CN212486578U - Thin fingerprint camera - Google Patents
Thin fingerprint camera Download PDFInfo
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- CN212486578U CN212486578U CN202020792934.4U CN202020792934U CN212486578U CN 212486578 U CN212486578 U CN 212486578U CN 202020792934 U CN202020792934 U CN 202020792934U CN 212486578 U CN212486578 U CN 212486578U
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Abstract
A thin fingerprint camera comprises a circuit board, a fingerprint acquisition chip, an IR sheet, a lens seat and a lens; the lens base is arranged on the circuit board, the lens is arranged on the lens base, a chip bonding layer is arranged on the circuit board, and the chip bonding layer is positioned in the lens base cavity; the fingerprint acquisition chip is fixed on the chip bonding layer; the fingerprint acquisition chip is provided with an IR bonding layer, the IR bonding layer is of a rectangular frame structure, and the bottom of the IR sheet is attached to the IR bonding layer. The IR sheet is directly attached to the fingerprint acquisition chip, so that the height of the product is effectively reduced. The research and development cost and the die sinking cost of the bracket are saved, and the production cost is reduced.
Description
Technical Field
The utility model relates to a cell-phone camera module field, concretely relates to slim fingerprint camera.
Background
Some mobile phones on the market at present have carried fingerprint camera under the screen, and fingerprint camera all need utilize the support to support and carry an IR piece above fingerprint collection chip, and the support supports IR piece mode is the conventional mode of carrying in camera field. Can't accomplish thinner more saving space, I department adopts a novel IR piece assembled mode, with the direct laminating of IR piece on fingerprint collection chip surface, the mode of cancellation support equipment IR piece, the thickness of the whole fingerprint camera module of effectual reduction to the realization is saved cell-phone assembly space.
The development and development of the bracket have the die sinking cost of at least 5-20 ten thousand yuan, and the production cost is high, so that in order to reduce the cost, a low-cost fingerprint camera needs to be provided, and meanwhile, the difficulty in the assembly process needs to be solved corresponding to the change of the structure.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to prior art's not enough, provide a slim fingerprint camera, a slim fingerprint camera's concrete technical scheme as follows:
the utility model provides a thin fingerprint camera which characterized in that: comprises a circuit board (1), a fingerprint acquisition chip (2), an IR sheet (3), a lens seat (4) and a lens (5);
the lens base (4) is installed on the circuit board (1), the lens (5) is installed on the lens base (4), a chip bonding layer (6) is arranged on the circuit board (1), and the chip bonding layer (6) is located in a cavity of the lens base (4);
the fingerprint acquisition chip (2) is fixed on the bonding layer of the fingerprint acquisition chip (2);
an IR bonding layer (7) is arranged on the fingerprint acquisition chip (2), the IR bonding layer is of a rectangular frame structure, and the bottom of the IR sheet (3) is attached to the IR bonding layer (7).
Further: a fracture (8) is formed in the IR bonding layer. A fracture is reserved on the rectangular structure and is used for reserving an opening for air escape, so that heat can be timely dissipated, the influence caused by glue expansion is avoided, and a path for discharging heat of a product is provided.
Further: a connector (9) is mounted on the circuit board (1).
Further: the upper surface of the microscope base (4) is provided with dustproof foam (10).
Further: the inner edge of the IR bonding layer and the outer edge of the photosensitive area of the fingerprint acquisition chip (2) are 0.2mm, and the height of the IR bonding layer is 0.03 mm. When down pressfitting when preventing the IR piece equipment, glue overflows to the photosensitive area, set up the safe distance of 0.2mm distance, press glue when guaranteeing the IR piece equipment, cause glue to overflow to the photosensitive area. IR bonds the high setting of 0.03mm and reserves and flees the gas port, and the prevention product toasts glue after the equipment IR piece, causes the unable discharge of inside air, and the unable discharge of inside air can cause the product to generate heat and lead to appearing the malfunction problem at the unable discharge of product during operation.
Further: the chip bonding layer is of a snowflake structure. When placing the fingerprint collection chip at the chip installation zone time, need guarantee that fingerprint collection chip equipment roughness is at 25um, the drawing glue mode that the tradition adopted, its roughness of unable effectual control keeps below 25um, leads to the fingerprint collection chip to appear the condition of high while low on one side. When the IR sheet is assembled, the IR sheet is pressed on the surface of the fingerprint acquisition chip on one side, so that the fingerprint acquisition chip or the IR sheet is damaged, or the assembly of the IR sheet is inclined, and the excessive glue overflow causes the problem of large-area glue overflow. Adopt snowflake form to draw gluey mode, guarantee that the glue processing procedure of fingerprint collection chip bottom is even, can effectively control the roughness of fingerprint collection chip, cause collision or slope problem when the effectual IR piece equipment of having controlled.
The utility model has the advantages that: first, with the direct laminating of IR piece on the fingerprint collection chip, the effectual product height that has reduced.
Secondly, the research and development cost and the die sinking cost of the bracket are saved, and the production cost is reduced.
Drawings
FIG. 1 is an exploded view of the present invention;
fig. 2 is a cross-sectional view of the present invention;
the reference numbers in the figure are illustrated as a circuit board 1, a fingerprint acquisition chip 2, an IR sheet 3, a lens seat 4, a lens 5, a chip bonding layer 6, an IR bonding layer 7, a fracture 8, a connector 9 and dustproof foam 10.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 and 2:
the specific technical scheme of the thin fingerprint camera is as follows:
a thin fingerprint camera comprises a circuit board 1, a fingerprint acquisition chip 2, an IR (infrared) sheet 3, a lens seat 4 and a lens 5;
a connector 9 is mounted on the circuit board 1. The lens seat 4 is installed on the circuit board 1, the lens 5 is installed on the lens seat 4, and the upper surface of the lens seat 4 is provided with dustproof foam 10.
