CN212484114U - Injection mold control circuit - Google Patents
Injection mold control circuit Download PDFInfo
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- CN212484114U CN212484114U CN202021112125.0U CN202021112125U CN212484114U CN 212484114 U CN212484114 U CN 212484114U CN 202021112125 U CN202021112125 U CN 202021112125U CN 212484114 U CN212484114 U CN 212484114U
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Abstract
The utility model provides an injection mold control circuit, the utility model discloses a host system, heating control module, cooling control module, mould temperature detection module and IO module, wherein, host system includes main control CPU, main control CPU respectively with heating control module, cooling control module, mould temperature detection module and IO module link to each other, heating control module is used for controlling heating pipe to the mould heating, cooling control module is used for controlling the cooling medium and cools down to the mould, mould temperature detection module is used for detecting the mould temperature, the IO module is used for connecing main control CPU and host computer respectively. The utility model has the advantages that: the CPU is adopted for control, so that the temperature of the module can be accurately controlled; has high compatibility and is compatible with all brands of injection molding machines.
Description
Technical Field
The utility model relates to a control circuit especially relates to an injection mold control circuit.
Background
The innovative multiple injection molding solutions are urgently needed in the fields of automobiles, aviation, medical treatment and electronic and electrical appliances with high requirements on the cost pressure and the product specification of the manufacturing industry in China at present. With the outburst of the new energy market of automobiles, lightweight automobiles with lower oil consumption and lighter automobile parts and ornaments are searched, and the production of the precision parts does not leave a new solution. Because the intelligent system solves the performance advantage and provides wide development space for the field due to 'mutation' in the field of plastic processing.
The existing injection mold needs to adopt a control system to control the temperature of a mold cavity, the existing intelligent control system is controlled by a Programmable Logic Controller (PLC), and the quality problem of an injection molding product is difficult to solve systematically due to the fact that the accurate control on the temperature of the mold cavity of the mold cannot be realized, and the level of the Chinese manufacturing industry is difficult to further improve.
SUMMERY OF THE UTILITY MODEL
For solving the problem in the prior art, the utility model provides an injection mold control circuit.
The utility model discloses a host system, heating control module, cooling control module, mould temperature detection module and IO module, wherein, host system includes main control CPU, main control CPU respectively with heating control module, cooling control module, mould temperature detection module and IO module link to each other, heating control module is used for controlling the heating pipe to the mould heating, cooling control module is used for controlling the cooling medium and cools down the mould, mould temperature detection module is used for detecting the mould temperature, the IO module is used for connecing main control CPU and host computer respectively.
The utility model discloses do further improvement, the heating control module includes the heating drive unit and the heating output unit that link to each other with master control CPU respectively, the quantity of heating output unit is more than one, the heating drive unit is equipped with and heats the unanimous drive interface of output unit output quantity.
The utility model discloses do further improvement, still include the switching module, the switching module sets up between host system and the heating output, host system includes interface J20, the switching module includes the interface J19 that meets with interface J20, still includes the output interface more than 1 that links to each other with the heating output unit, the input of heating output unit passes through the output interface and links to each other with host system.
The utility model is further improved, the heating output unit comprises an interface J1 connected with the main control module and two paths of same output units respectively connected with an interface J1, wherein one path of output unit comprises a relay RLY1, a current detection early current coil T101, a silicon controlled rectifier U101 for adjusting the current, a switch tube Q101 and a switch tube Q102, wherein,
The utility model discloses make further improvement, cooling control module includes flow control unit and the unit of blowing, wherein, host system includes the flow controller interface unit that links to each other with flow control unit, and the drive interface unit that blows that links to each other with the unit of blowing, cooling control module still includes the booster pump drive unit that the drive made water get into cooling pipe's booster pump, main control CPU links to each other with flow controller interface unit and the drive interface unit that blows respectively, booster pump drive unit links to each other with the IO module.
The utility model discloses make further improvement, cooling control module is still including the check valve drive unit of check valve on the control cooling tube, the check valve drive unit links to each other with the IO module.
