CN212517233U - Reinforced LED packaging structure - Google Patents

Abstract

The utility model provides a reinforcement type LED packaging structure relates to semiconductor device technical field, for solving prior art, the technical problem that lens and ceramic substrate joint strength are low that LED packaging structure exists, the technical scheme of the utility model as follows: comprises a ceramic substrate, a lens and a reinforcing plate. The ceramic substrate is provided with a surrounding dam, the bottom of the lens is provided with a flange extending towards the peripheral direction, the middle of the reinforcing plate is provided with an avoiding groove which can enable the lens to axially pass through but be blocked by the flange, the lens is fixedly connected in a space formed by the surrounding dam through the flange, and the avoiding groove of the reinforcing plate passes through the lens and is fixedly connected with the top surface of the surrounding dam at the periphery. When the connection between the lens and the ceramic substrate fails, for example, the bonding layer is aged or vibration occurs to cause the fracture of the connection, the lens falls off from the dam of the ceramic substrate, but the reinforcing plate can limit the flange, so that the lens can be prevented from falling off from the dam.

Description

Reinforced LED packaging structure

Technical Field

The utility model relates to a semiconductor device technical field, in particular to LED packaging structure.

Background

A light emitting diode (led) is a solid semiconductor device capable of converting electric energy into visible light. With the continuous development of the LED industry, LED products having the advantages of energy saving, high efficiency, fast response time, long life cycle time, environmental protection, etc. gradually become mainstream products in the technical fields of display or lighting, etc., and are more and more paid attention by people. When an LED product is prepared, an LED packaging device is needed to package an LED chip so as to achieve the purpose of protecting the LED chip and a lead electrode of the LED chip, and the LED packaging directly influences the quality and the service life of the LED product.

In the prior art, the high-power ceramic LED package structure is: and gluing an adhesive on the step of the dam of the ceramic substrate, covering the lens on the step of the dam, and baking to form an adhesive bonding layer. Although the method is simple and convenient to operate, the initial bonding force of the bonding layer is good, and the bonding layer can resist vibration to a certain degree, the adhesive can age after being used for a certain time, so that the bonding capability is reduced and the adhesive fails; the other packaging structure is that metal is evaporated at the bottom of the lens, metal is evaporated on the surface of the ceramic substrate, and the lens is welded to the ceramic substrate in a tin paste, nano metal sintering or eutectic mode to form an alloy connecting layer. Although the bonding force of the method is far higher than that of the method adopting the adhesive, the method has complex process and high cost; and the vibration-proof capability of the alloy connecting layer is poor. Therefore, the LED packaging structure in the prior art has the defect of low connection strength between the lens and the ceramic substrate.

SUMMERY OF THE UTILITY MODEL

For solving prior art, the technical problem that lens and ceramic substrate joint strength are low that LED packaging structure exists, the technical scheme of the utility model as follows:

in a first aspect, the utility model provides a reinforcement type LED packaging structure, including ceramic substrate, lens and gusset plate. The utility model discloses a LED lens, including ceramic substrate, lens cover, reinforcing plate, lens, dam, lens cover, lens, reinforcing plate, lens cover, lens cover, reinforcing plate and reinforcing plate, the last dam that has of ceramic substrate, LED chip arrange in the space that the dam constitutes, the outside of LED chip is located to the lens cover, the whole shape of lens is the hemisphere type, and the bottom has the flange that extends to direction all around, the middle part of reinforcing plate is seted up and is made lens axial pass, nevertheless by the dodge groove that the flange blockked, promptly the flange can overlap joint on the reinforcing plate base member who dodges the groove, and then prevents that lens from passing the reinforcing plate completely, lens pass through flange fixed connection in. When the connection between the lens and the ceramic substrate fails, for example, when the adhesive is aged to cause the part of the connection part to break, the lens falls off from the dam of the ceramic substrate, but the reinforcing plate can limit the flange, so that the lens can be prevented from falling off from the dam.

