CN212482747U

CN212482747U - Modular-design MEMS (micro-electromechanical system) diffused silicon pressure sensor

Info

Publication number: CN212482747U
Application number: CN202021471525.0U
Authority: CN
Inventors: 唐中山
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-23
Filing date: 2020-07-23
Publication date: 2021-02-05
Anticipated expiration: 2030-07-23

Abstract

The utility model provides a modular design MEMS diffused silicon pressure sensor, which comprises a pressure input module, a pressure sensing module, a signal processing module and a signal output module; the pressure input module is responsible for inputting external pressure, and a cavity is arranged in the center of the pressure input module in the vertical direction; the pressure sensing module is used for sensing a pressure signal and is embedded in the upper part of the cavity; the signal processing module is responsible for carrying out amplification, operation, shaping, compensation and calibration on the pressure signal, is arranged above the pressure sensing module and is in signal connection with the top end of the pressure sensing module; the signal output module is responsible for outputting the pressure signal, is positioned above the signal processing module, wraps the signal processing module, is in signal connection with the top end of the signal processing module, and is fixedly connected with the upper end part of the pressure input module. The beneficial effects of the utility model reside in that: the complexity of the production process is simplified through the modularized design and the manufacturing process, the production process cost is reduced, and the stability of the product quality and the production efficiency are improved.

Description

Modular-design MEMS (micro-electromechanical system) diffused silicon pressure sensor

[ technical field ] A method for producing a semiconductor device

The utility model relates to a pressure sensor which is manufactured by adopting MEMS silicon diffusion technology and modularization and comprises a pressure sensing module and a signal output module which is manufactured by one-time injection molding and sealing, wherein the pressure sensing module comprises a metal supporting body and a miniaturized metal glass sintered body, the miniaturized metal glass sintered body is embedded in a hole in the middle of the metal supporting body, and a related pressure sensing device is arranged on the bottom surface of the metal glass sintered body in the hole; the signal output module manufactured by one-time injection molding integrates a metal shell, a signal output copper needle and a plastic insulator, and the sealing protection requirement of an IP 67-grade product is met.

[ background of the invention ]

A pressure sensor is a device or apparatus that senses a pressure signal and converts the pressure signal into a usable output electrical signal according to a certain rule. The pressure sensor is the most common sensor in industrial practice, is widely applied to various industrial automatic control environments, and relates to a plurality of industries such as water conservancy and hydropower, railway traffic, intelligent buildings, production automatic control, aerospace, military industry, petrochemical industry, oil wells, electric power, ships, machine tools, pipelines and the like. The MEMS diffused silicon pressure sensor is manufactured by packaging a silicon piezoresistive (MEMS) pressure sensitive element with isolation in a stainless steel shell, can convert sensed liquid or gas pressure into a standard electric signal to be output outwards, and is widely applied to field measurement and control of industrial processes such as water supply/drainage, heating power, petroleum, chemical engineering, metallurgy and the like.

Although there are many disclosures related to the structure and manufacturing method of pressure sensors, such as: patent CN107543646A has been filed and published, but the pressure sensor disclosed in these patents is relatively complex in structure and requires the use of proprietary and confidential equipment and components in manufacturing. The utility model relates to a brand-new MEMS diffused silicon pressure sensor of modularization manufacturing, its modularized design and manufacturing process method have effectively reduced the complexity of production technology and have improved the stability of quality.

The problems of the MEMS diffused silicon pressure sensor which is the mainstream in the market at present are as follows:

1. the product uses the sealing ring, the aging speed is high, and air leakage is easy to occur, so that the failure fault of the product is caused;

2. each part of the product is manufactured separately, so that the manufacturing cost is high and the manufacturing production efficiency is low;

3. the product process is complex, and the product consistency is poor;

4. the production process of the product is not well controlled, the product quality is low and the stability is poor;

5, the MEMS diffused silicon sensing core body packaging technology has poor process control and poor product precision;

6. the product size is big, and the installation occupation space is big.

