CN212463862U

CN212463862U - Heat radiation structure for wireless WI-FI management equipment

Info

Publication number: CN212463862U
Application number: CN202021174828.6U
Authority: CN
Inventors: 马宁
Original assignee: Changchun Jiuzhou Shengxing Technology Co ltd
Current assignee: Changchun Jiuzhou Shengxing Technology Co ltd
Priority date: 2020-06-22
Filing date: 2020-06-22
Publication date: 2021-02-02
Anticipated expiration: 2030-06-22

Abstract

The utility model discloses a wireless WI-FI is heat radiation structure for management equipment, including casing, absorber plate, PCBA board, radiating block and lid, the casing is injectd to have the open-ended cavity for one end, the cavity is equipped with a plurality of through-holes, the absorber plate is equipped with in the cavity, the PCBA board is equipped with the top of absorber plate, the lower wall of PCBA board closely laminates with the upper wall of absorber plate, the top of PCBA board is equipped with a plurality of electronic component, the radiating block is equipped with PCBA board top, the radiating block is equipped with a plurality of louvres, the louvre is linked together with the through-hole, the radiating block is equipped with a plurality of recesses that are used for holding electronic component, the lid demountable installation in the opening, the lid offsets and is fixed in between PCBA board and the lid with the radiating block with the top of radiating block. The heat generated by the heat dissipation block and the electronic element is effectively dissipated, so that the heat is prevented from being dissipated outwards or accumulated on the PCBA or the electronic element body, and the heat dissipation effect is effectively improved.

Description

Heat radiation structure for wireless WI-FI management equipment

Technical Field

The utility model relates to a WI-FI management equipment technical field specifically is a wireless WI-FI is heat radiation structure for management equipment.

Background

The wifi wireless router is used for converting wired network signals into wireless signals through the wifi wireless router, and the wireless signals are received by a computer, a mobile phone, a PDA and the like supporting the technology of the wifi wireless router. For example, ADSL in a home, a cell broadband can realize wireless internet access of WIFI equipment as long as it is connected to a WIFI wireless router. In some companies or enterprises, in order to connect a plurality of wireless routers with each other, so that the local area network does not have faults, the wireless routers are connected through a wireless WI-FI management device, so that the local area network is safer, the coverage range is wider, and signals are more stable. Generally, the enterprise or unit using the wireless WI-FI management device has a large scale, so that the wireless WI-FI management device has a high operation frequency, a large power consumption, and a large heat productivity (due to overheating temperature, chips are easily burned out, and a PCB is damaged), and thus the wireless WI-FI management device has a high requirement on a heat dissipation structure of the wireless WI-FI management device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wireless WI-FI is heat radiation structure for management equipment to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a heat dissipation structure for a wireless WI-FI management device, comprising:

a housing defined as a cavity having an opening at one end, the cavity provided with a plurality of through holes;

the heat absorption plate is arranged in the cavity and is spaced from the bottom of the cavity;

the PCBA is arranged above the heat absorbing plate, the lower wall of the PCBA is tightly attached to the upper wall of the heat absorbing plate, and a plurality of electronic elements are arranged above the PCBA;

the heat dissipation block is arranged above the PCBA, the upper wall of the PCBA is tightly attached to the lower wall of the heat dissipation block, the heat dissipation block is provided with a plurality of heat dissipation holes, the heat dissipation holes are communicated with the through holes, and the heat dissipation block is provided with a plurality of grooves for containing electronic elements;

the lid, lid demountable installation in the opening, the lid offsets with the top of radiating block and is fixed in between PCBA board and the lid with the radiating block.

Preferably, the bottom of the casing is provided with a plurality of guide posts for supporting the heat absorbing plate, the guide posts are provided with screw holes, the heat absorbing plate and the PCBA plate are provided with screw through holes matched with the screw holes, and the root parts with screws penetrate through the screw through holes to fix the PCBA plate and the heat absorbing plate in the casing.

Preferably, the groove penetrates through the heat dissipation block.

Preferably, the heat dissipation holes (41) comprise vertically arranged heat dissipation holes and horizontally arranged heat dissipation holes, the vertically arranged heat dissipation holes are communicated with the horizontally arranged heat dissipation holes, and the grooves are communicated with the vertically arranged heat dissipation holes and the horizontally arranged heat dissipation holes.