The utility model provides a reinforcement type LED packaging structure at first fixes the LED chip on ceramic substrate, then fixed mounting lens on ceramic substrate, can adopt gluing agent bonding mode to bond the flange on ceramic substrate to inside lens are located the box dam, cover the gusset plate at last, lens pass and dodge the groove, the bottom surface of gusset plate and the top surface fixed connection of box dam, and then accomplish the LED encapsulation.

The utility model provides a reinforcement type LED packaging structure, lens and ceramic substrate joint strength to LED packaging structure existence among the prior art are low, the design of being connected is further consolidated to nothing, lead to the shortcoming that lens dropped from ceramic substrate easily, add the flange through improving lens structure, and then increased the connection area of lens and ceramic substrate, the joint strength of lens and ceramic substrate has been improved, add the gusset plate that uses with the lens is supporting simultaneously, form spacing reinforcing effect to lens through the gusset plate, even the problem that lens and ceramic substrate are connected to become invalid appears, lens drops in the dam of ceramic substrate, but the gusset plate can also restrict the flange, and then can avoid lens to fall out from the dam. To sum up, the utility model provides the high antidetonation effect of lens has further guaranteed lens and ceramic substrate's joint strength, and the trouble that can effectively avoid lens to drop appears.

In one possible design, the lens and the ceramic substrate are bonded by an adhesive, which may be silicone, epoxy, polyurethane, UV glue, or the like.

Preferably, the adhesive is silica gel. The silica gel material has excellent performances of resisting atmospheric aging, ultraviolet aging and the like, and is widely applied to the LED photoelectric industry. The silica gel can be classified into methyl-based organic silica gel and phenyl-based organic silica gel according to the kind of molecular chain group.

The adhesive is arranged, so that the lens is fixed; and on the other hand provides cushioning when an external force is applied.

In one possible design, the flange is a continuous edge structure that is rectangular in shape.

Optionally, the overall shape of the lens may be a structure such as a hemisphere, a prism, a pyramid, etc., and the shape of the flange at the bottom of the lens may be a circle, a triangle, a trapezoid, an ellipse, etc., which is adapted to the shape of the space formed by the dam.

In one possible design, the flange is a segmented edge structure which is evenly distributed along the circumference of the bottom of the flange, and the segmented structure is used for reducing the material cost of the lens.

Optionally, the segmentation mode of the flange does not need to be particularly limited, as long as the flange can generate interference, blocking and limiting effects when the lens passes through the avoidance groove.

In one possible design, the shape of the space formed by the box dam is adapted to the shape of the flange.

Optionally, the space formed by the dam is rectangular, circular, triangular, trapezoidal, oval, etc., and the space has no special requirement as long as the space can accommodate the LED chip, the lens and the flange of the lens.

In one possible design, the reinforcing plate is made of metal and has an outer shape adapted to the top surface of the box dam.

Optionally, the shape of the reinforcing plate may be rectangular, circular, triangular, trapezoidal, oval, etc., and is adapted to the shape of the top surface of the dam.

Furthermore, the shape of the avoiding groove in the middle of the reinforcing plate is not particularly limited, and can be circular, triangular, trapezoidal, oval and the like, as long as the requirement that the lens axially passes through but is blocked by the flange can be met.

In one possible design, the top surface of the box dam is covered with a metal layer, and is connected with the reinforcing plate by welding, nano-metal sintering or eutectic crystal. The physical properties of metal reinforcing plate and the metal level at box dam top are similar, and then can guarantee both joint strength through the welding.

In one possible design, the material of the ceramic substrate is alumina, zirconia, beryllia, aluminum nitride, or silicon carbide.

Optionally, the material of the ceramic substrate is detailed as follows:

alumina substrates are the most commonly used substrate materials in the electronics industry because of their high mechanical, thermal, and electrical properties, strength and chemical stability relative to most other oxide ceramics, and their abundant raw material sources, suitability for manufacturing by a variety of techniques and in different shapes.