[ Utility model ] content

The utility model discloses aim at solves the following problem that the pressure sensor of mainstream exists on the market at present: the sealing ring is used for sealing, the aging speed is high, and air leakage is easy to occur, so that failure faults are caused; each part is manufactured separately, so that the manufacturing cost is high and the manufacturing production efficiency is low; the production process is complicated and complicated, and the product consistency is poor; the production process is difficult to control, the product quality is low and the stability is poor; the process control of the diffusion silicon induction core body packaging technology is difficult, and the product precision is poor; the product size is large, and the installation occupied space is large; and a modular design MEMS diffused silicon pressure sensor is provided.

The utility model discloses a realize through following technical scheme: a modular design MEMS diffused silicon pressure sensor comprises a pressure input module, a pressure sensing module, a signal processing module and a signal output module; the pressure input module is responsible for inputting external pressure, and a cavity is arranged in the center of the pressure input module in the vertical direction; the pressure sensing module is used for sensing and transmitting a pressure signal and is embedded in the upper part of the cavity of the pressure input module; the signal processing module is used for carrying out amplification, operation, shaping, compensation and calibration on the pressure signal, is arranged above the pressure sensing module and is in signal connection with the top end of the pressure sensing module; the signal output module is in charge of butting an industry standard connector matched with the signal output module to output a pressure signal, the signal output module is located above the signal processing module and wraps the signal processing module, and the signal output module is in signal connection with the top end of the signal processing module and is fixedly connected with the upper end part of the pressure input module.

Furthermore, the pressure input module is a metal connector and is in a bolt structure shape, a pressure sensing module mounting cavity is arranged at the upper part of the pressure input module in the vertical direction, and a vertical cavity is communicated below the pressure sensing module mounting cavity; the pressure sensing module mounting cavity is in a circular step shape, and the diameter of the pressure sensing module mounting cavity is larger than that of the vertical cavity.

Further, the pressure induction module comprises a metal support body, a metal glass sintered body, a pressure chip, a metal pressure ring and a metal diaphragm; the metal supporting body is of a cylindrical structure and is embedded in the pressure sensing module mounting cavity, the upper section of the interior of the metal supporting body is provided with a metal glass sintered body mounting cavity, and the lower section of the interior of the metal supporting body is provided with a horn-shaped opening; the metal glass sintered body comprises a fixed support plate and a pressure signal guide pin, wherein the fixed support plate is of a circular plate structure and is embedded in the metal glass sintered body installation cavity; a plurality of pressure signal guide pins are fixedly sintered along the axial direction of the fixed support plate and penetrate through the top surface and the bottom surface of the fixed support plate; the pressure chip is a square MEMS diffused silicon pressure sensor chip and is fixed at the bottom end of the pressure signal guide pin by welding and bonding; the metal compression ring is a thin hollow circular ring, the metal diaphragm is a circular elastic metal thin sheet, and the metal diaphragm is welded on the metal compression ring in a clinging manner; a circular positioning inner ring groove is formed in the surface of the bottom of the metal support body, and the metal pressing ring is fixedly welded in the circular positioning inner ring groove; and silicone oil is filled in a cavity enclosed by the bottom surface of the metal glass sintered body and the metal diaphragm in the metal support body.

Furthermore, the signal processing module comprises a signal converter, a signal processing mainboard and a signal connecting plate; the signal converter is of a rod-shaped structure and comprises a gold-plated copper needle, a copper sleeve and an elastic sheet, wherein the copper sleeve is sleeved and fixed at the middle lower part of the gold-plated copper needle, the elastic sheet is sleeved and fixed at the upper part of the gold-plated copper needle, and the upper end of the copper sleeve is provided with an annular clamping groove; the signal processing mainboard and the signal connecting plate are both of circular plate structures, the signal processing mainboard is provided with a first signal converter connecting hole and a signal output copper needle connecting hole, and the signal connecting plate is provided with a second signal converter connecting hole and a pressure signal guide needle connecting hole; the signal processing main board is sleeved and fixed on the gold-plated copper needle exposed above the elastic sheet through the first signal converter connecting hole, and the signal connecting board is sleeved and fixed at the annular clamping groove through the second signal converter connecting hole; and the signal connecting plate is sleeved and fixed at the upper end of the pressure signal guide pin through the pressure signal guide pin connecting hole.

