CN212572630U - Efficient splicing structure for mobile phone motherboard - Google Patents

Abstract

The utility model discloses a high-efficient mosaic structure is used to mobile phone motherboard, including a mainboard, the top fixed connection of a mainboard installs No. two mainboards, a mainboard with the equal fixed connection in one side of No. two mainboards installs the concatenation card shell, a mainboard with the equal fixed connection installation fixed plate piece of opposite side of No. two mainboards, the equal fixed mounting in surface of fixed plate piece has spacing cap, a mainboard includes spread groove and fixed slot. A mobile phone motherboard uses high-efficient mosaic structure, can make butt joint inseparabler to it is except can being used to splice mainboard and mainboard fast, can also be used to other spare parts of high-speed joint mainboard and cell-phone, thereby makes its application range wider, and can accomplish the concatenation fast and fixed, and only need dig fixed plate hard when later maintenance dismantles alright take out together with fixed bayonet lock, accomplish the dismantlement fast.

Description

Efficient splicing structure for mobile phone motherboard

Technical Field

The utility model relates to a mosaic structure field, in particular to mobile phone motherboard uses high-efficient mosaic structure.

Background

The splicing structure is a structural body for electrically splicing and fixing the mainboard, is mainly used for various circuits and is installed in a box body with small area, so that the space in the box body can be fully utilized, the size of the box body is reduced, a good installation and fixing effect is achieved in use, the production cost is low, and the splicing structure is widely applied to various fields; however, the existing efficient splicing structure for the mobile phone motherboard has certain disadvantages when in use, is more troublesome in butt joint in use, needs to be welded by a welding tool through a connecting point, is troublesome in later maintenance, needs to be fixed by screws and the like in addition, and needs a screwdriver with a specific size to be installed or detached when being detached and installed, thereby being very troublesome.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a high-efficient mosaic structure is used to mobile phone motherboard can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a high-efficient mosaic structure is used to mobile phone motherboard, includes a mainboard, the top fixed connection of a mainboard installs No. two mainboards, a mainboard with the equal fixed connection in one side of No. two mainboards installs the concatenation card shell, a mainboard with the equal fixed connection installation fixed plate block of opposite side of No. two mainboards, the equal fixed mounting in surface of fixed plate block has spacing cap.

Preferably, the mainboard includes spread groove and fixed slot, the spread groove has been seted up to the below that the surface of mainboard lies in spacing cap, fixed slot has been seted up to the inside of spread groove.

Preferably, No. two mainboards include connecting plug and butt joint contact piece, No. one the mainboard with one side fixed surface of No. two mainboards installs connecting plug, connecting plug's the equal fixed mounting in lower surface has the butt joint contact piece.

Preferably, the concatenation card shell includes return shell fragment, extrusion plate, fixed winding displacement board and connection contact, fixed surface installs the return shell fragment on the inside of concatenation card shell, the lower extreme fixed connection of return shell fragment installs the extrusion plate, fixed winding displacement board is installed to the inside fixed surface of concatenation card shell, the last fixed surface of fixed winding displacement board installs connection contact, two the concatenation card shell all through connection contact respectively with mainboard and cell-phone parts electric connection.

Preferably, the surface of the fixing plate block is provided with a spiral through hole, the limiting cap comprises an indication convex pattern, a spiral rod and a fixing clamping pin, the upper surface of the limiting cap is fixedly provided with the indication convex pattern, the lower surface of the limiting cap is fixedly connected with the spiral rod, and the lower end of the spiral rod is fixedly connected with the fixing clamping pin.

Preferably, the limiting cap is fixedly connected with the fixed plate through the screw rod and the spiral through hole, and the fixed plate is clamped into the fixed clamping groove through the fixed clamping pin and is fixedly connected with the first main board.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses in, through the concatenation card shell that sets up, when the concatenation card shell can accomplish the butt joint fast, can also make the butt joint inseparabler, and it is except can being used to splice mainboard and mainboard fast, can also be used to other spare parts of high-speed joint mainboard and cell-phone, thereby make its application range wider, spacing cap through setting up, fix the hob rotation in the screw through hole in the spacing cap use, it presses to aim at the spread groove with fixed bayonet lock after fixed, make fixed bayonet lock card go into in the fixed slot lock, like this alright accomplish the concatenation and fix fast, and only need scratch fixed plate piece hard when later maintenance dismantles and alright take out together with fixed bayonet lock, accomplish the dismantlement fast.