The thermal conductivity of the zirconia ceramic substrate is dozens of times of that of alumina, so that the zirconia ceramic substrate is suitable for a high-power circuit, has low dielectric constant and can be used for a high-frequency circuit.

The beryllium oxide ceramic substrate has the characteristics of high heat conductivity coefficient, high melting degree, strength, high insulation, low dielectric constant, low dielectric loss, good packaging process adaptability and the like, is valued and applied in the technical fields of microwave technology, electric vacuum technology, nuclear technology, microelectronics and photoelectrons, and is a mainstream ceramic material for preparing high-heat-conductivity components in high-power semiconductor devices, high-power integrated circuits, high-power microwave vacuum devices and nuclear reactors.

The aluminum nitride ceramic substrate has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity and low dielectric loss, and is an ideal large-scale integrated circuit heat dissipation substrate and packaging material.

The silicon carbide ceramic substrate has excellent chemical stability and thermal stability, has a particularly large thermal diffusivity compared with other materials, even larger than copper, and has a thermal expansion coefficient closer to that of silicon. Substrates used for high heat dissipation packages for low-voltage circuits and very large scale integrated circuits with high withstand voltage are widely used, for example, high-speed and high-integration logic LSI packages with heat dissipation mechanisms, substrates for ultra-large computers and laser diodes for optical communications, and the like.

In one possible design, the lens is made of quartz or sapphire.

Optionally, the detailed explanation of each material of the lens is as follows:

the quartz glass is an amorphous material with a single silicon dioxide component, the microstructure of the quartz glass is a simple network consisting of silicon dioxide four-sided structural body structural units, and the quartz glass has unique performance due to the large Si-O chemical bond energy and the compact structure, particularly has excellent optical performance of transparent quartz glass, and has excellent transmittance in the continuous wavelength range from ultraviolet radiation to infrared radiation. The quartz glass is used for manufacturing semiconductors, electric light sources, semiconductor communication devices, lasers, optical instruments, laboratory instruments, electrical equipment, medical equipment, high-temperature-resistant and corrosion-resistant chemical instruments, chemical industry, electronics, metallurgy, building materials, national defense and other industries, and is very widely applied.

Sapphire is a single crystal of alumina, has high hardness of 9 Mohs hardness, good light transmittance, thermal conductivity and electrical insulation, good mechanical property, and wear resistance and wind erosion resistance. The sapphire crystal becomes the most ideal lens material for the LED due to the unique lattice structure, excellent mechanical property and good thermal property.

Drawings

Fig. 1 is a schematic view of a ceramic substrate according to an embodiment of the present invention;

fig. 2 is a schematic view of a lens provided in an embodiment of the present invention;

fig. 3 is a schematic view of a reinforcing plate according to an embodiment of the present invention;

fig. 4 is an assembly view of a reinforced LED package structure according to an embodiment of the present invention;

fig. 5 is a top view of another embodiment of the present invention, showing a lens;

fig. 6 is a top view of a box dam according to another embodiment of the present invention.

Reference numerals: 10. a ceramic substrate; 11. a box dam; 12. a groove; 20. a lens; 21. a flange; 30. a reinforcing plate; 31. avoiding the groove.

Detailed Description

The technical solution of the present invention will be described below with reference to the accompanying drawings. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom", and the like, indicate orientations or positional relationships based on installation, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

It should be noted that, in the embodiments of the present invention, the same reference numerals are used to denote the same components or parts, and for the same components or parts in the embodiments of the present invention, only one of the components or parts may be used as an example to denote the reference numeral in the drawings, and it should be understood that the reference numerals are also applicable to other similar components or parts.

