CN212460432U - Novel computer motherboard heat abstractor - Google Patents
Novel computer motherboard heat abstractor Download PDFInfo
- Publication number
- CN212460432U CN212460432U CN202021283948.XU CN202021283948U CN212460432U CN 212460432 U CN212460432 U CN 212460432U CN 202021283948 U CN202021283948 U CN 202021283948U CN 212460432 U CN212460432 U CN 212460432U
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- CN
- China
- Prior art keywords
- heat dissipation
- novel computer
- dissipation device
- device shell
- water
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- 238000001816 cooling Methods 0.000 claims abstract description 40
- 230000017525 heat dissipation Effects 0.000 claims abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 5
- 239000000110 cooling liquid Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 4
- 238000005728 strengthening Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- OFCNXPDARWKPPY-UHFFFAOYSA-N allopurinol Chemical compound OC1=NC=NC2=C1C=NN2 OFCNXPDARWKPPY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a novel computer motherboard heat dissipation device, which relates to the polishing field, the utility model comprises a heat dissipation device shell, a novel computer motherboard, an exhaust fan, a water cooling device and support legs, the interior of the heat dissipation device shell is of a hollow structure, the novel computer motherboard comprises a plurality of groove reinforcing ribs which are all welded with the inner surface of the heat dissipation device shell, the exhaust fan is arranged on the lower surface of the heat dissipation device shell, one surface of the water cooling device is connected with the inner surface of the heat dissipation device shell, a plurality of positioning grooves are arrayed on the lower surface of the heat dissipation device shell, one end of a plurality of support legs are respectively connected with the plurality of positioning grooves, the utility model can rapidly cool the device in a large area by increasing the exhaust fan, improve the working efficiency of the device, ensure that the device has excellent heat dissipation function by increasing the water cooling, the extension is the service life.
Description
Technical Field
The utility model relates to a heat dissipation equipment technical field, in particular to novel computer motherboard heat abstractor.
Background
The new energy battery is widely applied to various fields of automobiles, aerospace and industrial design based on the concept of environmental protection and high-efficiency electric power storage performance, but the safety of the new energy battery is always concerned by people, and the battery needs excellent heat dissipation and protection devices due to the characteristics of easy heating and easy damage. Therefore, the novel computer motherboard heat dissipation device becomes an indispensable device for protecting the new energy battery and has great market value.
The existing new energy battery device often does not have a damping effect and is inconvenient to transport, and the sealed box body enables the heat dissipation function of the device to be greatly reduced, so that the service environment of the energy battery is damaged. Therefore, a novel computer motherboard heat dissipation device is provided.
SUMMERY OF THE UTILITY MODEL
A primary object of the utility model is to provide a novel computer motherboard heat abstractor can effectively solve the closed box molding of new forms of energy battery protective equipment and lead to the radiating problem effectively, can effectively solve the technical problem of new forms of energy battery protective equipment shock attenuation effect not enough and crashproof.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a novel computer motherboard heat abstractor, includes heat abstractor shell, novel computer motherboard, air discharge fan, water cooling plant and landing leg, the inside hollow structure that is of heat abstractor shell, novel computer motherboard includes the draw-in groove strengthening rib, and is a plurality of the draw-in groove strengthening rib all with heat abstractor shell internal surface welded, the air discharge fan is installed in heat abstractor shell lower surface, a water cooling plant surface and heat abstractor shell internal surface connection, surface array has a plurality of constant head tanks, and is a plurality of under the heat abstractor shell landing leg one end is connected with a plurality of constant head tanks respectively.
Preferably, the heat dissipation device shell comprises a heat dissipation device shell body, an annular air inlet hole cover, a dust screen and mounting screws, the heat dissipation device shell body is of a hollow structure, the annular air inlet hole cover is welded with one end of the heat dissipation device shell body, a plurality of threaded holes are formed in the other end of the heat dissipation device shell body, and the dust screen is in rotating fit with the threaded holes through the mounting screws, so that the device is firmer and more stable through the addition of the mounting screws.
Preferably, novel computer mainboard still includes novel computer mainboard body and mainboard draw-in groove, novel computer mainboard body both ends with respectively with mainboard draw-in groove sliding fit, through increasing the mainboard draw-in groove for computer mainboard connection is inseparabler.
Preferably, the air discharge fan includes air discharge fan body, rotating electrical machines, fan blade and guard net, air discharge fan body surface is equipped with the screw thread, a guard net surface and air discharge fan body normal running fit, rotating electrical machines installs in the inside surface of air discharge fan body, a fan blade surface and rotating electrical machines normal running fit through increasing the air discharge fan for the device can be comprehensive, faster and better dispel the heat, improves work efficiency.