Furthermore, the signal output module comprises a metal shell, signal output copper needles and a plastic insulator, wherein the metal shell is internally provided with a plurality of signal output copper needles, and the plastic insulator is filled in the metal shell and insulates and separates the metal shell and each signal output copper needle; the signal output copper needle is a right-angle turning copper needle, the upper end of the signal output copper needle extends out of the upper part of the plastic insulator, and the lower end of the signal output copper needle extends out of the lower part of the plastic insulator; the lower end of the signal output copper needle penetrates through the signal output copper needle connecting hole to be fixedly connected with the signal processing main board; the metal shell is of a cylindrical structure, the diameter of the upper portion of the metal shell is smaller than that of the lower portion of the metal shell, and threads are arranged on the outer surface of the upper portion of the metal shell and the inner surface of the upper portion of the metal shell.

A manufacturing method of a modular design MEMS diffused silicon pressure sensor comprises the following steps:

step 1: the pressure input module, the pressure sensing module, the signal processing module and the signal output module are manufactured respectively and independently;

step 2: fixedly welding the metal support body of the pressure sensing module on the inner wall of the pressure sensing module mounting cavity;

and step 3: sleeving and fixing a signal connecting plate of the signal processing module on the upper end of a pressure signal guide pin of the pressure sensing module;

and 4, step 4: inserting and fixing the lower end of a signal output copper needle of the signal output module on the signal processing mainboard; and the bottom surface of the metal shell of the signal output module is welded at the top end of the metal connector.

The specific manufacturing method of the pressure input module in the step 1 comprises the following steps: selecting an external thread model matched with an external pressure input device to manufacture the metal connector; and then the central position of the metal connector is processed with the induction module mounting cavity and the vertical cavity along the vertical direction.

The specific manufacturing method of the pressure sensing module in the step 1 comprises the following steps: manufacturing a metal support body matched with the pressure sensing module mounting cavity, and processing the metal glass sintered body mounting cavity and the horn-shaped opening at the center of the metal support body along the vertical direction; manufacturing a metal diaphragm matched with the size of the horn-shaped opening; processing the circular positioning inner ring groove on the bottom surface of the metal support body, and manufacturing a metal pressure ring matched with the circular positioning inner ring groove in shape and size; welding a metal membrane and a metal pressure ring together, and then welding the metal pressure ring into the circular positioning inner ring groove; manufacturing a metal glass sintered body matched with the size of the metal glass sintered body mounting cavity, welding the pressure chip at the bottom end of the pressure signal guide pin of the metal glass sintered body, and welding the metal glass sintered body to the inner wall of the metal glass sintered body mounting cavity; and vacuumizing a cavity surrounded by the bottom surface of the metal glass sintered body and the metal diaphragm in the metal support body, and then filling silicon oil.

The specific manufacturing method of the signal processing module in the step 1 comprises the following steps: and selecting a signal converter matched with the pressure sensing module, sleeving and fixing the signal processing mainboard on the gold-plated copper needle exposed above the elastic sheet, and sleeving and fixing the signal connecting plate on an annular clamping groove at the upper part of the copper sleeve.

The specific manufacturing method of the signal output module in the step 1 comprises the following steps: the signal output copper needle, the metal shell and the plastic insulator are manufactured in a one-step molding and sealing mode through an injection molding process, the plastic insulator is filled in the metal shell to insulate and separate the metal shell and the signal output copper needle, the upper end of the signal output copper needle extends out of the upper portion of the plastic insulator, and the lower end of the signal output copper needle extends out of the lower portion of the plastic insulator.

The beneficial effects of the utility model reside in that: the complexity of the production process is effectively reduced, and the stability of the product quality and the production efficiency are improved through the modularized design and the manufacturing process; the 4 modules of the utility model can be independently manufactured, can also be manufactured in batches by other methods, and can be freely combined to form a plurality of different product series pressure sensors, thereby simplifying the production process cost while differentiating the products; the signal output module is manufactured by one-time injection molding, and is not sealed by a sealing ring, so that the aging and air leakage of the sealing ring are avoided, the sealing performance of the product is improved, the IP67 grade protection requirement is met, the service life is prolonged, and the failure fault rate is reduced; the signal processing module is connected with the signal processing main board and the signal connecting board in an inserting mode through the signal converter, so that convenient and reliable connection is realized, the manufacturing process of the pressure sensor is simplified, the manufacturability of a product is improved, and product pollution caused by using a welding wire or a flexible circuit board is avoided; the metal support body is of a cylindrical structure, a sealing ring groove is omitted outside the metal support body, and the metal support body can be inserted and welded into the metal connector from any angle of 360 degrees, so that the production process is simplified, the overall size of the pressure sensor is reduced, and the installation space is saved; the metal glass sintered body is of a miniaturized structure, so that the area of the product needing gold plating is reduced after the product is miniaturized, and the manufacturing cost is greatly reduced; through the circular positioning inner ring groove, the metal diaphragm and the metal pressure ring can be accurately installed and positioned, the assembly process is simplified, the metal diaphragm can be ensured to be positioned at the center of a product, and the production convenience, the quality consistency of the pressure sensor and the welding reliability are improved; through the horn-shaped opening, the signal linearity is improved when external pressure is transmitted through the metal diaphragm, and the product precision is improved.

