hole, avoids the support to take place to rotate.
Claims (3)
1. The utility model provides a thermal imaging monitoring device, includes imaging module, data processing module and output port module, and this data processing module is connected with the output port module, its characterized in that:
the imaging modules comprise three groups, namely a natural light imaging module, a short wave infrared imaging module and a medium wave infrared imaging module, and the three groups of imaging modules are respectively connected with the data processing module;
each group of imaging modules comprises a lens assembly, a bracket and a sensor assembly, wherein the lens assembly and the sensor assembly are both arranged on the bracket;
the thermal imaging monitoring device also comprises a heat dissipation module;
the heat dissipation module comprises a radiator and three groups of heat conduction assemblies;
each group of heat conducting assemblies comprises a semiconductor refrigerating sheet, a metal heat conducting piece and a heat pipe, wherein the heat pipe comprises an evaporation section and a condensation section which are communicated with each other, the evaporation section is connected with the metal heat conducting piece, the metal heat conducting piece is connected with the hot end of the semiconductor refrigerating sheet, and the condensation section is connected with a radiator;
the cold ends of the semiconductor refrigeration pieces of each group of heat conduction assemblies are respectively attached to the sensor assemblies of one group of imaging modules.
2. The thermal imaging monitoring device of claim 1, wherein:
the radiator comprises a radiating fan and a radiating fin which are stacked together;
the connection of the condensation section of the heat pipe and the radiator means that the condensation section of the heat pipe is connected with the radiating fins.
3. The thermal imaging monitoring device of claim 2, wherein:
the thermal imaging monitoring device also comprises a front end cover, a side shell and a rear end cover;
the front end cover and the rear end cover are respectively arranged at two ends of the side shell, the front end cover, the side shell and the rear end cover surround to form a shell cavity,
the imaging module, the data processing module, the output port module and the heat dissipation module are all arranged in the shell cavity;
the side shell is provided with a window for installing a heat radiation fan;
the rear end cover is provided with a plurality of air holes communicated with the shell cavity;
the front end cover is provided with three mounting holes, and the support of each group of imaging modules is respectively mounted in one mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021720205.4U CN212588422U (en) | 2020-08-18 | 2020-08-18 | Thermal imaging monitoring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021720205.4U CN212588422U (en) | 2020-08-18 | 2020-08-18 | Thermal imaging monitoring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212588422U true CN212588422U (en) | 2021-02-23 |
Family
ID=74652054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021720205.4U Expired - Fee Related CN212588422U (en) | 2020-08-18 | 2020-08-18 | Thermal imaging monitoring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212588422U (en) |
-
2020
- 2020-08-18 CN CN202021720205.4U patent/CN212588422U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210223 |