Drawings

Fig. 1 is a schematic view of an overall structure of a high-efficiency splicing structure for a mobile phone motherboard according to the present invention;

fig. 2 is a partial cross-sectional view of the high-efficiency splicing structure for the mobile phone motherboard of the present invention;

fig. 3 is a cross-sectional view of a splicing card shell and a connecting plug of the high-efficiency splicing structure for the mobile phone motherboard of the utility model;

fig. 4 is the utility model relates to a mobile phone motherboard is with high-efficient mosaic structure's concatenation card shell section view.

In the figure: 1. a first main board; 101. connecting grooves; 102. fixing the clamping groove; 2. a second main board; 201. a connecting plug; 202. a butt contact piece; 3. splicing the clamping shells; 301. returning the elastic sheet; 302. extruding the plate; 303. fixing the wire arranging plate; 304. connecting a contact piece; 4. fixing the plate; 401. a spiral through hole; 5. a limiting cap; 501. indicating a relief; 502. a screw rod; 503. the bayonet is fixed.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a high-efficiency splicing structure for mobile phone motherboards comprises a first main board 1, a second main board 2 fixedly connected and installed above the first main board 1, splicing clamping shells 3 fixedly connected and installed on one sides of the first main board 1 and the second main board 2, a fixing plate block 4 fixedly connected and installed on the other sides of the first main board 1 and the second main board 2, and a limiting cap 5 fixedly installed on the surface of the fixing plate block 4;

the first main board 1 comprises a connecting groove 101 and a fixed clamping groove 102, the connecting groove 101 is formed in the surface of the first main board 1, which is located below the limiting cap 5, and the fixed clamping groove 102 is formed in the connecting groove 101; the second main board 2 comprises a connecting plug 201 and a butt contact piece 202, the connecting plug 201 is fixedly installed on one side surface of the first main board 1 and the second main board 2, and the butt contact piece 202 is fixedly installed on the lower surface of each connecting plug 201; the splicing card shell 3 comprises a return elastic sheet 301, a pressing plate block 302, a fixed wire arranging plate 303 and a connecting contact sheet 304, the return elastic sheet 301 is fixedly installed on the upper surface inside the splicing card shell 3, the pressing plate block 302 is fixedly connected and installed at the lower end of the return elastic sheet 301, the fixed wire arranging plate 303 is fixedly installed on the lower surface inside the splicing card shell 3, the connecting contact sheet 304 is fixedly installed on the upper surface of the fixed wire arranging plate 303, the two splicing card shells 3 are respectively and electrically connected with the first main board 1 and the mobile phone component through the connecting contact sheet 304, the splicing card shell 3 can be quickly butted and tightly, can be used for quickly splicing the main board and can also be used for quickly connecting the main board and other parts of the mobile phone, and accordingly the acting range of the splicing card shell is wider; the surface of the fixed plate 4 is provided with a spiral through hole 401, the limiting cap 5 comprises an indicating convex pattern 501, a spiral rod 502 and a fixed bayonet 503, the upper surface of the limiting cap 5 is fixedly provided with the indicating convex pattern 501, the lower surface of the limiting cap 5 is fixedly connected with the spiral rod 502, the lower end of the spiral rod 502 is fixedly connected with the fixed bayonet 503, in use, the fixed bayonet 503 is clamped into the fixed bayonet groove 102, so that splicing and fixing can be quickly completed, and the fixed plate 4 can be taken out together with the fixed bayonet 503 only by pulling hard during later maintenance and disassembly, so that disassembly can be quickly completed; the limiting cap 5 is fixedly connected with the fixing plate 4 through the screw rod 502 and the screw through hole 401, and the fixing plate 4 is clamped into the fixing clamping groove 102 through the fixing clamping pin 503 to be fixedly connected with the first main board 1.

