CN212543833U - Shockproof anti-deformation mobile phone motherboard - Google Patents

Abstract

The utility model discloses a shockproof and deformation-resistant mobile phone mainboard, which belongs to the technical field of mobile phones and comprises a body, wherein damping mechanisms are fixedly arranged at four corners of the surface of the body, a plurality of electronic elements are arranged on the surface of the body in a surface mounting manner, heat conducting discs are fixedly connected to the surfaces of the electronic elements, the heat conducting discs are sequentially connected through heat conducting pipes, one end of each heat conducting pipe is connected with a heat dissipation box, the heat dissipation box is of an open structure, and a plurality of radiating fins are fixedly connected to the inside of the heat dissipation box in an equidistant manner; the shock-absorbing structure of four corners department all can act on the body simultaneously, makes the body have better shock attenuation effect, can effectively reduce the probability that leads to the body to damage after the cell-phone drops, has good protecting effect, can realize quick heat dissipation, avoids the heat to pile up on electronic component, ensures the functioning speed of body, when the body receives the extrusion, improves the anti extrusion strength of body self, avoids the body to receive after the extrusion and splits, and crushing resistance is strong, and it is effectual to prevent deformation.

Description

Shockproof anti-deformation mobile phone motherboard

Technical Field

The utility model belongs to the technical field of the cell-phone, concretely relates to shockproof anti-deformation's mobile phone motherboard.

Background

The mobile phones are divided into smart phones and non-smart phones, the performance of the smart phones is better than that of the non-smart phones, but the performance of the non-smart phones is stable than that of the smart phones, most of the non-smart phones and the smart phones use a CPU (central processing unit) of the English ARM company framework, the smart phones have higher dominant frequency and high running speed, processing program tasks are faster, daily convenience is better, and the dominant frequency and the running speed of the non-smart phones are lower and slower.

At present, the interior mainboard has occupied extremely important position in the cell-phone, belong to the core part of cell-phone, and in daily use, the condition such as the cell-phone accident drops can take place often, when the cell-phone falls to the ground, the impact force of production can conduct to the cell-phone mainboard on, and then lead to the inseparable part on the mainboard to damage easily, influence the use of cell-phone, and parts such as treater on the current cell-phone mainboard can produce certain temperature at the during operation, be difficult to in time spill, and then cause the high temperature, reduce cell-phone functioning speed, there is certain use drawback.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an anti deformation's mobile phone motherboard takes precautions against earthquakes to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an anti deformation's mobile phone motherboard takes precautions against earthquakes, includes the body, the four corners department on body surface has all set firmly damper, a plurality of electronic component have been arranged in the surface mounting of body, and a plurality of electronic component's equal rigid coupling has the heat conduction dish on the surface, and a plurality of heat conduction dishes all connect gradually through the heat pipe, one of heat pipe serves and is connected with the heat dissipation box, and the heat dissipation box is open type structure, the rigid coupling is arranged to the inside equidistance of heat dissipation box has a plurality of fin.

As a preferred embodiment, damper includes the fixed column of rigid coupling in body surface four corners department, rotates on the fixed column and is connected with two swivel becks, and two swivel becks respectively with the one end rigid coupling of two articulated arms, and the other end of two articulated arms articulates respectively in two articulated pieces, and two articulated pieces rigid coupling respectively on the lateral wall of two sliding sleeves, and two sliding sleeves overlap jointly and establish and sliding connection on the dead lever.

As a preferred embodiment, the damping mechanism further includes damping springs sleeved on the outer side walls of the two ends of the fixing rod, and the opposite ends of the two damping springs are respectively fixedly connected with the two sliding sleeves.

As a preferred embodiment, an open annular groove is formed in the bottom surface of the body at a position close to the edge, a layer of adhesive layer is coated in the annular groove, and the metal protection ring is bonded through the adhesive layer.

In a preferred embodiment, the metal guard ring has a size corresponding to the size of the annular groove.

As a preferred embodiment, the four side walls of the body are all fixedly provided with buffer strips, and the four buffer strips are all made of rubber.

