CN212544392U

CN212544392U - Novel pipe type cavity fin radiating fin

Info

Publication number: CN212544392U
Application number: CN202021543862.6U
Authority: CN
Inventors: 莫仁乐; 张野; 卢澳
Original assignee: Daojing Shanghai Information Technology Co Ltd
Current assignee: Daojing Shanghai Information Technology Co Ltd
Priority date: 2020-07-30
Filing date: 2020-07-30
Publication date: 2021-02-12
Anticipated expiration: 2030-07-30

Abstract

The utility model provides a novel pipe formula cavity fin, relates to electronic component fin technical field, including the bottom plate, bottom plate lower surface be equipped with the mounting structure who is used for installing electronic component, it has a plurality of fins to distribute at the upper surface vertical of bottom plate, the fin be the matrix arrangement, still fixedly connected with coiled heat pipe on matrix arrangement fin top, the heat pipe make by heat conduction metal material. This novel heat dispersion that can obviously improve the fin improves the radiating efficiency.

Description

Novel pipe type cavity fin radiating fin

Technical Field

This is novel belongs to electronic component fin technical field, concretely relates to novel pipe formula cavity fin.

Background

When the electronic element works, part of electric energy is converted into heat energy. If the electronic element works in a high-temperature environment and does not have good heat dissipation, the efficiency of the electronic element is reduced, and the service life of the electronic element is shortened.

At present, the heat dissipation of electronic products mainly depends on heat dissipation fins, wherein the fin heat dissipation fins are mainly in a heat dissipation fin form, and the working principle of the heat dissipation fins is that the heat dissipation area is enlarged through the fins, and the heat conduction speed is improved through arranging a ventilation channel.

However, the conventional fin heat sink has a drawback of low heat dissipation efficiency due to limitations of design considerations.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the novel guide tube type cavity fin radiating fin is provided with a plurality of fins with cavity structures, the cavity structures are communicated with the radiating area of an electronic element through air holes A, and the top of each fin is also provided with a coiled heat conducting pipe, so that the radiating performance can be obviously improved.

In order to realize the purpose, the novel technical scheme is as follows:

the utility model provides a novel pipe formula cavity fin, includes the bottom plate, bottom plate lower surface be equipped with the mounting structure who is used for installing electronic component, it has a plurality of fins to distribute at the upper surface vertical of bottom plate, the fin be the matrix arrangement, still fixedly connected with coiled heat pipe on matrix arrangement fin top, the heat pipe make by heat conduction metal material.

Preferably, the bottom ends of the fins are fixedly connected with the upper surface of the base plate, cavities are formed in the fins, and the cavities are communicated with the heat dissipation area of the electronic element through air holes A penetrating through the bottom ends of the fins and the lower end surface of the base plate.

Preferably, one end of the heat conduction pipe is sealed, the other end of the heat conduction pipe is provided with an air outlet, and the bottom of the heat conduction pipe is communicated with the cavity through an air hole B.

Preferably, the air outlet faces upward, and the area of the air outlet is smaller than the sum of the cross-sectional areas of all the air holes A.

Preferably, a plurality of transverse, longitudinal and oblique airflow channels for airflow series are formed among the fins arranged in the matrix.

Preferably, a chute for dust and sundries to slide down is arranged on the upper surface of the bottom plate and below the transverse and/or longitudinal airflow channel, and the lower end of the chute penetrates through the end part of the bottom plate.

Preferably, the outer surfaces of the fins and the heat conduction pipe are provided with wave grains.

Preferably, the outer surfaces of the fins and the heat conduction pipe are coated with a nano carbon material.

This novel duct formula cavity fin's beneficial effect does:

the fins in the prior art are usually fixed on the outer surface of the bottom plate, the heat conducted from the bottom plate is conducted through heat conduction to carry out secondary conduction heat dissipation, the cavity is directly formed in the fins, the cavity is directly communicated with the heat dissipation area of the electronic element through the air hole A, and therefore the fins are directly changed from secondary conduction heat into heat conduction from the heat dissipation area of the electronic element, meanwhile, the heat dissipation area of direct heat conduction is increased, and the heat dissipation efficiency is improved. In addition, the novel heat conduction pipe with the coiling is arranged at the top of the fin, and after hot air passing through the air hole A, the cavity and the air hole B enters the heat conduction pipe with the coiling, the stroke is greatly prolonged, so that the hot air is fully radiated and is discharged through the air outlet; in addition, because the area of the air outlet is smaller than the sum of the cross sectional areas of all the air holes A, the air flow at the air outlet is accelerated, and a siphon effect is formed in the heat conduction pipe, so that the hot air is quickly radiated and discharged. On this basis, this novel upper surface at the bottom plate has still set up the chute, can slide dust debris outside the fin, has avoided the fin to use the laying dust of a specified duration to influence heat dispersion.

Drawings

FIG. 1: the front structure of the novel device is shown schematically;

FIG. 2: the novel heat conduction pipe removing device can be used for removing the top view of the heat conduction pipe (the air hole B is not drawn);

FIG. 3: the novel top view with the heat conduction pipe;

1: bottom plate, 2: air hole a, 3: fin, 4: mounting hole, 5: air hole B, 6: cavity, 7: gas outlet, 8: a heat conducting pipe.

Detailed Description

The following description is of the preferred embodiment of the present invention only, and is not intended to limit the scope of the present invention, which is to be accorded the widest scope consistent with the principles and spirit of the present invention.

