CN212573080U - 一种防腐蚀的集成电路板 - Google Patents
一种防腐蚀的集成电路板 Download PDFInfo
- Publication number
- CN212573080U CN212573080U CN202021195177.9U CN202021195177U CN212573080U CN 212573080 U CN212573080 U CN 212573080U CN 202021195177 U CN202021195177 U CN 202021195177U CN 212573080 U CN212573080 U CN 212573080U
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- Prior art keywords
- circuit board
- installation
- screw rod
- heating panel
- spare
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- 238000005260 corrosion Methods 0.000 title claims abstract description 11
- 238000009434 installation Methods 0.000 claims abstract description 46
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000003860 storage Methods 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 14
- 230000007797 corrosion Effects 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021195177.9U CN212573080U (zh) | 2020-06-24 | 2020-06-24 | 一种防腐蚀的集成电路板 |
Applications Claiming Priority (1)
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CN202021195177.9U CN212573080U (zh) | 2020-06-24 | 2020-06-24 | 一种防腐蚀的集成电路板 |
Publications (1)
Publication Number | Publication Date |
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CN212573080U true CN212573080U (zh) | 2021-02-19 |
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ID=74612868
Family Applications (1)
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CN202021195177.9U Active CN212573080U (zh) | 2020-06-24 | 2020-06-24 | 一种防腐蚀的集成电路板 |
Country Status (1)
Country | Link |
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CN (1) | CN212573080U (zh) |
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2020
- 2020-06-24 CN CN202021195177.9U patent/CN212573080U/zh active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An anti-corrosion integrated circuit board Effective date of registration: 20211026 Granted publication date: 20210219 Pledgee: China Construction Bank Corporation Yangxin sub branch Pledgor: HUBEI ZHONGPEI ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2021980011338 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230518 Granted publication date: 20210219 Pledgee: China Construction Bank Corporation Yangxin sub branch Pledgor: HUBEI ZHONGPEI ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2021980011338 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A corrosion-resistant integrated circuit board Effective date of registration: 20230519 Granted publication date: 20210219 Pledgee: China Construction Bank Corporation Yangxin sub branch Pledgor: HUBEI ZHONGPEI ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2023420000206 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20210219 Pledgee: China Construction Bank Corporation Yangxin sub branch Pledgor: HUBEI ZHONGPEI ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2023420000206 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |