CN212501901U

CN212501901U - Be applied to device of carrying that moves in ceramic circuit board course of working

Info

Publication number: CN212501901U
Application number: CN202020557106.2U
Authority: CN
Inventors: 金徐胜; 李文武
Original assignee: Kunshan Fuyin Automation Equipment Co ltd
Current assignee: Kunshan Fuyin Automation Equipment Co ltd
Priority date: 2020-04-15
Filing date: 2020-04-15
Publication date: 2021-02-09
Anticipated expiration: 2030-04-15

Abstract

The utility model discloses a be applied to moving of ceramic circuit board course of working and carry device, keep off outside the protection, support the interior fender, prevent that static slope puts box and bubble bed course, the protection keeps off outward and is formed by three lateral walls and diapire concatenation, supports the interior fender and is formed by three lateral walls and diapire concatenation, supports in the fender locates the protection and keeps off outward in, supports in keep off double-phase to the lateral wall be the symmetry setting and be equipped with the support bar, the support bar is located along vertical direction evenly distributed and is supported the interior fender lateral wall, prevent that static slope puts on the support bar that box and bubble bed course are located respectively and are the symmetry setting. The utility model belongs to the technical field of circuit board processing, specifically a can prevent static, avoid puncturing electronic component at removal or quality control in-process, keep off outside the protection and keep off in with the support and play the effect of support and protection, avoid colliding with at the removal in-process, satisfy the load transfer device of being applied to in the ceramic circuit board course of working of large batch removal.

Description

Be applied to device of carrying that moves in ceramic circuit board course of working

Technical Field

The utility model belongs to the technical field of the circuit board processing, especially, relate to a be applied to moving of ceramic circuit board course of working and carry device.

Background

With the rapid popularization of electronic information industries such as computers, the internet, mobile communication, flat panel display, solar photovoltaic industry, energy-saving lighting industry and the like, electronic and electric products are continuously developed in the directions of miniaturization, flexibility, high integration and the like, and electronic packaging technologies closely related to the electronic and electric products enter the ultra-high speed development period. A Printed Circuit Board (PCB) is almost a necessary core component for every electronic product, and various aspects related to packaging technology are almost performed on or related to the PCB.

Ceramic materials have good high-frequency performance and electrical performance, and have performances which are not possessed by organic substrates, such as high thermal conductivity, excellent chemical stability and thermal stability, and the like, and are ideal packaging materials for new-generation large-scale integrated circuits and power electronic modules, so that ceramic circuit boards are widely concerned and rapidly developed. The ceramic circuit board is afraid of static electricity, electronic elements are easy to break down in the moving or quality inspection process, and the ceramic circuit board is afraid of collision in the moving process, so that the ceramic circuit board cannot meet the requirement of large-batch movement in the processing and transferring process.

Disclosure of Invention

To the above situation, for overcoming prior art's defect, the utility model provides a be applied to moving of ceramic circuit board course of working and carry device can prevent static, avoids puncturing electronic component at removal or quality control in-process, keeps off outside the protection and keeps off in supporting and play the effect of support and protection, avoids colliding with at the removal in-process, satisfies large batch removal.

The utility model adopts the technical scheme as follows: a transfer device applied to the processing process of a ceramic circuit board comprises an outer protective baffle, an inner supporting baffle, an anti-static inclined placing box and a bubble cushion layer, wherein the outer protective baffle is formed by splicing three side walls and a bottom wall, the inner supporting baffle is formed by splicing the three side walls and the bottom wall, the inner supporting baffle is arranged in the outer protective baffle, two opposite side walls of the inner supporting baffle are symmetrically provided with supporting bars, the supporting bars are uniformly distributed on the side walls of the inner supporting baffle along the vertical direction, the anti-static inclined placing box and the bubble cushion layer are respectively arranged on the symmetrically arranged supporting bars, the anti-static inclined placing box is arranged in a hollow cavity with an upper end opened, the bottom wall of the anti-static inclined placing box is provided with an inclined partition bar, the inclined partition bar is provided with an anti-static layer, the bubble cushion layer comprises a supporting frame and a protective bubble cushion, and the supporting frame is arranged on, the protection bubble pad is arranged on the support frame.

Furthermore, the middle part of the support frame is provided with a partition strip, and the partition strip is arranged on the protection bubble pad.

Further, keep off in supporting for PVC panel supports and keep off in, it has built-in bubble pad to keep off inside packing in supporting, keep off outward for PCB panel protection keeps off outward for the protection.

Furthermore, the non-opposite side walls of the support inner barrier are provided with limiting fixed sliding columns, and the non-opposite side walls of the protection outer barrier are provided with limiting fixed grooves matched with the limiting fixed sliding columns.

Furthermore, the outer side of the upper end of the three side walls of the outer guard is provided with a coaming, the coaming is a wood board coaming, and the opposite side walls of the outer guard are symmetrically provided with outer handles.

Furthermore, the bubble cushion layer is arranged above the anti-static inclined placing box, and the number of the anti-static inclined placing boxes is two.