The utility model discloses do further improvement, mould temperature detection module is including detecting chip U1, amplifier U7B, opto-coupler U8, wherein, it links to each other with the first output of early flow circle T3 respectively to detect chip U1 pin 6, 7, it links to each other with the second output of early flow circle T3 respectively to detect chip U1 pin 8, 11, the first input termination temperature sensor's of early flow circle T3 Temp _ SEN + terminal, the second input termination temperature sensor's of early flow circle T3 Temp _ SEN-terminal, detect chip's pin 12, 13 and connect main control CPU's pin 1, 2 respectively through steady voltage chip U4 and link to each other, detect chip's pin 14, 1 and connect main control CPU's pin 3, 4 respectively through steady voltage chip U5,
the positive direction input end of the comparator U7B is respectively connected with one end of a resistor R12 and one end of a resistor R13, the other end of the resistor R13 is grounded, the other end of the resistor R12 is connected with a reference voltage output pin 9 of a detection chip U1 and is connected with a 5V power supply through a resistor R11, an output pin of the comparator U7B is connected with a pin 2 of an optical coupler U8 through an electron R19, a pin 1 of the optical coupler U8 is connected with the 5V power supply, a pin 3 of the optical coupler U8 is grounded, a pin 4 is connected with a pin 5 of a main control CPU, and is connected with the 3.3V power supply through a resistor R17.
The utility model discloses make further improvement, the IO module includes IO board main control CPU unit, the communication interface who links to each other with host system and computer respectively, the signal input unit and the signal output unit that link to each other with the injection molding machine, wherein, IO board main control CPU unit links to each other with communication interface, signal input unit, signal output unit respectively.
The utility model discloses do further improvement, the IO module still includes the AC protection unit that staggers the looks, the AC protection unit that staggers the looks includes resistance R304, resistance R303, polarity electric capacity C304, polarity electric capacity C305, thermistor RT2, wherein, IO board master control CPU's pin 10 links to each other with resistance R303's one end and polarity electric capacity C305's positive pole respectively, resistance R303's the other end links to each other with resistance R304's one end and thermistor RT 2's negative pole respectively, and thermistor RT 2's positive pole links to each other with 3.3V power and polarity electric capacity C304's positive pole respectively, polarity electric capacity C304's negative pole, polarity electric capacity C305's negative pole and resistance R304's the other end ground connection respectively.
The utility model discloses do further improvement, the IO module is still including the temperature detecting element who is used for in the cooling tube, the temperature detecting element includes resistance R312, resistance R311, polarity electric capacity C308, polarity electric capacity C309, thermistor RT1, wherein, IO board main control CPU's pin 11 links to each other with resistance R311's one end and polarity electric capacity C309's positive pole respectively, resistance R311's the other end links to each other with resistance R312's one end and thermistor RT 1's negative pole respectively, and thermistor RT 1's positive pole links to each other with 3.3V power and polarity electric capacity C308's positive pole respectively, polarity electric capacity C308's negative pole, polarity electric capacity C309's negative pole and resistance R312's the other end ground connection respectively.
Compared with the prior art, the beneficial effects of the utility model are that: the CPU is adopted to control heating and cooling, and energy can be quantitatively output according to the temperature of the die cavity, so that the temperature of the module can be accurately controlled; has high compatibility and is compatible with all brands of injection molding machines.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic circuit diagram of a main control board, which includes a schematic circuit diagram of a main control module, a mold temperature detection module, and a heating driving unit;
fig. 3-7 are enlarged partial views of fig. 2, wherein,
FIG. 3 is a primary circuit diagram of a master CPU circuit;
FIG. 4 is a schematic circuit diagram of an interface unit of the flow controller;
FIG. 5 is a schematic circuit diagram of a temperature sensing module;
FIG. 6 is a schematic circuit diagram of a heating driving unit;
FIG. 7 is a schematic circuit diagram of an interface unit connected to the heating output unit;
FIG. 8 is a schematic circuit diagram of a heating output unit;
FIG. 9 is a schematic circuit diagram of a patching module;
FIG. 10 is a schematic diagram of a master control CPU circuit of the IO board;
FIG. 11 is a schematic diagram of a communication interface circuit of the IO module;
FIG. 12 is a schematic circuit diagram of a signal input unit and a signal output unit;
FIG. 13 is a schematic circuit diagram of an alarm signal driving unit;
FIG. 14 is a schematic circuit diagram of a booster pump drive unit;
FIG. 15 is a schematic circuit diagram of a check valve driving unit;
fig. 16 is a schematic circuit diagram of the AC phase-dislocation protection unit and the water temperature detection unit.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1, the utility model discloses a host system, heating control module, cooling control module, mould temperature detection module and IO module, wherein, host system includes main control CPU, main control CPU respectively with heating control module, cooling control module, mould temperature detection module and IO module link to each other, heating control module is used for controlling the heating pipe to the mould heating, cooling control module is used for controlling the cooling medium and cools down the mould, mould temperature detection module is used for detecting the mould temperature, the IO module is used for connecing main control CPU and host computer respectively.