It should be noted that, the utility model relates to a high-efficient splicing structure for mobile phone motherboard, when using and installing, firstly, the first motherboard 1 is installed and inserted on the splicing card shell 3 arranged inside the mobile phone, and is clamped into the fixed card slot 102 arranged inside the mobile phone through the fixed card pin 503 on the limit cap 5, then the splicing between the motherboard and the motherboard can be carried out, when splicing, the corresponding second motherboard 2 is taken to insert the connecting plug 201 thereof between the extrusion plate block 302 and the fixed line arrangement board 303 in the splicing card shell 3, the extrusion plate block 302 is extruded downwards under the elasticity of the return spring sheet 301, thereby the connecting plug 201 is pressed downwards, the butt contact piece 202 under the connecting plug 201 is tightly contacted with the connecting contact piece 304, then the screw rod 502 is fixed in the screw through hole 401 in a rotating way, after fixing, the fixed card pin 503 is aligned with the connecting slot 101 and pressed, so that the fixed card pin 503 is clamped into the fixed card slot 102, like this alright accomplish the concatenation fast and fix to only need pull hard fixed plate 4 when later maintenance dismantles alright take out together with fixed bayonet lock 503, accomplish the dismantlement fast, when 3 its butt joints that can accomplish fast of concatenation card shell that wherein are equipped with can also make the inseparabler of butt joint, and it except can be used to splice mainboard and mainboard fast, can also be used for other spare parts of high-speed joint mainboard and cell-phone, thereby make its application scope wider.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. The utility model provides a mobile phone motherboard is with high-efficient mosaic structure which characterized in that: including mainboard (1), No. two mainboard (2) are installed to the top fixed connection of mainboard (1), mainboard (1) with the equal fixed connection in one side of No. two mainboard (2) installs concatenation card shell (3), mainboard (1) with the equal fixed connection installation fixed plate block (4) of the opposite side of No. two mainboard (2), the equal fixed mounting in surface of fixed plate block (4) has spacing cap (5).

2. The efficient splicing structure for the mobile phone motherboard according to claim 1, wherein: a mainboard (1) is including connecting groove (101) and fixed slot (102), connecting groove (101) have been seted up to the below that the surface of a mainboard (1) is located spacing cap (5), fixed slot (102) have been seted up to the inside of connecting groove (101).

3. The efficient splicing structure for the mobile phone motherboard according to claim 2, wherein: no. two mainboard (2) are including connecting plug (201) and butt joint contact piece (202), No. one mainboard (1) with one side fixed surface of No. two mainboard (2) installs connecting plug (201), the equal fixed mounting of lower surface of connecting plug (201) has butt joint contact piece (202).

4. The efficient splicing structure for the mobile phone motherboard according to claim 3, wherein: concatenation card shell (3) include return shell fragment (301), stripper plate piece (302), fixed winding displacement board (303) and connection contact (304), fixed surface installs return shell fragment (301) on the inside of concatenation card shell (3), the lower extreme fixed connection of return shell fragment (301) installs extrusion plate piece (302), the inside fixed surface of concatenation card shell (3) installs fixed winding displacement board (303), the last fixed surface of fixed winding displacement board (303) installs connection contact (304), two concatenation card shell (3) all through connection contact (304) respectively with mainboard (1) and cell-phone part electric connection.

5. The efficient splicing structure for the mobile phone motherboard according to claim 2, wherein: spiral through-hole (401) have been seted up on the surface of fixed plate piece (4), spacing cap (5) are including instructing burr (501), hob (502) and fixed bayonet lock (503), the last fixed surface of spacing cap (5) installs and instructs burr (501), hob (502) are installed to the lower fixed surface connection of spacing cap (5), fixed bayonet lock (503) are installed to the lower extreme fixed connection of hob (502).

6. The efficient splicing structure for the mobile phone motherboard according to claim 5, wherein: spacing cap (5) pass through hob (502) and spiral through-hole (401) and fixed plate (4) fixed connection, fixed plate (4) are gone into fixed slot (102) and mainboard (1) fixed connection through fixed bayonet lock (503) card.

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