Compared with the prior art, the utility model provides a shockproof anti-deformation's mobile phone motherboard includes following beneficial effect at least:

(1) under the action of the damping mechanism, when the mobile phone falls to generate certain impact force, the impact force generated by the body can extrude the two hinged rods to be far away, so that the two sliding sleeves are driven to be far away from each other and extrude the damping spring, the damping spring is contracted, the damping effect is realized under the action of the damping spring, and meanwhile, the damping structures at four corners can simultaneously act on the body, so that the body has a better damping effect, the probability of damage to the body caused by falling of the mobile phone can be effectively reduced, the excellent protection effect is realized, heat generated by the work of an electronic element on the body can be conducted into the heat dissipation box under the action of the heat conduction disc and the heat conduction pipe, the heat is dissipated by the heat dissipation fins, the quick heat dissipation can be realized, the heat is prevented from being accumulated on the electronic element, and the running speed of the;

(2) through the setting of ring channel, viscose layer and metal protection ring, bond the metal protection ring in the ring channel under the effect of viscose layer, when the body receives the extrusion, improve the anti extrusion strength of body self, avoid the body to receive the fracture after the extrusion, the crushing resistance is strong, prevents that deformation is effectual.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the present invention viewed from the bottom;

fig. 3 is a schematic structural diagram of the damping mechanism of the present invention.

In the figure: 1. a body; 2. a damping mechanism; 201. fixing a column; 202. a rotating ring; 203. a hinged lever; 204. a hinged block; 205. a sliding sleeve; 206. a damping spring; 207. fixing the rod; 3. an electronic component; 4. a heat conducting plate; 5. a heat conducting pipe; 6. a heat dissipation box; 7. a heat sink; 8. an annular groove; 9. an adhesive layer; 10. a metal guard ring; 11. a buffer strip.

Detailed Description

The present invention will be further described with reference to the following examples.

The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention. The condition in the embodiment can be further adjusted according to concrete condition the utility model discloses a it is right under the design prerequisite the utility model discloses a simple improvement of method all belongs to the utility model discloses the scope of claiming.

Referring to fig. 1-3, the utility model provides a mobile phone motherboard with shock resistance and deformation resistance, which comprises a body 1, wherein a damping mechanism 2 is fixedly arranged at four corners of the surface of the body 1, the damping mechanism 2 comprises a fixed column 201 fixedly connected at four corners of the surface of the body 1, two rotating rings 202 are rotatably connected on the fixed column 201, the two rotating rings 202 are respectively fixedly connected with one ends of two hinge rods 203, the other ends of the two hinge rods 203 are respectively hinged in two hinge blocks 204, the two hinge blocks 204 are respectively fixedly connected on the outer side walls of two sliding sleeves 205, and the two sliding sleeves 205 are jointly sleeved and slidably connected on a fixed rod 207 (see fig. 1, 2 and 3); when the mobile phone drops and generates a certain impact force, the impact force generated by the body 1 can extrude the two hinged rods 203 to be away from each other, so that the two sliding sleeves 205 are driven to be away from each other and extrude the damping spring 206, and the damping spring 206 is extruded.

The damping mechanism 2 further comprises damping springs 206 sleeved on the outer side walls of the fixing rod 207 near the two ends, and the opposite ends of the two damping springs 206 are respectively fixedly connected with the two sliding sleeves 205 (see fig. 3); the function of buffer and shock absorption is realized under the action of the shock absorption spring 206.

A plurality of electronic elements 3 are arranged on the surface of the body 1, heat conduction discs 4 are fixedly connected on the surfaces of the electronic elements 3, the heat conduction discs 4 are sequentially connected through heat conduction pipes 5, one end of each heat conduction pipe 5 is connected with a heat dissipation box 6, the heat dissipation boxes 6 are of an open structure, and a plurality of radiating fins 7 (shown in figure 1) are fixedly connected in the heat dissipation boxes 6 in an equidistant arrangement manner; the heat generated by the operation of the electronic element 3 on the body 1 can be conducted to the heat dissipation box 6 under the action of the heat conduction disk 4 and the heat conduction pipe 5, and the heat dissipation is carried out by the heat dissipation sheet 7, so that the quick heat dissipation can be realized, the heat is prevented from being accumulated on the electronic element 3, and the running speed of the body 1 is ensured.

