CN212569848U - Damage-proof non-contact chip - Google Patents
Damage-proof non-contact chip Download PDFInfo
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- CN212569848U CN212569848U CN202021675372.1U CN202021675372U CN212569848U CN 212569848 U CN212569848 U CN 212569848U CN 202021675372 U CN202021675372 U CN 202021675372U CN 212569848 U CN212569848 U CN 212569848U
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- contact chip
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Abstract
The utility model discloses a damage-proof non-contact chip, which comprises a non-contact chip main body, wherein both sides of the non-contact chip main body are respectively provided with a first copper sheet and a second copper sheet, and the first copper sheet is provided with a first through hole which runs through the upper end surface and the lower end surface of the first copper sheet and can enhance the surface toughness of the first copper sheet; and the second copper sheet is provided with a second through hole which penetrates through the upper end surface and the lower end surface of the second copper sheet and can enhance the surface toughness of the second copper sheet. The utility model discloses be equipped with the first through-hole that runs through its terminal surface from top to bottom on first copper sheet, with this can strengthen the surface toughness of first copper sheet, and be equipped with the second through-hole that runs through its terminal surface from top to bottom and on the second copper sheet, with this can strengthen the surface toughness of second copper sheet, even this non-contact chip main part the phenomenon of bending appears in the use, because the surface toughness of this first copper sheet and second copper sheet is strong, so that this non-contact chip main part both sides can not cause the damage, reduce the damaged risk of non-contact chip main part, thereby reach the mesh of preventing damage, the order the utility model discloses extremely strong market competition has.
Description
The technical field is as follows:
the utility model relates to a non-contact chip technical field refers in particular to a prevent damaging non-contact chip.
Background art:
the non-contact IC card is also called radio frequency card, which is composed of IC chip and induction antenna, and is packaged in a standard PVC card, and the chip and antenna have no exposed part. The technology is a new technology developed in recent years in the world, the technology successfully combines the radio frequency identification technology and the IC card technology, the problem of passivity (no power supply in the card) and contact-free is solved, and the technology is a breakthrough in the field of electronic devices. The card is close to the surface of the reader-writer within a certain distance range (usually 5-10cm), and the reading and writing operation of data is completed through the transmission of radio waves.
The read-write operation is completed between the non-contact IC card and the card reader through radio waves. The communication frequency between the two is 13.56 MHZ. The non-contact IC card is a passive card, when the reader reads and writes the card, the signal sent by the reader is composed of two parts which are superposed, one part is a power signal, and the signal generates an instant energy with the self L/C to supply the chip to work after being received by the card. The other part is command and data signals, commands the chip to complete the reading, modification, storage and the like of data, and returns signals to the reader-writer to complete one read-write operation. The reader-writer is generally composed of a single chip microcomputer, a special intelligent module and an antenna, and is provided with a communication interface, a printing port, an I/O port and the like with a PC (personal computer) so as to be applied to different fields.
The thickness of the copper sheets on two sides of the non-contact chip used at present is relatively thin, so that the card body bending phenomenon in the use process of the non-contact IC card can cause the damage of two sides of the non-contact chip, and the non-contact function is lost.
In view of the above, the present inventors propose the following.
The utility model has the following contents:
an object of the utility model is to overcome prior art not enough, provide a prevent damaging non-contact chip.
In order to solve the technical problem, the utility model discloses a following technical scheme: the damage-proof non-contact chip comprises a non-contact chip main body, wherein a first copper sheet and a second copper sheet are respectively arranged on two sides of the non-contact chip main body, and a first through hole which penetrates through the upper end face and the lower end face of the first copper sheet and can enhance the surface toughness of the first copper sheet is formed in the first copper sheet; and the second copper sheet is provided with a second through hole which penetrates through the upper end surface and the lower end surface of the second copper sheet and can enhance the surface toughness of the second copper sheet.
Further, in the above technical solution, the length of the non-contact chip main body is 8mm, and the width thereof is 5 mm; the thickness of the first copper sheet and the thickness of the second copper sheet are both 0.06 mm.