Preferably, the water cooling plant includes water cooling plant body, water-cooling pipeline and water filling port, and is a plurality of the water-cooling pipeline is hollow structure, and is a plurality of the water-cooling pipeline intussuseption is filled with water-cooling liquid, the water cooling plant body is equipped with the recess, and is a plurality of the water-cooling pipeline is all installed in the recess, water filling port one end and water-cooling pipeline normal running fit through increasing water cooling plant for the device can evenly dispel the heat, prevents that the device from overheated initiation potential safety hazard.
Preferably, the supporting legs comprise connecting blocks and anti-slip pads, one ends of the connecting blocks are glued with the anti-slip pads, and the supporting legs are added, so that the device has excellent stability.
Preferably, the integrated controller comprises an integrated controller body and a signal lamp, the signal lamp is installed on one surface of the integrated controller body, and the integrated controller is added, so that the running speed of the device is increased, and the device can efficiently process work.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, through increasing water cooling plant for the device has good heat dissipation function, can cool down equipment simultaneously, and the extension is life.
The utility model discloses in, through increasing the air discharge fan, can carry out the large tracts of land cooling, hoisting device's work efficiency fast to the device.
Drawings
Fig. 1 is a schematic view of an overall structure of a novel heat dissipation device of a computer motherboard according to the present invention;
fig. 2 is a schematic side view of the novel heat dissipation device of the computer motherboard according to the present invention;
FIG. 3 is a schematic cross-sectional view of B-B of FIG. 2 according to the present invention;
fig. 4 is a schematic cross-sectional view of C-C of fig. 2 according to the present invention.
In the figure: 1. a heat sink housing; 101. an annular air inlet hole cover; 102. a dust screen; 103. mounting screws; 2. a novel computer motherboard; 201. a clamping groove reinforcing rib; 202. a main board clamping groove; 3. an exhaust fan; 301. a rotating electric machine; 302. a fan blade; 303. a protection net; 4. a water cooling device; 401. a water-cooled pipeline; 402. a water injection port; 5. a support leg; 501. connecting blocks; 502. a non-slip mat; 6. an integrated controller; 601. a signal lamp.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The first embodiment is as follows:
please refer to fig. 1-4, the utility model relates to a novel computer motherboard heat abstractor, including heat abstractor shell 1, novel computer motherboard 2, air discharge fan 3, water cooling plant 4 and landing leg 5, the inside hollow structure that is of heat abstractor shell 1, novel computer motherboard 2 includes draw-in groove strengthening rib 201, a plurality of draw-in groove strengthening ribs 201 all with 1 internal surface welded of heat abstractor shell, air discharge fan 3 is installed in 1 lower surface of heat abstractor shell, 4 a surface and the 1 internal surface connection of heat abstractor shell of water cooling plant, the surface array has a plurality of constant head tanks under the heat abstractor shell 1, 5 one ends of a plurality of landing legs are connected with a plurality of constant head tanks respectively.
Further, the heat dissipation device shell 1 comprises a heat dissipation device shell body, an annular air inlet hole cover 101, a dustproof net 102 and mounting screws 103, the heat dissipation device shell body is of a hollow structure, the annular air inlet hole cover 101 is welded with one end of the heat dissipation device shell body, a plurality of threaded holes are formed in the other end of the heat dissipation device shell body, the dustproof net 102 is in rotating fit with the threaded holes through the mounting screws 103, and the heat dissipation device shell is firmer and more stable through the addition of the mounting screws 103.
Further, novel computer mainboard 2 still includes novel computer mainboard body and mainboard draw-in groove 202, novel computer mainboard body both ends with respectively with mainboard draw-in groove 202 sliding fit, through increasing mainboard draw-in groove 202 for computer mainboard connection is inseparabler.
Further, exhaust fan 3 includes exhaust fan body, rotating electrical machines 301, fan blade 302 and guard net 303, and exhaust fan body surface is equipped with the screw thread, and a guard net 303 surface and the rotatory cooperation of exhaust fan body, rotating electrical machines 301 install in an inside surface of exhaust fan body, and a fan blade 302 surface and the rotatory cooperation of rotating electrical machines 301 through increasing exhaust fan 3 for the device can be comprehensive, faster and better dispel the heat, improves work efficiency.
Further, water cooling plant 4 includes water cooling plant body, water cooling pipeline 401 and water filling port 402, and a plurality of water cooling pipeline 401 are hollow structure, and a plurality of water cooling pipeline 401 intussuseption are filled with water-cooling liquid, and the water cooling plant body is equipped with the recess, and a plurality of water cooling pipeline 401 are all installed in the recess, and water filling port 402 one end and water cooling pipeline 401 normal running fit are through increasing water cooling plant 4 for the device can evenly dispel the heat, prevents that the device from overheated initiation potential safety hazard.
Further, the leg 5 comprises a connecting block 501 and a non-slip pad 502, one end of the connecting block 501 is glued with the non-slip pad 502, and the leg 5 is added, so that the device has excellent stability.
Further, the integrated controller 6 comprises an integrated controller body and a signal lamp 601, and the signal lamp 601 is installed on one surface of the integrated controller body, so that the operation speed of the device is increased and the work can be efficiently processed by adding the integrated controller 6.
Example two:
referring to fig. 1-4, the present invention relates to a novel heat dissipation device for a computer motherboard, which has the following working principle: when the device operates, the rotating motor 301 supplies power, the exhaust fan 3 rotates fast to dissipate heat, gas is discharged through the heat dissipation device shell 1, the dust screen 102 is used for filtering, the water cooling device 4 is used for cooling the whole device to prevent overheating equipment from aging, and the supporting legs 5 are used for reinforcing the device, wherein the model of the rotating motor 301 is BY24Y-2419 BL.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a novel computer motherboard heat abstractor, includes heat abstractor shell (1), novel computer motherboard (2), air discharge fan (3), water cooling plant (4), landing leg (5) and integrated control ware (6), its characterized in that: the novel computer mainboard (2) comprises a clamping groove reinforcing rib (201) and is a plurality of, the clamping groove reinforcing rib (201) is welded with the inner surface of the heat dissipation device shell (1), the exhaust fan (3) is installed on the lower surface of the heat dissipation device shell (1), one surface of the water cooling device (4) is connected with the inner surface of the heat dissipation device shell (1), the surface of the heat dissipation device shell (1) is provided with a plurality of positioning grooves and a plurality of supporting legs (5) one ends are respectively connected with the plurality of positioning grooves, and the integrated controller (6) is installed on one surface of the novel computer mainboard (2).
2. The novel computer motherboard heat sink of claim 1, wherein: the heat dissipation device shell (1) comprises a heat dissipation device shell body, an annular air inlet hole cover (101), a dustproof net (102) and mounting screws (103), wherein the heat dissipation device shell body is of a hollow structure, the annular air inlet hole cover (101) is welded with one end of the heat dissipation device shell body, a plurality of threaded holes are formed in the other end of the heat dissipation device shell body, and the dustproof net (102) is in rotating fit with the threaded holes through the mounting screws (103).
3. The novel computer motherboard heat sink of claim 1, wherein: the novel computer main board (2) further comprises a novel computer main board body and a main board clamping groove (202), and two ends of the novel computer main board body are respectively in sliding fit with the main board clamping groove (202).
4. The novel computer motherboard heat sink of claim 1, wherein: the exhaust fan (3) comprises an exhaust fan body, a rotating motor (301), fan blades (302) and a protection net (303), wherein threads are arranged on the outer surface of the exhaust fan body, one surface of the protection net (303) is in rotating fit with the exhaust fan body, the rotating motor (301) is installed on one surface inside the exhaust fan body, and one surface of the fan blades (302) is in rotating fit with the rotating motor (301).
5. The novel computer motherboard heat sink of claim 1, wherein: water cooling plant (4) include water cooling plant body, water-cooling pipeline (401) and water filling port (402), and are a plurality of water-cooling pipeline (401) are hollow structure, and are a plurality of water-cooling pipeline (401) intussuseption is filled with water-cooling liquid, the water cooling plant body is equipped with the recess, and is a plurality of water-cooling pipeline (401) are all installed in the recess, water filling port (402) one end and water-cooling pipeline (401) normal running fit.
6. The novel computer motherboard heat sink of claim 1, wherein: the supporting legs (5) comprise connecting blocks (501) and anti-skid pads (502), and one ends of the connecting blocks (501) are connected with the anti-skid pads (502) in a gluing mode.
7. The novel computer motherboard heat sink of claim 1, wherein: the integrated controller (6) comprises an integrated controller body and a signal lamp (601), wherein the signal lamp (601) is installed on one surface of the integrated controller body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021283948.XU CN212460432U (en) | 2020-07-03 | 2020-07-03 | Novel computer motherboard heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021283948.XU CN212460432U (en) | 2020-07-03 | 2020-07-03 | Novel computer motherboard heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212460432U true CN212460432U (en) | 2021-02-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021283948.XU Expired - Fee Related CN212460432U (en) | 2020-07-03 | 2020-07-03 | Novel computer motherboard heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212460432U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113276655A (en) * | 2021-06-08 | 2021-08-20 | 江苏悦达专用车有限公司 | Dust suppression vehicle cover shell structure |
-
2020
- 2020-07-03 CN CN202021283948.XU patent/CN212460432U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113276655A (en) * | 2021-06-08 | 2021-08-20 | 江苏悦达专用车有限公司 | Dust suppression vehicle cover shell structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210202 |