[ description of the drawings ]

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the cutting assembly of the present invention;

FIG. 3 is a schematic view of the exploded structure of the present invention;

fig. 4 is a schematic structural diagram of the pressure input module of the present invention;

fig. 5 is a schematic structural diagram of the pressure sensing module of the present invention;

fig. 6 is a schematic structural diagram of a signal processing module according to the present invention;

fig. 7 is a schematic structural diagram of a signal output module according to the present invention;

reference numerals: 1. a pressure input module; 11. a metal connector; 12. the pressure sensing module is arranged in the cavity; 13. a vertical cavity; 2. a pressure sensing module; 21. a metal support; 211. a metallic glass sintered body mounting cavity; 212. a horn-shaped opening; 213. an inner ring groove is circularly positioned; 22. a metallic glass sintered body; 221. fixing the support plate; 222. a pressure signal guide pin; 23. a pressure chip; 24. a metal compression ring; 25. a metal diaphragm; 3. a signal processing module; 31. a signal converter; 311. gold-plated copper needles; 312. a copper sleeve; 313. a spring plate; 314. an annular neck; 32. a signal processing main board; 321. a first signal converter connection hole; 322. a signal output copper needle connecting hole; 33. a signal connection board; 331. a second signal converter connection hole; 332. a pressure signal guide pin connecting hole; 4. a signal output module; 41. a metal housing; 42. a signal output copper pin; 43. a plastic insulator.

[ detailed description ] embodiments

The present invention will be further described with reference to the accompanying drawings and the detailed description. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.

In the description of the present application, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "center", "vertical", and the like, which indicate an orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

In this application, unless otherwise specifically stated or limited, the terms "mounted," "fixed," "fitted," "connected," "inserted," "embedded," and the like are to be construed broadly, and the specific meaning of the terms in the present application will be understood by those skilled in the art as a matter of course. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

Examples

As shown in fig. 1-7, a modular MEMS diffused silicon pressure sensor includes a pressure input module 1, a pressure sensing module 2, a signal processing module 3, and a signal output module 4; the pressure input module 1 is responsible for inputting external pressure, and a cavity is arranged in the center of the pressure input module 1 in the vertical direction; the pressure sensing module 2 is responsible for sensing and transmitting pressure signals, and the pressure sensing module 2 is embedded in the upper part of the cavity of the pressure input module 1; the signal processing module 3 is responsible for carrying out amplification, operation, shaping, compensation and calibration on pressure signals, is arranged above the pressure sensing module 2 and is connected with a top end signal of the pressure sensing module 2; the signal output module 4 is responsible for butt joint and outputting pressure signals with the industry standard connector of its adaptation, the signal output module 4 is located signal processing module 3 top and parcel live signal processing module 3, signal output module 4 with signal processing module 3's top signal connection, and with pressure input module 1 upper end fixed connection.

Preferably, the pressure input module 1 is a metal connector 11 in a bolt structure shape, a pressure sensing module mounting cavity 12 is arranged at the upper part of the pressure input module in the vertical direction, and a vertical cavity 13 is communicated below the pressure sensing module mounting cavity; the pressure sensing module mounting cavity 12 is in a circular step shape, and the diameter of the pressure sensing module mounting cavity 12 is larger than that of the vertical cavity 13.

