CN212505134U

CN212505134U - Local electroplating device

Info

Publication number: CN212505134U
Application number: CN202021192117.1U
Authority: CN
Inventors: 贺正林
Original assignee: Guangdong Zhenghui Industry Co ltd
Current assignee: Guangdong Zhenghui Industry Co ltd
Priority date: 2020-06-24
Filing date: 2020-06-24
Publication date: 2021-02-09
Anticipated expiration: 2030-06-24

Abstract

The utility model provides a local electroplating device, each elevating system evenly distributed is around the plating bath, and the lifting screw inserts and locates to rotate the hole and rotate with L type bracing piece and be connected, and the lifting screw inserts and locates in the screw hole and be connected with the drive block drive. The local electroplating device clamps a product to be electroplated on the electroplating clamp in the working process, then rotates the lifting screw rods in the lifting mechanisms according to the part of the product to be electroplated, and rotates to drive the driving block to drive the electroplating bath to move up and down along the L-shaped supporting rod by utilizing the screw rod principle, so that the height of the electroplating solution submerged in the electroplating bath by the product to be electroplated is adjusted. And connecting the electroplating clamp with the cathode of an external circuit, and connecting the anode plate with the anode of the external circuit so as to accurately carry out local electroplating treatment on a product to be electroplated. The local electroplating device has the advantages of simple and convenient steps, high efficiency and low cost for carrying out local electroplating treatment on the product to be electroplated.

Description

Local electroplating device

Technical Field

The utility model relates to an electroplate the field, especially relate to a local electroplating device.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to play roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, enhancing appearance and the like. The outer layer of many coins is also plated. During electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer. In order to eliminate the interference of other cations and make the coating uniform and firm, a solution containing the metal cations of the coating is used as an electroplating solution to keep the concentration of the metal cations of the coating constant. The purpose of electroplating is to plate a metal coating on a substrate, altering the surface properties or dimensions of the substrate. Electroplating enhances the corrosion resistance of the metal, increases hardness, prevents abrasion, improves conductivity, smoothness, heat resistance, and provides a beautiful surface.

However, some electroplating works only need to plate a part of the product, and conventional local electroplating usually needs to cover the non-plating area of the product with a large amount of shielding material, but products of different materials need different shielding materials. Moreover, manual work is required to cover and remove the shielding material for the product, which is costly and inefficient.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a local electroplating apparatus for solving the technical problems of high cost and low efficiency caused by manual shielding and removing of shielding materials for products.

A local electroplating device comprises an electroplating bath, an electroplating hanger, an electroplating clamp, an anode connecting mechanism and a plurality of lifting mechanisms;

the electroplating bath is used for containing electroplating solution, the electroplating hanger part is arranged in the electroplating bath and is connected with an external fixing device, the electroplating clamp is connected with the electroplating hanger, and the electroplating clamp is used for connecting a cathode of an external circuit and clamping and fixing a product to be electroplated;

the anode connecting mechanism comprises an anode frame and an anode plate, and the anode plate is connected with an external fixing device through the anode frame; the anode plate is used for connecting an anode of an external circuit;

each lifting mechanism is uniformly distributed around the electroplating bath and comprises an L-shaped supporting rod, a lifting screw and a driving block; one end of the L-shaped supporting rod is connected with an external fixing device; the other end of the L-shaped support rod is provided with a rotating hole, the driving block is connected with the outer side wall of the electroplating bath, the driving block is provided with a threaded hole, the rotating hole and the threaded hole are respectively matched with the lifting screw rod, the lifting screw rod is inserted into the rotating hole and is rotationally connected with the L-shaped support rod, and the lifting screw rod is inserted into the threaded hole and is drivingly connected with the driving block.

In one embodiment, the local electroplating device comprises four lifting mechanisms, and the four lifting mechanisms are respectively arranged at four corners of the electroplating bath.

In one embodiment, the driving block is integrally formed with the plating tank.

In one embodiment, the electroplating hanger is a U-shaped plate structure, two ends of the electroplating hanger are respectively provided with a clamping block and a fixed block, the fixed block is provided with a V-shaped clamping groove, the clamping block is matched with the V-shaped clamping groove, and the clamping block is inserted into the V-shaped clamping groove and connected with the fixed block; the fixed block is detachably connected with an external fixing device.