The utility model discloses a full automatic control of master control CPU can detect the mould temperature constantly to according to mould temperature control ration output energy, heat or cooling control, the difference in temperature that can reach chamber and core is less than 2 ℃, thereby improves the outward appearance quality of product greatly. The utility model discloses with the multimachine unit collaborative operation such as injection molding machine, cooling unit, heating unit. The mold temperature and the pressure of the mold in the injection molding process can be monitored constantly through the embedded sensor connected with the mold, and data are fed back to the main control CPU for intelligent control.
As shown in fig. 2, 6 and 8, the heating control module includes a heating driving unit and a heating output unit respectively connected to the main control CPU, the number of the heating output units is more than one, and the heating driving unit is provided with driving interfaces whose number is consistent with that of the output ends of the heating output units. The heating output units of the embodiment are 5 groups, each group controls the two heating modules to heat, of course, other numbers of heating output units can be arranged according to requirements, and the switching module is additionally arranged between the main control board and the heating output units because more heating output units are arranged.
As shown in fig. 2-3 and 7-9, the main control module is connected to the interface J19 of the adaptor module through an interface J20, and the interface J19 is respectively connected to 5 interfaces J14-J18 connected to the heating output modules, wherein the interface J14 is connected to the interface J1 of the first group of heating output modules.
The first group of heating output units of the embodiment comprises a interface J1 connected with the main control module and two identical output units respectively connected with an interface J1, wherein one output unit comprises a relay RLY1, a current detection early coil T101, a thyristor U101 for adjusting the current, a switch tube Q101 and a switch tube Q102,
As shown in fig. 6, the heating driving unit of this embodiment includes 10 relay interfaces and 10 thyristor driving interfaces, which respectively control the switches and the output energy of the 10 output units.
As shown in fig. 2, 4, 14 and 15, the cooling control module of this example includes a flow control unit and an air blowing unit, wherein the main control module includes a flow controller interface unit connected to the flow control unit and an air blowing driving interface unit connected to the air blowing unit, the cooling control module further includes a booster pump driving unit for driving a booster pump for making water enter a cooling pipe, the main control CPU is connected to the flow controller interface unit and the air blowing driving interface unit, and the booster pump driving unit is connected to the IO module. Of course, the booster pump driving unit of the embodiment can also be directly controlled by the main control CPU, but the air channel and the circuit of the embodiment are directly controlled by the main control CPU, and the water channel is controlled by the IO board main control CPU unit, so that the water channel and the circuit are separately controlled, the safety is higher, the output control of the water pump is increased, and the water flow can be well controlled. In order to prevent water from flowing backwards, the cooling control module of the embodiment further comprises a one-way valve driving unit for controlling the one-way valve on the cooling pipe, and the one-way valve driving unit is connected with the IO module.
As shown in fig. 2 and 5, the mold temperature detection module of this embodiment includes a detection chip U1, an amplifier U7B, and an optical coupler U8, wherein pins 6 and 7 of the detection chip U1 are respectively connected to a first output terminal of an early current coil T3, pins 8 and 11 of the detection chip U1 are respectively connected to a second output terminal of the early current coil T3, a first input terminal of the early current coil T3 is connected to a Temp _ SEN + terminal of a temperature sensor, a second input terminal of the early current coil T3 is connected to a Temp _ SEN-terminal of the temperature sensor, pins 12 and 13 of the detection chip are respectively connected to pins 1 and 2 of a main control CPU through a voltage stabilization chip U4, pins 14 and 1 of the detection chip are respectively connected to pins 3 and 4 of the main control CPU through a voltage stabilization chip U5,
the positive direction input end of the comparator U7B is respectively connected with one end of a resistor R12 and one end of a resistor R13, the other end of the resistor R13 is grounded, the other end of the resistor R12 is connected with a reference voltage output pin 9 of a detection chip U1 and is connected with a 5V power supply through a resistor R11, an output pin of the comparator U7B is connected with a pin 2 of an optical coupler U8 through an electron R19, a pin 1 of the optical coupler U8 is connected with the 5V power supply, a pin 3 of the optical coupler U8 is grounded, a pin 4 is connected with a pin 5 of a main control CPU, and is connected with the 3.3V power supply through a resistor R17. The temperature sensor can acquire the temperatures of the die cavity and the die core in real time, so that the die temperature can be adjusted and controlled in real time.