As shown in fig. 1-4, the present embodiment provides a ruggedized LED package structure, which includes a ceramic substrate 10, a lens 20, and a stiffener 30. Have the box dam 11 on the ceramic substrate 10, the LED chip arranges in the space that the box dam 11 constitutes, lens 20 covers the outside of locating the LED chip, lens 20's overall shape is the hemisphere type, the bottom has the flange 21 that extends to the direction all around, the middle part of gusset plate 30 is seted up and is made lens 20 axial pass, but dodge groove 31 that is blockked by flange 21, flange 21 can overlap joint on the gusset plate 30 base member of dodging groove 31 promptly, and then prevent that lens 20 from passing gusset plate 30 completely, lens 20 passes through flange 21 fixed connection in the space that the box dam 11 constitutes, the dodge groove 31 of gusset plate 30 passes lens 20 and peripheral and box dam 11's top surface fixed connection. When the connection between the lens 20 and the ceramic substrate 10 fails, for example, when the connection is broken due to vibration, the lens 20 falls off from the dam 11 of the ceramic substrate 10, but the reinforcing plate 30 restricts the flange 21, thereby preventing the lens 20 from falling off from the dam 11.

In the embodiment of the reinforced LED package structure, aiming at the defects that the connection strength between the lens 20 and the ceramic substrate 10 is low, the connection design is not further reinforced, and the lens 20 is easy to drop from the ceramic substrate 10 in the LED package structure in the prior art, the flange 21 is additionally arranged by improving the structure of the lens 20, so that the connection area between the lens 20 and the ceramic substrate 10 is increased, the connection strength between the lens 20 and the ceramic substrate 10 is improved, meanwhile, the reinforcing plate 30 used in cooperation with the lens 20 is additionally arranged, the reinforcing plate 30 forms a limiting reinforcing effect on the lens 20, even if the problem that the lens 20 and the ceramic substrate 10 are connected to fail occurs, the lens 20 drops from the dam 11 of the ceramic substrate 10, but the reinforcing plate 30 can also limit the flange 21, and further the lens 20 can be prevented from dropping from the dam 11. In conclusion, the present embodiment improves the anti-vibration effect of the lens 20, further ensures the connection strength between the lens 20 and the ceramic substrate 10, and can effectively avoid the occurrence of the failure that the lens 20 falls.

The lens 20 is bonded to the ceramic substrate 10 by an adhesive.

Wherein, the adhesive is silica gel. The silica gel material has excellent performances of resisting atmospheric aging, ultraviolet aging and the like, and is widely applied to the LED photoelectric industry. The silica gel can be classified into methyl-based organic silica gel and phenyl-based organic silica gel according to the kind of molecular chain group. As shown in FIG. 2, in one embodiment, the flange 21 is a continuous-sided structure that is rectangular in shape.

The overall shape of the lens 20 may be a structure such as a hemisphere, a prism, a pyramid, etc., and the shape of the flange 21 at the bottom of the lens 20 may be a circle, a triangle, a trapezoid, an ellipse, etc., which is adapted to the shape of the space formed by the dam 11.

As shown in fig. 5, in one embodiment, the flange 21 is a segmented edge structure that is uniformly distributed along the bottom circumference of the flange 21, and the segmented structure is used to reduce the material cost of the lens.

The segmentation mode of the flange 21 does not need to be specially limited, as long as the flange 21 can generate interference, blocking and limiting effects when the lens 20 passes through the avoiding groove 31.

In one embodiment, shown in fig. 1, the space formed by the box dam 11 is shaped to match the shape of the flange, and is rectangular.

As shown in fig. 6, the dam 11 corresponds in shape to the flange 21 in fig. 5, with a groove 12 corresponding to the segmented edge.

The shape of the space formed by the box dam 11 may also be circular, triangular, trapezoidal, oval, etc., and the shape of the space has no special requirement as long as the LED chip, the lens 20, and the flange 21 of the lens 20 can be accommodated.

In one embodiment, as shown in fig. 3, the reinforcing plate 30 is made of metal and has an outer shape that conforms to the top surface of the box dam.