In one embodiment, a T-shaped connecting rod is arranged on one side, away from the electroplating clamp, of the electroplating hanger, the T-shaped connecting rod comprises a cross rod and a vertical rod, the vertical rod is vertically connected with the middle area of the cross rod, and the vertical rod is connected with the electroplating hanger.

In one embodiment, the two ends of the cross rod are provided with moving handles.

In one embodiment, a protective sleeve is disposed on the moving handle.

In one embodiment, the protective sleeve is a soft rubber sleeve.

In one embodiment, the protective sleeve is a soft sponge sleeve.

In one embodiment, the protective sleeve is provided with anti-skid lines.

In the working process of the local electroplating device, a product to be electroplated is clamped on the electroplating clamp firstly, then the lifting screw rods in the lifting mechanisms are rotated according to the part to be electroplated of the product to be electroplated, and the lifting screw rods rotate to drive the driving blocks to drive the electroplating bath to move up and down along the L-shaped supporting rod by utilizing the principle of the screw rod, so that the height of the electroplating bath of the product to be electroplated submerged in the electroplating bath is adjusted. And connecting the electroplating clamp with the cathode of an external circuit, and connecting the anode plate with the anode of the external circuit so as to accurately carry out local electroplating treatment on a product to be electroplated. The local electroplating device has the advantages of simple and convenient steps, high efficiency and low cost for carrying out local electroplating treatment on the product to be electroplated.

Drawings

FIG. 1 is a schematic structural view of a local plating apparatus according to an embodiment;

FIG. 2 is a schematic diagram of a portion of a local plating apparatus according to an embodiment;

FIG. 3 is a schematic diagram of a portion of a local plating apparatus according to an embodiment.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 to 3, the present invention provides a local electroplating apparatus 10, wherein the local electroplating apparatus 10 includes an electroplating bath 100, an electroplating hanger 200, an electroplating fixture 300, an anode connection mechanism 400, and a plurality of lifting mechanisms 500. The electroplating bath 100 is used for containing electroplating solution, the electroplating hanger 200 is partially arranged in the electroplating bath 100 and is connected with an external fixing device, the electroplating clamp 300 is connected with the electroplating hanger 200, and the electroplating clamp 300 is used for connecting the cathode of an external circuit and clamping and fixing a product to be electroplated. The anode connection mechanism 400 includes an anode frame 410 and an anode plate 420, wherein the anode plate 420 is connected to an external fixing device through the anode frame 410. The anode plate 420 is used to connect the anode of an external circuit. The elevating mechanisms 500 are uniformly distributed around the electroplating tank 100, and in the present embodiment, the local electroplating apparatus 10 includes four elevating mechanisms 500, and the four elevating mechanisms 500 are respectively disposed at four corners of the electroplating tank 100. The elevating mechanism 500 includes an L-shaped support bar 510, an elevating screw 520, and a driving block 530. One end of the L-shaped support bar 510 is connected with an external fixing device. The other end of the L-shaped support bar 510 is provided with a rotation hole 501, and the driving block 530 is connected to the outer sidewall of the electroplating tank 100, in this embodiment, the driving block 530 is integrally formed with the electroplating tank 100. The driving block 530 is provided with a threaded hole 502, the rotating hole 501 and the threaded hole 502 are respectively matched with a lifting screw 520, the lifting screw 520 is inserted into the rotating hole 501 and is rotatably connected with the L-shaped support rod 510, and the lifting screw 520 is inserted into the threaded hole 502 and is in driving connection with the driving block 530.

In the working process of the local electroplating device 10, a product to be electroplated is clamped on the electroplating fixture 300, then the lifting screw 520 in each lifting mechanism 500 is rotated according to a part to be electroplated of the product to be electroplated, and the lifting screw 520 is rotated to drive the driving block 530 to drive the electroplating bath 100 to move up and down along the L-shaped supporting rod 510 by utilizing the screw rod principle, so that the height of the electroplating solution submerged in the electroplating bath 100 by the product to be electroplated is adjusted. The plating jig 300 is connected to the cathode of an external circuit, and the anode plate 420 is connected to the anode of the external circuit, so that the partial plating process is precisely performed on the product to be plated. The local electroplating device 10 has the advantages of simple and convenient steps, high efficiency and low cost for carrying out local electroplating treatment on the product to be electroplated.