An open annular groove 8 is formed in the bottom surface of the body 1 close to the edge, a viscose layer 9 is coated in the annular groove 8, and a metal protection ring 10 is bonded through the viscose layer 9 (see fig. 2); through the setting of ring channel 8, viscose layer 9 and metal protection ring 10, bond metal protection ring 10 in ring channel 8 under the effect of viscose layer 9, when body 1 received the extrusion, improve the anti extrusion strength of body 1 self, avoid the body 1 extrusion back to receive the fracture, the crushing resistance is strong, prevents that deformation effect is good.

The size of the metal protection ring 10 corresponds to the size of the annular groove 8 (see fig. 2); ensuring that the metal guard ring 10 fits completely within the annular groove 8.

The four side walls of the body 1 are all fixedly provided with buffer strips 11, and the four buffer strips 11 are all made of rubber (see figure 1); the shock absorbing effect of the body 1 is further improved.

When the mobile phone is used, under the action of the damping mechanism 2, when the mobile phone drops to generate a certain impact force, the impact force generated by the body 1 can extrude the two hinged rods 203 to be away, so as to drive the two sliding sleeves 205 to be away from each other and extrude the damping spring 206, so that the damping spring 206 contracts, and the damping effect of damping is realized under the action of the damping spring 206, meanwhile, the damping structures at four corners can simultaneously act on the body 1, so that the body 1 has a better damping effect, the probability of damage to the body 1 caused by dropping of the mobile phone can be effectively reduced, the excellent protection effect is realized, heat generated by the work of the electronic element 3 on the body 1 can be conducted into the heat dissipation box 6 under the action of the heat conduction plate 4 and the heat conduction pipe 5, the heat dissipation is realized by the heat dissipation fins 7, the heat can be rapidly dissipated, the heat is prevented from being accumulated on the electronic element 3, and, through the setting of ring channel 8, viscose layer 9 and metal protection ring 10, bond metal protection ring 10 in ring channel 8 under the effect of viscose layer 9, when body 1 received the extrusion, improve the anti extrusion strength of body 1 self, avoid the body 1 extrusion back to receive the fracture, the crushing resistance is strong, prevents that deformation effect is good.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a shockproof anti deformation's mobile phone motherboard, includes body (1), its characterized in that: body (1) surface four corners department has all set firmly damper (2), a plurality of electronic component (3) have been arranged to the surface mounting of body (1), and the equal rigid coupling in surface of a plurality of electronic component (3) has heat conduction dish (4), and a plurality of heat conduction dish (4) all connect gradually through heat pipe (5), one of heat pipe (5) is served and is connected with heat dissipation box (6), and heat dissipation box (6) are open type structure, the rigid coupling is arranged to the inside equidistance of heat dissipation box (6) has a plurality of fin (7).

2. The shockproof and deformation-resistant mobile phone motherboard of claim 1, wherein: damper (2) include fixed column (201) of rigid coupling in body (1) surface four corners department, it is connected with two swivel becket (202) to rotate on fixed column (201), and two swivel becket (202) respectively with the one end rigid coupling of two articulated mast (203), and the other end of two articulated mast (203) articulates respectively in two articulated blocks (204), and two articulated blocks (204) rigid coupling respectively on the lateral wall of two sliding sleeve (205), and two sliding sleeve (205) overlap jointly and establish and sliding connection on dead lever (207).

3. The shockproof and deformation-resistant mobile phone motherboard of claim 2, wherein: the damping mechanism (2) further comprises damping springs (206) sleeved on the fixing rod (207) and close to the outer side walls of the two ends, and the opposite ends of the two damping springs (206) are fixedly connected with the two sliding sleeves (205) respectively.

4. The shockproof and deformation-resistant mobile phone motherboard of claim 1, wherein: the utility model discloses a metal protection ring, including body (1), body (8), metal protection ring (10) are provided with uncovered formula ring channel (8) on the position that the bottom surface of body (1) is close to the border, and the coating has one deck viscose layer (9) and bonds through viscose layer (9) in ring channel (8).

5. The shockproof and deformation-resistant mobile phone motherboard of claim 4, wherein: the size of the metal protection ring (10) is consistent with that of the annular groove (8).

6. The shockproof and deformation-resistant mobile phone motherboard of claim 1, wherein: all set firmly buffering strip (11) on four lateral walls of body (1), and four buffering strips (11) are the rubber material.

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