CN212587477U - Silicon controlled rectifier module with low thermal resistance - Google Patents
Silicon controlled rectifier module with low thermal resistance Download PDFInfo
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- CN212587477U CN212587477U CN202021280503.6U CN202021280503U CN212587477U CN 212587477 U CN212587477 U CN 212587477U CN 202021280503 U CN202021280503 U CN 202021280503U CN 212587477 U CN212587477 U CN 212587477U
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Abstract
The utility model discloses a silicon controlled module with low thermal resistance, which comprises a main shell, wherein the upper part of the main shell is provided with an encapsulation plate, the two outer sides of the main shell are provided with dismounting structures, the dismounting structures are composed of dismounting handles, fixed seats, transmission columns, reinforcing plates and fixed plates, the side wall of the main shell is provided with a groove for installing a fixed seat, the bottom of the fixed seat is provided with a fixed plate, the fixing plate is a triangular plate, the fixing seat and the fixing plate are fixedly connected with the main shell, a moving groove is arranged in the fixing seat, a transmission post is arranged in the motion groove, two ends of the transmission post extend to the outside of the motion groove, the transmission post is in clearance fit with the motion groove, the horizontal end part of the transmission post is provided with a disassembly handle, the disassembly handle is fixedly connected with the transmission column, and the vertical end part of the transmission column is obliquely arranged. The utility model discloses, the maintenance of device is more convenient.
Description
Technical Field
The utility model relates to a silicon controlled rectifier module technical field specifically is a silicon controlled rectifier module that thermal resistance is low.
Background
The silicon controlled module is a semiconductor device with three PN junctions, has the advantages of small volume, compact structure, simple external connection, convenience for maintenance and installation and the like, and is widely applied to various designs of power systems.
The utility model discloses an applicant discovers that current silicon controlled module is when using, and the split of encapsulation board and the main casing body is comparatively troublesome, causes the maintenance of device inconvenient, influences the use of device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a silicon controlled rectifier module that thermal resistance is low to solve among the prior art silicon controlled rectifier module when using, the split of packaging board and the main casing body is comparatively troublesome, causes the inconvenient problem of maintenance of device.
In order to achieve the above object, the utility model provides a following technical scheme:
a silicon controlled module with low thermal resistance comprises a main shell, wherein a packaging plate is installed on the upper portion of the main shell, a dismounting structure is installed on two sides of the outer portion of the main shell and consists of a dismounting handle, a fixing seat, a transmission column, a reinforcing plate and a fixing plate, a groove for installing the fixing seat is formed in the side wall of the main shell, the fixing plate is installed at the bottom of the fixing seat and is a triangular plate, the fixing seat and the fixing plate are fixedly connected with the main shell, a movement groove is formed in the fixing seat, the movement groove is integrally L-shaped, the transmission column is installed in the movement groove and integrally L-shaped, two ends of the transmission column extend to the outer portion of the movement groove, a clearance fit is formed between the transmission column and the movement groove, the dismounting handle is installed at the horizontal end portion of the transmission column and fixedly connected with the transmission column, the vertical end of the transmission column is obliquely arranged.
Preferably, E, G electrodes are connected to the PCB board in the main housing, the upper part of the E, G electrode is bent, and the two adjacent bending directions of the E, G electrode are opposite.
Preferably, the mounting groove has been seted up to the both ends bottom of the main casing body, the mounting groove is L font groove, install the mounting panel in the mounting groove, the mounting panel is whole to be L font board, the horizontal part of mounting panel extends to the outside of mounting groove, the bolt mounting hole has been seted up to the horizontal part of mounting panel.
Preferably, the mounting plate and the main shell are provided with threaded holes for mounting connecting bolts, and the mounting plate is connected with the main shell through the connecting bolts.
Preferably, a reinforcing plate is installed at the vertical end of the transmission column, and the reinforcing plate is connected with the transmission column in a gluing mode.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the main casing body both sides have installed the dismantlement structure, and when the device was inside to go wrong, the device encapsulates the separation of board and the main casing body through dismantling the structure, and it overhauls the device inner structure to be convenient more.
2. The E, G electrode of the device has its upper portion bent and the adjacent two of the E, G electrodes are bent in opposite directions, which facilitates connection to the E, G electrode and facilitates use of the device.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the installation plate of the present invention;
fig. 3 is a schematic structural view of the detachment structure of the present invention.