In order to increase the connection stability between the electroplating hanger 200 and the external fixing device, please refer to fig. 1 to fig. 3, in one embodiment, the electroplating hanger 200 is a U-shaped plate structure, the two ends of the electroplating hanger 200 are both provided with a retaining block 210 and a fixing block 220, the fixing block 220 is provided with a V-shaped retaining groove 201, the retaining block 210 is adapted to the V-shaped retaining groove 201, and the retaining block 210 is inserted into the V-shaped retaining groove 201 and connected to the fixing block 220. The fixing block 220 is detachably connected to an external fixing device. Further, the fixing block 220 is screw-coupled with an external fixing device. Thus, the clamping block 210 and the fixing block 220 increase the connection stability of the electroplating hanger 200 and an external fixing device.

In order to facilitate the movement of the plating hanger 200, please refer to fig. 1 to 3, in one embodiment, a T-shaped connecting rod 230 is disposed on a side of the plating hanger 200 away from the plating jig 300, the T-shaped connecting rod 230 includes a cross rod 231 and a vertical rod 232, the vertical rod 232 is vertically connected to a middle region of the cross rod 231, and the vertical rod 232 is connected to the plating hanger 200. The electroplating hanger 200 is moved by the user through holding the cross bar 231. Further, both ends of the cross bar 231 are provided with moving handles 233. The electroplating hanger 200 is convenient for a user to move by holding and applying force to the moving handle 233. In this embodiment, the movable handle 233 is provided with a protective cover to prevent the hand from being frayed by the movable handle 233. Specifically, the protective sheath is soft rubber sleeve, and soft rubber sleeve has certain elasticity, good toughness and good non-skid property, has increased the frictional force between hand and the removal handle 233 when protecting the hand to the non-skid property of removal handle 233 has been increased. Further, the protective cover is provided with anti-slip lines to further increase the friction between the hand and the moving handle 233, thereby further increasing the anti-slip performance of the moving handle 233. In one embodiment, the protective sleeve is a soft sponge sleeve. Thus, the T-bar 230 facilitates movement of the plating hanger 200.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A local electroplating device is characterized by comprising an electroplating bath, an electroplating hanger, an electroplating clamp, an anode connecting mechanism and a plurality of lifting mechanisms;

2. The local plating apparatus as claimed in claim 1, wherein said local plating apparatus comprises four said elevating mechanisms, and said four said elevating mechanisms are respectively disposed at four corners of said plating tank.

3. The localized plating apparatus of claim 1, wherein the drive block is integrally formed with the plating cell.

4. The local electroplating device according to claim 1, wherein the electroplating hanger is a U-shaped plate structure, the two ends of the electroplating hanger are respectively provided with a clamping block and a fixed block, the fixed block is provided with a V-shaped clamping groove, the clamping block is matched with the V-shaped clamping groove, and the clamping block is inserted into the V-shaped clamping groove and connected with the fixed block; the fixed block is detachably connected with an external fixing device.

5. The local electroplating device according to claim 1, wherein a T-shaped connecting rod is arranged on one side of the electroplating hanger away from the electroplating clamp, the T-shaped connecting rod comprises a cross rod and a vertical rod, the vertical rod is vertically connected with the middle area of the cross rod, and the vertical rod is connected with the electroplating hanger.

6. The local plating apparatus of claim 5, wherein both ends of the cross bar are provided with a moving handle.

7. The local plating apparatus as claimed in claim 6, wherein a protective cover is provided on the moving handle.

8. The local plating apparatus as claimed in claim 7, wherein said protective sheath is a soft rubber sheath.

9. The apparatus according to claim 7, wherein the protective sheath is a soft sponge sheath.

10. The local plating apparatus as claimed in claim 7, wherein the protective sheath is provided with anti-slip lines.