Further, in the above technical solution, the aperture of each of the first through hole and the second through hole is 0.1mm, and the first through hole and the second through hole are respectively distributed on the first copper sheet and the second copper sheet in a matrix manner.
Further, in the above technical solution, the aperture of the first through hole is 0.75mm, and the number of the first through holes is two, and the first through holes are respectively distributed at the upper end and the lower end of the first copper sheet; the aperture of the second through holes is 0.75mm, the number of the second through holes is two, and the second through holes are respectively distributed at the upper end and the lower end of the second copper sheet.
Further, in the above technical solution, the first through hole is formed on the first copper sheet by die punching or laser cutting or etching.
Further, in the above technical solution, the second through hole is formed in the second copper sheet by die punching or laser cutting or etching.
Further, in the above technical solution, the first insulating layer and the second insulating layer are respectively fixed to the upper end and the lower end of the non-contact chip main body by dispensing or coating.
Further, in the above technical solution, the first insulating layer and the second insulating layer are any one of TPU, PA, PETG, PC insulating layer, epoxy resin insulating layer, or the like.
After the technical scheme is adopted, compared with the prior art, the utility model has following beneficial effect: the utility model discloses be provided with the first through-hole that runs through its terminal surface from top to bottom on first copper sheet, with this can strengthen the surface toughness of first copper sheet, and be provided with the second through-hole that runs through its terminal surface from top to bottom and on the second copper sheet, with this can strengthen the surface toughness of second copper sheet, even this non-contact chip main part the phenomenon of bending appears in the use, because the surface toughness of this first copper sheet and second copper sheet is strong, so that this non-contact chip main part both sides can not cause the damage, reduce the damaged risk of non-contact chip main part, thereby reach the mesh of damage prevention, the order the utility model discloses extremely strong market competition has.
Description of the drawings:
FIG. 1 is a front view of a first configuration of the present invention;
fig. 2 is a bottom view of the first structure of the present invention;
fig. 3 is a front view of a second structure of the present invention.
The specific implementation mode is as follows:
the present invention will be further described with reference to the following specific embodiments and accompanying drawings.
As shown in fig. 1-3, the damage-proof non-contact chip includes a non-contact chip main body 1, a first copper sheet 11 and a second copper sheet 12 are respectively disposed on two sides of the non-contact chip main body 1, and a first through hole 111 penetrating through upper and lower end faces of the first copper sheet 11 and capable of enhancing surface toughness thereof is disposed on the first copper sheet 11; the second copper sheet 12 is provided with a second through hole 121 which penetrates through the upper and lower end faces and can enhance the surface toughness thereof. The utility model discloses be provided with the first through-hole 111 that runs through its terminal surface from top to bottom on first copper sheet 11, with this can strengthen first copper sheet 11's surface toughness, and be provided with the second through-hole 121 that runs through its terminal surface from top to bottom and on second copper sheet 12, with this can strengthen second copper sheet 12's surface toughness, even this non-contact chip main part 1 the phenomenon of bending appears in the use, because this first copper sheet 11 and second copper sheet 12's surface toughness is strong, so that this non-contact chip main part 1 both sides can not cause the damage, reduce non-contact chip main part 1 damaged risk, thereby reach the mesh of damage prevention, the order the utility model discloses extremely strong market competition has.
The length of the non-contact chip main body 1 is 8mm, and the width of the non-contact chip main body is 5 mm; the thickness of the first copper sheet 11 and the second copper sheet 12 is 0.06 mm.
In combination with fig. 1, the aperture of each of the first through hole 111 and the second through hole 121 is 0.1mm, and the first through hole and the second through hole are distributed on the first copper sheet 11 and the second copper sheet 12 in a matrix manner, respectively. Or, as shown in fig. 3, the aperture of the first through hole 111 is 0.75mm, and the number of the first through holes is two, and the first through holes are respectively distributed at the upper end and the lower end of the first copper sheet 11; the aperture of the second through holes 121 is 0.75mm, the number of the second through holes is two, and the second through holes are respectively distributed at the upper end and the lower end of the second copper sheet 12.
The first through hole 111 is formed on the first copper sheet 11 by die punching or laser cutting or etching. The second through hole 121 is formed on the second copper sheet 12 by die punching or laser cutting or etching.