The circuit board 1 is provided with a chip bonding layer 6 which is of a snowflake structure.
The chip bonding layer 6 is positioned in the cavity of the lens base 4;
the fingerprint acquisition chip 2 is fixed on the chip bonding layer 6;
the fingerprint acquisition chip 2 is provided with an IR bonding layer 7, and the IR bonding layer is provided with a fracture 8. The IR bonding layer is of a rectangular frame structure, and the bottom of the IR sheet 3 is attached to the IR bonding layer 7.
The inner edge of the IR bonding layer and the outer edge of the photosensitive area of the fingerprint acquisition chip 2 are 0.2mm, and the height of the IR bonding layer is 0.03 mm. The inner edge of the IR bonding layer and the outer edge of the photosensitive area of the fingerprint acquisition chip 2 are 0.2mm, so that glue flowing is prevented from overflowing into the photosensitive area of the fingerprint acquisition chip 2.
The thin fingerprint camera adopts the following assembling method:
a thin fingerprint camera assembling method comprises the following steps:
s1: a chip mounting area and a lens glue painting area are respectively arranged on the circuit board, a glue painting manipulator paints and glues the chip mounting area to form a chip bonding layer, and the bottom of the fingerprint acquisition chip is placed on the bonding layer;
s2: the method comprises the following steps that a clamp clamps and fixes a circuit board, a non-photosensitive area on the surface of a fingerprint acquisition chip is a glue drawing area, a glue drawing path is arranged in a control system, and a glue drawing end of a glue drawing manipulator draws glue in the glue drawing area on the surface of the acquisition chip according to the glue drawing path to form an IR bonding layer;
s3: the upper surface of the IR sheet is sucked by the air suction manipulator, the air suction manipulator drives the IR sheet to move above the fingerprint acquisition chip, and the lower surface of the IR sheet is aligned to the IR bonding layer;
s4: placing an IR sheet on the IR bonding layer by using a suction manipulator;
s5: the glue painting manipulator forms a lens glue painting area bonding layer after painting glue on a lens glue painting area on the circuit board, and the integrated lens is installed on the lens glue painting bonding layer;
s6: and the upper surface of the integrated lens is provided with dustproof foam.
The glue painting manipulator adopts a snowflake glue painting mode in a chip mounting area. When placing the fingerprint collection chip at the chip installation zone time, need guarantee that fingerprint collection chip equipment roughness is at 25um, the drawing glue mode that the tradition adopted, its roughness of unable effectual control keeps below 25um, leads to the fingerprint collection chip to appear the condition of high while low on one side. When the IR sheet is assembled, the IR sheet is pressed on the surface of the fingerprint acquisition chip on one side, so that the fingerprint acquisition chip or the IR sheet is damaged, or the assembly of the IR sheet is inclined, and the excessive glue overflow causes the problem of large-area glue overflow. Adopt snowflake form to draw gluey mode, guarantee that the glue processing procedure of fingerprint collection chip bottom is even, can effectively control the roughness of fingerprint collection chip, cause collision or slope problem when the effectual IR piece equipment of having controlled.
The manipulator is in a rectangular structure in a glue drawing path of the fingerprint acquisition chip, and a fracture is reserved on the rectangular structure. A fracture is reserved on the rectangular structure and is used for reserving an opening for air escape, so that heat can be timely dissipated, the influence caused by glue expansion is avoided, and a path for discharging heat of a product is provided.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a thin fingerprint camera which characterized in that: comprises a circuit board (1), a fingerprint acquisition chip (2), an IR sheet (3), a lens seat (4) and a lens (5);
the lens base (4) is installed on the circuit board (1), the lens (5) is installed on the lens base (4), a chip bonding layer (6) is arranged on the circuit board (1), and the chip bonding layer (6) is located in a cavity of the lens base (4);
the fingerprint acquisition chip (2) is fixed on the chip bonding layer (6);
an IR bonding layer (7) is arranged on the fingerprint acquisition chip (2), the IR bonding layer is of a rectangular frame structure, and the bottom of the IR sheet (3) is attached to the IR bonding layer (7).
2. The thin fingerprint camera of claim 1, wherein: a fracture (8) is formed in the IR bonding layer.
3. The thin fingerprint camera of claim 1, wherein: a connector (9) is mounted on the circuit board (1).
4. The thin fingerprint camera of claim 1, wherein: the upper surface of the microscope base (4) is provided with dustproof foam (10).
5. The thin fingerprint camera of claim 1, wherein: the inner edge of the IR bonding layer and the outer edge of the photosensitive area of the fingerprint acquisition chip (2) are 0.2mm, and the height of the IR bonding layer is 0.03 mm.
6. The thin fingerprint camera of claim 1, wherein: the chip bonding layer is of a snowflake structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020792934.4U CN212486578U (en) | 2020-05-13 | 2020-05-13 | Thin fingerprint camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020792934.4U CN212486578U (en) | 2020-05-13 | 2020-05-13 | Thin fingerprint camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212486578U true CN212486578U (en) | 2021-02-05 |
Family
ID=74460526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020792934.4U Active CN212486578U (en) | 2020-05-13 | 2020-05-13 | Thin fingerprint camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212486578U (en) |
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2020
- 2020-05-13 CN CN202020792934.4U patent/CN212486578U/en active Active
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