The reinforcing plate 30 may be rectangular, circular, triangular, trapezoidal, oval, etc., and is adapted to the space formed by the dam 11.

Further, the shape of the avoiding groove 31 in the middle of the reinforcing plate 30 is not particularly limited, and may be circular, triangular, trapezoidal, elliptical, or the like, as long as the requirement that the lens 20 axially passes through but is blocked by the flange 21 is satisfied.

In one embodiment, the top surface of the dam 11 is covered with a metal layer and is connected to the reinforcing plate 30 by welding. The physical properties of the metal reinforcing plate 30 are similar to those of the metal layer on the top of the box dam 11, and the connection strength of the metal reinforcing plate and the metal layer can be ensured by welding.

In one embodiment, the ceramic substrate 10 is made of alumina, which has high strength and chemical stability, and is available from a wide variety of raw materials, and is suitable for manufacturing by various techniques and in various shapes.

In one embodiment, the ceramic substrate 10 is made of aluminum nitride, and has high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, and low dielectric loss.

In one embodiment, the lens 20 is made of sapphire, has a high crystal hardness of 9 mohs hardness, has good light transmittance, thermal conductivity and electrical insulation, and has good mechanical and mechanical properties, and is wear-resistant and weather-resistant. The sapphire crystal becomes the most ideal lens material for the LED due to the unique lattice structure, excellent mechanical property and good thermal property.

The utility model discloses an encapsulation process as follows:

firstly, die bonding is carried out on the ceramic substrate 10;

secondly, covering the ceramic substrate 10 with a lens 20, and bonding the lens with silica gel;

and thirdly, covering a metal reinforcing plate 30, and fixing the metal reinforcing plate on the dam 11 of the ceramic substrate 10 by welding.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The reinforced LED packaging structure comprises a ceramic substrate (10) and a lens (20), and is characterized by further comprising a reinforcing plate (30); the ceramic substrate (10) is provided with a surrounding dam (11), the bottom of the lens (20) is provided with a flange (21), the middle of the reinforcing plate (30) is provided with an avoiding groove (31) which can enable the lens (20) to pass through but is blocked by the flange (21), the lens (20) is fixedly connected in a space formed by the surrounding dam (11) through the flange (21), the avoiding groove (31) of the reinforcing plate (30) passes through the lens (20) and the periphery of the avoiding groove is fixedly connected with the top surface of the surrounding dam (11); when the connection of the lens (20) and the ceramic substrate (10) fails, the flange (21) and the reinforcing plate (30) are matched to form axial limit on the lens (20).

2. The reinforced LED package structure of claim 1, wherein the lens (20) is bonded to the ceramic substrate (10) by an adhesive.

3. The reinforced LED package structure of claim 2, wherein the adhesive is silicone, epoxy, UV glue, or polyurethane.

4. The reinforced LED package structure of claim 3, wherein the flange (21) is a continuous edge structure having a rectangular shape.

5. The ruggedized LED package structure of claim 3, wherein the flange (21) is a segmented edge structure that is uniformly distributed circumferentially along a bottom portion of the flange (21).

6. Reinforced LED package according to claim 4 or 5, characterized in that the dam (11) has a spatial shape adapted to the shape of the flange (21).

7. The reinforced LED package structure of claim 6, wherein the reinforcing plate (30) is made of metal and has an outer shape adapted to the shape of the top surface of the dam (11).

8. The reinforced LED package structure of claim 7, wherein the top surface of the dam (11) is covered with a metal layer, and is connected to the reinforcing plate (30) by soldering, nano-metal sintering or eutectic crystal.

9. The reinforced LED package structure according to claim 8, wherein the ceramic substrate (10) is made of alumina, zirconia, beryllia, aluminum nitride or silicon carbide.

10. The ruggedized LED package structure of claim 9, wherein the lens (20) is made of quartz or sapphire.

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