Preferably, the vertically arranged heat dissipation holes and the horizontally arranged heat dissipation holes are arranged at intervals and the heat dissipation block.

Preferably, the heat slug is made of copper or aluminum.

Preferably, the heat absorbing plate is made of a ceramic sheet.

Preferably, the through holes are formed at both sides of the case.

Compared with the prior art, the beneficial effects of the utility model are that:

1. a heat radiation structure for wireless WI-FI management equipment is characterized in that a heat absorption plate is arranged at the bottom of a PCBA board, and heat generated by the PCBA board is absorbed through the heat absorption plate, so that the PCBA board is prevented from being damaged; meanwhile, the heat dissipation block is arranged above the PCBA, heat generated by the heat dissipation block and the electronic element in a fit mode is effectively dissipated, the heat is prevented from being dissipated outwards or accumulated on the PCBA or the electronic element body, and therefore the heat dissipation effect is effectively improved;

2. the utility model provides a wireless WI-FI is heat radiation structure for management equipment, through set up the louvre of vertical setting and the louvre of horizontal setting at the radiating block, through setting up the louvre of vertical setting and the louvre of horizontal setting into the honeycomb, effectively improved radiating effect, the louvre cooperates through the matched with through-hole and effectively improved the radiating effect.

Drawings

FIG. 1 is a schematic perspective view of a heat dissipation structure for a wireless WI-FI management device;

FIG. 2 is a schematic perspective view of a housing of a heat dissipation structure for a wireless WI-FI management device;

fig. 3 is a rear view of a hidden cover of a heat dissipation structure for wireless WI-FI management device.

In the figure: the heat sink comprises a case 1, a through hole 11, a guide post 12, a screw hole 13, a screw through hole 131, a heat sink plate 2, a PCBA plate 3, an electronic component 31, a heat dissipation block 4, heat dissipation holes 41, heat dissipation holes 411, heat dissipation holes arranged vertically, heat dissipation holes 412 arranged horizontally, a groove 42 and a cover 5.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Referring to fig. 1-3, a heat dissipation structure for a wireless WI-FI management device includes:

a housing 1, the housing 1 defining a cavity with an opening at one end, the cavity being provided with a plurality of through holes 11;

the heat absorption plate 2 is arranged in the cavity, and a space is arranged between the heat absorption plate 2 and the bottom of the cavity;

the PCBA board 3 is arranged above the heat absorbing board 2, the lower wall of the PCBA board 3 is tightly attached to the upper wall of the heat absorbing board 2, and a plurality of electronic elements 31 are arranged above the PCBA board 3;

the heat dissipation block 4 is arranged above the PCBA board 3, the upper wall of the PCBA board 3 is tightly attached to the lower wall of the heat dissipation block 4, the heat dissipation block 4 is provided with a plurality of heat dissipation holes 41, the heat dissipation holes 41 are communicated with the through holes 11, and the heat dissipation block 4 is provided with a plurality of grooves 42 used for containing the electronic elements 31;

the lid 5, lid 5 demountable installation in the opening, lid 5 offsets and is fixed in between PCBA board 3 and the lid 5 with the top of radiating block 4.

The heat absorbing plate 2 is arranged at the bottom of the PCBA board 3, and the heat generated by the PCBA board 3 is absorbed by the heat absorbing plate 2, so that the PCBA board 3 is prevented from being damaged; simultaneously through setting up radiating block 4 in PCBA board 3's top, the heat that produces is laminated mutually through radiating block 4 and electronic component 31 effectively dispels the heat, avoids the heat to dispel outward or save with PCBA board 3 or electronic component 31 body to effectively improve radiating effect.

Further, the bottom of the casing 1 is provided with a plurality of guide posts 12 for supporting the heat absorbing plate 2, the guide posts 12 are provided with screw holes 13, the heat absorbing plate 2 and the PCBA plate 3 are provided with screw through holes 131 matched with the screw holes 13, and the roots of screws penetrate through the screw through holes 131 to fix the PCBA plate 3 and the heat absorbing plate 2 in the casing 1.

Further, the groove 42 penetrates the heat dissipation block 4. By penetrating the groove 42 through the heat dissipation block 4, the heat generated by the electronic component 31 can be dissipated in multiple dimensions.