As shown in fig. 10 to 12, the IO module includes an IO board main control CPU unit, a communication interface connected to the main control module and the computer, and a signal input unit and a signal output unit connected to the injection molding machine, where the IO board main control CPU unit is connected to the communication interface, the signal input unit, and the signal output unit. The utility model discloses have high compatibility, can be compatible with all brand injection molding machines.
As shown in fig. 13, the IO module of this embodiment further includes an alarm signal driving unit, so as to activate a fault alarm indicator lamp or other alarm device to alarm when a device is in fault or abnormal condition.
As shown in fig. 16, the IO module of this embodiment further includes an AC error phase protection unit, where the AC error phase protection unit includes a resistor R304, a resistor R303, a polar capacitor C304, a polar capacitor C305, and a thermistor RT2, where a pin 10 of the IO board main control CPU is connected to one end of the resistor R303 and an anode of the polar capacitor C305, respectively, the other end of the resistor R303 is connected to one end of the resistor R304 and a cathode of the thermistor RT2, an anode of the thermistor RT2 is connected to a 3.3V power supply and an anode of the polar capacitor C304, and a cathode of the polar capacitor C304, a cathode of the polar capacitor C305, and the other end of the resistor R304 are grounded, respectively. The phase loss detection and protection of the three-phase power are realized through real-time detection of the thermistor RT2 in the AC phase-dislocation protection unit.
The IO module of this example still includes the water temperature detecting element that is used for in the cooling tube, water temperature detecting element includes resistance R312, resistance R311, polarity electric capacity C308, polarity electric capacity C309, thermistor RT1, wherein, IO board master control CPU's pin 11 links to each other with resistance R311's one end and polarity electric capacity C309's anodal respectively, resistance R311's the other end links to each other with resistance R312's one end and thermistor RT 1's negative pole respectively, and thermistor RT 1's positive pole links to each other with 3.3V power and polarity electric capacity C308's positive pole respectively, polarity electric capacity C308's negative pole, polarity electric capacity C309's negative pole and resistance R312's the other end ground connection respectively. The cooling degree of the temperature of the mold core and the temperature of the mold cavity can be well evaluated by detecting the water temperature of the cooling water.
The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the present invention are within the protection scope of the present invention.
Claims (10)
1. The utility model provides an injection mold control circuit which characterized in that: the heating control module is used for controlling a heating pipe to heat a die, the cooling control module is used for controlling a cooling medium to cool the die, the die temperature detection module is used for detecting the temperature of the die, and the IO module is used for respectively connecting the master control CPU and an upper computer.
2. The injection mold control circuit of claim 1, wherein: the heating control module comprises a heating driving unit and a heating output unit which are respectively connected with the main control CPU, the number of the heating output units is more than one, and the heating driving unit is provided with driving interfaces which are consistent with the number of the output ends of the heating output units.
3. The injection mold control circuit of claim 2, wherein: still include the switching module, the switching module sets up between host system and the heating output, host system includes interface J20, the switching module includes the interface J19 that meets with interface J20, still includes the output interface more than 1 that links to each other with the heating output unit, the input of heating output unit passes through output interface and links to each other with host system.
4. The injection mold control circuit of claim 3, wherein: the heating output unit comprises a interface J1 connected with the main control module and two identical output units respectively connected with an interface J1, wherein one output unit comprises a relay RLY1, a current detection early current coil T101, a thyristor U101 for adjusting the current, a switch tube Q101 and a switch tube Q102,
pin 1 of the relay RLY1 is respectively connected with pins 8, 40 and 72 of an interface J1, pin 2 of the relay RLY1 outputs a set voltage and is connected with the cathode of a diode D103, pin 1 is respectively connected with the anode of the diode and the drain of a switch tube Q102, the source of the switch tube Q102 is grounded, the grid is connected with the relay interface of a heating driving unit, and pin 3 of the relay RLY1 is respectively connected with pins 1 and 3 of a current detection early current coil T101 and pin 4 of a thyristor U101;
pin 2 of the current detection early coil T101 is connected with pin 35 of the interface J1, pin 4 of the current detection early coil T101 is connected with pin 3 of the interface J1,
pin 6 of silicon controlled rectifier U101 links to each other with the live wire terminal L of interface J1, pin 1 of silicon controlled rectifier U101 passes through resistance connection 24V power, pin 2 of silicon controlled rectifier U101 links to each other with the drain electrode of switch tube Q101, and the source ground of switch tube Q101, the grid links to each other with the silicon controlled rectifier drive interface of heating drive unit.