In the figure: 1. a main housing; 2. a package board; 3. disassembling the structure; 301. disassembling the handle; 302. a fixed seat; 303. a drive post; 304. a reinforcing plate; 305. a motion groove; 306. a fixing plate; 4. e, G electrodes; 5. mounting a plate; 6. mounting grooves; 7. a bolt mounting hole; 8. and connecting the bolts.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, in an embodiment of the present invention, a silicon controlled module with low thermal resistance includes a main housing 1, a package board 2 is installed on an upper portion of the main housing 1, a PCB board in the main housing 1 is connected with E, G electrodes 4, the upper portion of E, G electrodes 4 is bent, two adjacent bending directions in E, G electrodes 4 are opposite, which is convenient for connecting E, G electrodes 4, a detaching structure 3 is installed on two outer sides of the main housing 1, the detaching structure 3 is composed of a detaching handle 301, a fixing base 302, a transmission column 303, a reinforcing plate 304 and a fixing plate 306, a groove for installing the fixing base 302 is arranged on a side wall of the main housing 1, a fixing plate 306 is installed at the bottom of the fixing base 302, the fixing plate 306 is a triangular plate, the fixing plate 306 enhances the fixing of the fixing base 302, the fixing base 302 and the fixing plate 306 are both fixedly, the whole motion groove 305 is L-shaped, the transmission column 303 is installed in the motion groove 305, the transmission column 303 is L-shaped, two ends of the transmission column 303 extend to the outside of the motion groove 305, the transmission column 303 and the motion groove 305 are in clearance fit, the horizontal end part of the transmission column 303 is provided with a disassembly handle 301, the disassembly handle 301 is fixedly connected with the transmission column 303, the vertical end part of the transmission column 303 is obliquely arranged, the vertical end part of the transmission column 303 is provided with a reinforcing plate 304, the reinforcing plate 304 is connected with the transmission column 303 in a gluing mode, the bottom parts of two ends of the main shell 1 are provided with installation grooves 6, the installation grooves 6 are L-shaped grooves, the installation grooves 6 are internally provided with installation plates 5, the installation plates 5 are L-shaped plates integrally, the horizontal parts of the installation plates 5 extend to the outside of the installation grooves 6, the horizontal parts of the installation plates 5 are provided with bolt, threaded holes for installing connecting bolts 8 are formed in the mounting plate 5 and the main casing 1, and the mounting plate 5 is connected with the main casing 1 through the connecting bolts 8.
The utility model discloses a theory of operation and use flow: mounting panel 5 has been installed in the mounting groove 6 of main casing body 1 both ends bottom, mounting panel 5 passes through connecting bolt 8 to be installed on main casing body 1, bolt mounting hole 7 has been seted up to the horizontal part of mounting panel 5, it is connected with other devices to carry out the device through the bolt, the outside both sides of main casing body 1 are installed and are dismantled structure 3, it is by dismantling handle 301 to dismantle structure 3, fixing base 302, transmission post 303, gusset plate 304 and fixed plate 306 constitute, when overhauing the device, the main electrode of buckling makes its vertical back, drive transmission post 303 through dismantling handle 301 and move, transmission post 303 promotes encapsulation board 2 and upwards moves, drive it and main casing body 1 separation.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A thyristor module having low thermal resistance comprising a main housing (1), characterized in that: the utility model discloses a novel packaging structure, including main casing body (1), packaging plate (2) are installed on main casing body (1), the outside both sides of main casing body (1) are installed and are dismantled structure (3), dismantle structure (3) by dismantling handle (301), fixing base (302), transmission post (303), gusset plate (304) and fixed plate (306) and constitute, set up the recess that is used for installing fixing base (302) on the lateral wall of main casing body (1), fixed plate (306) are installed to the bottom of fixing base (302), fixed plate (306) are the triangle-shaped board, fixing base (302), fixed plate (306) all link to each other with main casing body (1) is fixed, seted up in fixing base (302) motion groove (305), motion groove (305) wholly are the L font, install transmission post (303) in motion groove (305), transmission post (303) wholly is the L font, the both ends of transmission post (303) extend to the outside of motion groove (305, for clearance fit between transmission post (303) and motion groove (305), dismantle handle (301) is installed to the horizontal tip of transmission post (303), dismantle handle (301) and fixed linking to each other of transmission post (303), the vertical tip of transmission post (303) sets up for the slope.
2. The thyristor module of claim 1, wherein: e, G electrodes (4) are connected to the PCB in the main shell (1), the upper portion of the E, G electrodes (4) is bent, and the directions of two adjacent bends in the E, G electrodes (4) are opposite.
3. The thyristor module of claim 1, wherein: mounting groove (6) have been seted up to the both ends bottom of the main casing body (1), mounting groove (6) are L word shape groove, install mounting panel (5) in mounting groove (6), mounting panel (5) wholly are L word shaped plate, the horizontal part of mounting panel (5) extends to the outside of mounting groove (6), bolt mounting hole (7) have been seted up to the horizontal part of mounting panel (5).
4. The thyristor module of claim 3, wherein: the mounting plate (5) and the main shell (1) are provided with threaded holes for mounting connecting bolts (8), and the mounting plate (5) is connected with the main shell (1) through the connecting bolts (8).
5. The thyristor module of claim 1, wherein: the vertical end of the transmission column (303) is provided with a reinforcing plate (304), and the reinforcing plate (304) is connected with the transmission column (303) in a gluing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021280503.6U CN212587477U (en) | 2020-07-04 | 2020-07-04 | Silicon controlled rectifier module with low thermal resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021280503.6U CN212587477U (en) | 2020-07-04 | 2020-07-04 | Silicon controlled rectifier module with low thermal resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212587477U true CN212587477U (en) | 2021-02-23 |
Family
ID=74655040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021280503.6U Expired - Fee Related CN212587477U (en) | 2020-07-04 | 2020-07-04 | Silicon controlled rectifier module with low thermal resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212587477U (en) |
-
2020
- 2020-07-04 CN CN202021280503.6U patent/CN212587477U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210223 Termination date: 20210704 |
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| CF01 | Termination of patent right due to non-payment of annual fee |