The upper end and the lower end of the non-contact chip main body 1 are respectively fixed with a first insulating layer and a second insulating layer in a dispensing or film coating mode, so that damage prevention risks are further enhanced. The first insulating layer and the second insulating layer are any one of TPU, PA, PETG, PC insulating layers or epoxy resin insulating layers.
The utility model discloses be provided with the first through-hole 111 that runs through its terminal surface from top to bottom on first copper sheet 11, with this can strengthen first copper sheet 11's surface toughness, and be provided with the second through-hole 121 that runs through its terminal surface from top to bottom and on second copper sheet 12, with this can strengthen second copper sheet 12's surface toughness, even this non-contact chip main part 1 the phenomenon of bending appears in the use, because this first copper sheet 11 and second copper sheet 12's surface toughness is strong, so that this non-contact chip main part 1 both sides can not cause the damage, reduce non-contact chip main part 1 damaged risk, thereby reach the mesh of damage prevention, the order the utility model discloses extremely strong market competition has.
Of course, the above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the constructions, features, and principles of the present invention in accordance with the claims of the present invention are intended to be included in the scope of the present invention.
Claims (8)
1. A damage-proof non-contact chip comprises a non-contact chip main body (1), wherein a first copper sheet (11) and a second copper sheet (12) are respectively arranged on two sides of the non-contact chip main body (1), and the damage-proof non-contact chip is characterized in that: the first copper sheet (11) is provided with a first through hole (111) which penetrates through the upper end surface and the lower end surface of the first copper sheet and can enhance the surface toughness of the first copper sheet; and a second through hole (121) which penetrates through the upper end surface and the lower end surface of the second copper sheet (12) and can enhance the surface toughness of the second copper sheet is arranged on the second copper sheet.
2. A damage-preventing contactless chip according to claim 1, characterized in that: the length of the non-contact chip main body (1) is 8mm, and the width of the non-contact chip main body is 5 mm; the thickness of the first copper sheet (11) and the thickness of the second copper sheet (12) are both 0.06 mm.
3. A damage-preventing contactless chip according to claim 2, characterized in that: the aperture of each of the first through hole (111) and the second through hole (121) is 0.1mm, and the first through hole and the second through hole are respectively distributed on the first copper sheet (11) and the second copper sheet (12) in a matrix manner.
4. A damage-preventing contactless chip according to claim 2, characterized in that: the aperture of the first through holes (111) is 0.75mm, the number of the first through holes is two, and the first through holes are respectively distributed at the upper end and the lower end of the first copper sheet (11); the aperture of the second through holes (121) is 0.75mm, the number of the second through holes is two, and the second through holes are respectively distributed at the upper end and the lower end of the second copper sheet (12).
5. A damage prevention contactless chip according to any of claims 1 to 4, characterized in that: the first through hole (111) is formed on the first copper sheet (11) in a mode of die punching or laser cutting or corrosion.
6. A damage prevention contactless chip according to any of claims 1 to 4, characterized in that: the second through hole (121) is formed on the second copper sheet (12) in a mode of die punching or laser cutting or corrosion.
7. A damage prevention contactless chip according to any of claims 1 to 4, characterized in that: the upper end and the lower end of the non-contact chip main body (1) are respectively fixed with a first insulating layer and a second insulating layer in a dispensing or film coating mode.
8. The damage-preventing contactless chip of claim 7, wherein: the first insulating layer and the second insulating layer are any one of TPU, PA, PETG, PC insulating layers or epoxy resin insulating layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021675372.1U CN212569848U (en) | 2020-08-12 | 2020-08-12 | Damage-proof non-contact chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021675372.1U CN212569848U (en) | 2020-08-12 | 2020-08-12 | Damage-proof non-contact chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212569848U true CN212569848U (en) | 2021-02-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021675372.1U Active CN212569848U (en) | 2020-08-12 | 2020-08-12 | Damage-proof non-contact chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212569848U (en) |
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2020
- 2020-08-12 CN CN202021675372.1U patent/CN212569848U/en active Active
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