Preferably, the pressure sensing module 2 comprises a metal support 21, a metal glass sintered body 22, a pressure chip 23, a metal pressure ring 24 and a metal diaphragm 25; the metal support body 21 is of a cylindrical structure and is embedded in the pressure sensing module mounting cavity 12, a metal glass sintered body mounting cavity 211 is arranged at the upper section in the metal support body 21, and a horn-shaped opening 212 is arranged at the lower section; the metal glass sintered body 22 comprises a fixed support plate 221 and a pressure signal guide pin 222, wherein the fixed support plate 221 is of a circular plate structure and is embedded in the metal glass sintered body installation cavity 211; a plurality of pressure signal guide pins 222 are fixedly sintered along the axial direction of the fixed support plate 221, and the pressure signal guide pins 222 penetrate through the top surface and the bottom surface of the fixed support plate 221; the pressure chip 23 is a square MEMS diffused silicon pressure sensor chip, and is welded and bonded to the bottom end of the pressure signal guide pin 222; the metal press ring 24 is a thin hollow circular ring, the metal diaphragm 25 is a circular elastic metal thin sheet, and the metal diaphragm 25 is welded on the metal press ring 24 in a clinging manner; a circular positioning inner ring groove 213 is formed in the bottom surface of the metal support body 21, and the metal press ring 24 presses the metal diaphragm 25 and is fixedly welded in the circular positioning inner ring groove 213; silicone oil is filled in a cavity surrounded by the bottom surface of the metal glass sintered body 22 and the metal diaphragm 25 in the metal support body 21.

Preferably, the signal processing module 3 includes a signal converter 31, a signal processing motherboard 32, and a signal connection board 33; the overall shape of the signal converter 31 is a rod-shaped structure, the signal converter 31 comprises a gold-plated copper needle 311, a copper sleeve 312 and an elastic sheet 313, the copper sleeve 312 is sleeved and fixed on the middle lower part of the gold-plated copper needle 311, the elastic sheet 313 is sleeved and fixed on the upper part of the gold-plated copper needle 311, and an annular clamping groove 314 is arranged at the upper end of the copper sleeve 312; the signal processing main board 32 and the signal connecting board 33 are both of circular plate structures, the signal processing main board 32 is provided with a first signal converter connecting hole 321 and a signal output copper needle connecting hole 322, and the signal connecting board 33 is provided with a second signal converter connecting hole 331 and a pressure signal guide needle connecting hole 332; the signal processing main board 32 is sleeved and fixed on the gold-plated copper pin 311 exposed above the spring plate 313 through the first signal converter connecting hole 321, and the signal connecting board 33 is sleeved and fixed at the annular clamping groove 314 through the second signal converter connecting hole 331; the signal connecting plate 33 is sleeved and fixed on the upper end of the pressure signal guide pin 222 through the pressure signal guide pin connecting hole 332.

Preferably, the signal output module comprises a metal shell 41, signal output copper needles 42 and a plastic insulator 43, wherein a plurality of signal output copper needles 42 are arranged in the metal shell 41, and the plastic insulator 43 is filled in the metal shell 41 and insulates and separates the metal shell 41 and each signal output copper needle 42; the signal output copper needle 42 is a right-angle turning copper needle, the upper end of the signal output copper needle extends out of the upper part of the plastic insulator 43, and the lower end of the signal output copper needle extends out of the lower part of the plastic insulator 43; the lower end of the signal output copper pin 42 passes through the signal output copper pin connecting hole 322 and is fixedly connected with the signal processing mainboard 32; the metal shell 41 is a cylindrical structure, the diameter of the upper part is smaller than that of the lower part, and threads are arranged on the outer surface of the upper part and the inner surface of the upper part.

Appropriate changes and modifications to the embodiments described above will become apparent to those skilled in the art from the disclosure and teachings of the foregoing description. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

1. A modular design MEMS diffused silicon pressure sensor, comprising: the pressure sensing device comprises a pressure input module, a pressure sensing module, a signal processing module and a signal output module; the pressure input module is responsible for inputting external pressure, and a cavity is arranged in the center of the pressure input module in the vertical direction; the pressure sensing module is used for sensing and transmitting a pressure signal and is embedded in the upper part of the cavity of the pressure input module; the signal processing module is used for carrying out amplification, operation, shaping, compensation and calibration on the pressure signal, is arranged above the pressure sensing module and is in signal connection with the top end of the pressure sensing module; the signal output module is in charge of butting a connector matched with the signal output module to output a pressure signal, the signal output module is located above the signal processing module and wraps the signal processing module, and the signal output module is in signal connection with the top end of the signal processing module and is fixedly connected with the upper end part of the pressure input module.