Further, the heat dissipation holes 41 include vertically arranged heat dissipation holes 411 and horizontally arranged heat dissipation holes 412, the vertically arranged heat dissipation holes 411 and the horizontally arranged heat dissipation holes 412 are communicated with each other, and the grooves 42 are communicated with the vertically arranged heat dissipation holes 411 and the horizontally arranged heat dissipation holes 412. Through set up vertical louvre 411 and the louvre 412 of horizontal setting at radiating block 4, through set up vertical louvre 411 and the louvre 412 of horizontal setting to the honeycomb, effectively improved radiating effect, louvre 41 cooperates through matched with through-hole 11 and has effectively improved the radiating effect.

Further, the vertically arranged heat dissipation holes 411 and the horizontally arranged heat dissipation holes 412 are arranged at intervals with the heat dissipation block 4.

Furthermore, the radiating block 4 is made of copper or aluminum, wherein copper and aluminum have a good radiating effect, and can absorb heat and radiate heat in an express way.

Furthermore, the heat absorbing plate 2 is made of ceramic plates, generally speaking, the heat generated by the PCBA plate 3 is small, and the ceramic plates with quick heat dissipation can avoid heat accumulation and influence on the heat resistance of the case 1 when the temperature of the PCBA is too high.

Furthermore, the through holes 11 are disposed on two sides of the casing 1, but the through holes 11 may also be disposed on various positions of the casing 1, such as four sides, and the cover 5 may also improve the heat dissipation effect.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. A heat radiation structure for a wireless WI-FI management device, comprising:

a casing (1), wherein the casing (1) is defined as a cavity with an opening at one end, and the cavity is provided with a plurality of through holes (11);

the heat absorption plate (2) is arranged in the cavity, and a space is formed between the heat absorption plate (2) and the bottom of the cavity;

the heat sink comprises a PCBA board (3), wherein the PCBA board (3) is arranged above a heat sink plate (2), the lower wall of the PCBA board (3) is tightly attached to the upper wall of the heat sink plate (2), and a plurality of electronic elements (31) are arranged above the PCBA board (3);

the heat dissipation block (4), the heat dissipation block (4) is arranged above the PCBA board (3), the upper wall of the PCBA board (3) is tightly attached to the lower wall of the heat dissipation block (4), the heat dissipation block (4) is provided with a plurality of heat dissipation holes (41), the heat dissipation holes (41) are communicated with the through holes (11), and the heat dissipation block (4) is provided with a plurality of grooves (42) for containing the electronic elements (31);

lid (5), lid (5) demountable installation in the opening, lid (5) offset and are fixed in between PCBA board (3) and lid (5) with radiating block (4) with the top of radiating block (4).

2. The heat dissipation structure for the wireless WI-FI management equipment as claimed in claim 1, wherein the bottom of the casing (1) is provided with a plurality of guide posts (12) for supporting the heat absorption plate (2), the guide posts (12) are provided with screw holes (13), the heat absorption plate (2) and the PCBA plate (3) are provided with screw through holes (131) matched with the screw holes (13), and the root parts of the screws penetrate through the screw through holes (131) to fix the PCBA plate (3) and the heat absorption plate (2) in the casing (1).

3. The heat dissipation structure for wireless WI-FI management devices as claimed in claim 1, wherein the groove (42) extends through the heat dissipation block (4).

4. The heat dissipation structure for wireless WI-FI management equipment as claimed in claim 1, wherein the heat dissipation holes (41) comprise vertically arranged heat dissipation holes (411) and horizontally arranged heat dissipation holes (412), the vertically arranged heat dissipation holes (411) and the horizontally arranged heat dissipation holes (412) are communicated with each other, and the groove (42) is communicated with the vertically arranged heat dissipation holes (411) and the horizontally arranged heat dissipation holes (412).

5. The heat dissipation structure for wireless WI-FI management equipment as claimed in claim 4, wherein the vertically arranged heat dissipation holes (411) and the horizontally arranged heat dissipation holes (412) are arranged at intervals with the heat dissipation block (4).

6. The heat dissipation structure for wireless WI-FI management devices of claim 1, wherein the heat dissipation block (4) is made of copper or aluminum.

7. The heat dissipation structure for wireless WI-FI management devices of claim 1, wherein the heat sink plate (2) is made of a ceramic sheet.

8. The heat dissipation structure for wireless WI-FI management equipment as claimed in claim 1, wherein the through holes (11) are provided at both sides of the cabinet (1).