After the structure is adopted, the utility model discloses beneficial effect as follows: the utility model relates to a transfer device applied to the processing process of a ceramic circuit board, the inclined parting bead of an anti-static inclined placing box is provided with an anti-static layer, which can prevent static electricity, avoid the breakdown of electronic elements in the moving or quality inspection process, and the inclined parting bead is convenient to place and take, is stable to place and is easier to contact with the anti-static layer; keep off outside the protection and support the effect that the interior fender played support and protection, the bubble bed course is equipped with protection bubble pad, places the circuit board on the bubble bed course and can avoid colliding with at the removal in-process, satisfies large batch removal.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a schematic view of the overall structure of a transfer device applied to the ceramic circuit board processing process of the present invention;

fig. 2 is a schematic view of a protective outer baffle structure of a transfer device applied to a ceramic circuit board processing process of the present invention;

fig. 3 is a schematic view of a supporting inner rail structure of a transfer device applied to a ceramic circuit board processing process according to the present invention;

fig. 4 is a schematic structural view of an anti-static inclined placing box of a transfer device applied to a ceramic circuit board processing process of the present invention;

fig. 5 is a schematic view of a supporting frame structure of a transfer device applied in the process of processing a ceramic circuit board.

In the drawings: 1. the protection keeps off outward, 2, supports interior fender, 3, prevent that static slope puts the box, 4, bubble bed course, 5, support bar, 6, slope parting bead, 7, prevent the static layer, 8, support frame, 9, protection bubble pad, 10, partition strip, 11, outer handle, 12, spacing fixed sliding column, 13, spacing fixed recess, 14, bounding wall.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

As shown in fig. 1-5, a transfer device applied to the ceramic circuit board processing process comprises an outer protective shield 1, an inner support shield 2, an anti-static inclined placement box 3 and a bubble cushion 4, wherein the outer protective shield 1 is formed by splicing three side walls and a bottom wall, the inner support shield 2 is arranged in the outer protective shield 1, two opposite side walls of the inner support shield 2 are symmetrically provided with support bars 5, the support bars 5 are uniformly distributed on the side walls of the inner support shield 2 along the vertical direction, the anti-static inclined placement box 3 and the bubble cushion 4 are respectively arranged on the support bars 5 which are symmetrically arranged, the anti-static inclined placement box 3 is a hollow cavity with an open upper end, the bottom wall of the anti-static inclined placement box 3 is provided with an inclined spacer 6, the inclined spacer 6 is provided with an anti-static layer 7, the bubble cushion layer 4 comprises a support frame 8 and a protection bubble cushion 9, the support frame 8 is arranged on the support bar 5, and the protection bubble cushion 9 is arranged on the support frame 8.

Wherein, the middle part of the support frame 8 is provided with a partition strip 10, and the partition strip 10 is arranged on the protective bubble pad 9; the supporting inner baffle 2 is a PVC plate supporting inner baffle, an internal bubble pad is filled in the supporting inner baffle 2, and the protecting outer baffle 1 is a PCB plate protecting outer baffle; the non-opposite side walls of the supporting inner baffle 2 are provided with limiting fixed sliding columns 12, and the non-opposite side walls of the protecting outer baffle 1 are provided with limiting fixed grooves 13 which are matched with the limiting fixed sliding columns 12 in the direction; the outer side of the upper ends of the three side walls of the protective outer baffle 1 is provided with a coaming 14, the coaming 14 is a wood plate coaming, and the opposite side walls of the protective outer baffle 1 are symmetrically provided with outer handles 11; the bubble cushion layer 4 is arranged above the anti-static inclined placing box 3, and the anti-static inclined placing box 3 is provided with two.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.

Claims

1. The utility model provides a move and carry device for in ceramic circuit board course of working which characterized in that: keep off, prevent that static slope puts box and bubble bed course in keeping off, supporting including the protection outward, the protection keeps off by three lateral walls and diapire concatenation formation outward, keep off by three lateral walls and diapire concatenation formation in supporting, keep off in supporting and locate in the protection keeps off outward, it is the symmetry setting to keep off double-phase to the lateral wall in supporting and is equipped with the support bar, the support bar is located along vertical direction evenly distributed and is supported the interior lateral wall that keeps off, prevent static slope and put box and bubble bed course and locate respectively on the support bar that is the symmetry setting, prevent that static slope puts the box and be upper end open-ended cavity setting, prevent static slope and put the box bottom wall and be equipped with the slope parting bead, the slope parting bead is equipped with antistatic backing, the bubble bed course includes support frame and protective bubble pad, the support frame is located on the support frame, protective bubble pad is located on the support.

2. The transfer device applied to the ceramic circuit board processing process according to claim 1, wherein: the middle part of the support frame is provided with a partition strip, and the partition strip is arranged on the protection bubble pad.

3. The transfer device applied to the ceramic circuit board processing process according to claim 1, wherein: the support inner baffle is a PVC plate support inner baffle, the support inner baffle is internally filled with a built-in bubble pad, and the protection outer baffle is a PCB plate protection outer baffle.

4. The transfer device applied to the ceramic circuit board processing process according to claim 1, wherein: the supporting inner baffle non-opposite side wall is provided with a limiting fixed sliding column, and the protecting outer baffle non-opposite side wall is provided with a limiting fixed groove matched with the limiting fixed sliding column.

5. The transfer device applied to the ceramic circuit board processing process according to claim 1, wherein: the outer side of the upper end of the three side walls of the protective outer baffle is provided with a coaming, the coaming is a wood board coaming, and the opposite side walls of the protective outer baffle are symmetrically provided with outer handles.

6. The transfer device applied to the ceramic circuit board processing process according to claim 1, wherein: the bubble bed course is located and is prevented static slope and put box top, it is equipped with two to prevent static slope and put the box.