2. The modular design MEMS diffused silicon pressure sensor of claim 1 wherein: the pressure input module is a metal connector and is in a bolt structure shape, a pressure sensing module mounting cavity is arranged at the upper part of the pressure input module in the vertical direction, and a vertical cavity is communicated below the pressure sensing module mounting cavity; the pressure sensing module mounting cavity is in a circular step shape, and the diameter of the pressure sensing module mounting cavity is larger than that of the vertical cavity.

3. The modular design MEMS diffused silicon pressure sensor of claim 1 wherein: the pressure induction module comprises a metal support body, a metal glass sintered body, a pressure chip, a metal pressure ring and a metal diaphragm; the metal supporting body is of a cylindrical structure and is embedded in the pressure sensing module mounting cavity, the upper section of the interior of the metal supporting body is provided with a metal glass sintered body mounting cavity, and the lower section of the interior of the metal supporting body is provided with a horn-shaped opening; the metal glass sintered body comprises a fixed support plate and a pressure signal guide pin, wherein the fixed support plate is of a circular plate structure and is embedded in the metal glass sintered body installation cavity; a plurality of pressure signal guide pins are fixedly sintered along the axial direction of the fixed support plate and penetrate through the top surface and the bottom surface of the fixed support plate; the pressure chip is a square MEMS diffused silicon pressure sensor chip and is welded and bonded and fixed at the bottom end of the pressure signal guide pin; the metal compression ring is a thin hollow circular ring, the metal diaphragm is a circular elastic metal thin sheet, and the metal diaphragm is welded on the metal compression ring in a clinging manner; a circular positioning inner ring groove is formed in the surface of the bottom of the metal support body, and the metal pressing ring is fixedly welded in the circular positioning inner ring groove; and silicone oil is filled in a cavity enclosed by the bottom surface of the metal glass sintered body and the metal diaphragm in the metal support body.

4. The modular design MEMS diffused silicon pressure sensor of claim 1 wherein: the signal processing module comprises a signal converter, a signal processing mainboard and a signal connecting plate; the signal converter is of a rod-shaped structure and comprises a gold-plated copper needle, a copper sleeve and an elastic sheet, wherein the copper sleeve is sleeved and fixed at the middle lower part of the gold-plated copper needle, the elastic sheet is sleeved and fixed at the upper part of the gold-plated copper needle, and the upper end of the copper sleeve is provided with an annular clamping groove; the signal processing mainboard and the signal connecting plate are both of circular plate structures, the signal processing mainboard is provided with a first signal converter connecting hole and a signal output copper needle connecting hole, and the signal connecting plate is provided with a second signal converter connecting hole and a pressure signal guide needle connecting hole; the signal processing main board is sleeved and fixed on the gold-plated copper needle exposed above the elastic sheet through the first signal converter connecting hole, and the signal connecting board is sleeved and fixed at the annular clamping groove through the second signal converter connecting hole; and the signal connecting plate is sleeved and fixed at the upper end of the pressure signal guide pin through the pressure signal guide pin connecting hole.

5. The modular design MEMS diffused silicon pressure sensor of claim 1 wherein: the signal output module comprises a metal shell, signal output copper needles and a plastic insulator, wherein the metal shell is internally provided with a plurality of signal output copper needles, and the plastic insulator is filled in the metal shell and insulates and separates the metal shell and each signal output copper needle; the signal output copper needle is a right-angle turning copper needle, the upper end of the signal output copper needle extends out of the upper part of the plastic insulator, and the lower end of the signal output copper needle extends out of the lower part of the plastic insulator; the lower end of the signal output copper needle penetrates through the signal output copper needle connecting hole to be fixedly connected with the signal processing main board; the metal shell is of a cylindrical structure, the diameter of the upper portion of the metal shell is smaller than that of the lower portion of the metal shell, and threads are arranged on the outer surface of the upper portion of the metal shell and the inner surface of the upper portion of the metal shell.