5. An injection mold control circuit as claimed in any one of claims 1-4, wherein: the cooling control module comprises a flow control unit and a blowing unit, wherein the main control module comprises a flow controller interface unit connected with the flow control unit, a blowing driving interface unit connected with the blowing unit, the cooling control module further comprises a booster pump driving unit driving water to enter a booster pump of the cooling pipeline, the main control CPU is respectively connected with the flow controller interface unit and the blowing driving interface unit, and the booster pump driving unit is connected with the IO module.
6. The injection mold control circuit of claim 5, wherein: the cooling control module further comprises a one-way valve driving unit for controlling the one-way valve on the cooling pipe, and the one-way valve driving unit is connected with the IO module.
7. An injection mold control circuit as claimed in any one of claims 1-4, wherein: the die temperature detection module comprises a detection chip U1, an amplifier U7B and an optical coupler U8, wherein pins 6 and 7 of the detection chip U1 are respectively connected with a first output end of an early current coil T3, pins 8 and 11 of the detection chip U1 are respectively connected with a second output end of the early current coil T3, a first input end of the early current coil T3 is connected with a Temp _ SEN + terminal of a temperature sensor, a second input end of the early current coil T3 is connected with a Temp _ SEN-terminal of the temperature sensor, pins 12 and 13 of the detection chip are respectively connected with pins 1 and 2 of a main control CPU through a voltage stabilization chip U4, pins 14 and 1 of the detection chip are respectively connected with pins 3 and 4 of the main control CPU through a voltage stabilization chip U5,
the positive direction input end of the amplifier U7B is respectively connected with one end of a resistor R12 and one end of a resistor R13, the other end of the resistor R13 is grounded, the other end of the resistor R12 is connected with a reference voltage output pin 9 of a detection chip U1 and is connected with a 5V power supply through a resistor R11, an output pin of the amplifier U7B is connected with a pin 2 of an optical coupler U8 through an electron R19, a pin 1 of the optical coupler U8 is connected with the 5V power supply, a pin 3 of the optical coupler U8 is grounded, a pin 4 is connected with a pin 5 of a main control CPU, and is connected with the 3.3V power supply through a resistor R17.
8. An injection mold control circuit as claimed in any one of claims 1-4, wherein: the IO module comprises an IO board main control CPU unit, a communication interface, a signal input unit and a signal output unit, wherein the communication interface is respectively connected with the main control module and a computer, and the signal input unit and the signal output unit are connected with the injection molding machine, and the IO board main control CPU unit is respectively connected with the communication interface, the signal input unit and the signal output unit.
9. The injection mold control circuit of claim 8, wherein: the IO module still includes the AC protection unit that staggers the phase, the AC protection unit that staggers the phase includes resistance R304, resistance R303, polarity electric capacity C304, polarity electric capacity C305, thermistor RT2, wherein, IO board master control CPU's pin 10 links to each other with resistance R303's one end and polarity electric capacity C305's positive pole respectively, resistance R303's the other end links to each other with resistance R304's one end and thermistor RT 2's negative pole respectively, and thermistor RT 2's positive pole links to each other with 3.3V power and polarity electric capacity C304's positive pole respectively, polarity electric capacity C304's negative pole, polarity electric capacity C305's negative pole and resistance R304's the other end ground connection respectively.
10. The injection mold control circuit of claim 8, wherein: the IO module is still including the water temperature detecting element who is used for in the cooling tube, water temperature detecting element includes resistance R312, resistance R311, polarity electric capacity C308, polarity electric capacity C309, thermistor RT1, wherein, IO board main control CPU's pin 11 links to each other with resistance R311's one end and polarity electric capacity C309's positive pole respectively, resistance R311's the other end links to each other with resistance R312's one end and thermistor RT 1's negative pole respectively, and thermistor RT 1's positive pole links to each other with 3.3V power and polarity electric capacity C308's positive pole respectively, polarity electric capacity C308's negative pole, polarity electric capacity C309's negative pole and resistance R312's the other end ground connection respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021112125.0U CN212484114U (en) | 2020-06-16 | 2020-06-16 | Injection mold control circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021112125.0U CN212484114U (en) | 2020-06-16 | 2020-06-16 | Injection mold control circuit |
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| Publication Number | Publication Date |
|---|---|
| CN212484114U true CN212484114U (en) | 2021-02-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021112125.0U Active CN212484114U (en) | 2020-06-16 | 2020-06-16 | Injection mold control circuit |
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| CN (1) | CN212484114U (en) |
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- 2020-06-16 CN CN202021112125.0U patent/CN212484114U/en active Active
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