Examples 1,

As shown in fig. 1 and 2:

a novel pipe type cavity fin radiating fin comprises a bottom plate 1, wherein a mounting structure for mounting an electronic element is arranged on the lower surface of the bottom plate 1, a plurality of fins 3 are vertically distributed on the upper surface of the bottom plate 1, the fins 3 are arranged in a matrix, a coiled heat conduction pipe 8 is fixedly connected to the top ends of the matrix arrangement fins 3, and the heat conduction pipe 8 is made of a heat conduction metal material;

the bottom ends of the fins 3 are fixedly connected with the upper surface of the bottom plate 1, cavities 6 are arranged inside the fins 3, and the cavities 6 are communicated with the heat dissipation area of the electronic element through air holes A2 penetrating through the bottom ends of the fins and the lower end surface of the bottom plate;

one end of the heat conduction pipe 8 is sealed, the other end of the heat conduction pipe is provided with an air outlet 7, and the bottom of the heat conduction pipe 8 is communicated with the cavity 6 through an air hole B5;

the air outlet 7 is arranged upwards, and the area of the air outlet 7 is smaller than the sum of the cross sectional areas of all the air holes A2;

a plurality of transverse, longitudinal and oblique airflow channels for airflow series are formed among the fins 3 arranged in the matrix;

a chute for dust and sundries to slide down is arranged on the upper surface of the bottom plate and below the transverse or longitudinal airflow channel, and the lower end of the chute penetrates through the end part of the bottom plate;

the outer surfaces of the fins 3 and the heat conduction pipes 8 are provided with wave grains;

the outer surfaces of the fins 3 and the heat conduction pipe 8 are coated with nano carbon materials.

Examples 2,

On the basis of embodiment 1, this embodiment is improved, and is different from embodiment 1 in that:

and a chute for dust and sundries to slide down is arranged on the upper surface of the bottom plate 1 and below the transverse and longitudinal airflow channels.

This neotype theory of use:

the fins in the prior art are usually fixed on the outer surface of the bottom plate 1, the heat conducted from the bottom plate 1 is conducted through heat conduction to perform secondary conduction heat dissipation, the cavity 6 is directly formed in the fin 3, and the cavity 6 is directly communicated with the heat dissipation area of the electronic element through the air hole A2, so that the fins are directly changed from secondary conduction heat quantity to heat conduction from the heat dissipation area of the electronic element, and meanwhile, the heat dissipation area of direct heat conduction is increased, and the heat dissipation efficiency is improved.

Furthermore, the top of the fin 3 is provided with the coiled heat conduction pipe 8, and after the hot air passing through the air hole A2, the cavity 6 and the air hole B5 enters the coiled heat conduction pipe 8, the hot air is fully radiated and discharged through the air outlet 7 due to the great extension of the stroke; in addition, since the area of the air outlet 7 is smaller than the sum of the cross-sectional areas of all the air holes a2, the air flow at the air outlet 7 is accelerated, and a siphon effect is formed in the heat conduction pipe 8, so that the hot air is rapidly discharged.

On this basis, this is novel still set up the chute at bottom plate 1's upper surface, can slide dust debris outside the fin, has avoided the fin to use the laying dust of a specified duration to influence heat dispersion.

Claims

1. A novel duct type cavity fin radiating fin is characterized in that: the heat-conducting plate comprises a bottom plate, wherein a mounting structure for mounting an electronic element is arranged on the lower surface of the bottom plate, a plurality of fins are vertically distributed on the upper surface of the bottom plate, the fins are arranged in a matrix, the top ends of the fins arranged in the matrix are fixedly connected with a coiled heat-conducting pipe, and the heat-conducting pipe is made of a heat-conducting metal material.

2. The novel ducted cavity fin heat sink of claim 1, wherein: the bottom ends of the fins are fixedly connected with the upper surface of the bottom plate, cavities are arranged in the fins, and the cavities are communicated with the heat dissipation area of the electronic element through air holes A penetrating through the bottom ends of the fins and the lower end surface of the bottom plate.

3. A novel ducted cavity fin heat sink as claimed in claim 2, wherein: one end of the heat conduction pipe is sealed, the other end of the heat conduction pipe is provided with an air outlet, and the bottom of the heat conduction pipe is communicated with the cavity through an air hole B.

4. A novel ducted cavity fin heat sink as claimed in claim 3, wherein: the air outlet faces upwards, and the area of the air outlet is smaller than the sum of the cross sectional areas of all the air holes A.

5. The novel ducted cavity fin heat sink of claim 1, wherein: and a plurality of transverse, longitudinal and oblique airflow channels for airflow series are formed among the fins arranged in the matrix.

6. The novel ducted cavity fin heat sink of claim 5, wherein: and a chute for dust and sundries to slide down is arranged on the upper surface of the bottom plate and below the transverse and/or longitudinal airflow channel, and the lower end of the chute penetrates through the end part of the bottom plate.

7. The novel ducted cavity fin heat sink as claimed in any one of claims 1 to 6, wherein: the outer surfaces of the fins and the heat conduction pipe are provided with raised grains.

8. The novel ducted cavity fin heat sink as claimed in any one of claims 1 to 6, wherein: the outer surfaces of the fins and the heat conduction pipe are coated with nano carbon materials.